CN216700448U - Multilayer printed FPC circuit board capable of rapidly dissipating heat - Google Patents
Multilayer printed FPC circuit board capable of rapidly dissipating heat Download PDFInfo
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- CN216700448U CN216700448U CN202220069714.8U CN202220069714U CN216700448U CN 216700448 U CN216700448 U CN 216700448U CN 202220069714 U CN202220069714 U CN 202220069714U CN 216700448 U CN216700448 U CN 216700448U
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- radiating
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Abstract
The utility model discloses a multilayer printed FPC (flexible printed circuit) board capable of quickly radiating, which comprises a flexible circuit board main body, wherein two mounting structures are symmetrically arranged at the lower end of the flexible circuit board main body, a plurality of radiating structures are uniformly arranged between the two mounting structures, each radiating structure comprises a radiating substrate and a radiating fin structure, and a connecting structure is arranged on each of the two mounting structures. The utility model relates to a multilayer printed FPC (flexible printed circuit) circuit board capable of quickly radiating heat, which belongs to the technical field of circuit boards, and can improve the radiating speed of a flexible circuit board main body by arranging a radiating structure, so that the flexible circuit board main body is not easy to accumulate heat, the probability of burning out the flexible circuit board main body is finally reduced, and the service life of the flexible circuit board main body is prolonged; through setting up connection structure and mounting structure, can be so that heat radiation structure can increase or reduce according to the user demand to finally promote radiating flexibility.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer printed FPC circuit board capable of dissipating heat quickly.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. The multilayer circuit board has the advantages of high assembly density, small volume and light weight, and because of high-density assembly and reduction of connecting lines among components (including parts), the reliability is improved; the wiring layer can be increased, and then the design elasticity is increased; the impedance of the circuit can be formed, a certain high-speed transmission circuit can be formed, the circuit and the electromagnetic shielding layer can be set, and a metal core layer can be arranged to meet the functions and requirements of special thermal insulation and the like; the installation is convenient, the reliability is high. The multilayer pcb has the disadvantages of high cost and long period; a high reliability inspection method is required. Multilayer printed circuits are the product of electronics, multiple functions, high speed, small volume, and large volume. With the development of electronic technology, especially the wide application of large-scale and super-large-scale integrated circuits, the multilayer printed circuit has high density, high precision and high number of fine lines in the direction change.
The heat dissipation speed of the existing multilayer printed FPC circuit board is low in the using process, so that heat of the multilayer printed FPC circuit board is easy to accumulate, the burning probability of the multilayer printed FPC circuit board is increased finally, the multilayer printed FPC circuit board is easy to age, and the service life of the multilayer printed FPC circuit board is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a multilayer printed FPC circuit board capable of quickly dissipating heat, which can effectively solve the problems in the background art.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a multilayer printed FPC circuit board that can dispel heat fast, includes the flexible line way board main part, the lower extreme symmetry of flexible line way board main part is provided with two mounting structure, two evenly install a plurality of heat radiation structure between the mounting structure, heat radiation structure contains heat dissipation base plate and fin structure, two a connection structure all installs on the mounting structure.
Preferably, the flexible circuit board main body is fixedly mounted with the two mounting structures by screws.
Preferably, the mounting structure comprises a mounting substrate and a fixing clamping plate, the fixing clamping plate is provided with a plurality of parts which are uniformly arranged at the inner end of the mounting substrate, the outer end of the mounting substrate is provided with an accommodating groove structure, the inner end of the mounting substrate is provided with a communicating groove structure, the communicating groove structure penetrates through the inner end of the mounting substrate and the accommodating groove structure, and the fixing clamping plate and the mounting substrate are of an integrally formed structure.
Preferably, the heat dissipation substrate on the heat dissipation structure is in contact with the flexible circuit board main body, two mounting clamping grooves are symmetrically formed in the heat dissipation substrate, and the heat dissipation substrate is mounted on the fixing clamping plate on the mounting structure through the mounting clamping grooves formed in the heat dissipation substrate.
Preferably, the radiating fin structures on the radiating structure are a plurality of radiating fin structures which are uniformly arranged, and the radiating fin structures and the radiating substrate are in an integrally formed structure.
Preferably, connection structure contains connection substrate, anticreep baffle and fixed connection board, the outer end at connection substrate is installed to the anticreep baffle, the anticreep baffle is located the groove structure of accomodating that the mounting substrate outer end was seted up, fixed connection board is located the inboard of mounting substrate, connection substrate passes the intercommunication that sets up on the mounting substrate and wears the groove structure and link together anticreep baffle and fixed connection board, a plurality of connection fixed orifices, two have evenly been seted up on the fixed connection board two fixed connection boards on the connection structure pass through bolt fixed mounting together, connection substrate, anticreep baffle and fixed connection board position integrated into one piece structure.
Compared with the prior art, the utility model has the following beneficial effects:
by arranging the heat dissipation structure, the heat dissipation speed of the flexible circuit board main body can be increased, so that the flexible circuit board main body is not easy to accumulate heat, the probability of burning out the flexible circuit board main body is finally reduced, and the service life of the flexible circuit board main body is prolonged; through setting up connection structure and mounting structure, can be so that heat radiation structure can increase or reduce according to the user demand to finally promote radiating flexibility.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of a heat dissipation structure according to the present invention;
FIG. 3 is a schematic structural view of the mounting structure of the present invention;
fig. 4 is a schematic structural view of the connection structure of the present invention.
In the figure: 1. a flexible wiring board main body; 2. a mounting structure; 3. a heat dissipation structure; 4. a connecting structure; 5. a mounting substrate; 6. fixing the clamping plate; 7. a receiving groove structure; 8. the through groove structure is communicated; 9. a heat-dissipating substrate; 10. installing a clamping groove; 11. a heat sink structure; 12. connecting the substrates; 13. an anti-drop baffle plate; 14. fixing the connecting plate; 15. and connecting the fixing holes.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
Referring to fig. 1, 2, 3 and 4, a multilayer printed FPC board capable of dissipating heat quickly includes a flexible circuit board main body 1, two mounting structures 2 are symmetrically disposed at a lower end of the flexible circuit board main body 1, a plurality of heat dissipation structures 3 are uniformly mounted between the two mounting structures 2, each heat dissipation structure 3 includes a heat dissipation substrate 9 and a heat dissipation fin structure 11, a connection structure 4 is mounted on each of the two mounting structures 2, and the flexible circuit board main body 1 is fixedly mounted together with the two mounting structures 2 through screws.
In the embodiment, in order to increase or decrease the heat dissipation structure 3 according to the use requirement, thereby finally improving the flexibility of heat dissipation, a mounting structure 2 and a connection structure 4 are provided, the mounting structure 2 includes a mounting substrate 5 and a fixing clip 6, the fixing clip 6 has a plurality of fixing clips uniformly installed at the inner end of the mounting substrate 5, the outer end of the mounting substrate 5 is provided with an accommodating groove structure 7, the inner end of the mounting substrate 5 is provided with a communicating through groove structure 8, the communicating through groove structure 8 penetrates the inner end of the mounting substrate 5 and the accommodating groove structure 7, the fixing clip 6 and the mounting substrate 5 are an integral structure, the connection structure 4 includes a connection substrate 12, an anti-dropping baffle 13 and a fixing connection plate 14, the anti-dropping baffle 13 is installed at the outer end of the connection substrate 12, the anti-dropping baffle 13 is located in the accommodating groove structure 7 provided at the outer end of the mounting substrate 5, fixed connection board 14 is located the inboard of mounting substrate 5, and connecting substrate 12 passes the intercommunication that sets up on mounting substrate 5 and wears groove structure 8 to link together anticreep baffle 13 and fixed connection board 14, and fixed connection board 14 is last evenly to have seted up a plurality of and to connect fixed orifices 15, and two fixed connection boards 14 on two connection structure 4 pass through bolt fixed mounting together, connecting substrate 12, anticreep baffle 13 and 14 integrated into one piece structures of fixed connection board.
In this embodiment, in order to promote the radiating rate of flexible circuit board main part 1, thereby make flexible circuit board main part 1 be difficult to pile up the heat, finally reduce the probability that flexible circuit board main part 1 burns out, promote the life of flexible circuit board main part 1, heat radiation structure 3 has been set up, heat radiation substrate 9 on the heat radiation structure 3 contacts with flexible circuit board main part 1, two mounting groove 10 have been seted up to the symmetry on the heat radiation substrate 9, heat radiation substrate 9 installs on fixed cardboard 6 on mounting structure 2 through the mounting groove 10 that sets up on it, the last fin structure 11 of heat radiation structure 3 has a plurality of, a plurality of fin structure 11 is even setting up, fin structure 11 and heat radiation substrate 9 are the integrated into one piece structure.
The utility model is a multilayer printed FPC board capable of dissipating heat quickly, when in use and installation, a heat dissipation structure 3 can be installed on two installation structures 2, when in installation, a fixing clamping plate 6 on the installation structure 2 is inserted into an installation clamping groove 10, then two connection structures 4 are installed on the installation structure 2, fixing connection plates 14 on the two installation structures 2 are contacted with each other, finally bolts are used for penetrating through connecting fixing holes 15 formed on the two fixing connection plates 14, so that the two fixing connection plates 14 are fixedly installed together, and finally the installation structure 2 and the flexible circuit board main body 1 are fixedly installed together by using screws; when the heat dissipation structure is used, heat generated by the flexible circuit board main body 1 can be quickly taken away by the heat dissipation structure 3, so that the heat is not easy to accumulate in the flexible circuit board main body 1, the probability of burning out of the flexible circuit board main body 1 is finally reduced, and the service life of the flexible circuit board main body 1 is prolonged.
Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the utility model as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a multilayer printed FPC circuit board that can dispel heat fast, includes flexible line way board main part (1), its characterized in that: the lower extreme symmetry of flexible line way board main part (1) is provided with two mounting structure (2), two evenly install a plurality of heat radiation structure (3) between mounting structure (2), heat radiation structure (3) contain heat dissipation base plate (9) and fin structure (11), two all install a connection structure (4) on mounting structure (2).
2. The multilayer printed FPC board capable of dissipating heat rapidly as recited in claim 1, wherein: the flexible circuit board main body (1) is fixedly installed together with the two installation structures (2) through screws.
3. The multilayer printed FPC board capable of dissipating heat rapidly as recited in claim 2, wherein: mounting structure (2) contain mounting substrate (5) and fixed cardboard (6), fixed cardboard (6) have a plurality of and evenly install the inner at mounting substrate (5), the outer end of mounting substrate (5) has been seted up and has been accomodate groove structure (7), intercommunication wear groove structure (8) have been seted up to the inner of mounting substrate (5), intercommunication wear groove structure (8) run through the inner of mounting substrate (5) and accomodate groove structure (7), fixed cardboard (6) are the integrated into one piece structure with mounting substrate (5).
4. A multilayer printed FPC board that can dissipate heat quickly as claimed in claim 3, characterized in that: the flexible printed circuit board is characterized in that a radiating base plate (9) on the radiating structure (3) is in contact with the flexible printed circuit board main body (1), two mounting clamping grooves (10) are symmetrically formed in the radiating base plate (9), and the radiating base plate (9) is mounted on a fixing clamping plate (6) on the mounting structure (2) through the mounting clamping grooves (10) formed in the radiating base plate.
5. The multilayer printed FPC board capable of dissipating heat rapidly as recited in claim 4, wherein: the radiating fin structure (11) on the radiating structure (3) is provided with a plurality of radiating fin structures (11) which are uniformly arranged, and the radiating fin structures (11) and the radiating base plate (9) are of an integrally formed structure.
6. The multilayer printed FPC board capable of dissipating heat rapidly as recited in claim 5, wherein: the connecting structure (4) comprises a connecting substrate (12), an anti-dropping baffle (13) and a fixed connecting plate (14), the anti-drop baffle (13) is arranged at the outer end of the connecting substrate (12), the anti-drop baffle (13) is positioned in the accommodating groove structure (7) arranged at the outer end of the mounting substrate (5), the fixed connecting plate (14) is positioned at the inner side of the mounting substrate (5), the connecting substrate (12) passes through a communicating through-groove structure (8) arranged on the mounting substrate (5) to connect the anti-falling baffle (13) and the fixed connecting plate (14) together, a plurality of connecting and fixing holes (15) are uniformly arranged on the fixing connecting plates (14), two fixing connecting plates (14) on the two connecting structures (4) are fixedly arranged together through bolts, the connecting base plate (12), the anti-dropping baffle (13) and the fixed connecting plate (14) are of an integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220069714.8U CN216700448U (en) | 2022-01-12 | 2022-01-12 | Multilayer printed FPC circuit board capable of rapidly dissipating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220069714.8U CN216700448U (en) | 2022-01-12 | 2022-01-12 | Multilayer printed FPC circuit board capable of rapidly dissipating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216700448U true CN216700448U (en) | 2022-06-07 |
Family
ID=81818337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220069714.8U Active CN216700448U (en) | 2022-01-12 | 2022-01-12 | Multilayer printed FPC circuit board capable of rapidly dissipating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216700448U (en) |
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2022
- 2022-01-12 CN CN202220069714.8U patent/CN216700448U/en active Active
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