CN210671108U

CN210671108U - Improved PCB

Info

Publication number: CN210671108U
Application number: CN201921534358.7U
Authority: CN
Inventors: 郭永红; 明成兴
Original assignee: Xinfeng Mingshengxing Electronic Co Ltd
Current assignee: Xinfeng Mingshengxing Electronic Co Ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-06-02
Anticipated expiration: 2029-09-16

Abstract

The utility model discloses an improved generation PCB circuit board relates to PCB circuit board technical field, including the PCB circuit board, the layer is pasted to the bottom surface fixedly connected with of PCB circuit board, paste the insulating heat-conducting layer of bottom surface fixedly connected with on layer, the heating panel has been placed to the below of insulating heat-conducting layer, and the upper surface of heating panel contacts with the bottom surface of insulating heat-conducting layer. The utility model relates to a rational in infrastructure, it can be through the staff at first the top of putting the heating panel of PCB circuit board of holding, it fixes to turn over the top of buckling PCB circuit board on two locating frames by the staff, it fixes mounting panel and heating panel moving screw to twist, produce the heat at PCB circuit board during operation, produce through insulating heat-conducting layer and lead to dispelling the heat on the heating panel, under the effect that leads to groove and heat collection post, circulation of air and heat conduction effect have been improved, the radiating effect has been guaranteed, avoid PCB circuit board directly to pass through the fix with screw, the problem of destroying because of the uneven PCB circuit board that leads to of mounting hole atress.

Description

Improved PCB

Technical Field

The utility model relates to a PCB circuit board technical field specifically is an improved generation PCB circuit board.

Background

The PCB circuit board is also called as a printed circuit board, is a provider of electrical connection of electronic components, has been developed for more than 100 years, is mainly designed by a layout, has the main advantages of greatly reducing errors of wiring and assembly, improving the automation level and the production labor rate, and can be divided into single-layer boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards according to the number of layers of the circuit board.

The existing PCB has poor heat dissipation function, a large amount of heat can not be dissipated, the PCB is damaged and cannot be used, and meanwhile, the common PCB is directly fixed on a mounting surface through screws, but the PCB is often damaged due to uneven stress of mounting holes. To this end, we provide an improved PCB circuit board to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides an improved generation PCB circuit board for solve the problem of proposing among the background art.

In order to solve the technical problem, the utility model provides a following technical scheme: an improved PCB circuit board comprises a PCB circuit board, wherein a pasting layer is fixedly connected to the bottom surface of the PCB circuit board, an insulating heat-conducting layer is fixedly connected to the bottom surface of the pasting layer, a heat-radiating plate is placed below the insulating heat-conducting layer, the upper surface of the heat-radiating plate is contacted with the bottom surface of the insulating heat-conducting layer, through grooves are formed in the bottom surface of the insulating heat-conducting layer and are arranged equidistantly, heat-collecting columns are fixedly connected to the inner walls of the through grooves, the bottom ends of the heat-collecting columns are fixedly connected with the upper surface of the heat-radiating plate, positioning frames are placed at the two ends of the PCB circuit board, the two ends of the PCB circuit board are respectively positioned in the two positioning frames, the bottom end of each positioning frame is fixedly hinged to the upper surface of the heat-radiating plate through a pin shaft, mounting plates are fixedly connected to the left, two sets of symmetrical second screw holes are seted up to the upper surface of heating panel, every the screw has all been placed to the top of mounting panel, and the screw end of screw runs through first screw hole and second screw hole in proper order and extends to the below of heating panel, every the screw all with first screw hole and second screw hole threaded connection.

As a preferred technical scheme of the utility model, the guiding gutter that the equidistance was arranged is seted up to the bottom surface of heating panel, and the material of heating panel is nanocarbon.

As a preferred technical scheme of the utility model, every the equal fixedly connected with connecting plate of surface of heating panel bottom, and the bottom surface of connecting plate is connected with the last fixed surface of heating panel.

As an optimal technical scheme of the utility model, every the equal fixedly connected with of inner wall of locating frame and the static polyvinyl chloride board of preventing of locating frame looks adaptation, and the surface of preventing the static polyvinyl chloride board contacts with the surface of PCB circuit board.

As an optimized technical scheme of the utility model, two the air channel has all been seted up to the side that the locating frame was kept away from each other, and the quantity of air channel is nine at least.

The utility model discloses the beneficial effect who reaches is: the utility model relates to an improved generation PCB circuit board, not enough department among the prior art, make following several point improvements, put the top of heating panel through the staff at first the PCB circuit board of holding, it fixes to turn over the top of buckling the PCB circuit board on two locating frames by the staff, it fixes mounting panel and heating panel to twist the screw, produce the heat at PCB circuit board during operation, produce through insulating heat-conducting layer and lead to dispelling the heat on the heating panel, under the effect of logical groove and heat collection post, circulation of air and heat conduction effect have been improved, the radiating effect has been guaranteed, avoid PCB circuit board directly to pass through the fix with screw, the problem of destroying because of the mounting hole atress uneven PCB circuit board that leads to.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a perspective view of the PCB circuit board of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;

fig. 3 is a perspective view of the heat dissipating plate of the present invention.

In the figure: 1. a pin shaft; 2. a positioning frame; 3. a vent channel; 4. a heat dissipation plate; 5. a through groove; 6. a connecting plate; 7. a heat collecting column; 8. an insulating heat-conducting layer; 9. a bonding layer; 10. a PCB circuit board; 11. mounting a plate; 12. a first threaded hole; 13. a screw; 14. a second threaded hole; 15. an antistatic polyvinyl chloride plate; 16. and a diversion trench.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, a person skilled in the art can make all other embodiments obtained on the premise of creative work, and all the embodiments belong to the protection scope of the present invention.

Example (b): as shown in fig. 1-3, an improved PCB comprises a PCB 10, wherein a paste layer 9 is fixedly connected to the bottom surface of the PCB 10, an insulating and heat conducting layer 8 is fixedly connected to the bottom surface of the paste layer 9, a heat dissipating plate 4 is disposed below the insulating and heat conducting layer 8, the upper surface of the heat dissipating plate 4 contacts with the bottom surface of the insulating and heat conducting layer 8, through grooves 5 are disposed on the bottom surface of the insulating and heat conducting layer 8, heat collecting columns 7 are fixedly connected to the inner wall of each through groove 5, the bottom ends of the heat collecting columns 7 are fixedly connected to the upper surface of the heat dissipating plate 4, positioning frames 2 are disposed at the two ends of the PCB 10, the two ends of the PCB 10 are respectively located inside the two positioning frames 2, the bottom end of each positioning frame 2 is fixedly hinged to the upper surface of the heat dissipating plate 4 through a pin 1, and mounting plates 11 are fixedly connected to, first screw hole 12 has all been seted up to the upper surface of every mounting panel 11, and two sets of symmetrical second screw holes 14 have been seted up to the upper surface of heating panel 4, and screw 13 has all been placed to the top of every mounting panel 11, and screw 13's screw thread end runs through first screw hole 12 and second screw hole 14 in proper order and extends to the below of heating panel 4, and every screw 13 all with first screw hole 12 and second screw hole 14 threaded connection.

The bottom surface of the heat dissipation plate 4 is provided with flow guide grooves 16 arranged at equal intervals, and the heat dissipation plate 4 is made of nano carbon. Can make the air circulate, the radiating effect is good.

Wherein, the surface of every heating panel 4 bottom all fixedly connected with connecting plate 6, and the bottom surface of connecting plate 6 and the upper surface fixed connection of heating panel 4. The contact area is increased, and the heat transfer speed is improved.

Wherein, the inner wall of each positioning frame 2 is fixedly connected with an anti-static polyvinyl chloride plate 15 matched with the positioning frame 2, and the outer surface of the anti-static polyvinyl chloride plate 15 is contacted with the outer surface of the PCB 10. Prevent static and produce the damage to PCB circuit board 10, increase the protection to PCB circuit board 10, improve its life.

Wherein, air channel 3 has all been seted up to the side that two locating frame 2 kept away from each other, and air channel 3's quantity is nine at least. The heat accumulation in the positioning frame 2 is avoided from damaging the PCB 10.

Specifically, the utility model discloses during the use, an improved generation PCB circuit board, the staff is at first held PCB circuit board 10 and is put the top of heating panel 4, two locating frames 2 of holding by the staff are turned up and are buckled the top of PCB circuit board 10 and fix, screw 13 is being twisted and is being fixed mounting panel 11 and heating panel 4, produce the heat at PCB circuit board 10 during operation, produce through insulating heat-conducting layer 8 and lead to carrying out the heat dissipation on heating panel 4, under the effect that leads to groove 5 and heat collection post 7, circulation of air and heat conduction effect have been improved, the radiating effect has been guaranteed, it is fixed directly through screw 13 to avoid PCB circuit board 10, lead to the problem that PCB circuit board 10 board destroyed because of the mounting hole atress inequality.

It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "fixedly," "mounted," "connected," and "connected" are to be construed broadly, e.g., "mounted" may be fixedly connected, or detachably connected, or integrally connected; "connected" may be mechanically or electrically connected; "connected" may be directly connected or indirectly connected through an intermediate member, or may be internal or external to two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An improved PCB circuit board, includes PCB circuit board (10), its characterized in that: the bottom surface of the PCB (10) is fixedly connected with a pasting layer (9), the bottom surface of the pasting layer (9) is fixedly connected with an insulating heat conduction layer (8), a heat dissipation plate (4) is placed below the insulating heat conduction layer (8), the upper surface of the heat dissipation plate (4) is contacted with the bottom surface of the insulating heat conduction layer (8), the bottom surface of the insulating heat conduction layer (8) is provided with through grooves (5) which are arranged equidistantly, the inner wall of each through groove (5) is fixedly connected with heat collection columns (7) which are arranged equidistantly, the bottom ends of the heat collection columns (7) are fixedly connected with the upper surface of the heat dissipation plate (4), the two ends of the PCB (10) are respectively placed with positioning frames (2), the two ends of the PCB (10) are respectively positioned inside the two positioning frames (2), and the bottom end of each positioning frame (2) is fixedly hinged with the upper surface of the heat dissipation plate (4) through a pin shaft, every equal fixedly connected with mounting panel (11) in both ends about locating frame (2), every first screw hole (12) have all been seted up to the upper surface of mounting panel (11), two sets of symmetrical second screw holes (14) have been seted up to the upper surface of heating panel (4), every screw (13) have all been placed to the top of mounting panel (11), and the screw end of screw (13) runs through first screw hole (12) and second screw hole (14) in proper order and extend to the below of heating panel (4), every screw (13) all with first screw hole (12) and second screw hole (14) threaded connection.

2. An improved PCB circuit board as defined in claim 1, wherein: the bottom surface of the heat dissipation plate (4) is provided with guide grooves (16) which are arranged at equal intervals, and the heat dissipation plate (4) is made of nano carbon.

3. An improved PCB circuit board as defined in claim 1, wherein: every the surface of heating panel (4) bottom all fixedly connected with connecting plate (6), and the bottom surface of connecting plate (6) and the last fixed surface of heating panel (4) are connected.

4. An improved PCB circuit board as defined in claim 1, wherein: every the equal fixedly connected with of inner wall of posting (2) prevents static polyvinyl chloride board (15) with posting (2) looks adaptation, and prevents that the surface of static polyvinyl chloride board (15) contacts with the surface of PCB circuit board (10).

5. An improved PCB circuit board as defined in claim 1, wherein: two air channel (3) have all been seted up to the side that locating frame (2) kept away from each other, and the quantity of air channel (3) is nine at least.