CN215121298U - Copper-clad plate with insulation film-coated structure - Google Patents
Copper-clad plate with insulation film-coated structure Download PDFInfo
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- CN215121298U CN215121298U CN202120574130.1U CN202120574130U CN215121298U CN 215121298 U CN215121298 U CN 215121298U CN 202120574130 U CN202120574130 U CN 202120574130U CN 215121298 U CN215121298 U CN 215121298U
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Abstract
The utility model relates to a copper-clad plate technical field just discloses a copper-clad plate of insulating tectorial membrane structure in area, which comprises a substrate, vertical first recess has been seted up to the upper surface of base plate, the upper surface of base plate is fixed with the insulating layer, the upper surface of insulating layer is fixed with the heat-conducting layer, vertical second recess has all been seted up to the upper and lower both sides of heat-conducting layer, the heat dissipation through-hole has been seted up on the heat-conducting layer, the front of heat-conducting layer is run through to the one end of heat dissipation through-hole, the other end of heat dissipation through-hole runs through the back of heat-conducting layer. This copper-clad plate of insulating tectorial membrane structure in area transmits the heat through the heat-conducting layer to set up heat dissipation through-hole on the heat-conducting layer and can improve the area of contact with the air, thereby improve the radiating effect, guarantee electronic product's heat dissipation needs, through setting up the coating of the glue of being convenient for of first recess and second recess when bonding, make its bonding more firm, avoid appearing the layering phenomenon between the copper-clad plate.
Description
Technical Field
The utility model relates to a copper-clad plate technical field specifically is a copper-clad plate of insulating tectorial membrane structure in area.
Background
The copper-clad plate is a product which is prepared by using wood pulp paper or glass fiber cloth and the like as reinforcing materials, soaking the reinforcing materials in resin, coating copper foil on one side or two sides of the reinforcing materials and carrying out hot pressing. With the rapid development of the electronic industry, the volume size of electronic products is smaller and smaller, and the power density is larger and larger, so that the solution of the heat dissipation problem is a great challenge to the design of the electronic industry. The metal-based copper-clad plate is undoubtedly one of effective means for solving the heat dissipation problem. The insulating layers of some metal-based copper-clad plates in the current market have high thermal resistance and poor heat dissipation performance, are difficult to meet the requirements of high-power and high-heat-dissipation electronic products, and the copper-clad plates are not firmly bonded, so that the layering phenomenon is easy to occur.
SUMMERY OF THE UTILITY MODEL
The copper-clad plate of insulating tectorial membrane structure is not enough to prior art in the above-mentioned background art, the utility model aims to provide a copper-clad plate of area insulating tectorial membrane structure to solve some metal-based copper-clad plates on the existing market that provide among the above-mentioned background art insulating layer thermal resistance big, the thermal diffusivity is poor, is difficult to satisfy high-power, high heat dissipation electronic product's needs, and what bond moreover between the copper-clad plate is firm inadequately, appears the problem of layering phenomenon easily.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
the utility model provides a copper-clad plate of insulating tectorial membrane structure in area, includes the base plate, vertical first recess has been seted up to the upper surface of base plate, the upper surface fixed of base plate has the insulating layer, the upper surface fixed of insulating layer has the heat-conducting layer, vertical second recess has all been seted up to the upper and lower both sides of heat-conducting layer, the heat dissipation through-hole has been seted up on the heat-conducting layer, the front of heat-conducting layer is run through to the one end of heat dissipation through-hole, the other end of heat dissipation through-hole runs through the back of heat-conducting layer, the upper surface fixed of heat-conducting layer has the copper foil layer.
Preferably, the substrate is made of aluminum or copper, and the substrate has a sheet structure.
As a preferable scheme, the number of the first grooves is multiple, and the multiple first grooves are uniformly arranged on the upper surface of the substrate.
Preferably, one end of the first groove penetrates through the front surface of the substrate, and the other end of the first groove penetrates through the back surface of the substrate.
Preferably, the insulating layer has a film-like structure, and the insulating layer is made of alumina and epoxy resin.
Preferably, the number of the second grooves is multiple, and the second grooves are uniformly arranged on the upper side and the lower side of the heat conducting layer.
Preferably, one end of the second groove penetrates through the front surface of the heat conduction layer, and the other end of the second groove penetrates through the back surface of the heat conduction layer.
As a preferable scheme, the number of the heat dissipation through holes is multiple, and the multiple heat dissipation through holes are uniformly arranged on the heat conduction layer.
As a preferable scheme, the inner surface of the heat dissipation through hole is covered with a heat dissipation layer, and the material of the heat dissipation layer is at least one or more of copper, aluminum, silver, tin, gold and aluminum alloy.
Preferably, the copper foil layer is a sheet-like structure, and the thickness of the copper foil layer is 20-60 microns.
The utility model has the advantages that: this copper-clad plate of insulating tectorial membrane structure in area:
(1) this take copper-clad plate of insulating tectorial membrane structure transmits the heat through the heat-conducting layer to set up the area of contact that heat dissipation through-hole can improve with the air on the heat-conducting layer, thereby improve the radiating effect, guarantee electronic product's heat dissipation needs.
(2) This copper-clad plate of insulating tectorial membrane structure in area is convenient for the coating of glue through setting up first recess and second recess when bonding, makes its bonding more firm, avoids appearing the layering phenomenon between the copper-clad plate.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of a copper-clad plate with an insulation film structure according to the present invention;
FIG. 2 is a schematic diagram of a front view structure of the copper-clad plate with an insulation coating structure in FIG. 1;
fig. 3 is a schematic structural diagram of a heat conduction layer in the copper-clad plate with the insulation coating structure in fig. 1.
In the figure: 1. a substrate; 2. a first groove; 3. an insulating layer; 4. a heat conductive layer; 5. a second groove; 6. a heat dissipating through hole; 7. and a copper foil layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the utility model provides a copper-clad plate with insulating film structure, which comprises a substrate 1, a first groove 2, an insulating layer 3, a heat conduction layer 4, a second groove 5, a heat dissipation through hole 6 and a copper foil layer 7, wherein the upper surface of the substrate 1 is provided with the vertical first groove 2, glue can be reserved in the first groove 2, which is convenient for the bonding between the substrate 1 and the insulating layer 3, the insulating layer 3 is fixed on the upper surface of the substrate 1, the heat conduction layer 4 is fixed on the upper surface of the insulating layer 3, the copper-clad plate transfers heat through the heat conduction layer 4, the vertical second groove 5 is arranged on the upper and lower sides of the heat conduction layer 4, glue can be reserved in the second groove 5, which is convenient for the bonding between the heat conduction layer 4 and the insulating layer 3 and the copper foil layer 7, the heat dissipation through hole 6 is arranged on the heat conduction layer 4, one end of the heat dissipation through hole 6 penetrates through the front of the heat conduction layer 4, the other end of the heat dissipation through hole 6 penetrates through the back of the heat conduction layer 4, the heat dissipation through hole 6 can improve the contact area with air, so that the heat dissipation effect is improved, and a copper foil layer 7 is fixed on the upper surface of the heat conduction layer 4;
as an optimal technical solution of the utility model: the substrate 1 is made of aluminum or copper, and the substrate 1 is of a sheet structure, so that the substrate 1 can better dissipate heat;
as an optimal technical solution of the utility model: the number of the first grooves 2 is multiple, the multiple first grooves 2 are uniformly arranged on the upper surface of the substrate 1, and the multiple first grooves 2 enable the substrate 1 to be uniformly coated with glue for better bonding;
as an optimal technical solution of the utility model: one end of the first groove 2 penetrates through the front surface of the substrate 1, and the other end of the first groove 2 penetrates through the back surface of the substrate 1, so that the first groove 2 can be conveniently processed;
as an optimal technical solution of the utility model: the insulating layer 3 is of a film-shaped structure, and the insulating layer 3 is made of aluminum oxide and epoxy resin, so that the insulating performance of the copper foil layer 7 and the substrate 1 is better;
as an optimal technical solution of the utility model: the number of the second grooves 5 is multiple, the second grooves 5 are uniformly arranged on the upper side and the lower side of the heat conduction layer 4, and the second grooves 5 are arranged to enable the heat conduction layer 4 to be uniformly coated with glue for better bonding;
as an optimal technical solution of the utility model: one end of the second groove 5 penetrates through the front surface of the heat conduction layer 4, and the other end of the second groove 5 penetrates through the back surface of the heat conduction layer 4, so that the second groove 5 is convenient to process;
as an optimal technical solution of the utility model: the number of the heat dissipation through holes 6 is multiple, the heat dissipation through holes 6 are uniformly arranged on the heat conduction layer 4, and the contact area between the heat conduction layer 4 and air can be increased by arranging the heat dissipation through holes 6;
as an optimal technical solution of the utility model: the inner surface of the heat dissipation through hole 6 is covered with a heat dissipation layer, and the material of the heat dissipation layer is at least one or more of copper, aluminum, silver, tin, gold and aluminum alloy, so that the heat dissipation through hole 6 can better transfer heat;
as an optimal technical solution of the utility model: the copper foil layer 7 is a sheet-like structure, and the thickness of the copper foil layer 7 is 20-60 microns.
The working principle of the embodiment is as follows: when using this copper-clad plate of insulating tectorial membrane structure in area, as shown in fig. 1-3, the device is whole by base plate 1, first recess 2, insulating layer 3, heat-conducting layer 4, second recess 5, heat dissipation through-hole 6 and copper foil layer 7 are constituteed, as shown in fig. 1-3, this copper-clad plate transmits the heat through heat-conducting layer 4, and set up heat dissipation through-hole 6 on heat-conducting layer 4 and can improve the area of contact with the air, thereby improve the radiating effect, guarantee the heat dissipation needs of electronic product, be convenient for the coating of glue through setting up first recess 2 and second recess 5 when bonding, make its bonding more firm, avoid appearing the layering phenomenon between the copper-clad plate.
The above embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by the technical solution of the present invention by those skilled in the art are all within the scope of the present invention as defined by the claims.
Claims (8)
1. The utility model provides a copper-clad plate of insulating tectorial membrane structure in area, includes the base plate, its characterized in that, vertical first recess has been seted up to the upper surface of base plate, the upper surface fixed of base plate has the insulating layer, the upper surface fixed of insulating layer has the heat-conducting layer, vertical second recess has all been seted up to the upper and lower both sides of heat-conducting layer, the heat dissipation through-hole has been seted up on the heat-conducting layer, the front of heat-conducting layer is run through to the one end of heat dissipation through-hole, the other end of heat dissipation through-hole runs through the back of heat-conducting layer, the upper surface fixed of heat-conducting layer has the copper foil layer.
2. The copper-clad plate with the insulation film structure according to claim 1, wherein the substrate is made of aluminum or copper, and is of a sheet structure.
3. The copper-clad plate with the insulation film structure according to claim 2, wherein the number of the first grooves is plural, and the plural first grooves are uniformly arranged on the upper surface of the substrate.
4. The copper-clad plate with the insulation coating structure according to claim 3, wherein one end of the first groove penetrates through the front surface of the substrate, and the other end of the first groove penetrates through the back surface of the substrate.
5. The copper-clad plate with the insulation film covering structure according to claim 4, wherein the number of the second grooves is multiple, and the second grooves are uniformly arranged on the upper side and the lower side of the heat conducting layer.
6. The copper-clad plate with the insulation film covering structure according to claim 5, wherein one end of the second groove penetrates through the front surface of the heat conducting layer, and the other end of the second groove penetrates through the back surface of the heat conducting layer.
7. The copper-clad plate with the insulation film covering structure according to claim 6, wherein the number of the heat dissipation through holes is multiple, and the plurality of heat dissipation through holes are uniformly arranged on the heat conduction layer.
8. The copper-clad plate with the insulation film structure according to claim 7, wherein the copper foil layer is of a sheet-like structure, and the thickness of the copper foil layer is 20-60 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120574130.1U CN215121298U (en) | 2021-03-22 | 2021-03-22 | Copper-clad plate with insulation film-coated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120574130.1U CN215121298U (en) | 2021-03-22 | 2021-03-22 | Copper-clad plate with insulation film-coated structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215121298U true CN215121298U (en) | 2021-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120574130.1U Active CN215121298U (en) | 2021-03-22 | 2021-03-22 | Copper-clad plate with insulation film-coated structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215121298U (en) |
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2021
- 2021-03-22 CN CN202120574130.1U patent/CN215121298U/en active Active
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