CN216357454U

CN216357454U - High temperature resistant PCB circuit board

Info

Publication number: CN216357454U
Application number: CN202122514196.4U
Authority: CN
Inventors: 张志勤
Original assignee: Dongguan Wannianfu Electronics Co ltd
Current assignee: Dongguan Wannianfu Electronics Co ltd
Priority date: 2021-10-19
Filing date: 2021-10-19
Publication date: 2022-04-19
Anticipated expiration: 2031-10-19

Abstract

The utility model discloses a high-temperature-resistant PCB (printed circuit board), which comprises a circuit board body, wherein the circuit board body is provided with a second heat-conducting plate, the second heat-conducting plate is provided with a first heat-conducting plate, the second heat-conducting plate is provided with a groove, the first heat-conducting plate is provided with a ball bearing, a forward screw and a reverse screw are arranged in the ball bearing, heat-conducting clamping plates are arranged on the forward screw and the reverse screw, the heat-conducting clamping plates are in sliding connection with the first heat-conducting plate, a cooling mechanism is fixedly arranged on the first heat-conducting plate on the left side of the circuit board body, a dust removal mechanism is fixedly arranged on the first heat-conducting plate on the right side of the circuit board body, heat generated by the circuit board body can be transferred through the first heat-conducting plate and the second heat-conducting plate, so that the surface temperature of the circuit board body is prevented from being too high, the circuit board body is installed through double-sided adhesive, the disassembly is convenient, and the circuit board body is not contacted with a plane required to be installed under the support of the first heat-conducting plate, can better radiate heat.

Description

High temperature resistant PCB circuit board

Technical Field

The utility model relates to the field of circuit boards, in particular to a high-temperature-resistant PCB.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.

Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.

The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board.

Since printed circuit boards are not typical end products, they are somewhat confusing in the definition of names such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry. For another example: because of the integrated circuit components mounted on the circuit board, the news media is called an IC board, but it is not substantially identical to a printed circuit board. By printed circuit board we generally say bare board-i.e. a circuit board without upper components.

In the use process of the PCB, heat can be generated on the PCB, and the existing partial PCB has certain heat resistance, but the requirement can not be met when the temperature is too high, so that the PCB is damaged, and therefore the high-temperature-resistant PCB is designed.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a high temperature resistant PCB to solve the above technical problems.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a high temperature resistant PCB circuit board, includes the circuit board body, both ends all have set firmly the second heat-conducting plate about the circuit board body, two the one end that the second heat-conducting plate deviates from mutually all is provided with first heat-conducting plate, it is provided with the recess to run through on the second heat-conducting plate, first heat-conducting plate top and bottom all run through and have set firmly ball bearing, ball bearing inside has set firmly positive and negative screw rod, threaded connection has a plurality of heat conduction splint on the positive and negative screw rod, heat conduction splint and first heat-conducting plate sliding connection are located cooling mechanism has set firmly on the left first heat-conducting plate of circuit board body, are located dust removal mechanism has set firmly on the first heat-conducting plate on circuit board body right side.

Preferably, a plurality of first through holes are arranged on the heat conduction clamping plate in a penetrating mode.

Preferably, cooling mechanism includes cooling water, water storage box, water injection pipe, valve, water storage box and first heat-conducting plate rigid coupling, the inside cooling water that is provided with of water storage box, water storage box left side bottom has set firmly the water injection pipe, install the valve on the water injection pipe.

Preferably, dust removal mechanism includes ventilation case, second through-hole, fan, mounting bracket, ventilation case and first heat-conducting plate rigid coupling, the ventilation hole that is provided with all runs through in the ventilation case left and right sides, the inside mounting bracket that has set firmly of ventilation case, run through on the mounting bracket and set firmly the fan.

Preferably, the second through hole is communicated with the groove.

Preferably, the fan is an electric storage fan.

Preferably, the bottoms of the two first heat conduction plates are fixedly provided with double-sided adhesive tapes.

The utility model has the beneficial effects that:

1. according to the utility model, the heat generated by the circuit board body can be transferred through the first heat conduction plate and the second heat conduction plate, so that the overhigh surface temperature of the circuit board body is avoided, the circuit board body is mounted through the double-sided adhesive tape, the disassembly is convenient, the circuit board body is not contacted with a plane to be mounted under the support of the first heat conduction plate, and the heat can be better radiated.

2. Through cooling down the mechanism, can carry out neutralization with the temperature that shifts to reach the effect for the circuit board body cooling, through dust removal mechanism, can not only effectually blow away the dust that falls into on the circuit board body, guarantee that the circuit board body does not receive the dust harm, can also carry out the cooling for the circuit board body.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the connection between the first heat-conducting plate and the heat-conducting clamping plate according to the present invention;

reference numerals: 1. a first heat-conducting plate; 2. cooling water; 3. a water storage tank; 4. a positive and negative screw; 5. a heat conducting splint; 6. a circuit board body; 7. a second heat-conducting plate; 8. pasting with double-sided adhesive tape; 9. a ventilation box; 10. a second through hole; 11. a fan; 12. a mounting frame; 13. a ball bearing; 14. a first through hole; 15. a groove; 16. a water injection pipe; 17. and (4) a valve.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

As shown in fig. 1-2, a high temperature resistant PCB comprises a circuit board body 6, wherein second heat conducting plates 7 are fixedly arranged at the left and right ends of the circuit board body 6, a first heat conducting plate 1 is arranged at the opposite ends of the two second heat conducting plates 7, a groove 15 is arranged on the second heat conducting plate 7 in a penetrating manner, ball bearings 13 are fixedly arranged at the top and the bottom of the first heat conducting plate 1 in a penetrating manner, positive and negative screw rods 4 are fixedly arranged in the ball bearings 13, a plurality of heat conducting clamping plates 5 are in threaded connection with the positive and negative screw rods 4, the heat conducting clamping plates 5 are in sliding connection with the first heat conducting plate 1, a cooling mechanism is fixedly arranged on the first heat conducting plate 1 at the left side of the circuit board body 6, a dust removing mechanism is fixedly arranged on the first heat conducting plate 1 at the right side of the circuit board body 6, a plurality of first through holes 14 are arranged on the heat conducting clamping plates 5 in a penetrating manner, and double-sided adhesive tapes 8 are fixedly arranged at the bottoms of the two first heat conducting plates 1;

when the heat dissipation device is used specifically, the heat conduction clamping plate 5 can clamp the second heat conduction plate 7 by rotating the positive and negative screw rods 4 so as to fix the circuit board body 6, the circuit board body 6 is installed through the double-sided adhesive tape 8, so that the disassembly is convenient, and the circuit board body 6 is not contacted with a plane to be installed under the support of the first heat conduction plate 1, so that the bottom of the circuit board body 6 can be better dissipated;

the cooling mechanism comprises cooling water 2, a water storage tank 3, a water injection pipe 16 and a valve 17, the water storage tank 3 is fixedly connected with the first heat conduction plate 1, the cooling water 2 is arranged inside the water storage tank 3, the water injection pipe 16 is fixedly arranged at the bottom end of the left side of the water storage tank 3, the valve 17 is arranged on the water injection pipe 16, when a large amount of heat is generated when the circuit board body 6 is used, the heat can be transmitted to the water storage tank 3 through the second heat conduction plate 7 and the first heat conduction plate 1, the water storage tank 3 is used for offsetting the heat by means of the cooling water 2, the cooling effect is achieved, and the cooling water 2 is convenient to replace through the water injection pipe 16 and the valve 17;

dust removal mechanism includes ventilation box 9, second through-hole 10, fan 11, mounting bracket 12, ventilation box 9 and 1 rigid coupling of first heat-conducting plate, the ventilation hole all runs through to be provided with in the ventilation box 9 left and right sides, ventilation box 9 is inside to have set firmly mounting bracket 12, run through on mounting bracket 12 and set firmly fan 11, second through-hole 10 is linked together with recess 15, fan 11 is electric power storage formula fan 11, when remaining the dust on circuit board body 6, can start fan 11, fan 11 produces wind-force and blows, wind is through first through-hole 14, second through-hole 10 blows on circuit board body 6, can not only blow away the dust, can also play the effect of cooling.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high temperature resistant PCB circuit board, includes circuit board body (6), its characterized in that: both ends all set firmly second heat-conducting plate (7), two about circuit board body (6) the one end that second heat-conducting plate (7) deviates from mutually all is provided with first heat-conducting plate (1), it is provided with recess (15) to run through on second heat-conducting plate (7), ball bearing (13) inside has set firmly positive and negative screw rod (4) all to run through in first heat-conducting plate (1) top and bottom, threaded connection has a plurality of heat conduction splint (5) on positive and negative screw rod (4), heat conduction splint (5) and first heat-conducting plate (1) sliding connection are located set firmly cooling mechanism on left first heat-conducting plate (1) of circuit board body (6), are located dust removal mechanism has set firmly on first heat-conducting plate (1) on circuit board body (6) right side.

2. The high temperature resistant PCB circuit board of claim 1, wherein: a plurality of first through holes (14) are arranged on the heat conduction clamping plate (5) in a penetrating mode.

3. The high temperature resistant PCB circuit board of claim 1, wherein: the cooling mechanism comprises cooling water (2), a water storage tank (3), a water injection pipe (16) and a valve (17), the water storage tank (3) is fixedly connected with a first heat conducting plate (1), the cooling water (2) is arranged inside the water storage tank (3), the water injection pipe (16) is fixedly arranged at the bottom end of the left side of the water storage tank (3), and the valve (17) is installed on the water injection pipe (16).

4. The high temperature resistant PCB circuit board of claim 1, wherein: dust removal mechanism includes ventilation case (9), second through-hole (10), fan (11), mounting bracket (12), ventilation case (9) and first heat-conducting plate (1) rigid coupling, ventilation case (9) left and right sides all runs through and is provided with the ventilation hole, ventilation case (9) inside has set firmly mounting bracket (12), run through on mounting bracket (12) and set firmly fan (11).

5. The high temperature resistant PCB circuit board of claim 4, wherein: the second through hole (10) is communicated with the groove (15).

6. The high temperature resistant PCB circuit board of claim 4, wherein: the fan (11) is an electric storage type fan (11).

7. The high temperature resistant PCB circuit board of claim 1, wherein: two double-sided adhesive tapes (8) are fixedly arranged at the bottoms of the first heat conduction plates (1).