CN210609846U

CN210609846U - Multilayer PCB circuit board

Info

Publication number: CN210609846U
Application number: CN201921534339.4U
Authority: CN
Inventors: 郭永红; 明成兴
Original assignee: Xinfeng Mingshengxing Electronic Co Ltd
Current assignee: Xinfeng Mingshengxing Electronic Co Ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-05-22
Anticipated expiration: 2029-09-16

Abstract

The utility model discloses a multilayer PCB circuit board relates to multilayer PCB circuit board technical field, including first base plate and two fixed plates, be equipped with second base plate and third base plate under the first base plate in proper order, the first heat-conducting plate of last fixed surface of first base plate connection. The utility model relates to a rational in infrastructure, it can be at multilayer PCB circuit board during operation, through being provided with first heat-conducting plate, the second heat-conducting plate, third heat-conducting plate and fourth heat-conducting plate, can guide first base plate, the heat of second base plate and third base plate, through the fan that sets up, at the connecting pipe, the conveyer pipe, set up with the cooperation of through-hole, can be to first heat-conducting plate, the second heat-conducting plate, third heat-conducting plate and fourth heat-conducting plate cool down, recycle the fin that sets up, accelerate first heat-conducting plate, the second heat-conducting plate, the rate of third heat-conducting plate and fourth heat-conducting plate cooling, reach the effect to multilayer PCB circuit board rapid cooling.

Description

Multilayer PCB circuit board

Technical Field

The utility model relates to a multilayer PCB circuit board technical field specifically is a multilayer PCB circuit board.

Background

The PCB circuit board is also called as a printed circuit board, is a provider of electrical connection of electronic components, the design of the PCB circuit board is mainly a layout design, the main advantage of adopting the circuit board is that the errors of wiring and assembly are greatly reduced, the automation level and the production labor rate are improved, in order to increase the area capable of wiring, a printed circuit board with two double surfaces as an inner layer and two single surfaces as an outer layer or two double surfaces as an inner layer and two single surfaces as an outer layer is used, the printed circuit board which is alternately arranged together through a positioning system and an insulating binding material and is interconnected by conductive patterns according to the design requirement becomes a four-layer or six-layer printed circuit board, also called as a multilayer PCB circuit board.

At present to the fixed mode that generally adopts the bolt fastening of installation of multilayer PCB circuit board, cause the damage to multilayer PCB circuit board easily, influence the life of multilayer PCB circuit board, simultaneously because a large amount of electronic components are installed to multilayer PCB circuit board, can produce a large amount of heats when electronic components during operation, lead to multilayer PCB circuit board to rise fast, if not timely cooling, then can cause electronic components's damage, influence the normal operating of multilayer PCB circuit board, for this reason, we propose a multilayer PCB circuit board and solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

The utility model provides a multilayer PCB circuit board for solve the problem of proposing among the background art.

In order to solve the technical problem, the utility model provides a following technical scheme: a multilayer PCB circuit board comprises a first substrate and two fixing plates, wherein a second substrate and a third substrate are sequentially arranged under the first substrate, the upper surface of the first substrate is fixedly connected with a first heat-conducting plate, the upper surface of the first heat-conducting plate is fixedly connected with a first insulating plate, the bottom surface of the first substrate is fixedly connected with a second heat-conducting plate, the bottom surface of the second heat-conducting plate is fixedly connected with a second insulating plate, the bottom surface of the second insulating plate is fixedly connected with the upper surface of the second substrate, the bottom surface of the second substrate is fixedly connected with a third heat-conducting plate, the bottom surface of the third heat-conducting plate is fixedly connected with a third insulating plate, the bottom surface of the third insulating plate is fixedly connected with the upper surface of the third substrate, the bottom surface of the third substrate is fixedly connected with a fourth heat-conducting plate, and the bottom surface of the fourth heat-conducting plate is fixedly connected, symmetrical positioning plates are fixedly connected to the upper surface of the first insulating plate and the bottom surface of the fourth insulating plate, and clamping grooves are formed in the outer surfaces, far away from each other, of the two positioning plates;

two the standing groove has all been seted up to the side that the fixed plate is close to each other, the equal fixedly connected with cardboard of interior diapire of standing groove and the interior diapire of standing groove, the last fixed surface of fixed plate is connected with the fan, the fixed intercommunication in gas outlet of fan has the connecting pipe, and the connecting pipe is provided with three air outlet, every the right flank of fixed plate is all fixed to be inlayed and is had the conveyer pipe that the equidistance was arranged, and the quantity of conveyer pipe is three, the conveyer pipe is close to the one end of connecting pipe all with the fixed intercommunication in air outlet of connecting pipe, every the through-hole that the equidistance was arranged is.

As a preferred technical scheme of the utility model, the horizontal length value of draw-in groove equals with the horizontal length value of locating plate, the cardboard with draw-in groove looks adaptation.

As a preferred technical scheme of the utility model, the symmetrical support frame of bottom surface fixedly connected with of fixed plate, and the upper surface of support frame has seted up the fixed orifices.

As a preferred technical scheme of the utility model, between first heat-conducting plate and the second heat-conducting plate, between second heat-conducting plate and the third heat-conducting plate and between third heat-conducting plate and the fourth heat-conducting plate equal fixed mounting has the fin of equidistance range, every the wind dispelling hole has all been seted up to the right flank of fin.

As a preferred technical scheme of the utility model, fin cross arrangement between fin and second heat-conducting plate between first heat-conducting plate and the second heat-conducting plate and the third heat-conducting plate, fin and the fin cross arrangement between third heat-conducting plate and the fourth heat-conducting plate between second heat-conducting plate and the third heat-conducting plate.

The utility model discloses the beneficial effect who reaches is: the utility model relates to a multilayer PCB circuit board, to the not enough department among the prior art, make following several point improvements, utilize the cooperation setting of draw-in groove and cardboard, can be with the whole joint of multilayer PCB circuit board between two fixed plates, reach the effect of installing multilayer PCB circuit board fast, when multilayer PCB circuit board is worked, through being provided with first heat-conducting plate, the second heat-conducting plate, third heat-conducting plate and fourth heat-conducting plate, can guide the heat of first base plate, second base plate and third base plate, avoid first base plate, the temperature of second base plate and third base plate is too high, simultaneously through the fan that sets up, under the cooperation setting of connecting pipe, conveyer pipe and through-hole, can cool down first heat-conducting plate, the second heat-conducting plate, third heat-conducting plate and fourth heat-conducting plate, recycle the fin that sets up, accelerate first heat-conducting plate, the second heat-conducting plate, The cooling rate of the third heat-conducting plate and the fourth heat-conducting plate achieves the effect of rapidly cooling the multilayer PCB circuit board, and the normal work of the multilayer PCB circuit board can be guaranteed.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the multi-layer PCB of the present invention;

FIG. 2 is a schematic view of the whole fixing plate of the present invention;

fig. 3 is an enlarged schematic view of a structure shown in fig. 1 according to the present invention.

In the figure: 1. a first substrate; 2. a second substrate; 3. a third substrate; 4. a fixing plate; 5. a first heat-conducting plate; 6. a second heat-conducting plate; 7. a third heat-conducting plate; 8. a fourth heat-conducting plate; 9. a first insulating plate; 10. a second insulating plate; 11. positioning a plate; 12. a card slot; 13. a heat sink; 14. a placement groove; 15. clamping a plate; 16. a fan; 17. a connecting pipe; 18. a delivery pipe; 19. a through hole; 20. a support frame; 21. a fixing hole; 22. a ventilation hole; 23. a third insulating plate; 24. a fourth insulating plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, a person skilled in the art can make all other embodiments obtained on the premise of creative work, and all the embodiments belong to the protection scope of the present invention.

Example (b): as shown in FIGS. 1 to 3, a multi-layered PCB circuit board includes a first substrate 1 and two fixing plates 4, a second substrate 2 and a third substrate 3 are sequentially disposed under the first substrate 1, a first heat-conducting plate 5 is fixedly coupled to an upper surface of the first substrate 1, a first insulating plate 9 is fixedly coupled to an upper surface of the first heat-conducting plate 5, a second heat-conducting plate 6 is fixedly coupled to a bottom surface of the first substrate 1, a second insulating plate 10 is fixedly coupled to a bottom surface of the second heat-conducting plate 6, a bottom surface of the second insulating plate 10 is fixedly coupled to an upper surface of the second substrate 2, a third heat-conducting plate 7 is fixedly coupled to a bottom surface of the second substrate 2, a third insulating plate 23 is fixedly coupled to a bottom surface of the third heat-conducting plate 7, a bottom surface of the third insulating plate 23 is fixedly coupled to an upper surface of the third substrate 3, a fourth heat-conducting plate 8 is fixedly coupled to a bottom surface of the fourth heat-conducting plate 8, symmetrical positioning plates 11 are fixedly connected to the upper surface of the first insulating plate 9 and the bottom surface of the fourth insulating plate 24, and clamping grooves 12 are formed in the outer surfaces, far away from each other, of the two positioning plates 11;

standing groove 14 has all been seted up to the side that two fixed plates 4 are close to each other, the equal fixedly connected with cardboard 15 of the interior diapire of standing groove 14 and standing groove 14, the last fixed surface of fixed plate 4 is connected with fan 16, fan 16's the fixed intercommunication in gas outlet has connecting pipe 17, and connecting pipe 17 is provided with three air outlet, the right flank of every fixed plate 4 is all fixed to be inlayed and is had the conveyer pipe 18 that the equidistance was arranged, and the quantity of conveyer pipe 18 is three, conveyer pipe 18 is close to the one end of connecting pipe 17 and all communicates with the air outlet of connecting pipe 17 is fixed, the through-hole 19 that the equidistance was arranged is all seted up to.

Wherein, the horizontal length value of draw-in groove 12 equals with the horizontal length value of locating plate 11, cardboard 15 with draw-in groove 12 looks adaptation.

Wherein, the bottom surface of the fixed plate 4 is fixedly connected with a symmetrical support frame 20, and the upper surface of the support frame 20 is provided with a fixing hole 21.

Radiating fins 13 which are arranged equidistantly are fixedly arranged between the first heat-conducting plate 5 and the second heat-conducting plate 6, between the second heat-conducting plate 6 and the third heat-conducting plate 7 and between the third heat-conducting plate 7 and the fourth heat-conducting plate 8, and the right side surface of each radiating fin 13 is provided with a ventilation hole 22.

The radiating fins 13 between the first heat conduction plate 5 and the second heat conduction plate 6 and the radiating fins 13 between the second heat conduction plate 6 and the third heat conduction plate 7 are arranged in a crossed manner, and the radiating fins 13 between the second heat conduction plate 6 and the third heat conduction plate 7 and the radiating fins 13 between the third heat conduction plate 7 and the fourth heat conduction plate 8 are arranged in a crossed manner.

Specifically, the utility model discloses during the use, a multilayer PCB circuit board, when installing multilayer PCB circuit board, utilize draw-in groove 12 and cardboard 15's cooperation setting, at first with the whole joint of multilayer PCB circuit board between two fixed plates 4, then utilize the cooperation setting of staple and fixed orifices 21, realize the fixed of two fixed plates 4, reach the effect of installing multilayer PCB circuit board fast, multilayer PCB circuit board during operation, through being provided with first heat-conducting plate 5, second heat-conducting plate 6, third heat-conducting plate 7 and fourth heat-conducting plate 8, can guide the heat of first base plate 1, second base plate 2 and third base plate 3, avoid the high temperature of first base plate 1, second base plate 2 and third base plate 3, simultaneously through the fan 16 who sets up, under the cooperation setting of connecting pipe 17, conveyer pipe 18, and through-hole 19, realize to first heat-conducting plate 5, The second heat-conducting plate 6, the third heat-conducting plate 7 and the cooling effect of the fourth heat-conducting plate 8, recycle the fin 13 that sets up for to the speed of first heat-conducting plate 5, second heat-conducting plate 6, the cooling of third heat-conducting plate 7 and fourth heat-conducting plate 8, reach the effect to multilayer PCB circuit board rapid cooling, guarantee that multilayer PCB circuit board normally works.

It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "fixedly," "mounted," "connected," and "connected" are to be construed broadly, e.g., "mounted" may be fixedly connected, or detachably connected, or integrally connected; "connected" may be mechanically or electrically connected; "connected" may be directly connected or indirectly connected through an intermediate member, or may be internal or external to two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A multilayer PCB circuit board, includes first base plate (1) and two fixed plates (4), its characterized in that: a second substrate (2) and a third substrate (3) are sequentially arranged under the first substrate (1), a first heat-conducting plate (5) is fixedly connected to the upper surface of the first substrate (1), a first insulating plate (9) is fixedly connected to the upper surface of the first heat-conducting plate (5), a second heat-conducting plate (6) is fixedly connected to the bottom surface of the first substrate (1), a second insulating plate (10) is fixedly connected to the bottom surface of the second heat-conducting plate (6), the bottom surface of the second insulating plate (10) is fixedly connected to the upper surface of the second substrate (2), a third heat-conducting plate (7) is fixedly connected to the bottom surface of the second substrate (2), a third insulating plate (23) is fixedly connected to the bottom surface of the third heat-conducting plate (7), the bottom surface of the third insulating plate (23) is fixedly connected to the upper surface of the third substrate (3), and a fourth heat-conducting plate (8) is fixedly connected to the bottom surface of the third substrate (3), a fourth insulating plate (24) is fixedly connected to the bottom surface of the fourth heat conducting plate (8), symmetrical positioning plates (11) are fixedly connected to the upper surface of the first insulating plate (9) and the bottom surface of the fourth insulating plate (24), and clamping grooves (12) are formed in the outer surfaces, far away from each other, of the two positioning plates (11);

two standing groove (14) have all been seted up to the side that fixed plate (4) are close to each other, the equal fixedly connected with cardboard (15) of interior roof of standing groove (14) and the interior diapire of standing groove (14), the last fixed surface of fixed plate (4) is connected with fan (16), the fixed intercommunication of gas outlet of fan (16) has connecting pipe (17), and connecting pipe (17) are provided with three air outlet, every the equal fixed conveyer pipe (18) of inlaying of the right flank of fixed plate (4) has the equidistance to be arranged, and the quantity of conveyer pipe (18) is three, conveyer pipe (18) are close to the one end of connecting pipe (17) and all communicate with the air outlet of connecting pipe (17) is fixed, every through-hole (19) that the equidistance was arranged are all seted up to conveyer pipe (18) the surface of keeping.

2. A multilayer PCB circuit board according to claim 1, wherein: the horizontal length value of the clamping groove (12) is equal to that of the positioning plate (11), and the clamping plate (15) is matched with the clamping groove (12).

3. A multilayer PCB circuit board according to claim 1, wherein: the bottom surface of the fixed plate (4) is fixedly connected with symmetrical support frames (20), and the upper surface of each support frame (20) is provided with a fixed hole (21).

4. A multilayer PCB circuit board according to claim 1, wherein: between first heat-conducting plate (5) and second heat-conducting plate (6), between second heat-conducting plate (6) and third heat-conducting plate (7) and between third heat-conducting plate (7) and fourth heat-conducting plate (8) equal fixed mounting has fin (13) of equidistance range, every wind-dispelling hole (22) have all been seted up to the right flank of fin (13).

5. A multilayer PCB circuit board according to claim 1, wherein: the radiating fins (13) between the first heat-conducting plate (5) and the second heat-conducting plate (6) and the radiating fins (13) between the second heat-conducting plate (6) and the third heat-conducting plate (7) are arranged in a crossed manner, and the radiating fins (13) between the second heat-conducting plate (6) and the third heat-conducting plate (7) and the radiating fins (13) between the third heat-conducting plate (7) and the fourth heat-conducting plate (8) are arranged in a crossed manner.