CN213694271U

CN213694271U - Novel circuit board

Info

Publication number: CN213694271U
Application number: CN202022598504.1U
Authority: CN
Inventors: 叶钢华; 吴永强; 程祥艳
Original assignee: Winglung Huizhou Pcb Co ltd
Current assignee: Winglung Huizhou Pcb Co ltd
Priority date: 2020-11-11
Filing date: 2020-11-11
Publication date: 2021-07-13
Anticipated expiration: 2030-11-11

Abstract

The utility model discloses a novel circuit board, which comprises a shell and a board body, wherein a groove is arranged in the middle part of the shell, and the board body is arranged in the groove; the board body is including base plate, first heat-conducting glue layer, second heat-conducting glue layer, first copper foil layer, second copper foil layer, first heat-conducting glue layer is located first copper foil layer with between the second copper foil layer, second heat-conducting glue layer is located the base plate with between the second copper foil layer, first heat-conducting glue layer is polyimide heat-conducting glue layer, through the setting of casing, plate body, has solved the unstable problem of circuit board operation under adverse circumstances, has realized that the circuit board operates stably under adverse circumstances, effectively ensures the good operation of circuit board, improves the operation yield of circuit board, reduces the maintenance number of times, effectively uses manpower and materials sparingly, reduces economic cost.

Description

Novel circuit board

Technical Field

The utility model belongs to the technical field of the circuit board, concretely relates to novel circuit board.

Background

At present, when a circuit board runs in a severe environment, such as under the conditions of humidity and high temperature, the running of the circuit board can be affected correspondingly, and the state of the circuit board is expanded and contracted, so that the circuit board is unstable, the functions of the circuit board are greatly weakened, the running yield of the circuit board is reduced, the repair rate proportion is increased, and manpower and material resources are wasted.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application solves the problem that the circuit board is unstable in operation under the severe environment by providing the novel circuit board and setting the shell and the board body, realizes stable operation of the circuit board under the severe environment, effectively ensures good operation of the circuit board, improves the operation yield of the circuit board, reduces the maintenance frequency, effectively saves manpower and material resources, and reduces the economic cost.

The technical scheme provided by the embodiment of the application is as follows:

a novel circuit board comprises a shell and a board body, wherein a groove is formed in the middle of the shell, and the board body is arranged in the groove; the plate body is including base plate, first heat-conducting glue layer, second heat-conducting glue layer, first copper foil layer, second copper foil layer, first heat-conducting glue layer is located first copper foil layer with between the second copper foil layer, second heat-conducting glue layer is located the base plate with between the second copper foil layer, first heat-conducting glue layer is polyimide heat-conducting glue layer.

The utility model discloses in, through adopting polyimide heat conduction glue film, traditional epoxy resin sheet layer relatively says, thickness is thin a little relatively, and polyimide heat conduction glue film has good high temperature resistance and insulating nature, and dielectric strength is high, can effectively reduce the thermal resistance that produces in the operation process, stability when effectively increasing the operation, make its circuit board operation yield improve greatly, reduce the fault frequency, the performance is more excellent, effectively use manpower and materials sparingly, locate the mode in the recess in the casing through adopting the plate body, effectively reduce the area of plate body contact adverse circumstances, thereby the protection plate body operates normally, improve circuit board operation life, set up through the combination of casing and plate body, effectively ensure the good performance operation of circuit board, improve the operation yield, and improve the work efficiency, reduce manpower and materials, increase economic benefits.

Furthermore, the handles are arranged on the two sides of the shell, the anti-slip lines are arranged on the surfaces of the handles, and through the arrangement, the circuit board is convenient to take and clamp in other modes, is not easy to damage, and effectively prolongs the service life of the circuit board.

Furthermore, the outside of casing is equipped with the polyethylene polypropylene fibre waterproof layer, adopts the polyethylene polypropylene fibre waterproof layer through the casing outside to improve the tensile strength of casing, improve impervious ability, effectively promote the protection of casing to the plate body, provide more excellent operational environment for the plate body.

Further, the substrate is a copper substrate or an aluminum substrate.

Furthermore, the area of the groove accounts for 1/3 of the area of the shell, the depth of the groove is 6-20mm, and through the arrangement, the groove effectively protects the board body, so that good operation of the board body is guaranteed, the operation yield of the circuit board is improved, and the depth of the groove can be selected according to the thickness of the board body.

The utility model has the advantages that:

through the setting of casing, plate body, solved the circuit board and moved unstable problem under adverse circumstances, realized that the circuit board moves stably under adverse circumstances, effectively ensured the good operation of circuit board, improved the operation yield of circuit board, reduce the maintenance number of times, effectively use manpower sparingly material resources, reduce economic cost.

Drawings

Fig. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic view of the structure of FIG. 1 taken along the sectional direction A-A'.

The labels in the figure are: the anti-slip device comprises a shell 1, a groove 11, a handle 12 and anti-slip strips 121; the board body 2, the substrate 21, the first thermal adhesive layer 22, the second thermal adhesive layer 23, the first copper foil layer 24, and the second copper foil layer 25.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

To facilitate understanding of the present invention for those skilled in the art, the present invention will be described in further detail with reference to the following detailed description and accompanying drawings.

A novel circuit board comprises a shell 1 and a board body 2, wherein a groove 11 is formed in the middle of the shell 1, and the board body 2 is arranged in the groove 11; the 2 bodies of board are including base plate 21, first heat-conducting adhesive layer 22, second heat-conducting adhesive layer 23, first copper foil layer 24, second copper foil layer 25, first heat-conducting adhesive layer 22 is located first copper foil layer 24 with between the second copper foil layer 25, second heat-conducting adhesive layer 23 is located base plate 21 with between the second copper foil layer 25, first heat-conducting adhesive layer 22 is polyimide heat-conducting adhesive layer.

Further, the handles 12 are arranged on the two sides of the shell 1, the anti-slip stripes 121 are arranged on the surfaces of the handles 12, and through the arrangement, the circuit board is convenient to take and clamp in other modes, is not easy to damage, and effectively prolongs the service life of the circuit board.

Further, the outside of casing 1 is equipped with the polyethylene polypropylene fibre waterproof layer, adopts the polyethylene polypropylene fibre waterproof layer through the 1 outside of casing to improve the tensile strength of casing, improve impervious ability, effectively promote the protection of casing to the plate body, provide more excellent operational environment for the plate body.

Further, the substrate 21 is a copper substrate or an aluminum substrate.

Furthermore, the area of the groove 11 accounts for 1/3 of the area of the shell 1, the depth of the groove 11 is 6-20mm, and through the arrangement, the groove 11 effectively protects the board body 2, so that good operation of the board body 2 is guaranteed, the operation yield of the circuit board is improved, and the depth of the groove 11 can be selected according to the thickness of the board body 2.

The utility model has the advantages that:

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.

Claims

1. A novel circuit board is characterized by comprising a shell and a board body, wherein a groove is formed in the middle of the shell, and the board body is arranged in the groove; the plate body is including base plate, first heat-conducting glue layer, second heat-conducting glue layer, first copper foil layer, second copper foil layer, first heat-conducting glue layer is located first copper foil layer with between the second copper foil layer, second heat-conducting glue layer is located the base plate with between the second copper foil layer, first heat-conducting glue layer is polyimide heat-conducting glue layer.

2. The novel circuit board of claim 1, wherein handles are provided on both sides of the housing.

3. The novel circuit board of claim 1, wherein a waterproof polyethylene polypropylene layer is disposed on the outer side of the housing.

4. The novel circuit board of claim 1, wherein the substrate is a copper substrate.

5. The novel circuit board of claim 1, wherein the substrate is an aluminum substrate.

6. The novel wiring board of claim 1, wherein the recess area is 1/3 times the area of the housing.

7. The novel circuit board of claim 1, wherein the depth of the groove is 6-20 mm.

8. The novel circuit board of claim 2, wherein the handle surface is provided with anti-slip lines.