CN210444557U - Rigid-flex circuit board - Google Patents
Rigid-flex circuit board Download PDFInfo
- Publication number
- CN210444557U CN210444557U CN201921269827.7U CN201921269827U CN210444557U CN 210444557 U CN210444557 U CN 210444557U CN 201921269827 U CN201921269827 U CN 201921269827U CN 210444557 U CN210444557 U CN 210444557U
- Authority
- CN
- China
- Prior art keywords
- flexible
- layer
- rigid
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000009413 insulation Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to the technical field of printed circuit boards, in particular to a rigid-flexible circuit board, which comprises a flexible board; both ends of the flexible plate are connected with the rigid plates; the flexible board is provided with a flexible substrate, a flexible insulating layer and a flexible circuit layer; the hard board is provided with a hard substrate, a heat dissipation layer, a heat conduction layer, a hard insulation layer and a hard circuit layer; the heat conducting layer is provided with a boss; the flexible substrate is arranged on the boss; the flexible substrate is connected with the heat conducting layer; the rigid-flex circuit board further comprises a fixing piece used for fixing the flexible board on the boss. The utility model connects the flexible substrate with the heat conducting layer of the rigid board, the heat of the flexible substrate can be transmitted to the heat radiating layer through the heat conducting layer to be radiated, thereby enhancing the heat radiation performance of the rigid-flexible circuit board; in addition, the flexible board is fixed on the boss through the fixing piece, so that the flexible board can be effectively prevented from falling off from the rigid board, and the mounting firmness is enhanced.
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to soft or hard combines circuit board.
Background
At present, the printed circuit board technology develops towards multilayering and multifunctionalization, and a plurality of printed circuit boards are required to be bent between different planes for many times, so that the base material of the printed circuit board is required to have better flexibility. With the development and improvement of printed circuit technology, rigid-flex boards have appeared. The rigid-flexible printed circuit board has the characteristics of both FPC and PCB, has the characteristics of high wiring density, light weight, thin thickness and good bending property, but has poor integral heat dissipation effect due to poor heat dissipation effect of the conventional flexible printed circuit board, and the flexible printed circuit board and the rigid printed circuit board are not firmly mounted.
Disclosure of Invention
The utility model aims at providing a soft or hard combines circuit board to the above-mentioned not enough among the prior art.
The purpose of the utility model is realized through the following technical scheme: a rigid-flex circuit board comprises a flexible board; both ends of the flexible plate are connected with the rigid plates; the flexible board is sequentially provided with a flexible substrate, a flexible insulating layer and a flexible circuit layer from bottom to top; the rigid board is sequentially provided with a rigid substrate, a heat dissipation layer, a heat conduction layer, a rigid insulation layer and a rigid circuit layer from bottom to top; the flexible insulating layer is connected with the hard insulating layer; the flexible circuit layer is connected with the hard circuit layer; the heat conducting layer is provided with a boss; the flexible substrate is arranged on the boss; the flexible substrate is connected with the heat conducting layer;
the rigid-flex circuit board further comprises a fixing piece used for fixing the flexible board on the boss.
The utility model is further arranged that the flexible board is provided with a first through hole which runs through the flexible substrate, the flexible insulating layer and the flexible circuit layer; the boss is provided with a second through hole; the fixing piece comprises a rod part and a head part; the rod part penetrates through the first through hole and then is fixed to the second through hole; the head is secured to the flexible circuit layer.
The utility model discloses further set up to, be equipped with the short copper between flexible substrate and the boss.
The utility model discloses further set up to, the heat-conducting layer is the aluminum alloy layer.
The utility model discloses further set up to, be equipped with the fastening between flexible substrate and the heat-conducting layer and glue.
The utility model discloses further set up to, the top on hard circuit layer is equipped with the printing ink film.
The utility model is further arranged that a plurality of heat radiating pieces are arranged in the heat radiating layer; the heat dissipation piece comprises a core branch, a core rod and a core root; the core branches and the core roots are respectively arranged at two ends of the core rod; the core branches and the core roots are respectively connected with the radiating layer.
The utility model discloses further set up to, core branch and core root are the umbrella-type.
The utility model has the advantages that: the utility model connects the flexible substrate with the heat conducting layer of the rigid board, the heat of the flexible substrate can be transmitted to the heat radiating layer through the heat conducting layer to be radiated, thereby enhancing the heat radiation performance of the rigid-flexible circuit board; in addition, the flexible board is fixed on the boss through the fixing piece, so that the flexible board can be effectively prevented from falling off from the rigid board, and the mounting firmness is enhanced.
Drawings
The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived from the following drawings without inventive effort.
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the structure of the flexible board and the rigid board of the present invention;
wherein: 1-a flexible plate; 11-a flexible substrate; 12-a flexible insulating layer; 13-a flexible circuit layer; 2-hard board; 21-a rigid substrate; 22-a heat dissipation layer; 23-a thermally conductive layer; 24-a hard insulating layer; 25-a hard line layer; 26-ink film; 3-boss; 4-a fixing piece; 41-a rod part; 42-a head; 5-short copper plate; 6-fastening glue; 7-a heat sink; 71-core branch; 72-core rod; 73-coreroot.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 2; the flexible-rigid combined circuit board comprises a flexible board 1; both ends of the flexible plate 1 are connected with rigid plates 2; the flexible board 1 is sequentially provided with a flexible substrate 11, a flexible insulating layer 12 and a flexible circuit layer 13 from bottom to top; the hard board 2 is sequentially provided with a hard substrate 21, a heat dissipation layer 22, a heat conduction layer 23, a hard insulation layer 24 and a hard circuit layer 25 from bottom to top; the flexible insulating layer 12 is connected with the rigid insulating layer 24; the flexible circuit layer 13 is connected with the rigid circuit layer 25; the heat conducting layer 23 is provided with a boss 3; the flexible substrate 11 is arranged on the boss 3; the flexible substrate 11 is connected with the heat conduction layer 23;
the rigid-flex circuit board further comprises a fixing piece 4 for fixing the flexible board 1 on the boss 3.
Specifically, in the flexible-rigid printed circuit board according to this embodiment, by connecting the flexible substrate 11 and the heat conducting layer 23 of the rigid board 2, the heat of the flexible substrate 11 can be transferred to the heat dissipation layer 22 through the heat conducting layer 23 for heat dissipation, so as to enhance the heat dissipation performance of the flexible-rigid printed circuit board; in addition, in the present embodiment, the flexible board 1 is fixed on the boss 3 through the fixing member 4, so that the flexible board 1 can be effectively prevented from falling off the rigid board 2, and the mounting firmness is enhanced.
In the flexible-rigid combined circuit board of this embodiment, the flexible board 1 is provided with a first through hole penetrating through the flexible substrate 11, the flexible insulating layer 12 and the flexible circuit layer 13; the boss 3 is provided with a second through hole; the fixing member 4 includes a shaft portion 41 and a head portion 42; the rod part 41 passes through the first through hole and then is fixed to the second through hole; the head 42 is secured to the flexible circuit layer 13. The first through hole and the second through hole are not shown in the figure.
Specifically, in the present embodiment, the shaft portion 41 is fixed to the second through hole after passing through the first through hole, so that the flexible board 1 can be effectively fixed to the boss 3, and the head portion 42 is provided, so that the head portion 42 can be riveted to the flexible board 1 to prevent the fixing member 4 from falling.
In the rigid-flex circuit board of this embodiment, the short copper plate 5 is disposed between the flexible substrate 11 and the boss 3. The above arrangement can facilitate the flexible board 1 to transfer heat into the heat conductive layer 23.
In the flexible-rigid combined circuit board of this embodiment, the heat conducting layer 23 is an aluminum alloy layer.
In the flexible-rigid circuit board according to this embodiment, the fastening adhesive 6 is disposed between the flexible substrate 11 and the heat conducting layer 23. The above arrangement can further enhance the firmness of the installation of the flexible board 1 and the rigid board 2.
In the flexible-rigid combined circuit board of this embodiment, an ink film 26 is disposed on the top of the rigid circuit layer 25.
In the flexible-rigid combined circuit board of this embodiment, a plurality of heat dissipation members 7 are disposed in the heat dissipation layer 22; the heat sink 7 includes a core branch 71, a core rod 72, and a core root 73; the core branches 71 and the core roots 73 are respectively arranged at two ends of the core rod 72; the core branches 71 and the core roots 73 are respectively connected with the heat dissipation layer 22. In the flexible-rigid combined circuit board of this embodiment, the core branches 71 and the core roots 73 are both umbrella-shaped. Specifically, the above arrangement can improve the stability of the heat dissipation layer 22, and the core branches 71 can sufficiently absorb the heat of the heat conduction layer 23, and the heat is transmitted to the core root 73 through the core rod 72, so that the heat is quickly and uniformly dissipated to various angles of the heat dissipation layer 22, and the heat dissipation speed is improved.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. A soft and hard combined circuit board is characterized in that: comprising a flexible plate (1); both ends of the flexible plate (1) are connected with rigid plates (2); the flexible printed circuit board (1) is sequentially provided with a flexible substrate (11), a flexible insulating layer (12) and a flexible circuit layer (13) from bottom to top; the rigid board (2) is sequentially provided with a rigid substrate (21), a heat dissipation layer (22), a heat conduction layer (23), a rigid insulation layer (24) and a rigid circuit layer (25) from bottom to top; the flexible insulating layer (12) is connected with the hard insulating layer (24); the flexible circuit layer (13) is connected with the hard circuit layer (25); the heat conducting layer (23) is provided with a boss (3); the flexible substrate (11) is arranged on the boss (3); the flexible substrate (11) is connected with the heat conduction layer (23);
the rigid-flex circuit board further comprises a fixing piece (4) used for fixing the flexible board (1) on the boss (3).
2. The flexible-rigid combined circuit board of claim 1, wherein: the flexible printed circuit board (1) is provided with a first through hole penetrating through the flexible substrate (11), the flexible insulating layer (12) and the flexible circuit layer (13); the boss (3) is provided with a second through hole; the fixing piece (4) comprises a rod part (41) and a head part (42); the rod part (41) penetrates through the first through hole and then is fixed to the second through hole; the head (42) is secured to the flexible circuit layer (13).
3. The flexible-rigid combined circuit board of claim 1, wherein: and a short copper plate (5) is arranged between the flexible substrate (11) and the boss (3).
4. The flexible-rigid combined circuit board of claim 1, wherein: the heat conduction layer (23) is an aluminum alloy layer.
5. The flexible-rigid combined circuit board of claim 1, wherein: and a fastening glue (6) is arranged between the flexible substrate (11) and the heat conduction layer (23).
6. The flexible-rigid combined circuit board of claim 1, wherein: and an ink film (26) is arranged on the top of the hard circuit layer (25).
7. The flexible-rigid combined circuit board of claim 1, wherein: a plurality of heat dissipation pieces (7) are arranged in the heat dissipation layer (22); the heat dissipation piece (7) comprises a core branch (71), a core rod (72) and a core root (73); the core branches (71) and the core roots (73) are respectively arranged at two ends of the core rod (72); the core branches (71) and the core roots (73) are respectively connected with the heat dissipation layer (22).
8. The flexible-rigid combined circuit board of claim 7, wherein: the core branches (71) and the core roots (73) are both umbrella-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921269827.7U CN210444557U (en) | 2019-08-06 | 2019-08-06 | Rigid-flex circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921269827.7U CN210444557U (en) | 2019-08-06 | 2019-08-06 | Rigid-flex circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210444557U true CN210444557U (en) | 2020-05-01 |
Family
ID=70407779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921269827.7U Expired - Fee Related CN210444557U (en) | 2019-08-06 | 2019-08-06 | Rigid-flex circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210444557U (en) |
-
2019
- 2019-08-06 CN CN201921269827.7U patent/CN210444557U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200501 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |