CN216250705U - Low-impedance breakdown-resistant patch voltage-stabilizing diode - Google Patents

Abstract

The utility model discloses a low-impedance breakdown-resistant patch voltage-stabilizing diode, which comprises a diode body and an installation mechanism, wherein pins are fixedly connected to two sides of the bottom end of the diode body, the installation mechanism comprises a connecting sheet and L-shaped supporting seats, the two ends of the connecting sheet are fixedly connected with the L-shaped supporting seats, an installation groove is formed between the top end surface of the connecting sheet and one side of each of the two L-shaped supporting seats, the bottom of the diode body is fixedly bonded in the installation groove, the installation mechanism is arranged between the diode body and a main board after installation, so that the heat of the diode body is conveniently transmitted and dissipated, air can flow from a ventilation groove, the heat between the bottom end of the diode body and the main board is further conveniently dissipated, the diode body is effectively prevented from thermal breakdown, the pins are integrally installed in a plug-in-out mode during installation, the assembly and the disassembly are convenient, and the diode is integrally fixed on the main board through the installation mechanism after the installation, the service life is prolonged.

Description

Low-impedance breakdown-resistant patch voltage-stabilizing diode

Technical Field

The utility model belongs to the technical field of diodes, and particularly relates to a low-impedance breakdown-resistant surface-mounted voltage stabilizing diode.

Background

The diode and the electronic element are provided with a device with two electrodes, current is only allowed to flow in a single direction, a plurality of applications use the rectification function, most of the current directionality of the diode is generally called as the rectification function, the most common function of the diode is to only allow the current to flow in the single direction and block the current in the reverse direction, therefore, the diode can be thought of as a check valve of an electronic plate, the existing patch type diode is generally welded on a main plate by pins when being installed, the gap between the bottom end face of the diode and the bottom end face of the main plate is extremely small after the diode is installed, the heat of the diode face is not smoothly dissipated, the diode face is easy to be damaged by thermal breakdown after long-time use, and the pins of the mounting mode are directly stressed, are easy to damage when being vibrated, and the subsequent disassembly and assembly are inconvenient.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a low-impedance breakdown-resistant patch voltage stabilizing diode to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a resistant paster zener diode that punctures of low impedance, includes diode body and installation mechanism, the equal fixedly connected with pin in both sides of diode body bottom, installation mechanism includes connection piece and L shape supporting seat, the equal fixedly connected with L shape supporting seat in both ends of connection piece, the top face and two of connection piece form the mounting groove between one side of L shape supporting seat, the bottom fixed bonding of diode body is in the inside of mounting groove, the bottom face and two of connection piece form the ventilation groove between one side of L shape supporting seat, the air vent has been seted up on the surface of connection piece, the air vent has a plurality of, and a plurality of air vent evenly distributed, the both sides of connection piece all inlay and are equipped with insulating sleeve, two the pin runs through two respectively insulating sleeve.

Preferably, the connecting sheet and the L-shaped supporting seat respectively comprise a heat-conducting metal layer, a heat-insulating layer and an insulating layer, the heat-insulating layer is fixedly connected to one side of the heat-conducting metal layer, and the insulating layer is fixedly connected to one side of the heat-insulating layer.

Preferably, the heat-conducting metal layer is made of stainless steel, the heat-insulating layer is made of glass fiber, and the insulating layer is made of rubber.

Preferably, the heat dissipation groove has been seted up on the heat conduction metal level top surface of connection piece, the heat dissipation groove has a plurality of, and a plurality of the heat dissipation groove distributes along the width direction equidistance of connection piece.

Preferably, two threaded holes are formed in two sides of the bottom end of each L-shaped supporting seat.

Preferably, the pins comprise a conductive connecting column and a metal ring, the metal ring is fixedly sleeved in the middle of the side wall of the conductive connecting column, a milling groove is formed in the bottom of the side wall of the conductive connecting column, elastic metal folding pieces are fixedly connected to the side wall of the milling groove, the elastic metal folding pieces are provided with a plurality of numbers, and the elastic metal folding pieces are distributed around the axis of the conductive connecting column at equal intervals.

Preferably, the bottom end surfaces of the metal ring and the two L-shaped supporting seats are in the same horizontal plane.

Compared with the prior art, the utility model has the beneficial effects that: be equipped with installation mechanism between installation back diode body and the mainboard, the thermal transmission of the diode body of being convenient for scatters and disappears, and the air can be followed the ventilation groove and circulated moreover, and then the heat between the diode body bottom of being convenient for and the mainboard scatters and disappears, prevents effectively that diode body thermal breakdown, and the pin is whole to be installed through the mode of plug during the installation, and the dismouting of being convenient for passes through installation mechanism after the installation moreover and fixes diode whole on the mainboard, reduces the atress of pin, improves life.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of a portion A of the present invention;

FIG. 3 is a front view of the present invention;

FIG. 4 is a front cross-sectional view of the present invention;

fig. 5 is a schematic structural view of a part B of the present invention.

In the figure: 1. a diode body; 2. a pin; 21. a conductive connection post; 22. a metal ring; 23. an elastic metal flap; 3. an installation mechanism; 31. connecting sheets; 311. a heat-conducting metal layer; 312. a thermal insulation layer; 313. an insulating layer; 32. an L-shaped support seat; 33. mounting grooves; 34. a ventilation slot; 35. a vent hole; 36. a heat sink; 4. an insulating sleeve.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a resistant paster zener diode that punctures of low impedance, including diode body 1 and installation mechanism 3, the equal fixedly connected with pin 2 in both sides of 1 bottom of diode body, installation mechanism 3 includes connection piece 31 and L shape supporting seat 32, the equal fixedly connected with L shape supporting seat 32 in both ends of connection piece 31, form mounting groove 33 between the top face of connection piece 31 and one side of two L shape supporting seats 32, diode body 1's bottom fixed bonding is in the inside of mounting groove 33, form ventilation groove 34 between the bottom face of connection piece 31 and one side of two L shape supporting seats 32, air vent 35 has been seted up on the surface of connection piece 31, air vent 35 has a plurality of, and a plurality of air vent 35 evenly distributed, connection piece 31's both sides all inlay and are equipped with insulating sleeve 4, two insulating sleeve 4 are run through respectively to two pin 2.

Preferably, the connecting sheet 31 and the L-shaped supporting base 32 each include a heat conducting metal layer 311, a heat insulating layer 312 and an insulating layer 313, the heat insulating layer 312 is fixedly connected to one side of the heat conducting metal layer 311, the insulating layer 313 is fixedly connected to one side of the heat insulating layer 312, and the heat conducting metal layer 311 is used for absorbing and transferring heat at the bottom end face of the diode body 1 and then dissipating the heat into the air, so as to prevent the heat at the bottom end face of the diode body 1 from being dissipated smoothly, which leads to thermal breakdown of the diode body 1 as a whole.

Preferably, the heat-conducting metal layer 311 is made of stainless steel, the heat-insulating layer 312 is made of glass fiber, the insulating layer 313 is made of rubber, the heat-insulating layer 312 made of glass fiber has a heat-insulating effect, and therefore heat generated by the main board is prevented from being transferred to the heat-conducting metal layer 311 to influence the heat dissipation effect of the diode body 1, the insulating layer 313 made of rubber has an insulating effect, and the phenomenon that when the diode is integrally installed, the main board contact is short-circuited through the installation mechanism 3 is avoided.

Preferably, the top surface of the heat conducting metal layer 311 of the connecting sheet 31 is provided with a plurality of heat dissipation grooves 36, the plurality of heat dissipation grooves 36 are equidistantly distributed along the width direction of the connecting sheet 31, and the arrangement of the plurality of heat dissipation grooves 36 further improves the circulation of air at the bottom end surface of the diode body 1, thereby improving the heat dissipation effect.

Preferably, threaded holes are formed in two sides of the bottom ends of the two L-shaped supporting seats 32, and the mounting mechanism 3 is integrally mounted on the main board through screws during mounting, so that mounting stability is improved.

Preferably, the pin 2 includes the electrically conductive spliced pole 21 and becket 22, the fixed cover in middle part of the electrically conductive spliced pole 21 lateral wall is equipped with becket 22, the milling flutes has been seted up to the bottom of the electrically conductive spliced pole 21 lateral wall, the lateral wall fixed connection elastic metal folded piece 23 of milling flutes, elastic metal folded piece 23 has a plurality of, and a plurality of elastic metal folded piece 23 distributes around the axis equidistance of electrically conductive spliced pole 21, during the installation with two electrically conductive spliced poles 21 respectively insert the mounting hole that corresponds on the mainboard, insert back elastic metal folded piece 23 and contract inwards, contact with the metallic coating of jack inner wall, improve the compactness between the whole pin 2 and the jack, prevent contact failure, the top of jack is arranged in to the becket 22 after the electrically conductive spliced pole 21 pegs graft in place, the bottom of becket 22 is connected with the metallic coating ring at jack top edge, further avoid contact failure.

Preferably, the bottom end surface of the metal ring 22 and the bottom end surfaces of the two L-shaped supporting seats 32 are in the same horizontal plane, and after the L-shaped supporting seats 32 are installed on the main board by screws, the bottom end of the metal ring 22 is ensured to be in contact with the top end surface of the main board.

The working principle and the using process of the utility model are as follows: after the installation of the utility model, firstly checking the installation fixing and the safety protection of the utility model, then the utility model can be used, when in installation, two conductive connecting columns 21 are respectively inserted into corresponding jacks on the main board, after the conductive connecting columns 21 are inserted in place, the elastic metal folding pieces 23 are pressed inwards to shrink and contact with the metal coating on the inner walls of the jacks, the tightness between the whole pins 2 and the jacks is improved, poor contact is prevented, after the conductive connecting columns 21 are inserted in place, the metal rings 22 are arranged at the top ends of the jacks, the bottom ends of the metal rings 22 are connected with the metal coating on the edges of the top ends of the jacks, poor contact is further avoided, then the installation mechanism 3 is fixedly installed on the main board by penetrating screws through screw holes on the connecting pieces 31, when in use, the heat conducting metal layer 311 is used for absorbing and transferring the heat of the bottom end face of the diode body 1 and then dissipating the heat into the air, thereby avoiding the unsmooth dissipation of the bottom end face of the diode body 1, lead to the whole by thermal breakdown of diode body 1, insulating layer 312 that glass fiber made has thermal-insulated effect, avoid on the heat conduction metal level 311 of mainboard production heat transfer, influence the effect that diode body 1 heat was lost, insulating layer 313 that rubber was made has insulating effect, avoid diode whole when installing, lead to the mainboard contact to pass through installation mechanism 3 short circuit, the setting up of a plurality of radiating grooves 36 does benefit to the circulation of diode body 1 bottom face air, thereby improve the radiating effect, air can circulate from ventilation groove 34 when using, and then be convenient for the heat loss between diode body 1 bottom and the mainboard.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a low impedance is able to bear or endure paster zener diode of puncture, includes diode body (1) and installation mechanism (3), its characterized in that: the LED lamp is characterized in that pins (2) are fixedly connected to two sides of the bottom end of the diode body (1), the mounting mechanism (3) comprises a connecting piece (31) and L-shaped supporting seats (32), the L-shaped supporting seats (32) are fixedly connected to two ends of the connecting piece (31), mounting grooves (33) are formed between the top end face of the connecting piece (31) and one side of the two L-shaped supporting seats (32), the bottom of the diode body (1) is fixedly bonded inside the mounting grooves (33), ventilating grooves (34) are formed between the bottom end face of the connecting piece (31) and one side of the two L-shaped supporting seats (32), air holes (35) are formed in the surface of the connecting piece (31), the air holes (35) are provided with a plurality of air holes (35) which are uniformly distributed, and insulating sleeves (4) are embedded in two sides of the connecting piece (31), the two pins (2) penetrate through the two insulating sleeves (4) respectively.

2. The low-impedance breakdown-resistant patch zener diode of claim 1 wherein: the connecting sheet (31) and the L-shaped supporting seat (32) comprise a heat-conducting metal layer (311), a heat-insulating layer (312) and an insulating layer (313), the heat-insulating layer (312) is fixedly connected to one side of the heat-conducting metal layer (311), and the insulating layer (313) is fixedly connected to one side of the heat-insulating layer (312).

3. The low-impedance breakdown-resistant patch zener diode of claim 2 wherein: the heat-conducting metal layer (311) is made of stainless steel, the heat-insulating layer (312) is made of glass fiber, and the insulating layer (313) is made of rubber.

4. The low-impedance breakdown-resistant patch zener diode of claim 2 wherein: heat dissipation groove (36) have been seted up on heat conduction metal layer (311) top surface of connection piece (31), heat dissipation groove (36) have a plurality of, and a plurality of heat dissipation groove (36) are along the width direction equidistance distribution of connection piece (31).

5. The low-impedance breakdown-resistant patch zener diode of claim 1 wherein: threaded holes are formed in two sides of the bottom end of each L-shaped supporting seat (32).

6. The low-impedance breakdown-resistant patch zener diode of claim 1 wherein: the pin (2) comprises a conductive connecting column (21) and a metal ring (22), the metal ring (22) is fixedly sleeved in the middle of the side wall of the conductive connecting column (21), a milling groove is formed in the bottom of the side wall of the conductive connecting column (21), an elastic metal folding piece (23) is fixedly connected to the side wall of the milling groove, the elastic metal folding piece (23) is provided with a plurality of elastic metal folding pieces (23), and the elastic metal folding pieces (23) are equidistantly distributed around the axis of the conductive connecting column (21).

7. The low-impedance breakdown-resistant patch zener diode of claim 6 wherein: the bottom end surfaces of the metal rings (22) and the two L-shaped supporting seats (32) are positioned in the same horizontal plane.

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