CN216584857U - Single-sided heat dissipation film for electronic device - Google Patents
Single-sided heat dissipation film for electronic device Download PDFInfo
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- CN216584857U CN216584857U CN202123419245.2U CN202123419245U CN216584857U CN 216584857 U CN216584857 U CN 216584857U CN 202123419245 U CN202123419245 U CN 202123419245U CN 216584857 U CN216584857 U CN 216584857U
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- graphite alkene
- aluminium foil
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Abstract
The utility model discloses a single face radiating film for electron device, include: PET substrate layer and aluminium foil layer, the surface coating that PET substrate layer and graphite alkene layer carried on the back mutually has the mute black ink layer of a heat conduction, the aluminium foil layer has a plurality of interval distribution's through-hole, and the upper surface and the lower surface on this aluminium foil layer have covered graphite alkene layer, lower graphite alkene layer respectively, and this goes up graphite alkene layer, lower graphite alkene layer and corresponds the regional direct laminating connection of through-hole department respectively, go up and be connected through first heat conduction adhesive layer between graphite alkene layer and the PET substrate layer, the surface coating that graphite alkene layer and aluminium foil layer carried on the back mutually has a second heat conduction adhesive layer down, one from the surface that the material layer subsides in second heat conduction adhesive layer. The utility model discloses single face heat dissipation membrane for electronic device has both improved the soaking performance of heat dissipation pad pasting to the heat in the horizontal direction, has also improved the heat conductivility in the vertically direction to whole comprehensive radiating efficiency has been improved.
Description
Technical Field
The utility model relates to a single face heat dissipation membrane for electron device belongs to heat dissipation membrane technical field.
Background
On the one hand, along with the acceleration of the present upgrading of electronic product, the popularization of high power, high thermal chip, on the other hand, the rapid development of science and technology, electronic device is miniaturized gradually, and the dominant frequency of chip is higher and higher, and power is bigger and bigger, leads to heat flux density to increase sharply, produces a large amount of heats. The failure to process the heat in a timely manner affects the operation of the electronic device, reduces the component life, and may present safety concerns. In the prior art, a heat dissipation film is used to improve the heat dissipation problem of an electronic device, but the prior heat dissipation film still has a lot of technical spaces which can be improved in the technology.
Disclosure of Invention
The utility model aims at providing a single face radiating film for electronic device, this single face radiating film for electronic device have both improved the heat dissipation pad pasting in the horizontal direction to thermal soaking performance, have also improved the heat conductivility in the vertically direction to whole comprehensive radiating efficiency has been improved.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a single-sided heat dissipating film for an electronic device, comprising: PET substrate layer and aluminium foil layer, the surface coating that PET substrate layer and aluminium foil layer carried on the back mutually has the mute black ink layer of a heat conduction, the aluminium foil layer has a plurality of interval distribution's through-hole, and the upper surface and the lower surface on this aluminium foil layer have covered graphite alkene layer, lower graphite alkene layer respectively, and this goes up graphite alkene layer, lower graphite alkene layer and corresponds the regional direct laminating connection of through-hole department respectively, go up and be connected through first heat conduction adhesive layer between graphite alkene layer and the PET substrate layer, graphite alkene layer and aluminium foil layer carried on the back mutually the surface coating have a second heat conduction adhesive layer down, one from the surface that the material layer subsides in second heat conduction adhesive layer.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the thickness of the upper graphene layer is greater than that of the lower graphene layer.
2. In the scheme, the thickness of the upper graphene layer is 60-150 microns.
3. In the scheme, the thickness of the lower graphene layer is 200-400 microns.
4. In the scheme, the diameter of the through hole is 1-3 mm.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses single face heat dissipation membrane for electronic device, its aluminium foil layer has a plurality of interval distribution's through-hole, the upper surface and the lower surface on this aluminium foil layer cover respectively have graphene layer, graphite alkene layer down, this go up graphite alkene layer, graphite alkene layer corresponds the regional direct laminating of through-hole department separately down and connects, go up and be connected through first heat conduction adhesive layer between graphite alkene layer and the PET substrate layer, graphite alkene layer and aluminium foil layer back of the body surface coating that carries on the back mutually have a second heat conduction adhesive layer down, the soaking performance of heat dissipation pad pasting in the horizontal direction to the heat has both been improved, the heat conductivility in the vertically direction has also been improved, thereby whole comprehensive radiating efficiency has been improved.
Drawings
FIG. 1 is a schematic structural view of a single-sided heat-dissipating film for an electronic device according to the present invention;
fig. 2 is a schematic view of a partial structure of a single-sided heat dissipation film for an electronic device according to the present invention.
In the above drawings: 1. a PET substrate layer; 2. an aluminum foil layer; 3. a heat-conducting matte black ink layer; 4. a first thermally conductive adhesive layer; 5. an upper graphene layer; 6. a lower graphene layer; 7. a release material layer; 8. a second thermal adhesive layer.
Detailed Description
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1: a single-sided heat dissipating film for an electronic device, comprising: PET substrate layer 1 and aluminium foil layer 2, the surface coating that PET substrate layer 1 and aluminium foil layer 2 carried on the back mutually has a mute black ink layer 3 of heat conduction, aluminium foil layer 2 has a plurality of interval distribution's through-hole 9, and this aluminium foil layer 2's upper surface and lower surface have covered graphite alkene layer 5, graphite alkene layer 6 down respectively, and this goes up graphite alkene layer 5, graphite alkene layer 6 corresponds regional direct laminating connection of 9 departments of through-hole separately, go up and be connected through first heat conduction gluing layer 4 between graphite alkene layer 5 and the PET substrate layer 1, graphite alkene layer 6 has a second heat conduction gluing layer 8 with the surface coating that aluminium foil layer 2 carried on the back mutually down, one from type material layer 7 pastes the surface of applying in second heat conduction gluing layer 8.
The thickness of the upper graphene layer 5 is 120 μm.
The thickness of the lower graphene layer 6 was 300 μm, and the diameter of the through-hole 9 was 1.2 mm.
Example 2: a single-sided heat dissipating film for an electronic device, comprising: PET substrate layer 1 and aluminium foil layer 2, the surface coating that PET substrate layer 1 and aluminium foil layer 2 carried on the back mutually has a mute black ink layer 3 of heat conduction, aluminium foil layer 2 has a plurality of interval distribution's through-hole 9, and this aluminium foil layer 2's upper surface and lower surface have covered graphite alkene layer 5, graphite alkene layer 6 down respectively, and this goes up graphite alkene layer 5, graphite alkene layer 6 corresponds regional direct laminating connection of 9 departments of through-hole separately, go up and be connected through first heat conduction gluing layer 4 between graphite alkene layer 5 and the PET substrate layer 1, graphite alkene layer 6 has a second heat conduction gluing layer 8 with the surface coating that aluminium foil layer 2 carried on the back mutually down, one from type material layer 7 pastes the surface of applying in second heat conduction gluing layer 8.
The thickness of the upper graphene layer 5 is 80 μm.
The thickness of the lower graphene layer 6 was 150 μm, and the diameter of the through-hole 9 was 2 mm.
When adopting above-mentioned single face radiating film for electronic device, its aluminium foil layer has a plurality of interval distribution's through-hole, the upper surface and the lower surface on this aluminium foil layer have covered graphite alkene layer respectively, graphite alkene layer down, this go up graphite alkene layer, graphite alkene layer corresponds regional direct laminating of through-hole department separately and connects down, go up and be connected through first heat conduction adhesive between graphite alkene layer and the PET substrate layer, graphite alkene layer and aluminium foil layer back of the body surface coating mutually have a second heat conduction adhesive layer down, both improved the soaking performance of heat dissipation pad pasting in the horizontal direction to the heat, also improved the heat conductivility in the vertically direction, thereby whole comprehensive radiating efficiency has been improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (4)
1. A single-sided heat dissipation film for an electronic device, characterized in that: the method comprises the following steps: PET substrate layer (1) and aluminium foil layer (2), the surface coating that PET substrate layer (1) and aluminium foil layer (2) carried on the back mutually has a mute black ink layer of heat conduction (3), aluminium foil layer (2) have through-hole (9) of a plurality of interval distribution, and the upper surface and the lower surface of this aluminium foil layer (2) have covered graphite alkene layer (5), graphite alkene layer (6) down respectively, and this goes up graphite alkene layer (5), graphite alkene layer (6) correspond through-hole (9) separately and locate regional direct laminating and connect down, go up and be connected through first heat conduction adhesive layer (4) between graphite alkene layer (5) and PET substrate layer (1), graphite alkene layer (6) and aluminium foil layer (2) surface coating mutually on the back have a second heat conduction adhesive layer (8) down, one from type material layer (7) paste and apply in the surface of second heat conduction adhesive layer (8).
2. The single-sided heat dissipating film for electronic devices according to claim 1, wherein: the thickness of the upper graphene layer (5) is 60-150 mu m.
3. The single-sided heat dissipating film for electronic devices according to claim 1, wherein: the thickness of the lower graphene layer (6) is 200-400 microns.
4. The single-sided heat dissipating film for electronic devices according to claim 1, wherein: the diameter of the through hole (9) is 1-3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419245.2U CN216584857U (en) | 2021-12-30 | 2021-12-30 | Single-sided heat dissipation film for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123419245.2U CN216584857U (en) | 2021-12-30 | 2021-12-30 | Single-sided heat dissipation film for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216584857U true CN216584857U (en) | 2022-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123419245.2U Active CN216584857U (en) | 2021-12-30 | 2021-12-30 | Single-sided heat dissipation film for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216584857U (en) |
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2021
- 2021-12-30 CN CN202123419245.2U patent/CN216584857U/en active Active
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