CN107426915A - A kind of thermal conductivity flexible wiring board - Google Patents
A kind of thermal conductivity flexible wiring board Download PDFInfo
- Publication number
- CN107426915A CN107426915A CN201710684955.7A CN201710684955A CN107426915A CN 107426915 A CN107426915 A CN 107426915A CN 201710684955 A CN201710684955 A CN 201710684955A CN 107426915 A CN107426915 A CN 107426915A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- board body
- heat
- insulation layer
- thermal insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of thermal conductivity flexible wiring board,Including wiring board body,The middle part of the wiring board body is provided with flexible-belt,Heat abstractor is uniformly provided with wiring board body,The wiring board body shares three layers,The middle level of wiring board body is copper foil layer,The wiring board body up and down two layers be thermal insulation layer,Thermal insulation layer passes through heat-conducting glue and copper foil layer adhesion,The surface of the thermal insulation layer is provided with thermally conductive sheet,Thermally conductive sheet is evenly distributed on the marginal position of thermal insulation layer,The heat abstractor has four groups,This thermal conductivity flexible wiring board,Flexible-belt is distributed with the middle part of assist side body,Add the overall pliability of the wiring board,It ensure that the reasonability of design,Pass through copper foil layer,Thermal insulation layer and thermally conductive sheet carry out heat conduction,Substantially increase the heat conductivility of the wiring board,Further radiated by heat abstractor,Considerably increase the service life of component on the wiring board.
Description
Technical field
The present invention relates to wiring board techniques field, specially a kind of thermal conductivity flexible wiring board.
Background technology
In the prior art：Authorization Notice No. is that the U of CN 204335138 patent discloses a kind of thermal conductivity flexible wiring board,
Include layers of copper, high heat conduction polyimide layer and the viscose glue for being pasted together them, its heat-conducting mode is single, causes this
The heat dispersion of thermal conductivity flexible wiring board is general, it is impossible to meets use demand.
The content of the invention
The technical problem to be solved in the present invention is to overcome the defects of existing, there is provided a kind of thermal conductivity flexible wiring board, thermal diffusivity
Can be good, use demand is disclosure satisfy that, effectively can be solved the problems, such as in background technology.
To achieve the above object, the present invention provides following technical scheme：A kind of thermal conductivity flexible wiring board, including wiring board sheet
Body, the middle part of the wiring board body are provided with flexible-belt, heat abstractor are uniformly provided with wiring board body.
As a preferred technical solution of the present invention, the wiring board body shares three layers, the middle level of wiring board body
For copper foil layer, the wiring board body up and down two layers be thermal insulation layer, thermal insulation layer is glued by heat-conducting glue and copper foil layer
Even.
As a preferred technical solution of the present invention, the surface of the thermal insulation layer is provided with thermally conductive sheet, and thermally conductive sheet is equal
The even marginal position for being distributed in thermal insulation layer.
As a preferred technical solution of the present invention, the heat abstractor has four groups, four pack heat dissipation device parallel side-by-sides
Set.
As a preferred technical solution of the present invention, the heat abstractor includes radiating groove, and radiating groove is distributed in circuit
The surface of plate body, the inner homogeneous of the radiating groove are provided with heat emission hole.
Compared with prior art, the beneficial effects of the invention are as follows：This thermal conductivity flexible wiring board, the middle part of assist side body
Flexible-belt is distributed with, adds the overall pliability of the wiring board, ensure that the reasonability of design, is led by copper foil layer, insulation
Thermosphere and thermally conductive sheet carry out heat conduction, substantially increase the heat conductivility of the wiring board, are further radiated by heat abstractor,
Considerably increase the service life of component on the wiring board.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
In figure：1 wiring board body, 2 thermal insulation layers, 3 copper foil layers, 4 flexible-belts, 5 heat emission holes, 6 radiating grooves, 7 thermally conductive sheets,
8 heat abstractors.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Referring to Fig. 1, the present invention provides a kind of technical scheme：A kind of thermal conductivity flexible wiring board, including wiring board body 1,
The middle part of wiring board body 1 is provided with flexible-belt 4, and flexible-belt 4 ensure that design to increase the overall pliability of the wiring board
Reasonability, heat abstractor 8 is uniformly provided with wiring board body 1；
Wiring board body 1 shares three layers, and the middle level of wiring board body 1 is copper foil layer 3, copper foil layer 3 have good thermal conductivity and
Ductility, wiring board body 1 is for two layers thermal insulation layer 2 up and down, thermal insulation layer 2 by heat-conducting glue and the adhesion of copper foil layer 3,
Thermal insulation layer 2 not only possesses heat conductivility, is also equipped with insulating capacity；
The surface of thermal insulation layer 2 is provided with thermally conductive sheet 7, and thermally conductive sheet 7 is evenly distributed on the marginal position of thermal insulation layer 2, heat conduction
Piece 7 further increases the heat conductivility of the wiring board；
Heat abstractor 8 has four groups, and the parallel side-by-side of four pack heat dissipation device 8 is set, and facilitates heat quickly to discharge；
Heat abstractor 8 includes radiating groove 6, and radiating groove 6 is distributed the surface of assist side body 1, and the inner homogeneous of radiating groove 6 is provided with
Heat emission hole 5, caused heat is discharged by the heat emission hole 5 in radiating groove 6 on wiring board body 1, considerably increases the wiring board
The service life of upper component.
When in use：Flexible-belt 4 is to increase the overall pliability of the wiring board, caused heat on wiring board body 1
Discharged by the heat emission hole 5 in radiating groove 6, wiring board body 1 is led by copper foil layer 3, thermal insulation layer 2 and thermally conductive sheet 7
Heat.
Flexible-belt 4 is distributed with the middle part of assist side body 1 of the present invention, adds the overall pliability of the wiring board, protects
The reasonability of design has been demonstrate,proved, heat conduction is carried out by copper foil layer 3, thermal insulation layer 2 and thermally conductive sheet 7, substantially increases the wiring board
Heat conductivility, further radiated by heat abstractor 8, considerably increase the service life of component on the wiring board.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of thermal conductivity flexible wiring board, including wiring board body（1）, it is characterised in that：The wiring board body（1）Middle part
Provided with flexible-belt（4）, wiring board body（1）On be uniformly provided with heat abstractor（8）.
A kind of 2. thermal conductivity flexible wiring board according to claim 1, it is characterised in that：The wiring board body（1）It is shared
Three layers, wiring board body（1）Middle level be copper foil layer（3）, the wiring board body（1）Up and down two layers be thermal insulation layer
（2）, thermal insulation layer（2）Pass through heat-conducting glue and copper foil layer（3）Adhesion.
A kind of 3. thermal conductivity flexible wiring board according to claim 2, it is characterised in that：The thermal insulation layer（2）Table
Face is provided with thermally conductive sheet（7）, thermally conductive sheet（7）It is evenly distributed on thermal insulation layer（2）Marginal position.
A kind of 4. thermal conductivity flexible wiring board according to claim 1, it is characterised in that：The heat abstractor（8）There are four groups,
Four pack heat dissipation devices（8）Parallel side-by-side is set.
A kind of 5. thermal conductivity flexible wiring board according to claim 1, it is characterised in that：The heat abstractor（8）Including dissipating
Heat channel（6）, radiating groove（6）It is distributed assist side body（1）Surface, the radiating groove（6）Inner homogeneous be provided with heat emission hole
（5）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710684955.7A CN107426915A (en) | 2017-08-11 | 2017-08-11 | A kind of thermal conductivity flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710684955.7A CN107426915A (en) | 2017-08-11 | 2017-08-11 | A kind of thermal conductivity flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107426915A true CN107426915A (en) | 2017-12-01 |
Family
ID=60437651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710684955.7A Pending CN107426915A (en) | 2017-08-11 | 2017-08-11 | A kind of thermal conductivity flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107426915A (en) |
-
2017
- 2017-08-11 CN CN201710684955.7A patent/CN107426915A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171201 |
|
| WD01 | Invention patent application deemed withdrawn after publication |