CN213783693U - Heat dissipation type LED lamp FPC circuit board - Google Patents
Heat dissipation type LED lamp FPC circuit board Download PDFInfo
- Publication number
- CN213783693U CN213783693U CN202023166750.6U CN202023166750U CN213783693U CN 213783693 U CN213783693 U CN 213783693U CN 202023166750 U CN202023166750 U CN 202023166750U CN 213783693 U CN213783693 U CN 213783693U
- Authority
- CN
- China
- Prior art keywords
- led lamp
- circuit board
- copper foil
- heat dissipation
- fpc circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a heat dissipation type LED lamp FPC circuit board, which comprises a substrate, be equipped with the copper foil on the base plate, install the LED lamp on the copper foil, the LED lamp outside is equipped with the subsides and is in insulating film on the copper foil, be equipped with the fin on the insulating film. The insulating film is used for insulating the radiating fin and the copper foil; the radiating fin is used for absorbing heat radiated by the LED lamp and radiating the heat, so that the FPC circuit board has a good radiating effect.
Description
Technical Field
The utility model relates to a FPC circuit board technical field specifically is a heat dissipation type LED lamp FPC circuit board.
Background
The FPC board, also called flexible circuit board, is a flexible printed circuit board with high reliability and excellent performance, which is made of polyimide or polyester film as base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.
Especially, after the FPC circuit board is used for the LED lamp, the application field is wider. However, the heat conductivity of the FPC circuit board material is only 0.4W/m.k, the heat conduction effect is poor, and the heat dissipation of the LED lamp is not facilitated.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: the technical problem of poor heat dissipation effect of the traditional FPC circuit board applied to the LED lamp is solved.
The utility model provides a heat dissipation type LED lamp FPC circuit board, which comprises a substrate, be equipped with the copper foil on the base plate, install the LED lamp on the copper foil, the LED lamp outside is equipped with the subsides and is in insulating film on the copper foil, be equipped with the fin on the insulating film.
The insulating film is used for insulating the radiating fin and the copper foil; the radiating fin is used for absorbing heat radiated by the LED lamp and radiating the heat, so that the FPC circuit board has a good radiating effect.
Furthermore, one end of the radiating fin is provided with a plurality of guide vanes which are arranged at intervals, and the guide vanes point to the side part of the substrate. So set up, make the radiating effect of fin better.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a front view of the present invention;
FIG. 2 is an enlarged view at A in FIG. 1;
FIG. 3 is a right side view at the heat sink;
in the figure: 1. a substrate; 2. copper foil; 3. an LED lamp; 4. an insulating film; 5. a heat sink; 6. and a guide sheet.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
As shown in fig. 1, the utility model relates to a heat dissipation type LED lamp FPC circuit board, including base plate 1, be equipped with copper foil 2 on the base plate 1, install LED lamp 3 on the copper foil 2, as shown in fig. 3, the 3 outsides of LED lamp are equipped with the insulating film 4 of pasting on copper foil 2, are equipped with fin 5 on the insulating film 4.
As shown in fig. 2, the heat sink 5 is provided at one end with a plurality of guide fins 6 arranged at intervals, the guide fins 6 being directed to the side of the substrate. Thus, the heat dissipation effect of the heat dissipation plate 5 is better.
The insulating film 4 is used for insulating the heat sink 5 from the copper foil 2; the radiating fins 5 are used for absorbing heat radiated by the LED lamp 3 and radiating the heat, so that the FPC circuit board has a good radiating effect.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (2)
1. The utility model provides a heat dissipation type LED lamp FPC circuit board, includes base plate (1), be equipped with copper foil (2) on base plate (1), install LED lamp (3) on copper foil (2), its characterized in that: the LED lamp is characterized in that an insulating film (4) adhered to the copper foil (2) is arranged on the outer side of the LED lamp (3), and radiating fins (5) are arranged on the insulating film (4).
2. The FPC board of the heat dissipation type LED lamp of claim 1, wherein: one end of the radiating fin (5) is provided with a plurality of guide vanes (6) which are arranged at intervals, and the guide vanes (6) point to the side part of the substrate (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202023166750.6U CN213783693U (en) | 2020-12-24 | 2020-12-24 | Heat dissipation type LED lamp FPC circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202023166750.6U CN213783693U (en) | 2020-12-24 | 2020-12-24 | Heat dissipation type LED lamp FPC circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213783693U true CN213783693U (en) | 2021-07-23 |
Family
ID=76900164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202023166750.6U Active CN213783693U (en) | 2020-12-24 | 2020-12-24 | Heat dissipation type LED lamp FPC circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213783693U (en) |
-
2020
- 2020-12-24 CN CN202023166750.6U patent/CN213783693U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7443678B2 (en) | Flexible circuit board with heat sink | |
JP4969332B2 (en) | Substrate and lighting device | |
JP2003324214A (en) | Light emitting module | |
JP5429321B2 (en) | Light module and its light components | |
US7943855B2 (en) | Flexible printed circuit board and electronic component assembly | |
CN213783693U (en) | Heat dissipation type LED lamp FPC circuit board | |
TW202318581A (en) | Chip-on-film structure and electronic device | |
CN219437215U (en) | Intelligent heat dissipation multilayer circuit board | |
CN213818342U (en) | High-efficient heat dissipation FPC circuit board | |
CN108124378A (en) | A kind of bent aluminum substrate | |
US20040227230A1 (en) | Heat spreaders | |
CN105263257A (en) | Foldable circuit board for luminescent lamp | |
CN210670726U (en) | Multilayer PCB heat radiation structure | |
JP2012038894A (en) | Substrate module for mounting heat generator, and illumination device | |
CN210670724U (en) | Modularized printed circuit board heat radiation structure | |
CN210432020U (en) | Double-layer straight-through heat-radiating copper substrate structure | |
CN210725475U (en) | Multilayer PCB board with heat radiation structure | |
CN210670727U (en) | Quick heat dissipation type multilayer PCB board | |
CN113727515A (en) | Metal copper-clad plate | |
CN217770471U (en) | Circuit board copper foil substrate with black shielding effect | |
CN218998358U (en) | Multilayer printed circuit board | |
CN210444557U (en) | Rigid-flex circuit board | |
CN219780485U (en) | Flexible circuit board | |
CN216700448U (en) | Multilayer printed FPC circuit board capable of rapidly dissipating heat | |
CN220733091U (en) | Double-sided radiating PCB circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |