CN206865825U - A kind of thermal conductivity flexible wiring board - Google Patents
A kind of thermal conductivity flexible wiring board Download PDFInfo
- Publication number
- CN206865825U CN206865825U CN201721003561.2U CN201721003561U CN206865825U CN 206865825 U CN206865825 U CN 206865825U CN 201721003561 U CN201721003561 U CN 201721003561U CN 206865825 U CN206865825 U CN 206865825U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- heat
- board body
- insulation layer
- thermal insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of thermal conductivity flexible wiring board,Including wiring board body,The middle part of the wiring board body is provided with flexible-belt,Heat abstractor is uniformly provided with wiring board body,The wiring board body shares three layers,The middle level of wiring board body is copper foil layer,The wiring board body up and down two layers be thermal insulation layer,Thermal insulation layer passes through heat-conducting glue and copper foil layer adhesion,The surface of the thermal insulation layer is provided with thermally conductive sheet,Thermally conductive sheet is evenly distributed on the marginal position of thermal insulation layer,The heat abstractor has four groups,This thermal conductivity flexible wiring board,Flexible-belt is distributed with the middle part of assist side body,Add the overall pliability of the wiring board,It ensure that the reasonability of design,Pass through copper foil layer,Thermal insulation layer and thermally conductive sheet carry out heat conduction,Substantially increase the heat conductivility of the wiring board,Further radiated by heat abstractor,Considerably increase the service life of component on the wiring board.
Description
Technical field
Wiring board techniques field is the utility model is related to, specially a kind of thermal conductivity flexible wiring board.
Background technology
In the prior art：Authorization Notice No. is that the U of CN 204335138 patent discloses a kind of thermal conductivity flexible wiring board,
Include layers of copper, high heat conduction polyimide layer and the viscose glue for being pasted together them, its heat-conducting mode is single, causes this
The heat dispersion of thermal conductivity flexible wiring board is general, it is impossible to meets use demand.
Utility model content
The technical problems to be solved in the utility model is to overcome the defects of existing, there is provided a kind of thermal conductivity flexible wiring board, is dissipated
Good in thermal property, use demand is disclosure satisfy that, effectively can solved the problems, such as in background technology.
To achieve the above object, the utility model provides following technical scheme：A kind of thermal conductivity flexible wiring board, including circuit
Plate body, the middle part of the wiring board body are provided with flexible-belt, heat abstractor are uniformly provided with wiring board body.
As a kind of optimal technical scheme of the present utility model, the wiring board body shares three layers, wiring board body
Middle level is copper foil layer, the wiring board body up and down two layers be thermal insulation layer, thermal insulation layer passes through heat-conducting glue and copper foil
Layer adhesion.
As a kind of optimal technical scheme of the present utility model, the surface of the thermal insulation layer is provided with thermally conductive sheet, heat conduction
Piece is evenly distributed on the marginal position of thermal insulation layer.
As a kind of optimal technical scheme of the present utility model, the heat abstractor has four groups, and four pack heat dissipation devices are parallel
It is set up in parallel.
As a kind of optimal technical scheme of the present utility model, the heat abstractor includes radiating groove, and radiating groove is distributed in
The surface of wiring board body, the inner homogeneous of the radiating groove are provided with heat emission hole.
Compared with prior art, the beneficial effects of the utility model are：This thermal conductivity flexible wiring board, assist side body
Flexible-belt is distributed with middle part, adds the overall pliability of the wiring board, ensure that the reasonability of design, by copper foil layer, absolutely
Edge heat-conducting layer and thermally conductive sheet carry out heat conduction, substantially increase the heat conductivility of the wiring board, are carried out by heat abstractor further
Radiating, considerably increase the service life of component on the wiring board.
Brief description of the drawings
Fig. 1 is the utility model structure diagram.
In figure：1 wiring board body, 2 thermal insulation layers, 3 copper foil layers, 4 flexible-belts, 5 heat emission holes, 6 radiating grooves, 7 thermally conductive sheets,
8 heat abstractors.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, the utility model provides a kind of technical scheme：A kind of thermal conductivity flexible wiring board, including wiring board sheet
Body 1, the middle part of wiring board body 1 are provided with flexible-belt 4, and flexible-belt 4 ensure that and set to increase the overall pliability of the wiring board
The reasonability of meter, heat abstractor 8 is uniformly provided with wiring board body 1；
Wiring board body 1 shares three layers, and the middle level of wiring board body 1 is copper foil layer 3, and copper foil layer 3 has good heat conduction
Property and ductility, wiring board body 1 up and down two layers be thermal insulation layer 2, thermal insulation layer 2 passes through heat-conducting glue and copper foil layer 3
Adhesion, thermal insulation layer 2 not only possess heat conductivility, are also equipped with insulating capacity；
The surface of thermal insulation layer 2 is provided with thermally conductive sheet 7, and thermally conductive sheet 7 is evenly distributed on the marginal position of thermal insulation layer 2,
Thermally conductive sheet 7 further increases the heat conductivility of the wiring board；
Heat abstractor 8 has four groups, and the parallel side-by-side of four pack heat dissipation device 8 is set, and facilitates heat quickly to discharge；
Heat abstractor 8 includes radiating groove 6, and radiating groove 6 is distributed the surface of assist side body 1, the inner homogeneous of radiating groove 6
Provided with heat emission hole 5, caused heat is discharged by the heat emission hole 5 in radiating groove 6 on wiring board body 1, considerably increases the line
The service life of component on the plate of road.
When in use：Flexible-belt 4 is to increase the overall pliability of the wiring board, caused heat on wiring board body 1
Discharged by the heat emission hole 5 in radiating groove 6, wiring board body 1 is led by copper foil layer 3, thermal insulation layer 2 and thermally conductive sheet 7
Heat.
Flexible-belt 4 is distributed with the middle part of the utility model assist side body 1, adds the flexible of wiring board entirety
Property, the reasonability of design is ensure that, heat conduction is carried out by copper foil layer 3, thermal insulation layer 2 and thermally conductive sheet 7, substantially increases the line
The heat conductivility of road plate, further radiated by heat abstractor 8, considerably increase the use longevity of component on the wiring board
Life.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of thermal conductivity flexible wiring board, including wiring board body（1）, it is characterised in that：The wiring board body（1）Middle part
Provided with flexible-belt（4）, wiring board body（1）On be uniformly provided with heat abstractor（8）.
A kind of 2. thermal conductivity flexible wiring board according to claim 1, it is characterised in that：The wiring board body（1）It is shared
Three layers, wiring board body（1）Middle level be copper foil layer（3）, the wiring board body（1）Up and down two layers be thermal insulation layer
（2）, thermal insulation layer（2）Pass through heat-conducting glue and copper foil layer（3）Adhesion.
A kind of 3. thermal conductivity flexible wiring board according to claim 2, it is characterised in that：The thermal insulation layer（2）Table
Face is provided with thermally conductive sheet（7）, thermally conductive sheet（7）It is evenly distributed on thermal insulation layer（2）Marginal position.
A kind of 4. thermal conductivity flexible wiring board according to claim 1, it is characterised in that：The heat abstractor（8）There are four groups,
Four pack heat dissipation devices（8）Parallel side-by-side is set.
A kind of 5. thermal conductivity flexible wiring board according to claim 1, it is characterised in that：The heat abstractor（8）Including dissipating
Heat channel（6）, radiating groove（6）It is distributed assist side body（1）Surface, the radiating groove（6）Inner homogeneous be provided with heat emission hole
（5）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721003561.2U CN206865825U (en) | 2017-08-11 | 2017-08-11 | A kind of thermal conductivity flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721003561.2U CN206865825U (en) | 2017-08-11 | 2017-08-11 | A kind of thermal conductivity flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206865825U true CN206865825U (en) | 2018-01-09 |
Family
ID=60832664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721003561.2U Expired - Fee Related CN206865825U (en) | 2017-08-11 | 2017-08-11 | A kind of thermal conductivity flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206865825U (en) |
-
2017
- 2017-08-11 CN CN201721003561.2U patent/CN206865825U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 224000 Yan Long Street office, Yan Du District, Yancheng City, Jiangsu, the intersection of wee eight road and Qinchuan Road (D) Patentee after: YANCHENG HUAXU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 224000 Yan Long Street office, Yan Du District, Yancheng City, Jiangsu, the intersection of wee eight road and Qinchuan Road (D) Patentee before: YANCHENG CHINA STAR OPTICAL TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190611 Address after: 518000 12 floors, Block C, Tsinghua Ziguang Science Park, 13 Longshan Road, North District, Xili Street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Guowu Technology Co.,Ltd. Address before: 224000 Yan Long Street office, Yan Du District, Yancheng City, Jiangsu, the intersection of wee eight road and Qinchuan Road (D) Patentee before: YANCHENG HUAXU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180109 Termination date: 20190811 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |