CN210016685U

CN210016685U - HDI high density laminated plate

Info

Publication number: CN210016685U
Application number: CN201920430177.3U
Authority: CN
Inventors: 陈裕斌; 余东良; 江善华
Original assignee: Xinfeng Huihe Circuit Co Ltd
Current assignee: Xinfeng Huihe Circuit Co Ltd
Priority date: 2019-04-01
Filing date: 2019-04-01
Publication date: 2020-02-04
Anticipated expiration: 2029-04-01

Abstract

The utility model discloses a HDI high density laminated board, including the base plate, the lower surface paste of base plate is fixed with first rigidity layer, and the last surface paste of base plate is fixed with second rigidity layer, and the last surface paste on second rigidity layer is fixed with first heat dissipation layer, and first louvre is seted up to the inside on first heat dissipation layer. The HDI high-density laminated plate effectively solves the problem that the internal temperature of HDI circuit boards is high due to poor heat dissipation effect of some HDI high-density laminated plates at present by arranging the heat dissipation component, and ensures the service lives of the HDI circuit boards and electrical components; in addition, the problem that the HDI high-density laminated plates are poor in strength and extremely easy to damage HDI circuit boards in the installation process is solved by arranging the fixing parts, and the quality of the whole HDI circuit board is improved.

Description

HDI high density laminated plate

Technical Field

The utility model relates to a HDI high density laminated board technical field specifically is HDI high density laminated board.

Background

High Density Interconnect (HDI) manufacturing is a fastest growing field in the printed wiring board industry, a circuit board with relatively high line distribution density using micro-blind buried via technology, and HDI is a compact product designed specifically for small-volume users.

However, some current HDI high-density laminated plates often have poor heat dissipation effects, so that the internal temperature of the HDI circuit board is high, and the service lives of the HDI circuit board and electrical components are affected; and in addition, some HDI high-density laminated plates have poor strength, and the HDI circuit board is very easy to damage in the installation process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a HDI high density laminated board to it is poor because of the radiating effect often to solve some HDI high density laminated boards, and leads to the inside temperature of HDI circuit board higher, influences HDI circuit board and electrical components's life's problem.

In order to achieve the above object, the utility model provides a following technical scheme: HDI high density laminated board, including the base plate, the lower surface paste of base plate is fixed with first rigid layer, the upper surface paste of base plate is fixed with the second rigid layer, the upper surface paste on second rigid layer is fixed with first heat dissipation layer, first louvre is seted up to the inside on first heat dissipation layer.

Preferably, a circuit board is fixedly attached to the upper surface of the first heat dissipation layer, and a second heat dissipation layer is fixedly attached to the upper surface of the circuit board.

Preferably, a second heat dissipation hole is formed in the second heat dissipation layer, and the upper surface of the second heat dissipation layer is coated with a graphene heat dissipation layer.

Preferably, vertical radiating holes are formed in the base plate, and penetrate through the second radiating layer, the circuit board, the first radiating layer, the second rigid layer and the first rigid layer.

Preferably, a first fixing plate is fixedly attached to the left side surface and the right side surface of the substrate, a second fixing plate is fixedly attached to the side surface of the first fixing plate, and the surface of the second fixing plate is penetrated by the second heat dissipation hole and the first heat dissipation hole.

Compared with the prior art, the beneficial effects of the utility model are that: the HDI high-density laminated plate effectively solves the problem that the internal temperature of HDI circuit boards is high due to poor heat dissipation effect of some HDI high-density laminated plates at present by arranging the heat dissipation component, and ensures the service lives of the HDI circuit boards and electrical components; in addition, the problem that the HDI high-density laminated plates are poor in strength and extremely easy to damage HDI circuit boards in the installation process is solved by arranging the fixing parts, and the quality of the whole HDI circuit board is improved.

Drawings

FIG. 1 is a block diagram of the present invention;

FIG. 2 is a front view of the present invention;

fig. 3 is a top view of the present invention.

In the figure: 1, a graphene heat dissipation layer; 2 a second heat dissipation hole; 3 a first heat dissipation hole; 4 a first fixing plate; 5, vertical heat dissipation holes; 6 a second fixing plate; 7 a first rigid layer; 8 a second heat dissipation layer; 9 a circuit board; 10 a first heat dissipation layer; 11 a second rigid layer; 13 a substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 or fig. 2, the present invention provides a technical solution: a high-density laminated plate of HDI comprises a substrate 13, a first rigid layer 7 is fixedly adhered to the lower surface of the substrate 13, the first rigid layer 7 is made of polyethylene and has good strength, which is beneficial to improving the strength of the whole HDI circuit board, a second rigid layer 11 is fixedly adhered to the upper surface of the substrate 13, the second rigid layer 11 is made of nano carbon material, which also has higher strength and is beneficial to improving the strength of the whole HDI circuit board, first fixing plates 4 are fixedly adhered to the left side surface and the right side surface of the substrate 13, a second fixing plate 6 is fixedly adhered to the side surface of the first fixing plate 4, the first fixing plate 4 and the second fixing plate 6 improve the side surface strength of the HDI circuit board under the condition of protecting the side surface of the HDI circuit board from being damaged, the problem that the circuit board is easily damaged in the installation process due to the fact that the strength of some HDI high-density laminated plates is poor is solved through the fixing part, and the quality of the whole HDI circuit board is improved.

Referring to fig. 1 or fig. 3, a first heat dissipation layer 10 is adhered and fixed on the upper surface of a second rigid layer 11, the first heat dissipation layer 10 is made of polyphenylene sulfide and has a good heat dissipation effect, a first heat dissipation hole 3 is formed inside the first heat dissipation layer 10, the first heat dissipation hole 3 is provided with a plurality of heat dissipation holes which are arranged in parallel and penetrate through the surface of a second fixing plate 6, so that heat generated in the use process of the HDI circuit board can be dissipated to the outside through the first heat dissipation hole 3, a circuit board 9 is adhered and fixed on the upper surface of the first heat dissipation layer 10, a second heat dissipation layer 8 is adhered and fixed on the upper surface of the circuit board 9, the second heat dissipation layer 8 is made of a natural graphite heat dissipation film, a second heat dissipation hole 2 is formed inside the second heat dissipation layer 8, the second heat dissipation hole 2 is also provided with a plurality of heat dissipation holes which are arranged in parallel and penetrate through the surface of the second fixing plate 6, the upper surface, graphite alkene heat dissipation layer 1 multiplicable radiating effect, a plurality of vertical louvres 5 have been seted up to the inside of base plate 13, vertical louvre 5 runs through in second heat dissipation layer 8 simultaneously, circuit board 9, first heat dissipation layer 10, second rigidity layer 11 and first rigidity layer 7, through setting up the radiating part effectively solved some current HDI high density laminated boards often lead to the higher problem of HDI circuit board internal temperature because of the radiating effect is poor, the life of HDI circuit board and electrical components has been ensured.

The utility model discloses when concrete implementation: the lower surface of the base plate 13 is fixedly adhered with a first rigid layer 7, the material of the first rigid layer 7 is polyethylene, the strength of the whole HDI circuit board is improved, the upper surface of the base plate 13 is fixedly adhered with a second rigid layer 11, the second rigid layer 11 is a nano carbon material, the first rigid layer 7 and the second rigid layer 11 have higher strength, the strength of the whole HDI circuit board is improved, the left side surface and the right side surface of the base plate 13 are fixedly adhered with a first fixing plate 4, the side surface of the first fixing plate 4 is fixedly adhered with a second fixing plate 6, the first fixing plate 4 and the second fixing plate 6 improve the side surface strength of the HDI circuit board under the condition of protecting the side surface of the HDI circuit board from being damaged, the problem that the circuit board is easily damaged in the installation process due to the fact that the strength of some HDI high-density laminated plates is poor is solved through the fixing part, and the quality of the whole HDI circuit board is improved. A first heat dissipation layer 10 is fixedly adhered on the upper surface of the second rigid layer 11, the material of the first heat dissipation layer 10 is polyphenylene sulfide which has good heat dissipation effect, a first heat dissipation hole 3 is arranged inside the first heat dissipation layer 10, a second heat dissipation layer 8 is fixedly adhered on the upper surface of the circuit board 9, the material of the second heat dissipation layer 8 is a natural graphite heat dissipation film, a second heat dissipation hole 2 is arranged inside the second heat dissipation layer 8, the high temperature in the HDI circuit board can be better dissipated to the outside through the first heat dissipation hole 3, the second heat dissipation hole 2 and the vertical heat dissipation hole 5, meanwhile, the upper surface of the second heat dissipation layer 8 is coated with the graphene heat dissipation layer 1, the graphene heat dissipation layer 1 can also increase the heat dissipation effect, the problem that the internal temperature of HDI circuit boards is high due to poor heat dissipation effect of some HDI high-density laminated boards at present is effectively solved through the arrangement of the heat dissipation component, and the service lives of the HDI circuit boards and electrical components are guaranteed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

An HDI high density laminated board, including base plate (13), its characterized in that: the lower surface of base plate (13) is pasted and is fixed with first rigidity layer (7), the upper surface of base plate (13) is pasted and is fixed with second rigidity layer (11), the upper surface of second rigidity layer (11) is pasted and is fixed with first heat dissipation layer (10), first louvre (3) are seted up to the inside of first heat dissipation layer (10).
2. An HDI high density laminate according to claim 1 wherein: a circuit board (9) is fixedly attached to the upper surface of the first heat dissipation layer (10), and a second heat dissipation layer (8) is fixedly attached to the upper surface of the circuit board (9).
3. An HDI high density laminate according to claim 2 wherein: second louvre (2) have been seted up to the inside on second heat dissipation layer (8), graphite alkene heat dissipation layer (1) has been paintd on the upper surface on second heat dissipation layer (8).
4. An HDI high density laminate according to claim 1 wherein: vertical radiating holes (5) are formed in the base plate (13), and the vertical radiating holes (5) penetrate through the second radiating layer (8), the circuit board (9), the first radiating layer (10), the second rigid layer (11) and the first rigid layer (7) simultaneously.
5. An HDI high density laminate according to claim 1 wherein: the side is pasted and is fixed with first fixed plate (4) about base plate (13), the side of first fixed plate (4) is pasted and is fixed with second fixed plate (6), the surface of second fixed plate (6) is run through by second louvre (2) and first louvre (3).