CN211702548U

CN211702548U - PCB circuit board that gentle and hard combines

Info

Publication number: CN211702548U
Application number: CN202020096030.8U
Authority: CN
Inventors: 袁淮高
Original assignee: Dongguan New Honest Electronic Technology Co ltd
Current assignee: Dongguan New Honest Electronic Technology Co ltd
Priority date: 2020-01-16
Filing date: 2020-01-16
Publication date: 2020-10-16
Anticipated expiration: 2030-01-16

Abstract

The utility model relates to the technical field of circuit boards, in particular to a flexible-rigid PCB circuit board, which comprises a flexible board and a rigid board; the flexible board is sequentially provided with a flexible substrate, a flexible insulating layer and a flexible circuit layer from bottom to top; the hard board is sequentially provided with a heat transfer layer, a hard insulating layer and a hard circuit layer from bottom to top; the flexible insulating layer is connected with the hard insulating layer; the flexible circuit layer is connected with the hard circuit layer; the heat transfer layer is provided with a boss; the flexible substrate is arranged on the boss; the flexible substrate is connected with the heat transfer layer; the rigid-flex PCB circuit board further comprises a heat dissipation plate. The utility model discloses a be connected the heat transfer layer of flexible substrate and rigid board, the heat of flexible substrate can be dispelled the heat in heat transfer layer conveying to the heating panel to strengthen the heat dispersion of circuit board.

Description

PCB circuit board that gentle and hard combines

Technical Field

The utility model relates to a circuit board technical field, concretely relates to PCB circuit board that gentle hard combines.

Background

At present, the printed circuit board technology develops towards multilayering and multifunctionalization, and a plurality of printed circuit boards are required to be bent between different planes for many times, so that the base material of the printed circuit board is required to have better flexibility. With the development and improvement of printed circuit technology, flexible and rigid combined boards have appeared. The flexible-rigid combination board has the characteristics of FPC and PCB, has the characteristics of high wiring density, light weight, thin thickness and good bending property, but has poor heat dissipation effect due to the current flexible-rigid combination board.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the above-mentioned not enough among the prior art, provide a PCB circuit board that gentle and hard combines.

The purpose of the utility model is realized through the following technical scheme: a flexible-rigid PCB comprises a flexible board and a rigid board connected with the flexible board; the flexible board is sequentially provided with a flexible substrate, a flexible insulating layer and a flexible circuit layer from bottom to top; the hard board is sequentially provided with a heat transfer layer, a hard insulating layer and a hard circuit layer from bottom to top; the flexible insulating layer is connected with the hard insulating layer; the flexible circuit layer is connected with the hard circuit layer; the heat transfer layer is provided with a boss; the flexible substrate is arranged on the boss; the flexible substrate is connected with the heat transfer layer;

the flexible-rigid PCB circuit board also comprises a fixing piece for fixing the flexible board on the boss;

the flexible and rigid combined PCB circuit board also comprises a heat dissipation plate detachably connected with the rigid plate; the hard board is provided with an insertion hole in a penetrating way; the heat dissipation plate comprises a heat conduction layer and a heat dissipation sheet arranged at the bottom of the heat conduction layer; the top of the heat conduction layer is provided with a limiting block; and the limiting block penetrates through the jack and then is clamped with the rigid plate.

The utility model is further arranged that the limiting block comprises a connecting strip arranged at the top of the heat-conducting layer; the top of the connecting strip is downwards connected with an elastic clamping hook which is obliquely arranged; the limiting block penetrates through the jack of the rigid plate, and then the free end of the elastic clamping hook abuts against the rigid plate.

The utility model is further arranged that a reinforcing rib is arranged between the bottom of the connecting strip and the heat-conducting layer;

the bottom of the elastic clamping hook is provided with a baffle.

The utility model discloses further set up as, the both sides of fin are equipped with the raised grain.

The utility model is further provided with a first through hole which is arranged on the flexible board in a penetrating way; the boss is provided with a second through hole; the fixing piece comprises a rod part and a head part; the rod part penetrates through the first through hole and then is fixed to the second through hole; the head is secured to the flexible circuit layer.

The utility model discloses further set up to, be equipped with the short copper between flexible substrate and the boss.

The utility model discloses further set up to, the heat transfer layer is the aluminium alloy layer.

The utility model discloses further set up as, be equipped with the fastening between flexible substrate and the heat transfer layer and glue.

The utility model discloses further set up to, the top on hard circuit layer is equipped with the printing ink film.

The utility model has the advantages that: the utility model discloses a be connected the heat transfer layer of flexible substrate and rigid board, the heat of flexible substrate can be dispelled the heat in heat transfer layer conveying to the heating panel to strengthen the heat dispersion of circuit board.

Drawings

The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived from the following drawings without inventive effort.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a cross-sectional view AA' of FIG. 1;

FIG. 3 is a view of BB' in FIG. 2;

fig. 4 is a schematic structural view of the heat dissipating plate of the present invention;

wherein: 1. a flexible board; 11. a flexible substrate; 12. a flexible insulating layer; 13. a flexible circuit layer; 2. a hard plate; 21. an ink film; 22. a heat transfer layer; 23. a hard insulating layer; 24. a hard circuit layer; 25. a jack; 3. a boss; 41. a heat conductive layer; 42. a heat sink; 43. a limiting block; 51. a connecting strip; 52. an elastic clamping hook; 53. reinforcing ribs; 54. a baffle plate; 6. wave lines; 7. a fixing member; 71. a rod portion; 72. a head portion; 8. a short copper plate; 9. and (5) fastening glue.

Detailed Description

The invention will be further described with reference to the following examples.

As can be seen from fig. 1 to 4, the flexible-rigid PCB of the present embodiment includes a flexible board 1 and a rigid board 2 connected to the flexible board 1; the flexible board 1 is sequentially provided with a flexible substrate 11, a flexible insulating layer 12 and a flexible circuit layer 13 from bottom to top; the hard board 2 is provided with a heat transfer layer 22, a hard insulating layer 23 and a hard circuit layer 24 in sequence from bottom to top; the flexible insulating layer 12 is connected with the hard insulating layer 23; the flexible circuit layer 13 is connected with the rigid circuit layer 24; the heat transfer layer 22 is provided with a boss 3; the flexible substrate 11 is arranged on the boss 3; the flexible substrate 11 is connected with the heat transfer layer 22;

the flexible-rigid PCB circuit board also comprises a fixing piece 7 for fixing the flexible board 1 on the boss 3;

the flexible-rigid PCB circuit board also comprises a heat dissipation plate detachably connected with the rigid board 2; the hard board 2 is provided with an inserting hole 25 in a penetrating way; the heat dissipation plate comprises a heat conduction layer 41 and a heat dissipation sheet 42 arranged at the bottom of the heat conduction layer 41; the top of the heat conduction layer 41 is provided with a limiting block 43; the limiting block 43 is clamped with the rigid plate 2 after penetrating through the jack 25.

Specifically, in the flexible-rigid PCB described in this embodiment, by connecting the flexible substrate 11 with the heat transfer layer 22 of the rigid board 2, the heat of the flexible substrate 11 can be transferred to the heat dissipation plate through the heat transfer layer 22 for heat dissipation, so as to enhance the heat dissipation performance of the flexible-rigid PCB; in addition, in the embodiment, the flexible board 1 is fixed on the boss 3 through the fixing piece 7, so that the flexible board 1 can be effectively prevented from falling off from the rigid board 2, and the mounting firmness is enhanced; in addition, the heat dissipation plate is arranged at the bottom of the rigid board 2, and the heat of the rigid board 2 and the flexible board 1 can be effectively dissipated through the heat conduction function of the heat conduction layer 41 of the heat dissipation plate and the heat dissipation function of the heat dissipation fins 42; in addition, the heat dissipation plate and the rigid plate 2 can be fixed by arranging the limit block 43 at the top of the heat conduction layer 41 and arranging the insertion hole 25 in the rigid plate 2, so that the heat dissipation plate and the rigid plate 2 can be conveniently detached by inserting the limit block 43 into the insertion hole 25.

In the flexible-rigid PCB of this embodiment, the limiting block 43 includes a connecting strip 51 disposed on the top of the heat conducting layer 41; the top of the connecting strip 51 is downwards connected with an elastic clamping hook 52 which is obliquely arranged; the free end of the elastic hook 52 abuts against the rigid plate 2 after the limiting block 43 passes through the insertion hole 25 of the rigid plate 2.

Specifically, when the rigid board 2 and the heat dissipation plate need to be fixed, the elastic hook 52 is first tightened to insert the limiting block 43 into the insertion hole 25 on the rigid board 2, and after the limiting block 4 completely passes through the insertion hole 25 on the rigid board 2, the free end of the elastic hook 52 forms a barb to tightly clamp the heat dissipation plate in the rigid board 2.

In the flexible-rigid PCB of this embodiment, a reinforcing rib 53 is disposed between the bottom of the connecting bar 51 and the heat conducting layer 41; the strength of the stopper 43 can be enhanced by the above arrangement.

The bottom of the elastic hook 52 is provided with a baffle 54. Abutment with the inner wall of the receptacle 25 is facilitated by the provision of the stop 54.

In the flexible-rigid PCB of this embodiment, the two sides of the heat sink 42 are provided with the raised grains 6. The arrangement can increase the heat dissipation speed because the heat dissipation area is larger than the plane under the condition of the same cross-sectional area.

In the flexible-rigid PCB circuit board of the embodiment, the flexible board 1 is provided with a first through hole in a penetrating manner; the boss 3 is provided with a second through hole; the fixing member 7 includes a shaft portion 71 and a head portion 72; the rod part 71 passes through the first through hole and then is fixed to the second through hole; the head 72 is secured to the flexible circuit layer 13. The first through hole and the second through hole are not shown in the figure.

Specifically, in the present embodiment, the rod portion 71 is fixed to the second through hole after passing through the first through hole, so that the flexible board 1 can be effectively fixed to the boss 3, and the head portion 72 is provided, so that the head portion 72 can be riveted to the flexible board 1 to prevent the fixing member 7 from falling.

In the flexible-rigid PCB of this embodiment, the short copper plate 8 is disposed between the flexible substrate 11 and the boss 3. The above arrangement can facilitate the flexible board 1 to transfer heat into the heat transfer layer 22.

In the flexible-rigid PCB of this embodiment, the heat transfer layer 22 is an aluminum alloy layer.

In the flexible-rigid PCB of this embodiment, a fastening adhesive 9 is disposed between the flexible substrate 11 and the heat transfer layer 22.

In the flexible-rigid PCB circuit board of this embodiment, the top of the rigid circuit layer 24 is provided with an ink film 21.

It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The utility model provides a PCB circuit board of gentle hard combination which characterized in that: comprises a flexible plate (1) and a rigid plate (2) connected with the flexible plate (1); the flexible printed circuit board (1) is sequentially provided with a flexible substrate (11), a flexible insulating layer (12) and a flexible circuit layer (13) from bottom to top; the hard board (2) is sequentially provided with a heat transfer layer (22), a hard insulating layer (23) and a hard circuit layer (24) from bottom to top; the flexible insulating layer (12) is connected with the hard insulating layer (23); the flexible circuit layer (13) is connected with the hard circuit layer (24); the heat transfer layer (22) is provided with a boss (3); the flexible substrate (11) is arranged on the boss (3); the flexible substrate (11) is connected with the heat transfer layer (22);

the flexible-rigid PCB circuit board also comprises a fixing piece (7) used for fixing the flexible board (1) on the boss (3);

the flexible-rigid PCB circuit board also comprises a heat dissipation plate detachably connected with the rigid board (2); the hard board (2) is provided with an insertion hole (25) in a penetrating way; the heat dissipation plate comprises a heat conduction layer (41) and heat dissipation fins (42) arranged at the bottom of the heat conduction layer (41); the top of the heat conduction layer (41) is provided with a limiting block (43); and the limiting block (43) penetrates through the jack (25) and then is clamped with the rigid plate (2).

2. A rigid-flex PCB circuit board as recited in claim 1, wherein: the limiting block (43) comprises a connecting strip (51) arranged at the top of the heat conducting layer (41); the top of the connecting strip (51) is downwards connected with an elastic clamping hook (52) which is obliquely arranged; the limiting block (43) penetrates through the insertion hole (25) of the hard plate (2) and then the free end of the elastic clamping hook (52) abuts against the hard plate (2).

3. A rigid-flex PCB circuit board as recited in claim 2, wherein: reinforcing ribs (53) are arranged between the bottom of the connecting strip (51) and the heat conducting layer (41);

the bottom of the elastic clamping hook (52) is provided with a baffle (54).

4. A rigid-flex PCB circuit board as recited in claim 1, wherein: wave grains (6) are arranged on two sides of the radiating fin (42).

5. A rigid-flex PCB circuit board as recited in claim 1, wherein: the flexible plate (1) is provided with a first through hole in a penetrating manner; the boss (3) is provided with a second through hole; the fixing piece (7) comprises a rod part (71) and a head part (72); the rod part (71) penetrates through the first through hole and then is fixed to the second through hole; the head (72) is secured to the flexible circuit layer (13).

6. A rigid-flex PCB circuit board as recited in claim 1, wherein: and a short copper plate (8) is arranged between the flexible substrate (11) and the boss (3).

7. A rigid-flex PCB circuit board as recited in claim 1, wherein: the heat transfer layer (22) is an aluminum alloy layer.

8. A rigid-flex PCB circuit board as recited in claim 1, wherein: and a fastening glue (9) is arranged between the flexible substrate (11) and the heat transfer layer (22).

9. A rigid-flex PCB circuit board as recited in claim 1, wherein: and an ink film (21) is arranged on the top of the hard circuit layer (24).