CN217563993U - Electromagnetic shielding cover, circuit board and electronic terminal equipment - Google Patents
Electromagnetic shielding cover, circuit board and electronic terminal equipment Download PDFInfo
- Publication number
- CN217563993U CN217563993U CN202221332019.2U CN202221332019U CN217563993U CN 217563993 U CN217563993 U CN 217563993U CN 202221332019 U CN202221332019 U CN 202221332019U CN 217563993 U CN217563993 U CN 217563993U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- heat conduction
- electromagnetic shield
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses an electromagnetic shielding cover, a circuit board and electronic terminal equipment, wherein the electromagnetic shielding cover comprises a heat conduction layer, a film layer and a shielding layer; the heat conduction layer is arranged on one surface of the film layer, and the shielding layer is arranged on one surface of the film layer, which is far away from the heat conduction layer; the heat conducting layer is provided with through holes penetrating through the upper surface and the lower surface of the heat conducting layer, and the porosity of the through holes is 0.2-12%. The utility model discloses a set up the heat-conducting layer in electromagnetic shield cover for electromagnetic shield cover can effectually carry out heat-conduction when electronic component, set up the through-hole simultaneously in the heat-conducting layer and can release the inside heat of heat-conducting layer to the air fast, improve the radiating efficiency. In addition, the porosity of the through holes is set to be 0.2-12%, so that enough through holes are ensured to dissipate heat of the heat conduction layer, and meanwhile, the heat conduction layer is prevented from absorbing heat due to the fact that the heat conduction materials in the heat conduction layer are reduced due to the fact that the number of the through holes is too large, and the heat conduction performance of the electromagnetic shielding cover is further improved.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to an electromagnetic shield cover, circuit board and electronic terminal equipment.
Background
Electronic components in the electronic terminal equipment continuously emit useless electromagnetic signals during operation, the useless electromagnetic signals can generate no interference to adjacent resistors, and the common solution adopts a stainless steel metal shielding cover to package electronic components needing shielding so as to inhibit the leakage of useless electromagnetic waves to the outside. However, the package described above is advantageous for shielding a large, concentrated IC, but as the parts are reduced and the package space is reduced, the use of a stainless steel shield can is limited. In addition, with the miniaturization of electronic terminal devices, the electronic terminal devices are being developed to be light, thin and beautiful, and cannot be provided with large heat sinks or heat dissipation devices like large electrical products. Therefore, heat of electronic components on the existing electronic terminal equipment is often dissipated through the stainless steel metal shielding case, and the stainless steel metal shielding case is a rigid material, so that the stainless steel metal shielding case can not conduct heat effectively when covering the electronic components directly, which causes over-high temperature of the electronic terminal equipment and easily damages the electronic components.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an aim at provides an electromagnetic shield cover, circuit board and electronic terminal equipment, through set up the heat-conducting layer in electromagnetic shield cover for electromagnetic shield cover can effectually carry out heat-conduction when electronic components, sets up the through-hole simultaneously in the heat-conducting layer and can release the inside heat of heat-conducting layer to the air fast, improves the radiating efficiency.
In order to achieve the above object, an embodiment of the present invention provides an electromagnetic shielding cover, which includes a heat conducting layer, a film layer and a shielding layer;
the heat conduction layer is arranged on one surface of the film layer, and the shielding layer is arranged on one surface of the film layer, which is far away from the heat conduction layer;
the heat conduction layer is internally provided with a through hole penetrating through the upper surface and the lower surface of the heat conduction layer, and the porosity of the through hole is 0.2-12%.
As an improvement of the scheme, the aperture of the through hole is 0.2-1.5 microns.
As an improvement of the scheme, the thickness of the heat conduction layer is 1.2-15 microns.
In an improvement of the above scheme, the heat conduction layer contains a heat conduction filler, and the proportion of the heat conduction filler in the heat conduction layer is 60% -70%.
As a modification of the above, the thermally conductive filler includes a thermally conductive filler of a sheet structure.
As an improvement of the scheme, the heat conduction filler comprises a heat conduction filler with a spherical structure, and the particle size of the heat conduction filler with the spherical structure is 0.1-2 microns.
As an improvement of the scheme, the thickness of the thin film layer is 5-10 microns.
As an improvement of the scheme, the thickness of the shielding layer is 7-20 micrometers.
As an improvement of the above scheme, the electromagnetic shielding case further comprises a glue film layer, and the glue film layer is arranged on one surface of the shielding layer far away from the thin film layer.
As a modification of the above, the shielding layer contains conductive particles.
In order to achieve the above object, an embodiment of the present invention further provides a circuit board, including a circuit board body and the electromagnetic shielding cover according to any of the above embodiments; the electromagnetic shielding cover is pressed with the circuit board body, and one surface of the shielding layer, which is far away from the thin film layer, is electrically connected with the ground layer of the circuit board body.
In order to achieve the above object, the embodiment of the present invention further provides an electronic terminal device, including the circuit board according to any of the above embodiments.
Compared with the prior art, the embodiment of the utility model provides an electromagnetic shield cover, circuit board and electronic terminal equipment have following beneficial effect:
because set up the heat-conducting layer in the electromagnetic shield cover for the electromagnetic shield cover can effectually carry out heat-conduction when electronic components, set up the through-hole simultaneously in the heat-conducting layer and can release the inside heat of heat-conducting layer to the air fast, improve the radiating efficiency. Moreover, the porosity of the through holes is set to be 0.2-12%, so that sufficient through holes can be ensured to dissipate heat of the heat conduction layer while the porosity is reduced, and meanwhile, the heat absorption of the heat conduction layer is not influenced due to the fact that the heat conduction material in the heat conduction layer is reduced because of excessive number of the through holes, and the heat conduction performance of the electromagnetic shielding cover is further improved. In addition, the porosity of the through holes is set to be 0.2-12%, so that the problem that the heat conduction layer is easy to break due to the fact that the number of the through holes is too large in the pressing process is solved, and the electromagnetic shielding cover has good toughness on the premise of low hardness.
Drawings
Fig. 1 is a schematic structural diagram of a first electromagnetic shielding case according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second electromagnetic shielding case according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a third electromagnetic shielding case according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fourth electromagnetic shielding case according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a fifth electromagnetic shielding case according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of the electromagnetic shielding cover and the circuit board body according to an embodiment of the present invention.
Wherein, 1, heat conducting layer; 2. a thin film layer; 3. a shielding layer; 4. a glue film layer; 5. a circuit board body; 11. A through hole; 12. a thermally conductive filler of a lamellar structure; 13. a heat conductive filler of a spherical structure; 31. conductive particles.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides an electromagnetic shielding enclosure, which includes a heat conducting layer 1, a thin film layer 2, and a shielding layer 3; the heat conduction layer 1 is arranged on one surface of the thin film layer 2, and the shielding layer 3 is arranged on one surface, far away from the heat conduction layer 1, of the thin film layer 2; the heat conduction layer 1 is provided with through holes 11 penetrating through the upper and lower surfaces thereof, and the porosity of the through holes 11 is 0.2-12%.
The embodiment of the utility model provides an in, owing to set up heat-conducting layer 1 in electromagnetic shield cover for electromagnetic shield cover can effectually carry out heat-conduction when electronic components, set up through-hole 11 simultaneously in heat-conducting layer 1 and can release heat-conducting layer 1's inside heat to the air fast, improve the radiating efficiency. And, set up the porosity of through-hole 11 to 0.2% -12%, can guarantee that there is sufficient through-hole to dispel the heat to the inside heat of heat-conducting layer when reducing the porosity, also can not lead to the reduction of the interior heat conduction material of heat-conducting layer because of the too much quantity of through-hole simultaneously, influence the heat-conducting layer and absorb the heat, further improved the heat conductivility of electromagnetic shield. In addition, the porosity of the through holes is set to be 0.2-12%, so that the problem that the heat conduction layer is easy to break due to the fact that the number of the through holes is too large in the pressing process is solved, and the electromagnetic shielding cover has good toughness on the premise of low hardness.
In this embodiment, the porosity is 12%, and the corresponding thermal conductivity is 2-2.8W/(m.K). The porosity is 0.2%, and the corresponding thermal conductivity is 2-2.8W/(m.K). The porosity is 5.9%, and the corresponding thermal conductivity is 3-6W/(m.K). Therefore, by applying the electromagnetic shielding cover of the embodiment, the porosity can be reduced, and meanwhile, enough through holes are ensured to dissipate heat of the heat conduction layer, and the heat absorption of the heat conduction layer is not influenced due to the fact that the heat conduction material in the heat conduction layer is reduced because of the excessive number of the through holes, so that the heat conduction performance of the electromagnetic shielding cover is further improved.
In the present embodiment, the aperture of the through hole 11 is 0.2 to 1.5 μm. By setting the aperture of the through hole 11 to 0.2 to 1.5 μm, it can be ensured that the through hole 11 can smoothly discharge the internal heat of the heat conductive layer 1.
In the embodiment, the thickness of the heat conduction layer is 1.2-15 micrometers. The thickness of the heat conducting layer is set to be 1.2-15 microns, so that the thickness of the whole electromagnetic shielding cover is not too thick, and the electromagnetic shielding cover also has better heat conducting performance.
In this embodiment, the heat conductive layer contains a heat conductive filler, and the proportion of the heat conductive filler in the heat conductive layer is 60% to 70%. The heat conduction layer 1 is composed of heat conduction resin and heat conduction filler, the heat conduction resin accounts for 30-40%, and the heat conduction resin can be epoxy resin, polyurethane or other heat conduction resins. The heat conducting filler can be an insulating heat conducting filler, such as any one of boron nitride, aluminum oxide, magnesium oxide, silicon nitride, diamond or crystalline silica or a combination of at least two of the above. The proportion of the heat-conducting filler is set to be 60% -70% and the proportion of the heat-conducting resin is set to be 30% -40%, so that the heat-conducting layer can be guaranteed to have better heat-conducting performance, meanwhile, the heat-conducting resin with enough weight can wrap the heat-conducting filler, the heat-conducting filler can be fully filled in the heat-conducting resin, in the process of laminating the electromagnetic shielding cover to the circuit board at high temperature, the heat-conducting resin with enough weight can enable the heat-conducting layer 1 not to be broken under the high-temperature laminating condition, and the electromagnetic shielding cover has better toughness on the premise of low hardness.
In this embodiment, referring to fig. 2, the heat conductive filler includes heat conductive fillers 12 having a sheet structure, and the contact surface between the sheet structures is large, so that the contact surface between the heat conductive fillers is increased to facilitate heat conduction, and improve the heat conduction efficiency of the heat conductive layer 1.
In the present embodiment, referring to fig. 3, the heat conductive filler includes a heat conductive filler having a spherical structure, and the particle size of the heat conductive filler having a spherical structure is 0.1 to 2 μm. Spherical structure easily fills when preparation heat-conducting layer 1, sets up spherical structure's heat conduction filler 13's particle diameter to 0.1 ~ 2 microns simultaneously, can make it realize more closely knit packing in heat conduction rubber to make spherical structure's heat conduction filler 13 between can have more contact points, form the heat conduction network that the number of connections is more, can reach and realize better heat conduction and toughness.
In this embodiment, referring to fig. 4, the heat conductive filler includes a heat conductive filler 12 having a sheet structure and a heat conductive filler 13 having a spherical structure, and the heat conductive fillers having the two structures are reasonably proportioned to further fill gaps between the heat conductive fillers, so as to increase a compression effect during high-temperature pressing, so that the electromagnetic shielding case has a better heat conductive property on the premise of low hardness.
In this embodiment, the thickness of the thin film layer 2 is 5 to 10 micrometers, and the material of the thin film layer 2 may be PET (Polyethylene terephthalate, polyester resin). The thickness of the thin film layer 2 is set to be 5-10 micrometers, so that the thickness of the electromagnetic shielding case is moderate. The thin film layer 2 can effectively and electrically isolate the shielding layer 3 from the outside, so that the electromagnetic shielding effect of the shielding layer 3 can be ensured.
In the present embodiment, the thickness of the shielding layer 3 is 7 to 20 μm. The thickness of the shielding layer 3 is set to be 7-20 microns, so that the thickness of the electromagnetic shielding cover is moderate, and meanwhile, the shielding layer 3 has better shielding performance.
In this embodiment, referring to fig. 5, the shielding layer 3 contains conductive particles 31 therein, and the material of the shielding layer 3 may be thermoplastic adhesive, thermosetting adhesive, pressure-sensitive adhesive, or the like. The composition and shape of the conductive particles 31 are not limited, and for example, the material of the conductive particles 31 is any one or more of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, and gold. The conductive particles 31 are filled in the shielding layer, and the conductive particles 31 may protrude from the shielding layer 3 or may not protrude from the shielding layer 3.
When the conductive particles 31 do not protrude from the shielding layer 3, the grounding can be achieved by soldering.
When the conductive particles 31 protrude from the shielding layer 3, the conductive particles 31 can pierce through the glue film layer to achieve connection with the circuit board ground layer, and the height of the conductive particles 31 protruding from the shielding layer 3 is equal to the height of the glue film layer. By penetrating the conductive particles 31 through the adhesive film layer and conducting the circuit board stratum, the electromagnetic shielding requirement of the electromagnetic shielding cover is met, the shielding layer 3 and the adhesive film layer can be further tightly bound together through the penetration of the conductive particles 31, the conductive particles 31 are like positioning nails formed between two layers of structures of the electromagnetic shielding cover, all the layers of structures are firmly nailed together, and the layering phenomenon cannot occur in the pressing process.
In this embodiment, referring to fig. 5, the electromagnetic shielding case further includes a glue film layer 4, the glue film layer 4 is disposed on a surface of the shielding layer 3 away from the thin film layer 2, and the glue film layer 4 may be bonded to the circuit board in a high-temperature pressing process. The adhesive film layer 4 can be thermoplastic adhesive, thermosetting adhesive or pressure-sensitive adhesive. Specifically, the material of the adhesive film layer 4 may be bisphenol a type epoxy resin, bisphenol S type epoxy resin, bisphenol F type epoxy resin, acrylic resin, polyester resin, or the like. In addition, the resin used may be any one or a mixture of at least two selected from the group consisting of epoxy resin, cyanate resin, polyphenylene ether resin, polybutadiene resin, styrene-butadiene resin, bismaleimide-triazine resin (BT), bismaleimide resin, polytetrafluoroethylene resin, polyimide resin, phenol resin, acrylic resin, liquid crystal resin, benzoxazine resin, phenoxy resin, nitrile rubber, carboxyl-terminated nitrile rubber, and hydroxyl-terminated nitrile rubber, but is not limited thereto, and all resin materials disclosed in the prior art may be used. Such as a mixture of an epoxy resin and a cyanate resin, a mixture of a polyphenylene ether resin and a polybutadiene resin, a mixture of a styrene-butadiene resin and a BT resin, a mixture of a polytetrafluoroethylene resin and a polyimide resin, a mixture of a phenol resin and an acrylic resin, a mixture of an epoxy resin, a cyanate resin and a polyphenylene ether resin, a polybutadiene resin, a mixture of a styrene-butadiene resin and a BT resin, and a mixture of a polytetrafluoroethylene resin, a polyimide resin, a phenol resin and an acrylic resin. That is, a mixture of two or more resins may be used.
An embodiment of the utility model provides an electromagnetic shield cover is owing to set up heat-conducting layer 1 in electromagnetic shield cover for electromagnetic shield cover can effectually carry out heat-conduction when electronic components, sets up through-hole 11 simultaneously in heat-conducting layer 1 and can release heat-conducting layer 1's inside heat to the air fast, improves the radiating efficiency. Moreover, the porosity of the through holes 11 is set to be 0.2-12%, so that sufficient through holes 11 can be ensured to dissipate heat of the heat conduction layer while the porosity is reduced, and meanwhile, the heat absorption of the heat conduction layer 1 is not influenced due to the reduction of heat conduction materials in the heat conduction layer 1 caused by the excessive number of the through holes 11, and the heat conduction performance of the electromagnetic shielding cover is further improved. In addition, the porosity of the through holes 11 is set to be 0.2-12%, so that the heat conducting layer 1 cannot be easily broken due to the excessive number of the through holes in the pressing process, and the electromagnetic shielding cover has better toughness on the premise of low hardness.
Referring to fig. 6, another embodiment of the present invention provides a circuit board, which includes a circuit board body 5 and an electromagnetic shielding case according to the above embodiment; the electromagnetic shielding cover is pressed with the circuit board body 5, and one surface of the shielding layer 3, which is far away from the film layer 2, is electrically connected with the ground layer of the circuit board body.
Preferably, the circuit board body 5 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board and a flex-rigid board.
In this embodiment, the rough surface of the shielding layer 3 can pierce through the adhesive film layer 4 and be connected with the ground layer of the circuit board body 5 when the electromagnetic shielding cover is pressed on the circuit board body 5, so that the ground connection between the shielding layer 3 and the circuit board body 5 is ensured, the interference charges in the shielding layer 3 are guided into the ground, and the interference source formed by the accumulation of the interference charges is prevented from affecting the normal operation of the circuit board.
Furthermore, another embodiment of the present invention provides an electronic terminal device, which includes the circuit board described in the above embodiment.
Specifically, the circuit board of this embodiment is owing to use there is the electromagnetic shield cover has set up heat-conducting layer 1 in the electromagnetic shield cover for the electromagnetic shield cover can effectually carry out heat-conduction when electronic components, sets up through-hole 11 simultaneously in heat-conducting layer 1 and can release the inside heat of heat-conducting layer 1 to the air fast, improves the radiating efficiency. Moreover, the porosity of the through holes 11 is set to be 0.2-12%, so that sufficient through holes 11 can be ensured to dissipate heat of the heat conduction layer while the porosity is reduced, and meanwhile, the heat absorption of the heat conduction layer 1 is not influenced due to the reduction of heat conduction materials in the heat conduction layer 1 caused by the excessive number of the through holes 11, and the heat conduction performance of the electromagnetic shielding cover is further improved. In addition, the porosity of the through holes 11 is set to be 0.2-12%, so that the heat conducting layer 1 cannot be easily broken due to the excessive number of the through holes in the pressing process, and the electromagnetic shielding cover has better toughness on the premise of low hardness.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and decorations can be made, which are also considered as the protection scope of the present invention.
Claims (12)
1. An electromagnetic shielding case is characterized by comprising a heat conduction layer, a film layer and a shielding layer;
the heat conduction layer is arranged on one surface of the film layer, and the shielding layer is arranged on one surface of the film layer, which is far away from the heat conduction layer;
the heat conduction layer is internally provided with a through hole penetrating through the upper surface and the lower surface of the heat conduction layer, and the porosity of the through hole is 0.2-12%.
2. The electromagnetic shield of claim 1, wherein the aperture of the through-hole is 0.2 to 1.5 microns.
3. The electromagnetic shield of claim 1, wherein the thermally conductive layer has a thickness of 1.2 to 15 microns.
4. The electromagnetic shield of claim 1 wherein said thermally conductive layer comprises a thermally conductive filler, said thermally conductive filler being present in said thermally conductive layer in an amount of 60% to 70%.
5. The electromagnetic shield of claim 4, wherein the thermally conductive filler comprises a sheet-structured thermally conductive filler.
6. The electromagnetic shield according to claim 4, wherein the thermally conductive filler comprises a spherically structured thermally conductive filler having a particle size of 0.1 to 2 μm.
7. The electromagnetic shield of claim 1, wherein the thin film layer has a thickness of 5 to 10 microns.
8. The electromagnetic shield of claim 1, wherein the thickness of the shielding layer is 7-20 microns.
9. The electromagnetic shield of claim 1 further comprising a glue film layer disposed on a side of the shielding layer distal from the film layer.
10. The electromagnetic shield of claim 1, wherein the shielding layer comprises conductive particles.
11. A circuit board comprising a circuit board body and an electromagnetic shield according to any one of claims 1 to 10; the electromagnetic shielding cover is in press fit with the circuit board body, and one surface of the shielding layer, which is far away from the thin film layer, is electrically connected with the ground layer of the circuit board body.
12. An electronic terminal device, characterized by comprising the wiring board of claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221332019.2U CN217563993U (en) | 2022-05-30 | 2022-05-30 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221332019.2U CN217563993U (en) | 2022-05-30 | 2022-05-30 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217563993U true CN217563993U (en) | 2022-10-11 |
Family
ID=83499550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221332019.2U Active CN217563993U (en) | 2022-05-30 | 2022-05-30 | Electromagnetic shielding cover, circuit board and electronic terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217563993U (en) |
-
2022
- 2022-05-30 CN CN202221332019.2U patent/CN217563993U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2633746B1 (en) | Composite film for board level emi shielding | |
| CN109315084B (en) | Ultra-thin electromagnetic wave shielding sheet and electronic device having the same | |
| JP5100878B1 (en) | Component built-in board mounting body, manufacturing method thereof, and component built-in board | |
| CN109310005A (en) | A kind of graphite composite circuit board | |
| CN205105522U (en) | Electromagnetic wave shielding piece and electronic equipment | |
| JP2017045932A (en) | Method for manufacturing electronic component module | |
| CN206686441U (en) | A kind of flexible PCB radiator structure and wearable device | |
| TW200830975A (en) | PCB structure having heat-dissipating member | |
| CN217563993U (en) | Electromagnetic shielding cover, circuit board and electronic terminal equipment | |
| CN206977798U (en) | Heat radiating type thickness copper coin | |
| CN211702875U (en) | Electromagnetic shielding film and circuit board | |
| US7355276B1 (en) | Thermally-enhanced circuit assembly | |
| WO2019130995A1 (en) | Noise absorption heat conduction sheet and electronic device using this | |
| US20120031651A1 (en) | Circuit board | |
| CN105744724B (en) | Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device | |
| CN113727515A (en) | Metal copper-clad plate | |
| CN115175550A (en) | Electromagnetic shielding case, circuit board and electronic terminal equipment | |
| JP2018046282A (en) | Method for manufacturing electronic component module | |
| CN211378348U (en) | Embedded soaking plate type multilayer circuit board | |
| CN210610139U (en) | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material | |
| CN214384968U (en) | Heat dissipation film with electromagnetic shielding function | |
| CN220390523U (en) | Wrapped type buffer foam capable of welding, conducting and radiating | |
| CN216584857U (en) | Single-sided heat dissipation film for electronic device | |
| JP3199599B2 (en) | Metal-based multilayer circuit board | |
| JPH08148781A (en) | Metal base multilayer circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |