JP2018046282A - Method for manufacturing electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component module by which an electromagnetic wave shield structure can be easily formed.SOLUTION: The method for manufacturing an electronic component module of the present invention includes: a step of mounting an electronic component 25 on a substrate 10 (11); a step of disposing a conductive sheet 51 having at least a heat radiation layer and a conductive adhesive layer comprising a conductive filler and a binder resin that is softened by heat, above the substrate where the electronic component 25 is mounted; and a step of forming an electromagnetic wave shield layer 50 by hot-pressing the conductive sheet 51 to follow the electronic component 25 and an exposed surface of the substrate 10 (11). The electromagnetic wave shield layer 50 is grounded by contacting a ground pattern 32 connected to the substrate 10 (11).SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing an electronic component module covered with an electromagnetic wave shielding layer.

  An electronic component equipped with an IC chip or the like is usually provided with an electromagnetic wave shielding structure in order to prevent malfunction caused by an external magnetic field or radio wave. For example, there is a method of shielding a package on which an electronic component such as an IC is mounted with a metal can. Further, an electronic component package in which a plating layer is formed on the surface of a sealing body constituting a package on which the electronic component is mounted and grounded has been proposed (Patent Document 1).

  Patent Document 2 discloses a method of electromagnetic shielding an electronic component module by a method of filling a conductive foil and a conductive material. Specifically, the electrodes on the wiring board and circuit components are connected with solder or the like, and after covering them with an insulating resin, a conductive foil is formed on the top surface of the insulating resin, and the conductive resin is formed in the groove on the side surface of the insulating resin. A method of electrically connecting a conductive foil provided on the top surface of an insulating resin and a ground pattern of a wiring board via a conductive substance by filling with a conductive substance is disclosed.

  Patent Document 3 discloses a configuration in which a conductive resin layer is provided by coating a mold resin, which is a part of an electronic component, with a conductive paste. More specifically, a method of providing a conductive shield including a step of applying a conductive paste on a mold resin and a step of heating and curing the conductive paste has been proposed.

JP-A-11-163583 JP 2005-159227 A JP 2013-207213 A

However, the electronic component module of Patent Document 1 has limited improvement in productivity because it takes time to form a plating layer. In addition, the electronic component module of Patent Document 2 requires the formation of the conductive foil on the top surface and the formation of the conductive material on the side surface, and the formation of the electromagnetic wave shielding layer requires at least two steps. there were. In addition, since the electronic component module of Patent Document 3 is formed by applying a conductive paste to form a conductive shield layer, the thickness is likely to vary, and the productivity is limited.
In addition, with the recent high performance of electronic modules, there has been a problem that the amount of heat generation increases and heat is retained in the electronic modules, resulting in a decrease in performance.

  The present invention has been made in view of the above background, and an object of the present invention is to provide an electronic component module manufacturing method capable of easily forming an electromagnetic wave shielding structure and a heat dissipation structure.

As a result of extensive studies by the present inventors, it has been found that the problems of the present invention can be solved in the following modes, and the present invention has been completed.
An electronic component module manufacturing method according to the present invention includes a step of mounting an electronic component on a substrate, and a conductive adhesive containing a binder resin and a conductive filler that are softened by heat above the substrate on which the electronic component is mounted. A step of disposing a conductive sheet having at least a layer and a heat dissipation layer; and a step of forming an electromagnetic wave shielding layer by thermocompression bonding the conductive sheet so as to follow the surface of the electronic component and the exposed substrate. The electromagnetic wave shielding layer is grounded with a ground pattern formed on the substrate.

  According to the present invention, there is no problem of waste liquid treatment as in the plating process, there is little variation in the coating thickness as in the conductive paste coating, and the conductive sheet prepared in advance in the thermocompression bonding process to electronic components etc. Since the electromagnetic wave shielding structure and the heat dissipation structure could be formed, an electronic component module in which the electromagnetic wave shielding structure and the heat dissipation structure were easily formed could be obtained.

  According to the present invention, an electronic component module manufacturing method capable of easily forming an electromagnetic wave shielding structure can be provided.

1 is a schematic cross-sectional view of an electronic component module according to a first embodiment. Sectional drawing of the manufacturing process of the electronic component module which concerns on 1st Embodiment. Sectional drawing of the manufacturing process of the electronic component module which concerns on 1st Embodiment. Sectional drawing of the manufacturing process of the electronic component module which concerns on 1st Embodiment. Sectional drawing of the manufacturing process of the electronic component module which concerns on 2nd Embodiment. Manufacturing process sectional drawing of the electronic component module which concerns on 3rd Embodiment. Manufacturing process sectional drawing of the electronic component module which concerns on 4th Embodiment. Manufacturing process sectional drawing of the electronic component module which concerns on 4th Embodiment. Typical sectional drawing of the electronic component module which concerns on 4th Embodiment. Manufacturing process sectional drawing of the electronic component module which concerns on 5th Embodiment. Typical sectional drawing of the electronic component module which concerns on 6th Embodiment. Manufacturing process sectional drawing of the electronic component module which concerns on 6th Embodiment. Manufacturing process sectional drawing of the electronic component module which concerns on 7th Embodiment. The structure sectional view of the conductive sheet which has a heat dissipation layer.

  Hereinafter, an example of an embodiment to which the present invention is applied will be described. In addition, the size and ratio of each member in the following drawings are for convenience of explanation, and are not limited to this.

[First Embodiment]
FIG. 1 is a schematic cross-sectional view of an electronic component module obtained by the manufacturing method according to the first embodiment. As shown in FIG. 1, the electronic component module 1 includes a substrate 10, an electronic component 25, an electromagnetic wave shield layer 50, and the like. In the electronic component 25, the integrated circuit 20 is molded with a sealing resin 40. The electronic component of the present invention is not limited to the above-described configuration, and can be applied to a bare chip semiconductor IC, or an electronic component in which a capacitor, an inductor, a thermistor, a resistor, and the like are protected by an insulator. Hereinafter, the manufacturing method of the electronic component module 1 according to the first embodiment will be described using the manufacturing process sectional views of FIGS.

(Process 1)
First, as shown in FIG. 2, the electronic component 25 is mounted on the mother board 11. More specifically, the integrated circuit 20 is mounted on the mother substrate 11, and then the integrated circuit 20 is molded with the sealing resin 40. Alternatively, an electronic component obtained by molding an integrated circuit with a sealing resin may be mounted on the mother substrate 11. The material of the sealing resin 40 is not particularly limited, but a thermosetting resin is usually used. The method for forming the sealing resin 40 is not particularly limited, and examples thereof include printing, laminating, transfer molding, compression, and casting.

  The mother substrate 11 is a substrate on which the electronic component 25 is mounted, and is a work board on which a conductive pattern made of copper foil or the like is formed on one side or both sides. Ultimately, the substrate 10 is separated through a cutting process described later. The mother substrate 11 may be any substrate as long as it can mount the electronic component 25 and can withstand a thermocompression bonding step (step 3) described later. Suitable examples include a glass epoxy substrate, a glass composite substrate, a Teflon (registered trademark) substrate, a ceramic substrate, and the like.

  On the surface of the mother substrate 11, a conductive pattern 30 on which electrodes and wiring patterns are formed is formed. The conductive pattern 30 includes an electrode / wiring pattern 31 for electrical connection with the electronic component 25, a ground pattern 32 for ground contact with the electromagnetic wave shield layer 50, and the like. The material of the conductive pattern 30 is not particularly limited as long as the above-described object can be achieved. However, metals such as Cu, Al, Au, Ag, Ni, Pd, Sn, Cr, W, Fe, Ti, and SUS material, and alloys thereof An example is an isoconductive material. The structure of the inside and the back surface of the mother substrate 11 can be arbitrarily designed according to the application. For example, a back surface electrode (not shown) is formed on the back surface of the mother substrate 11, a wiring pattern (not shown) and an inner via (not shown) are formed inside, and a multilayer in which the front electrode and the back electrode are electrically connected. A wiring board can be exemplified.

  A plurality of electronic components 25 are formed in an array in the X direction and the Y direction on the mother substrate 11 (for example, 6 in the X direction and 50 in the Y direction). The electrode / wiring pattern 31 formed on the mother substrate 11 and the integrated circuit 20 are electrically connected and fixed via a conductor (not shown) such as solder or a conductive adhesive.

  One integrated circuit 20 or a plurality of integrated circuits 20 may be mounted on one electronic component module 1 as shown in FIG. Moreover, it replaces with the aspect which arrange | positions the electronic component 25 in an array form like FIG. 2, and the electronic component 25 can also be arrange | positioned in arbitrary positions. Moreover, this manufacturing method can be applied not only when manufacturing a plurality of electronic component modules 1 from the mother substrate 11 but also when manufacturing one electronic component module from the substrate 10 such as a printed wiring board.

(Process 2)
As shown in FIG. 2, a conductive sheet 51 having at least a conductive adhesive layer 52 and a heat dissipation layer 53 is disposed above the substrate on which the electronic component 25 is mounted. From the viewpoint of simplifying the manufacturing process, it is preferable to use one conductive sheet 51 for the entire plurality of electronic components 25 mounted on the mother substrate 11, but depending on the manufacturing equipment or the size of the mother substrate, etc. A plurality of conductive sheets 51 may be used for each area of the mother substrate 11, or the conductive sheets 51 may be provided for each electronic component 25.

  As described above, the conductive sheet 51 has at least the conductive adhesive layer 52 and the heat dissipation layer 53. The conductive adhesive layer 52 is a layer formed using a composition containing at least a binder resin softened by heat and a conductive filler. From the viewpoint of easy handling during thermocompression bonding, the conductive sheet 51 is preferably a laminate of a conductive adhesive layer 52 and a heat dissipation layer 53 as shown in FIG. The conductive adhesive layer 52 may be a single layer or a plurality of layers. In the case of forming with a plurality of layers, it is preferable that the outermost layer is composed of a layer having higher fluidity.

The conductive adhesive layer 52 preferably has a flow amount of 0.05 mm or more and 2 mm or less, and 0.1 mm or more and 1 mm or less when thermocompression bonding is performed for 30 minutes at 150 ° C. and a pressure of 5 kg / cm ^2. More preferably, it is 0.1 mm or more and 0.5 mm or less. By setting the thickness in the range of 0.05 mm or more and 2 mm or less, moderate fluidity can be obtained for covering the electronic component 25 and the mother substrate 11. The flow amount refers to a length that protrudes from the side surface with respect to the original size of the conductive adhesive layer 52 when the conductive adhesive layer 52 is pressure-bonded under the above conditions. The temperature and pressure in the thermocompression bonding process of this manufacturing process do not have to be performed under the conditions of 150 ° C. and 5 kg / cm ² , and the electromagnetic shielding layer is coated according to the heat resistance of the electronic component 25, the manufacturing equipment, or needs. Each can be set independently and independently within a range in which the property can be secured. It is preferable to set the temperature and pressure conditions so that a flow amount of 0.1 mm or more and 2 mm or less is obtained. The pressure range, the flow amount but is not limited, it is preferably a pressure to be obtained, preferably about 1 to 10 kg / cm ^2, about 2~8kg / cm ² is more preferable. The crimping time is preferably not limited to a time for obtaining the flow amount, but is preferably about 1 to 30 minutes. What is necessary is just to use the electroconductive sheet of the thickness from which the said flow amount is obtained as an electroconductive sheet.

  The thickness of the conductive adhesive layer 52 is such that the groove 61 is filled with the conductive adhesive layer 52 in the thermocompression bonding step (step 3) to be described later and the top surface of the electronic component 25 can be covered. To do. Although it may vary depending on the fluidity of the binder resin used and the size of the groove 61, it is usually preferably about 10 to 500 μm, more preferably about 20 to 300 μm, and further preferably about 30 to 100 μm. Thereby, the electromagnetic wave shielding property can be effectively exhibited while improving the covering property to the sealing resin 40.

  The Tg of the binder resin constituting the conductive adhesive layer 52 is preferably −20 ° C. or higher and 100 ° C. or lower, and more preferably 0 ° C. or higher and 80 ° C. or lower. One type of binder resin may be used or a plurality of types may be used in combination. In the case of using a plurality of types, it is preferable that the main component is Tg before mixing included in the above range. The material of the conductive adhesive layer 52 only needs to have a flow property that softens during thermal compression and follows the surface of the electronic component 25 and the exposed mother substrate 11, and has a conductive property that can exhibit electromagnetic shielding properties. There is no particular limitation.

  Although it does not specifically limit as binder resin in the range which does not deviate from the meaning of this invention, A thermosetting resin is preferable. In applications where there is no heating step such as a reflow step in the subsequent step, a thermoplastic resin is preferred. As the thermosetting resin, a self-crosslinking type and a curing agent reaction type can be used. As the curing agent reaction type binder resin, a thermosetting resin to which a reactive functional group capable of reacting with the curing agent is bonded is preferable.

  The thermosetting resin is preferably epoxy, acrylic, urethane, polystyrene, polycarbonate, polyamide, polyamideimide, polyesteramide, polyether ester, urethane urea, polyimide, or the like. The thermosetting resin usually has a functional group capable of self-crosslinking or a functional group capable of reacting with a curing agent. Among these, in consideration of harsh conditions when manufacturing an electronic device in which the electronic component module 1 is mounted (for example, at the time of reflow), the thermosetting resin is an epoxy, epoxy ester, urethane, urethane urea, or polyamide. It is preferable that at least one of these is included. Moreover, if it is the range which can endure a heating process, a thermosetting resin and a thermoplastic resin can be used together.

  The curing agent has a plurality of functional groups capable of reacting with the curable functional group. The curing agent is preferably an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, an aziridine compound, an amine compound such as dicyandiamide, an aromatic diamine, or a phenol compound such as a phenol novolac resin.

  It is preferable that 1-100 mass parts is contained with respect to 100 mass parts of thermosetting resins, as for a hardening | curing agent, 3-70 weight part is more preferable, and 3-50 weight part is further more preferable.

  The thermoplastic resin is preferably polyester, acrylic, polyether, urethane, styrene elastomer, polycarbonate, butadiene, polyamide, ester amide, isoprene, cellulose or the like.

  The conductive filler is not particularly limited as long as it has conductive properties and can exhibit electromagnetic wave shielding properties, but examples thereof include metals such as gold, silver and copper, alloys thereof, and conductive polymers. The shape of the conductive filler is not particularly limited, and examples thereof include a spherical shape, a flake shape, and a dendritic shape. The content of the conductive filler is preferably 30 to 1000 parts by mass and more preferably 40 to 800 parts by mass with respect to 100 parts by mass of the binder resin. By setting it as this range, the effect that it becomes easy to make electromagnetic shielding property and flow property compatible is acquired.

  The average particle diameter of the conductive filler is preferably 1 to 50 μm. In addition, an average particle diameter is a numerical value which averaged about 10-20 from the enlarged image (for example, 1000 times-10,000 times) of the scanning electron microscope. When the length of the conductive filler is greatly different between the length direction and the lateral direction (when the aspect ratio is 1.5 or more), the average particle diameter is calculated in the length direction.

Furthermore, the composition constituting the conductive adhesive layer may contain a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent, and the like.
Examples of the colorant include organic pigments, carbon black, ultramarine blue, petals, zinc white, titanium oxide, and graphite.
Examples of the flame retardant include a halogen-containing flame retardant, a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, and an inorganic flame retardant.
Examples of the inorganic additive include glass fiber, silica, talc, and ceramic.
Examples of the lubricant include fatty acid esters, hydrocarbon resins, paraffin, higher fatty acids, fatty acid amides, aliphatic alcohols, metal soaps, and modified silicones.
Examples of the anti-blocking agent include calcium carbonate, silica, polymethylsilsesquiosan, aluminum silicate salt and the like.

The heat-dissipating layer 53 is selected from a vapor-deposited film, a metal foil, a metal mesh, a metallic nonwoven fabric, a resin coating containing a thermally conductive filler, and a graphite sheet. Are stacked.
The selection of the heat dissipation layer 53 can be determined according to the required heat dissipation.

  The resin coating film containing a heat conductive filler is a sheet formed from a mixture in which a heat conductive filler is mixed and dispersed in a binder resin.

The binder resin used for the resin coating film containing the thermally conductive filler can be the same as the binder resin described for the conductive sheet. The thermal conductive filler is not particularly limited as long as it has thermal conductivity. For example, metal oxides such as aluminum oxide, calcium oxide, and magnesium oxide, metal nitrides such as aluminum nitride and boron nitride, aluminum hydroxide, Metal hydroxides such as magnesium hydroxide, metal carbonates such as calcium carbonate and magnesium carbonate, metal silicates such as calcium silicate, hydrated metal compounds, crystalline silica, amorphous silica, silicon carbide or these A composite etc. are mentioned. Among these, metal oxides and metal nitrides are preferably used, and aluminum oxide, aluminum nitride, and boron nitride are more preferably used from the viewpoint of thermal conductivity.
These may be used alone or in combination of two or more.

(Process 3)
The conductive sheet 51 is thermocompression bonded so as to follow the electronic component 25 and the exposed surface of the mother substrate 11. Thereby, as shown in FIG. 3, the electromagnetic wave shielding layer 50 which covers the electronic component 25 is formed. The temperature and pressure at the time of thermocompression bonding may vary depending on the characteristics of the conductive adhesive layer 52 to be used, but the heating temperature is 100 ° C. from the viewpoint of ensuring sufficient bonding between the sealing resin 40 and the electromagnetic wave shielding layer 50. It is preferable that it is above, More preferably, it is 110 degreeC or more, More preferably, it is 120 degreeC or more. Moreover, although it depends on the heat resistance of the electronic component 25 as an upper limit, it is preferable that it is 220 degrees C or less, It is more preferable that it is 200 degrees C or less, It is still more preferable that it is 180 degrees C or less. From the viewpoint of smoothness and production efficiency, the pressure range is preferably 1 kg / cm ² or more, more preferably 3 kg / cm ² or more, and still more preferably 5 kg / cm ² or more. Further, the upper limit value is preferably 100 kg / cm ² or less, more preferably 80 kg / cm ² or less, and 50 kg / cm ² or less from the viewpoint of pressure resistance of the electronic component 25 and the mother substrate 11. More preferably it is.
The thermocompression bonding time can be set according to the heat resistance of the electronic component, the binder resin used for the conductive sheet, the production process, and the like. When a thermosetting resin is used as the binder resin, a range of about 1 minute to 2 hours is preferable. The thermocompression bonding time is more preferably about 1 minute to 1 hour. The thermosetting resin is cured by this thermocompression bonding. However, the thermosetting resin may be cured before thermocompression bonding as long as it can flow.

  By thermally pressing the conductive sheet 51 from the upper side, the binder resin is softened and the conductive adhesive layer 52 flows into the groove 61 and fills the groove 61, and the top and side surfaces of the sealing resin 40 and the mother substrate. An electromagnetic wave shielding layer 50 is formed on the exposed surface. Then, on the mother substrate 11 located on the side of the electronic component 25, the ground pattern 32 formed so as to protrude from the sealing resin 40 is brought into ground contact with the electromagnetic wave shielding layer 50 to form an electromagnetic wave shielding structure. The

  The depth h and the width w of the groove 61 are not limited as long as the conductive adhesive layer 52 can be filled in the thermocompression bonding process, but the depth h is, for example, about 50 to 1000 μm, and the width w is, for example, , About 100 to 1000 μm.

  The thickness of the electromagnetic shielding layer 50 formed on the top surface of the electronic component 25 can be appropriately designed depending on the application. In the case of applications where thinning is required, for example, about 1 to 10 μm is preferable, and about 1 to 8 μm is more preferable. In addition, when shielding high-frequency noise with high accuracy, it is possible to use a thick film of, for example, 50 to 1000 μm, but it is usually about 5 to 200 μm. The electromagnetic wave shielding layer can be appropriately selected from isotropic conductivity and anisotropic conductivity.

  In addition, a heat dissipation structure is formed on the top surface of the sealing resin 40 that seals the electronic component 25 by the heat dissipation layer 53 laminated on the conductive adhesive layer 52. The material, thickness, and the like of the heat dissipation layer 53 are determined based on required heat dissipation, heating temperature at the time of manufacture, heating pressure, and the like.

(Process 4)
After step 3, as shown in FIG. 4, the electromagnetic wave shielding layer 50 and the mother substrate 11 are cut. For example, using a dicing blade or the like, dicing is performed in the XY directions at a position corresponding to the product area of the individual electronic component module 1 on the mother substrate 11. Thereby, the electronic component module 1 in which the electronic component 25 is covered with the electromagnetic wave shielding layer 50 and the ground pattern 32 formed on the substrate 10 and the electromagnetic wave shielding layer 50 are grounded is obtained.

  Conventionally, as a method of forming an electromagnetic wave shielding layer, a method of fitting a metal can, a method of plating, a method of applying a conductive paste, and the like have been proposed. However, it cannot be said that the method of fitting a metal can has high versatility. In addition, the plating method and the method of applying a conductive paste have a problem that the processing steps are complicated. Moreover, in the method of performing a plating process and an electrically conductive paste, there existed a subject in the smoothness of the top | upper surface of an electromagnetic wave shield layer.

According to the method for manufacturing the electronic component module according to the first embodiment, since the sealing resin that covers the electronic component is covered with the electromagnetic wave shielding layer, high electromagnetic wave shielding properties can be exhibited. Moreover, since the electromagnetic wave shielding layer is formed using the conductive sheet having at least the conductive adhesive layer and the heat radiation layer, the manufacturing process of the electronic component module having the electromagnetic wave shielding structure and the heat radiation structure can be simplified. Can be planned. Further, since electronic components arranged in an array can be processed in a lump, manufacturing time can be shortened. Furthermore, since the conductive sheet is pressed and pressed in the surface direction of the mother board, the electromagnetic wave shielding layer on the top surface of the electronic component is excellent in smoothness. For this reason, when a product name or lot number is printed by an inkjet method or a laser marking method, a high-quality electronic component module with improved character visibility can be provided.
Moreover, since the heat dissipation layer 53 as a heat dissipation structure is formed in the electronic component module obtained by this manufacturing method, the heat released during the operation of the electronic component 25 is efficiently dissipated from the heat dissipation layer 53 to the outside. The As a result, it is possible to effectively prevent the deterioration of the function of the electronic component caused by the heat released during the operation of the electronic component 25 staying in the sealing resin 40.

[Second Embodiment]
Next, an example of a manufacturing method different from the first embodiment will be described. The manufacturing method according to the second embodiment has the same basic structure and manufacturing method as the first embodiment except for the following points. That is, the conductive sheet of the second embodiment is different from the first embodiment in which the concave and convex pattern is not formed on the conductive sheet in that the concave and convex pattern is formed. In the following drawings, the same element members are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  In FIG. 5, the manufacturing process sectional drawing of the process 1 which concerns on 2nd Embodiment is shown. The conductive adhesive layer 52a constituting the conductive sheet 51a has convex portions 62 formed at positions corresponding to the grooves 61 between the electronic components 25 formed on the mother substrate 11, and the top of the electronic component 25 is viewed from above. A recess 63 having substantially the same shape is formed at a position corresponding to the surface.

  The height and width of the convex portion 62 may be substantially the same size so as to be fitted into the depth h and width w of the electronic component 25, or may be filled as a small size. The convex portion of the conductive adhesive layer 52a can be formed by printing, photolithography, a lift-off method, or the like.

  According to the second embodiment, since the electromagnetic wave shielding layer is formed using the conductive sheet, the manufacturing process can be simplified and shortened. Moreover, it is excellent in the smoothness of the top surface of the electromagnetic wave shielding layer. Furthermore, the groove 61 can be suitably filled with a resin having a small flow amount of the conductive adhesive layer 52a. Moreover, it is particularly suitable for applications where the groove 61 is deep.

  It is also possible to stack an insulating pattern on the conductive sheet 51a. For example, in order to avoid a short circuit on the surface of the mother substrate 11, an insulating pattern is formed at a desired position of the convex portion 62, or an insulating layer is further provided on the surface of the concave portion 63 to insulate and protect the integrated circuit 20. It is also possible to laminate them.

[Third Embodiment]
The configuration of the manufacturing method and the electronic component module according to the third embodiment is the same as that of the first embodiment except that the shape of the sealing resin is different.

  FIG. 6 shows a cross-sectional view of the manufacturing process of the process 2 according to the third embodiment. The sealing resin 40b of the electronic component 25b is provided with a taper shape such that the area decreases toward the top surface of the electronic component 25b in order to improve the coverage of the electromagnetic wave shielding layer 50.

  According to the third embodiment, the same effect as that of the first embodiment can be obtained. Further, by providing the tapered shape, the coverage of the electromagnetic wave shielding layer 50 on the side surface of the electronic component 25b can be more effectively improved.

[Fourth Embodiment]
The basic structure and manufacturing method of the fourth embodiment manufacturing method and electronic component module are the same as those of the first embodiment except for the following points. That is, it differs from the first embodiment in that the electromagnetic wave shielding layer is provided not only around the sealing resin 40 but also on the side surface of the substrate 10. Further, the timing of the substrate cutting process and the method of forming the sealing resin are different from those of the first embodiment.

  In FIG. 7, the manufacturing process sectional drawing of the process 1 which concerns on 4th Embodiment is shown. As shown in the figure, the integrated circuit 20 is mounted on the mother substrate 11, and a sealing resin 40 c is formed on substantially the entire surface of the mother substrate 11. And after fixing the mother board | substrate 11 to the mounting base 64, the sealing resin 40c and the mother board | substrate 11 are cut | disconnected by the dicing etc. in the position corresponding to a product area by a cutting process. Thereby, the board | substrate 10c and the electronic component 25c which were separated into pieces as shown in FIG. 8 are obtained. At this time, the width w is determined so that the groove 61 is sufficiently filled with the conductive adhesive layer of the conductive sheet in a thermocompression bonding step (step 3) described later.

  Next, an electromagnetic wave shielding layer 50c that covers the side of the substrate 10c, the side of the sealing resin 40c, and the top surface of the sealing resin 40c is obtained by the same method as in the first embodiment. Then, the electromagnetic wave shielding layer 50c is cut at a position corresponding to the product area by the cutting process, thereby obtaining the electronic component module 2 as shown in FIG.

  According to the fourth embodiment, the same effect as in the first embodiment can be obtained. In addition, the side of the substrate 10c can be covered with the electromagnetic wave shielding layer 50c by an easy manufacturing process.

[Fifth Embodiment]
The electronic component module and the manufacturing method thereof according to the fifth embodiment have the same basic structure and manufacturing method as those of the fourth embodiment except for the following points. That is, the fourth embodiment is different from the fourth embodiment in that the manufacturing method of the sealing resin is the same as that of the first embodiment and that the groove is formed only in the thickness direction of the mother substrate.

  FIG. 10 is a cross-sectional view of the manufacturing process of the process 1 according to the fifth embodiment. As shown in the figure, the integrated circuit 20 and the sealing resin 40 are formed on the mother substrate, and then only the upper portion in the thickness direction of the mother substrate is cut. The groove 65 is obtained by fixing the mother substrate to the mounting table 64 and then cutting the substrate by dicing or the like at a position corresponding to the product area by a cutting process. As a result, a mother substrate 11d is obtained in which grooves 65 having substantially the same shape as viewed from above are formed on the upper side in the thickness direction of the mother substrate. The widths of the groove 61 and the groove 65 are not limited to the same, and can be designed independently.

  Next, an electromagnetic wave shielding layer that covers the upper side portion of the mother substrate 11, the side portion of the sealing resin 40, and the top surface is obtained by the same method as in the first embodiment. Then, by cutting the electromagnetic wave shield layer and the mother substrate 11d at a position corresponding to the product area by a cutting process, an electronic component module in which the electromagnetic wave shield layer is formed on the electronic component 25 and the upper side of the substrate 10 is obtained.

  According to the fifth embodiment, the same effect as that of the fourth embodiment can be obtained. Moreover, the electronic component module in which the electromagnetic wave shielding layer is formed to a desired position on the side surface of the substrate can be formed by an easy manufacturing process.

[Sixth Embodiment]
The electronic component module and the manufacturing method thereof according to the sixth embodiment are such that a plurality of integrated circuits are mounted on a substrate, the electronic component is mounted on a substrate constituting the electronic component module without using a mother substrate, The same as the fourth embodiment, except that an uneven shape is formed on the top surface of the stop resin.

  FIG. 11 is a schematic cross-sectional view of the electronic component module 3 obtained by the manufacturing method according to the sixth embodiment. The electronic component module 3 has a plurality of concave and convex shapes on the top surface of the sealing resin 40 e, and an electromagnetic wave shielding layer 50 e is formed in the concave portion 66.

  For example, as shown in FIG. 12, the electromagnetic wave shielding layer 50e is formed by fixing the mounted substrate 10 at a desired position in a manufacturing container 70 having a concave shape that is substantially the same shape as the finished product. Then, the conductive sheet 51e is placed and thermocompression bonded. Then, by taking out from the manufacturing container 70, the electronic component module which formed the electromagnetic shielding layer 50e in the top | upper surface of the sealing resin 40e and the side of the sealing resin 40e and the board | substrate 10 is obtained.

  According to the manufacturing method according to the sixth embodiment, the same effects as in the fourth embodiment can be obtained. Further, by using the conductive sheet of the present invention, even when the top surface of the electronic component 25e is provided with an uneven shape, the electromagnetic wave shielding layer can be easily formed in the recess by a simple manufacturing process. . Therefore, it becomes possible to increase the degree of freedom in designing the top surface of the electronic component, and an electromagnetic wave shielding layer can be easily formed on the insulating structure portion of the electronic component. In addition, the size and formation position of the recessed part 66 can be designed arbitrarily. Moreover, the cross-sectional shape of a recessed part can be designed arbitrarily, for example, rectangular shape, V shape, U shape etc. can be illustrated.

[Seventh Embodiment]
The electronic component module and the manufacturing method thereof according to the seventh embodiment are the same as those in the first embodiment except for the following points. That is, the electromagnetic wave shielding layer is different from the first embodiment in that it is formed along the sealing resin 40.

  FIG. 13 shows a cross-sectional view of the manufacturing process of process 3 according to the seventh embodiment. As shown in the figure, the electromagnetic wave shielding layer 50f is formed so as to follow the shape of the top and side surfaces of the sealing resin 40f and the exposed surface of the mother substrate 11.

  According to the method according to the seventh embodiment, the same effect as in the first embodiment can be obtained. Moreover, since the method of covering the exposed surface without filling the groove 61 is employed, the conductive adhesive layer can be used efficiently. It is particularly suitable for applications where the groove width is wide.

  In each of the above embodiments, the sheet-like heat radiation layer 53 is laminated on the conductive sheet 51. However, FIG. 14 illustrates the heat radiation layer 53 in FIG. 14 (x1) in order to enhance the heat radiation effect of the heat radiation layer 53. A cross-sectional shape such as a bellows shape 53x1 shown in FIG. 5 and a sleeper shape 53x2 shown in FIG. 14 (x2).

  In order to configure the heat dissipation layer 53 in the cross-sectional shape as described above, the metal foil is formed with irregularities by cutting or etching, and the convex portions arranged in line are the material of the conductive sheet 51, the heat dissipation conditions, etc. The distance w between the convex portions, the height h of the convex portions, the thickness t of the convex portions, etc. are determined accordingly. Further, if unevenness is formed on the surface of the rotating roller provided so as to sandwich the heat dissipation layer in the manufacturing process of the heat dissipation layer 53, the unevenness is automatically formed in the heat dissipation layer 53 during the manufacturing process.

  As described above, the use of the heat dissipation layer 53 having an uneven surface increases the contact area with air as compared to the case where the sheet-shaped heat dissipation layer 53 is used. As a result, the heat released from the electronic component 25 is effectively radiated to the outside, and the electronic component 25 can be more effectively prevented from being degraded by the heat retained in the sealing resin 40.

  The conductive sheet 51 may be provided with a protective film on the conductive adhesive layer 52 as necessary in order to prevent foreign matter from adhering to the conductive adhesive layer 52. Since this protective film is finally peeled off, a material having excellent releasability is preferable. It is also possible to peel the protective film at the timing when the electronic component module 1 is mounted on the electronic device. As a suitable example, a polyester film provided with a silicone or fluorine release layer or the like can be exemplified. The thickness of the protective film is, for example, about 5 to 300 μm, and more preferably about 25 to 200 μm.

  Further, a protective film may be provided on the heat radiation layer side of the conductive sheet 51. By providing the protective film, the handling property of the conductive sheet 51 is improved.

  It goes without saying that other embodiments may belong to the category of the present invention as long as they match the gist of the present invention. Moreover, the said embodiment is mutually combined suitably.

DESCRIPTION OF SYMBOLS 1, 2 Electronic component module 10 Board | substrate 11 Mother board 20 Integrated circuit 25 Electronic component 30 Conductive pattern 31 Electrode / wiring pattern 32 Ground pattern 40 Sealing resin 50 Electromagnetic wave shield layer 51 Conductive sheet 52 Conductive adhesive layer 53 Heat radiation layer 53 ( x1) Bellows-like heat dissipation layer 53 (x2) Sleeper-like heat dissipation layer 61 Groove 62 Protrusion 63 Concavity 64 Mounting table 65 Groove 66 Concavity

Claims (9)

Mounting electronic components on a substrate;
Disposing a conductive sheet having at least a binder resin and a conductive filler softened by heat on the substrate on which the electronic component is mounted, and a heat dissipation layer; and
Forming an electromagnetic wave shielding layer by thermocompression bonding the conductive sheet so as to follow the surface of the electronic component and the substrate,
A method for manufacturing an electronic component module, wherein the electromagnetic shielding layer is grounded to a ground pattern formed on the substrate.   The electronic component module according to claim 1, wherein a plurality of the electronic components are formed on the substrate, and an electromagnetic wave shielding layer is formed on the plurality of electronic components and between the electronic components. Method. The flow rate when the conductive adhesive layer is thermocompression bonded for 30 minutes under conditions of a temperature of 150 ° C. and a pressure of 5 kg / cm ² is 0.05 mm or more and 2 mm or less. The manufacturing method of the electronic component module of description.   The heat dissipation layer is any one selected from a vapor deposition film, a metal foil, a metal mesh, a metallic non-woven fabric, a resin coating containing a heat conductive filler, and a graphite sheet. The manufacturing method of the electronic component module of description.   5. The method of manufacturing an electronic component module according to claim 1, wherein the electromagnetic wave shielding layer is further coated on at least a part of a side of the substrate.   The binder resin of the conductive adhesive layer is at least one of a self-crosslinkable thermosetting resin, a thermosetting resin having a functional group capable of reacting with a curing agent, and a thermoplastic resin, and reacts with the curing agent. 6. The method of manufacturing an electronic component module according to claim 1, wherein, when the thermosetting resin having a functional group is used, the conductive adhesive layer includes the curing agent.   The method of manufacturing an electronic component module according to claim 1, further comprising a cutting step of the electromagnetic wave shielding layer after the step of forming the electromagnetic wave shielding layer. The upper surface and the side surface of the electronic component are made of a sealing resin,
8. The electronic component module according to claim 1, wherein the top surface of the sealing resin has an uneven shape, and an electromagnetic wave shielding layer is formed in the uneven portion of the uneven shape. 9. Method. The method for manufacturing an electronic component module according to claim 1, wherein the conductive sheet has a heat dissipation layer and a protective film laminated on the conductive adhesive layer.