CN213847113U - High temperature resistant PCB board - Google Patents
High temperature resistant PCB board Download PDFInfo
- Publication number
- CN213847113U CN213847113U CN202022460942.1U CN202022460942U CN213847113U CN 213847113 U CN213847113 U CN 213847113U CN 202022460942 U CN202022460942 U CN 202022460942U CN 213847113 U CN213847113 U CN 213847113U
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- China
- Prior art keywords
- board
- high temperature
- outside
- inferior
- temperature resistant
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- Expired - Fee Related
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Abstract
The utility model discloses a high temperature resistant PCB board, including mainboard and anticollision institution, the outside of mainboard is provided with inferior board, and the inboard of inferior board has seted up the draw-in groove, and draw-in groove and fixture block cooperation installation simultaneously, the outside of inferior board is provided with the fixed block, and the inboard of fixed block has seted up the fixed slot, and fixed slot and dead lever cooperation installation simultaneously, the inboard of inferior board is provided with the louvre, the outside of inferior board is provided with the vacuum plate, and the outside of vacuum plate is provided with the silica gel membrane, anticollision institution is in the outside of inferior board. This high temperature resistant PCB board, through the setting of vacuum plate and louvre, such design does benefit to the heat conductivity that reduces whole PCB board, improves the heat resistance of board, increases the practical value of board to through the setting of pellosil, such structure is favorable to the antistatic properties of whole panel, and protection panel internal circuit is not destroyed, prolongs the life of panel.
Description
Technical Field
The utility model relates to a PCB board technical field that is related to specifically is a high temperature resistant PCB board.
Background
The printed circuit board, also called printed circuit board, is the provider of electrical connection of electronic components, the printed circuit board is expressed by "PCB" but can not be called PCB board, its development has been over 100 years history, its design is mainly the domain design, the main advantage of adopting the circuit board is that it greatly reduces the error of wiring and assembling, has raised automation level and production labor rate, can be divided into single panel, double-sided board, four-layer board, six-layer board and other multilayer circuit boards according to the number of layers of circuit board, because the printed circuit board is not a general terminal product, therefore it is slightly chaotic in the definition of name, for example the mother board for personal computer, called mainboard, but can not be called circuit board directly, although there is circuit board in the mainboard, but not the same, therefore the two are related but can not be said the same when evaluating the industry. For another example, the news media is called an IC board because of the integrated circuit components mounted on the circuit board, but it is not substantially identical to the printed circuit board. We generally say that the PCB is a bare board, i.e. a circuit board without upper components, and therefore we need a high temperature resistant PCB.
However, the currently used high-temperature-resistant PCB has the disadvantages of poor heat dissipation, poor heat resistance and poor anti-collision performance.
Disclosure of Invention
An object of the utility model is to provide a high temperature resistant PCB board to a high temperature resistant PCB board of using at present who proposes in solving above-mentioned background art, it is not good to have the heat dissipation, and heat resistance is poor, the poor problem of crashworthiness.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistant PCB board, includes mainboard and anticollision institution, the outside of mainboard is provided with inferior board, and the inboard of inferior board has seted up the draw-in groove, and draw-in groove and fixture block cooperation installation simultaneously, the outside of inferior board is provided with the fixed block, and the inboard of fixed block has seted up the fixed slot, and fixed slot and dead lever cooperation installation simultaneously, the inboard of inferior board is provided with the louvre, the outside of inferior board is provided with the vacuum plate, and the outside of vacuum plate is provided with the pellosil, anticollision institution is in the outside of inferior board.
Preferably, the secondary plate is connected with the main plate in a clamping manner through a clamping block, and the clamping block is arranged on the central axis of the main plate.
Preferably, the fixing rod is in threaded connection with the fixing groove, and the outer side wall of the fixing rod and the inner side wall of the fixing groove are both in threaded arrangement.
Preferably, the secondary plate is designed in an opening mode, and the heat dissipation holes are distributed on the secondary plate at equal intervals.
Preferably, the vacuum plate is tightly attached to the main plate, and the outer width of the vacuum plate is consistent with the outer width of the main plate.
Preferably, the silicone membrane is tightly attached to the vacuum plate, and the outer width of the silicone membrane is consistent with the outer width of the vacuum plate.
Preferably, the anticollision institution includes anticollision frame, holding frame, supporting rod and centre gripping pad, and the inboard of anticollision frame is provided with the holding frame, and the holding frame is installed with the supporting rod cooperation simultaneously, the outside of supporting rod is provided with the centre gripping pad.
Compared with the prior art, the beneficial effects of the utility model are that:
1. according to the high-temperature-resistant PCB, through the arrangement of the vacuum plate and the heat dissipation holes, the design is favorable for reducing the heat conductivity of the whole PCB, improving the heat resistance of the PCB and increasing the practical value of the PCB;
2. according to the high-temperature-resistant PCB, the arrangement of the silica gel film is beneficial to the antistatic performance of the whole board, so that the internal circuit of the board is protected from being damaged, and the service life of the board is prolonged;
3. this high temperature resistant PCB board, through anticollision institution, such design is favorable to the crashproof ability of monoblock panel, improves the economic benefits who adorns individual panel.
Drawings
Fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of the structure of the anti-collision mechanism of the present invention;
fig. 4 is a schematic diagram of the structure of the fixing block of the present invention.
In the figure: 1. a main board; 2. a secondary plate; 3. a card slot; 4. a clamping block; 5. a fixed block; 6. fixing grooves; 7. fixing the rod; 8. heat dissipation holes; 9. a vacuum plate; 10. a silicone membrane; 11. an anti-collision mechanism; 1101. an anti-collision frame; 1102. a clamping frame; 1103. a clamping rod; 1104. a clamping pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high temperature resistant PCB board, including mainboard 1 and anticollision institution 11, the outside of mainboard 1 is provided with inferior board 2, and the inboard of inferior board 2 has seted up draw-in groove 3, draw-in groove 3 and the cooperation installation of fixture block 4 simultaneously, the outside of inferior board 2 is provided with fixed block 5, and fixed block 5's inboard has seted up fixed slot 6, fixed slot 6 and the cooperation installation of dead lever 7 simultaneously, the inboard of inferior board 2 is provided with louvre 8, the outside of inferior board 2 is provided with vacuum plate 9, and vacuum plate 9's the outside is provided with pellosil 10, anticollision institution 11 sets up the outside at inferior board 2.
Further, inferior board 2 passes through fixture block 4 and is connected with 1 block of mainboard, and fixture block 4 sets up with the axis of mainboard 1, and such mechanism is favorable to the dismantlement and the equipment of inferior board 2, improves the practicality of panel.
Further, threaded connection between dead lever 7 and the fixed slot 6, and the lateral wall of dead lever 7 and the inside wall of fixed slot 6 are the screw thread form and arrange, and such design does benefit to fixed whole panel, improves the stability of panel.
Furthermore, the secondary plate 2 is in a hole-opening type design, and the heat dissipation holes 8 are distributed on the secondary plate 2 at equal intervals, so that the design is favorable for improving the heat dissipation performance of the plate and increasing the practical value of the plate.
Further, closely laminate between vacuum plate 9 and the mainboard 1, and the outside width of vacuum plate 9 is unanimous with the outside width size of mainboard 1, and such design is favorable to reducing the heat conductivity of whole PCB board, improves the heat resistance of board, increases the practical value of board.
Furthermore, the silicone membrane 10 is tightly attached to the vacuum plate 9, and the width of the outer side of the silicone membrane 10 is consistent with the width of the outer side of the vacuum plate 9, so that the structure is favorable for the antistatic performance of the whole plate, the internal circuit of the plate is protected from being damaged, and the service life of the plate is prolonged.
Further, the anticollision mechanism 11 includes anticollision frame 1101, holding frame 1102, holding rod 1103 and centre gripping pad 1104, and the inboard of anticollision frame 1101 is provided with holding frame 1102, and holding frame 1102 and holding rod 1103 cooperation installation simultaneously, and the outside of holding rod 1103 is provided with centre gripping pad 1104, and such design is favorable to the crashproof performance of monoblock panel, improves the economic benefits of adorning individual panel.
The working principle is as follows: for a high temperature resistant PCB, firstly aligning the notch of a clamping groove 3 arranged on a secondary plate 2 with a clamping block 4 protruding from two ends of a main plate 1 for clamping connection, then tightly attaching a vacuum plate 9 to the outer sides of the main plate 1 and the secondary plate 2, enabling the vacuum plate 9 to completely cover a heat dissipation hole 8 arranged on the secondary plate 2, thus enhancing the heat resistance and heat dissipation performance of the plate, then pasting a silicon film 10 on the whole assembled plate, thus effectively protecting the circuit on the main plate 1 and the secondary plate 2, then installing a fixing block 5 on two sides of the secondary plate 2, secondly installing an anti-collision frame 1101 at two ends of the secondary plate 2, then installing a clamping frame 1102 on the anti-collision frame 1101, then connecting a clamping rod 1103 to the clamping frame 1102, then installing a clamping pad 1104 on the clamping rod 1103, thus the whole anti-collision mechanism 11 is assembled, finally inserting the bottom end of a fixing rod 7 with a thread-shaped protruding end into a fixing groove 6 arranged on the fixing block 5, and screwing up the whole plate to rotate and tighten the fixing groove And fixing to finish the whole installation and use process of the high-temperature-resistant PCB.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a high temperature resistant PCB board, includes mainboard (1) and anticollision institution (11), its characterized in that: the outside of mainboard (1) is provided with inferior board (2), and draw-in groove (3) have been seted up to the inboard of inferior board (2), and draw-in groove (3) and fixture block (4) cooperation installation simultaneously, the outside of inferior board (2) is provided with fixed block (5), and the inboard of fixed block (5) has seted up fixed slot (6), and fixed slot (6) and dead lever (7) cooperation installation simultaneously, the inboard of inferior board (2) is provided with louvre (8), the outside of inferior board (2) is provided with vacuum plate (9), and the outside of vacuum plate (9) is provided with pellosil (10), anticollision institution (11) set up the outside at inferior board (2).
2. The high temperature resistant PCB board of claim 1, wherein: the secondary plate (2) is connected with the main plate (1) in a clamping mode through a clamping block (4), and the clamping block (4) is arranged on the central axis of the main plate (1).
3. The high temperature resistant PCB board of claim 1, wherein: the fixing rod (7) is in threaded connection with the fixing groove (6), and the outer side wall of the fixing rod (7) and the inner side wall of the fixing groove (6) are arranged in a threaded mode.
4. The high temperature resistant PCB board of claim 1, wherein: the secondary plate (2) is designed in an opening mode, and the heat dissipation holes (8) are distributed on the secondary plate (2) at equal intervals.
5. The high temperature resistant PCB board of claim 1, wherein: the vacuum plate (9) is tightly attached to the main plate (1), and the width of the outer side of the vacuum plate (9) is consistent with the width of the outer side of the main plate (1).
6. The high temperature resistant PCB board of claim 1, wherein: the silicone membrane (10) is tightly attached to the vacuum plate (9), and the width of the outer side of the silicone membrane (10) is consistent with the width of the outer side of the vacuum plate (9).
7. The high temperature resistant PCB board of claim 1, wherein: the anti-collision mechanism (11) comprises an anti-collision frame (1101), a clamping frame (1102), a clamping rod (1103) and a clamping pad (1104), wherein the clamping frame (1102) is arranged on the inner side of the anti-collision frame (1101), the clamping frame (1102) and the clamping rod (1103) are installed in a matched mode, and the clamping pad (1104) is arranged on the outer side of the clamping rod (1103).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022460942.1U CN213847113U (en) | 2020-10-30 | 2020-10-30 | High temperature resistant PCB board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022460942.1U CN213847113U (en) | 2020-10-30 | 2020-10-30 | High temperature resistant PCB board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213847113U true CN213847113U (en) | 2021-07-30 |
Family
ID=77012093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202022460942.1U Expired - Fee Related CN213847113U (en) | 2020-10-30 | 2020-10-30 | High temperature resistant PCB board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213847113U (en) |
-
2020
- 2020-10-30 CN CN202022460942.1U patent/CN213847113U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210730 Termination date: 20211030 |
|
CF01 | Termination of patent right due to non-payment of annual fee |