CN110972389A - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN110972389A CN110972389A CN201811152665.9A CN201811152665A CN110972389A CN 110972389 A CN110972389 A CN 110972389A CN 201811152665 A CN201811152665 A CN 201811152665A CN 110972389 A CN110972389 A CN 110972389A
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- shielding
- circuit
- electronic component
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a circuit board, the circuit board includes the circuit layer, set up in the protective layer of circuit layer one side and set up in the protective layer is kept away from the shielding layer of circuit layer one side, the circuit board still includes a plurality of electronic component and a plurality of shielding unit, electronic component with circuit layer electric connection, every be provided with at least one around the electronic component and run through the protective layer makes the naked connecting hole of circuit layer, every the shielding unit covers the naked surface of at least one electronic component, every the shielding unit passes through the connecting hole with circuit layer electric connection, every the shielding unit with shielding layer electric connection.
Description
Technical Field
The present invention relates to a circuit board, and more particularly, to a circuit board with high electromagnetic shielding capability.
Background
In recent years, many electronic devices such as mobile phones and tablet terminals are provided with circuit boards on which many electronic components for transmitting large-capacity data are mounted. The presence of these electronic components not only easily generates noise, but also has high sensitivity to noise, and is likely to cause malfunction when exposed to noise from the outside. On the other hand, in order to achieve both reduction in size and weight and improvement in function of electronic equipment, it is necessary to increase the mounting density of electronic components. However, if the mounting density is increased, not only electronic components that are noise generation sources but also electronic components affected by noise increase.
In the prior art, the electronic components are often shielded by a metal cover by mounting the metal cover on the circuit board. However, the metal cover needs to occupy a large space and has a poor shielding effect when being disposed on the circuit board, and the difficulty of disposing the metal cover is increasing as the density of electronic components in the circuit board increases gradually, so that the shielding effect is further reduced if the metal cover is thinned to be suitable for a high-density circuit board. It is necessary to solve the problem of the skilled person how to design a circuit board with better shielding effect and small space occupation of the shielding unit.
Disclosure of Invention
The invention provides a circuit board which comprises a circuit layer, a protective layer arranged on one side of the circuit layer, a shielding layer arranged on one side of the protective layer far away from the circuit layer, a plurality of electronic elements and a plurality of shielding units, wherein the electronic elements are electrically connected with the circuit layer, at least one connecting hole penetrating through the protective layer and exposing the circuit layer is arranged around each electronic element, each shielding unit covers the exposed surface of at least one electronic element, each shielding unit is electrically connected with the circuit layer through the connecting hole, and each shielding unit is electrically connected with the shielding layer.
The invention also provides another circuit board which comprises a circuit layer, a protective layer positioned on one side of the circuit layer and a shielding layer positioned on one side of the protective layer far away from the circuit layer, and is characterized by also comprising a plurality of electronic elements and a plurality of shielding units, wherein the electronic elements are electrically connected with the circuit layer, each shielding unit covers the exposed surface of at least one electronic element, at least one conducting sheet is arranged around each electronic element, the conducting sheet is not contacted with the electronic elements, and the shielding units are electrically connected with the shielding layer through the conducting sheets.
According to the circuit board, the shielding units are respectively arranged on the single electronic element, so that the shielding units have smaller size, the space occupancy rate is reduced, the shielding units cover the exposed surfaces of the electronic elements, the electrical connection between the shielding units and the shielding layer is realized, and the shielding effect is greatly improved.
Drawings
Fig. 1 is a plan view of a circuit board according to a first embodiment of the present invention.
Fig. 2 is a schematic sectional view of the circuit board of the first embodiment of the present invention along the direction II-II.
Fig. 3A to 3F are schematic views of a manufacturing process structure of the circuit board according to the first embodiment of the invention.
Fig. 4 is a plan view of a circuit board of a second embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of a circuit board along the V-V direction according to a second embodiment of the present invention.
Fig. 6A to 6F are schematic views of a manufacturing process structure of a circuit board according to a second embodiment of the invention.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to make the disclosure more complete and complete, reference may be made to the accompanying drawings, in which like references indicate the same or similar elements, and to the following description of various embodiments of the invention. However, it will be understood by those of ordinary skill in the art that the examples provided below are not intended to limit the scope of the present invention. Furthermore, the drawings are for illustrative purposes only and are not drawn to scale in accordance with actual dimensions thereof.
Embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
First embodiment
As shown in fig. 1, a plan view of a circuit board 10 according to a first embodiment of the present invention is shown. Fig. 2 is a schematic sectional view of the circuit board of the first embodiment of the present invention along the direction II-II. The circuit board 10 includes a base layer 180, a circuit layer 110 disposed on a surface of one side of the base layer 180, a protection layer 120 disposed on a side of the circuit layer 110 away from the base layer 180, and a shielding layer 130 disposed on a side of the protection layer 120 away from the circuit layer 110. The circuit board 10 further includes a plurality of electronic components 150, a plurality of dielectric units 140, and a plurality of shielding units 160, wherein one electronic component 150 is electrically connected to the circuit layer 110 through one dielectric unit 140. At least one connection hole 121 penetrating through the protective layer 120 and exposing the circuit layer 110 is disposed around one electronic component 150, each shielding unit 160 covers an exposed surface of at least one electronic component 150, each shielding unit 160 is electrically connected to the circuit layer 110 through the connection hole 121, and each shielding unit 160 is electrically connected to the shielding layer 130.
The circuit layer 110 is disposed on a surface of one side of the base layer 180, the circuit layer 110 includes a plurality of mounting areas 111, the circuit layer 110 corresponds to an area where the mounting areas 111 are located, the protective layer 120 and the shielding layer 130 are not disposed on a side away from the base layer 180, and a thickness of the circuit layer 110 corresponding to the area where the mounting areas 111 are located is smaller than thicknesses of other areas.
The circuit layer 110 is made of a conductive material, and the circuit layer 110 has a good conductive capability, in an embodiment, the circuit layer 110 may be a metal simple substance, an alloy, a composite metal, or other conductive materials, in this embodiment, the material of the circuit layer 110 is copper (Cu). The circuit layer 110 has a plurality of traces 112 corresponding to the mounting area 111, the electronic component 150 is disposed corresponding to the mounting area 111, the electronic component 150 is electrically connected to the traces 112 through a dielectric unit 140, the traces 112 can extend to be electrically connected to other components, such as a Central Processing Unit (CPU), and the traces 112 can have other electrical functions, such as serving as a signal transmitting antenna; other functional lines, such as a grounding circuit (not shown), are also included in the line layer 110.
The protective layer 120 is disposed on a side of the circuit layer 110 away from the base layer 180, and the protective layer 120 can protect a covered portion of the circuit layer 110 from being oxidized by contact with air, or from being corroded by water vapor, or from being short-circuited by contact with other conductive substances, or from physical damage caused by scratch and knock. The protective layer 120 is an insulating material, and the composition of the protective layer may include at least one of Polyimide (PI), Polyethylene naphthalate (PEN), Polyethylene terephthalate (PET), or ink.
The passivation layer 120 has a plurality of connection holes 121 and through holes 123. The connection holes 121 penetrate through the protection layer 120 and expose at least a portion of the surface of the circuit layer 110, the connection holes 121 are disposed adjacent to the mounting regions 111, in one embodiment, at least one connection hole 121 is disposed around each mounting region 111, in other embodiments, at least two connection holes 121 are disposed around each mounting region 111, the connection holes 121 are disposed on two opposite sides of the mounting region 111 or disposed around the mounting region 111, and the diameter of the connection hole 121 is greater than or equal to 0.2 mm. The circuit board 10 may further include a plurality of connection pads 122, at least one connection pad 122 is disposed in each connection hole 121, the connection pad 122 covers at least a portion of the surface of the circuit layer 110 exposed in the connection hole 121 to protect the at least a portion of the surface of the circuit layer 110, the connection pad 122 is made of a conductive material, and may be a metal, such as gold (Au), and the connection pad 122 is electrically connected to the circuit layer 110. The through holes 123 penetrate through the protection layer 120 and expose at least a portion of the surface of the circuit layer 110, the through holes 123 are disposed on a side of the connection hole 121 away from the mounting region 111, and one or more through holes 123 may be provided.
The shielding layer 130 covers the surface of the protection layer 120 away from the circuit layer 110 and fills the through hole 123 to extend to contact with the circuit layer 110, but the protection layer 120 between the mounting region 111 and the connection hole 121 is not covered by the shielding layer 130, the shielding layer 130 is made of a conductive material, the shielding layer 130 is disposed outside the circuit layer 110 to form a continuous shielding field, and the shielding layer 130 is electrically connected to the circuit layer 110 and connected to a ground line in the circuit layer 110.
The dielectric unit 140 is disposed corresponding to the mounting region 111 and at least fills a recess region surrounded by the base layer 180, the circuit layer 110 and the protection layer 120, the electronic element 150 is disposed on a side of the dielectric unit 140 away from the base layer 180, and the electronic element 150 is electrically connected to the trace 112 through the dielectric unit 140. In one embodiment, the dielectric unit 140 may be a conductor or a semiconductor, and in this embodiment, the dielectric unit 140 is an anisotropic conductive adhesive, which has conductivity only in the connection direction of the electronic element 150 and the trace 112, so as to realize the directional electrical connection between the electronic element 150 and the trace 112. The electronic component 150 may be a transistor, a resistor, a capacitor, or an inductor, among other micro-electronic devices or components.
In one embodiment, the shielding unit 160 covers the surface of the electronic element 150 not in contact with the dielectric unit 140, i.e., the shielding unit 160 covers the exposed surface of the electronic element 150, the shielding unit 160 is partially disposed in the connection hole 121 and is in contact with the connection pad 122 to form an electrical connection, and the shielding unit 160 is electrically connected to the shielding layer 130. In the embodiment, the shielding unit 160 is a silver paste coated on the exposed surface of the electronic element 150 and further extends to contact with the shielding layer 130 and extends into the connection hole 121 to contact with the connection pad 122, and the shielding unit 160 made of the silver paste is electrically connected to the shielding layer 130 and electrically connected to the ground line of the circuit layer 110 through the connection pad 122 to form a continuous shielding structure, which has a better electromagnetic shielding effect. In an embodiment, the thickness of the shielding unit 160 on the side of the electronic component 150 away from the circuit layer 110 is greater than the thickness of the shielding unit 160 on other exposed surfaces of the electronic component 150, in this embodiment, the thickness of the silver paste on the sidewall of the electronic component 150 is less than the thickness of the silver paste on the top surface of the electronic component 150 away from the circuit layer 110, and the ratio of the thickness of the sidewall silver paste to the thickness of the top surface silver paste may be greater than or equal to 0.5.
Fig. 3A to 3F are schematic diagrams of a manufacturing flow structure of the circuit board 10 according to the first embodiment of the present invention. The method for manufacturing the circuit board 10 of the first embodiment of the present invention includes the steps of:
the method comprises the following steps: a base layer 180 is provided, and a conductive material layer a is disposed on the surface of the base layer 180.
Specifically, as shown in fig. 3A, a conductive material layer a may be formed on a surface of the base layer 180 by Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), adhesion, or crystal growth, and the conductive material layer a may uniformly cover the base layer 180.
Step two: the conductive material layer a is patterned to obtain the circuit layer 110.
Specifically, as shown in fig. 3B, a mask may be formed on the conductive material layer a by forming a photosensitive film, the mask is exposed and etched to pattern the surface of the mask, the mask and the conductive material layer a are etched by a conventional etching method, and the mask is removed to obtain the circuit layer 110, where the etched circuit layer 110 includes a mounting area 111 having a thickness smaller than that of other areas and a trace 112 located in the mounting area.
Step three: a protection layer 120 is formed on the surface of the circuit layer 110 away from the base layer 180.
Specifically, as shown in fig. 3C, an insulating material layer is formed on the surface of the circuit layer 110 by wet coating, dry film pressing, etc., a mask is formed on the surface of the insulating material layer on the side away from the circuit layer 110 by forming a photosensitive film, the mask is exposed and etched to pattern the surface of the mask, the mask and the insulating material layer are etched by a conventional etching method, and the mask is removed to obtain the protection layer 120, where the protection layer 120 is not disposed in the mounting region 111. The etched protection layer 120 has a plurality of connection holes 121 and through holes 123 penetrating through the protection layer 120, the connection holes 121 are located around the mounting region 111, and the through holes 123 are located on a side of the connection holes 121 away from the mounting region 111.
Step four: a shielding layer 130 is formed on the surface of the protection layer 120 away from the circuit layer 110.
Specifically, as shown in fig. 3D, in this example, the shielding layer 130 may be formed on the surface of the protection layer 120 away from the circuit layer 110 by sputtering, physical vapor deposition, chemical vapor deposition, or coating conductive silver paste, so that the shielding layer 130 covers at most only the surface of the protection layer 120 and does not include the region between the connection hole 121 and the mounting region 111, and the shielding layer 130 extends and fills the through hole 123 and contacts the circuit layer 110. A connection pad 122 is disposed in the connection hole 121, so that the circuit layer 110 exposed in the connection hole 121 is covered.
Step five: the electronic component 150 is mounted.
Specifically, as shown in fig. 3E, a dielectric unit 140 is disposed corresponding to the mounting region 111 and fills the recessed area of the mounting region 111, the dielectric unit 140 covers the trace 112, and the electronic component 150 is mounted at one end of the dielectric unit 140 so as not to be in direct contact with the circuit layer 110 or the protection layer 120.
Step six: the shielding unit 160 is formed.
Specifically, as shown in fig. 3F, a silver paste is sprayed, printed, or spin-coated on the exposed surface of the electronic component 150, the silver paste further extends into the nearest adjacent connection hole 121 of the electronic component 150 and contacts the connection pad 122, the silver paste further extends to contact the shielding layer 130, and the silver paste is solidified by baking, ventilation, or standing, and the shielding unit 160 is finally formed.
Second embodiment
Fig. 4 is a plan view of a circuit board 20 according to a second embodiment of the present invention. Fig. 5 is a schematic sectional view of a circuit board according to a second embodiment of the present invention along the V-V direction. The circuit board 20 includes a base layer 280, a circuit layer 210 disposed on a surface of one side of the base layer 280, a protection layer 220 disposed on a side of the circuit layer 210 away from the base layer 280, and a shielding layer 230 disposed on a side of the protection layer 220 away from the circuit layer 210. The circuit board 20 further includes a plurality of electronic components 250, a plurality of dielectric units 240, and a plurality of shielding units 260, wherein each electronic component 250 is electrically connected to the circuit layer 210 through the corresponding dielectric unit 240. Each shielding unit 260 covers the exposed surface of at least one electronic element 250, at least one conductive sheet 270 is disposed around one or more electronic elements 250, the conductive sheet 270 is not in contact with the electronic element 250, and the shielding unit 260 is electrically connected to the shielding layer 230 through the conductive sheet 270.
The circuit layer 210 is disposed on a surface of one side of the base layer 280, the circuit layer 210 includes a plurality of mounting regions 211, a protection layer 220 and a shielding layer 230 are not disposed on a side of a region of the circuit layer 210 corresponding to the mounting region 211, the side being away from the base layer 280, and a thickness of the region of the circuit layer 210 corresponding to the mounting region 211 is smaller than thicknesses of other regions.
The circuit layer 210 is a conductive material, and the circuit layer 210 has a good conductive capability, in an embodiment, the circuit layer 210 may be a metal simple substance, an alloy, a composite metal, or other conductive materials, in this embodiment, the material of the circuit layer 210 is copper (Cu). The circuit layer 210 is provided with a plurality of traces 212 corresponding to the mounting area 211, the electronic component 250 is provided corresponding to the mounting area 211, the electronic component 250 is electrically connected to the traces 212 through a dielectric unit 240, the traces 212 can extend to be electrically connected to other components, such as a Central Processing Unit (CPU), and the traces 212 can have other electrical functions, such as serving as a signal transmitting antenna; other functional lines, such as a grounding circuit (not shown), are also included in the line layer 210.
The protective layer 220 is disposed on a side of the circuit layer 210 away from the base layer 280, and the protective layer 220 can protect a covered portion of the circuit layer 210 from being oxidized by contact with air, or from being corroded by water vapor, or from being short-circuited by contact with other conductive substances, or from physical damage caused by scratch and collision. The protective layer 220 is an insulating material, and the composition of the protective layer may include at least one of Polyimide (PI), Polyethylene naphthalate (PEN), Polyethylene terephthalate (PET), or ink.
The protection layer 220 is provided with a plurality of through holes 223, the through holes 223 penetrate through the protection layer 220 and expose at least a part of the surface of the wiring layer 210, the through holes 223 are disposed around the mounting region 211, and one or more through holes 223 may be provided.
The shielding layer 230 covers the surface of the protection layer 220 away from the circuit layer 210 and fills the through hole 223 to extend to contact with the circuit layer 210, the shielding layer 230 is not disposed in the region corresponding to the mounting region 211, the shielding layer 230 is made of a conductive material, the shielding layer 230 is disposed outside the circuit layer 210 to form a continuous shielding field, and the shielding layer 230 is electrically connected to the circuit layer 210 and connected to a ground line in the circuit layer 210.
The dielectric unit 240 is disposed corresponding to the mounting region 211 and at least fills a recessed area surrounded by the base layer 280, the circuit layer 210, the protection layer 220 and the shielding layer 230, the electronic element 250 is disposed on a side of the dielectric unit 240 away from the base layer 280, and the electronic element 250 is electrically connected to the trace 212 through the dielectric unit 240. In an embodiment, the dielectric unit 240 may be a conductor or a semiconductor, and in this embodiment, the dielectric unit 240 is an anisotropic conductive adhesive, which has conductivity only in a connection direction of the electronic element 250 and the trace 212, so as to realize directional electrical connection between the electronic element 250 and the trace 212. The electronic component 250 may be a transistor, a resistor, a capacitor, or an inductor, among other miniature electronic devices or components.
The conductive sheet 270 is disposed on the surface of the shielding layer 230 away from the protection layer 220, the conductive sheet 270 is disposed around the mounting region 211, and the conductive sheet 270 does not directly contact with the electronic element 250. In one embodiment, at least one conductive sheet 270 is disposed around each mounting region 211, in other embodiments, at least two conductive sheets 270 are disposed around each mounting region 211, and a plurality of conductive sheets 270 are disposed on two opposite sides of the mounting region 211 or around the mounting region 211. The conductive sheet 270 is a conductive material, which may be a single substance, a mixture, or a composite material, for example, the conductive sheet 270 may be a composite gold foil, the composite gold foil includes a conductive adhesive, a copper foil layer, a gold foil layer, and a protective layer, which are sequentially stacked, the composite gold foil has high conductivity, and one side of the composite gold foil, which is provided with the conductive adhesive, is pressed on the surface of the shielding layer 230, so that the conductive sheet 270 and the shielding layer 230 are electrically connected. The length of the conductive strip 270 is greater than or equal to 2mm and the width of the conductive strip is greater than or equal to 2 mm.
In an embodiment, the shielding unit 260 covers a surface of the electronic element 250 not in contact with the dielectric unit 240, that is, the shielding unit 260 covers an exposed surface of the electronic element 250, and the shielding unit 260 fills a gap between the electronic element 250 and the conductive sheet 270 and covers a side of the conductive sheet 270 away from the shielding layer 230. In the embodiment, the shielding unit 260 is made of silver paste, the silver paste is coated on the exposed surface of the electronic element 250, further fills the gap between the electronic element 250 and the conductive sheet 270, and covers the side of the conductive sheet 270 away from the shielding layer 230, the shielding unit 260 formed by the silver paste is electrically connected to the conductive sheet 270 and the shielding layer 230, the shielding layer 230 is electrically connected to the ground line of the circuit layer 210, and the shielding unit 260, the conductive sheet 270 and the shielding layer 230 are electrically connected in an up-down manner to form a continuous shielding structure, which has a better electromagnetic shielding effect.
In an embodiment, the thickness of the shielding unit 260 at the side of the electronic component 250 away from the circuit layer 210 is greater than the thickness of the shielding unit 260 at other exposed surfaces of the electronic component 250, in this embodiment, the thickness of the silver paste on the sidewall of the electronic component 250 is less than the thickness of the silver paste on the top surface of the electronic component 250 away from the circuit layer 210, and the ratio of the thickness of the silver paste on the sidewall to the thickness of the silver paste on the top surface may be greater than or equal to 0.5.
Fig. 6A to 6F are schematic diagrams illustrating a manufacturing flow structure of a circuit board 20 according to a second embodiment of the present invention. The method for manufacturing the circuit board 20 of the second embodiment of the present invention includes the steps of:
the method comprises the following steps: a base layer 280 is provided, and a conductive material layer a is disposed on the surface of the base layer 280.
Specifically, as shown in fig. 6A, a conductive material layer a may be formed on a surface of the base layer 280 by Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), adhesion, or crystal growth, and the conductive material layer a may uniformly cover the base layer 280.
Step two: the conductive material layer a is patterned to obtain the circuit layer 210.
Specifically, as shown in fig. 6B, a mask may be formed on the conductive material layer a by forming a photosensitive film, the mask is exposed and etched to pattern the surface of the mask, the mask and the conductive material layer a are etched by a conventional etching method, and the mask is removed to obtain the circuit layer 210, where the etched circuit layer 210 includes a mounting area 211 having a thickness smaller than that of other areas and a trace 212 located in the mounting area.
Step three: a passivation layer 220 is formed on the surface of the circuit layer 210 away from the base layer 280.
Specifically, as shown in fig. 6C, an insulating material layer is formed on the surface of the circuit layer 210 by wet coating, dry film pressing, etc., a mask is formed on the surface of the insulating material layer on the side away from the circuit layer 210 by forming a photosensitive film, the mask is exposed and etched to pattern the surface of the mask, the mask and the insulating material layer are etched by a conventional etching method, and the mask is removed to obtain the protection layer 220, wherein the protection layer 220 is not disposed in the mounting region 211. The protective layer 220 obtained by etching has a plurality of through holes 223 penetrating the protective layer 220, and the through holes 223 are located around the mounting region 211.
Step four: a shielding layer 230 is formed on the surface of the protection layer 220 away from the circuit layer 210 and the conductive sheet 270 is disposed.
Specifically, as shown in fig. 6D, in this example, the shielding layer 230 may be formed on the surface of the protection layer 220 away from the circuit layer 210 by sputtering, physical vapor deposition, chemical vapor deposition, or coating with conductive silver paste, so that the shielding layer 230 is not disposed in the mounting region 211, and the shielding layer 230 extends and fills the through hole 223 and contacts the circuit layer 210. A conductive strip 270 is provided on the side of the shield layer 230 remote from the protective layer 220.
Step five: the electronic component 250 is mounted.
Specifically, as shown in fig. 6E, a dielectric element 240 is disposed corresponding to the mounting region 211 and fills the recessed area of the mounting region 211, the dielectric element 240 covers the trace 212, and the electronic element 250 is mounted at one end of the dielectric element 240 so as not to be in direct contact with the circuit layer 210 or the conductive sheet 270.
Step six: the shielding unit 260 is formed.
Specifically, as shown in fig. 6F, a silver paste is sprayed, printed, or spin-coated to cover the exposed surface of the electronic element 250, the silver paste further fills the gap between the electronic element 250 and the conductive sheet 270 and covers the side of the conductive sheet 270 away from the shielding layer 230, and the silver paste is cured by baking, ventilation, or standing to finally form the shielding unit 260.
Hereinbefore, specific embodiments of the present invention are described with reference to the drawings. However, those skilled in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present invention without departing from the spirit and scope of the invention. Such modifications and substitutions are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (10)
1. The utility model provides a circuit board, the circuit board includes the circuit layer, set up in the protective layer of circuit layer one side and set up in the protective layer is kept away from the shielding layer of circuit layer one side, its characterized in that, the circuit board still includes a plurality of electronic component and a plurality of shielding unit, electronic component with circuit layer electric connection, every be provided with at least one around the electronic component and run through the protective layer makes the naked connecting hole of circuit layer, one the shielding unit covers at least one the naked surface of electronic component, every the shielding unit passes through the connecting hole with circuit layer electric connection, every the shielding unit with shielding layer electric connection.
2. The circuit board of claim 1, wherein the shielding unit is made of silver paste, and the shielding unit completely covers the exposed surface of the electronic component and extends into the connection hole to be electrically connected with the circuit layer, and extends to be in contact with the shielding layer to form an electrical connection.
3. The circuit board of claim 2, wherein at least two of the connection holes are disposed around each electronic component, the at least two connection holes are disposed on opposite sides of the electronic component, and a shielding unit electrically connected to the circuit layer is disposed in each of the connection holes.
4. The utility model provides a circuit board, the circuit board includes the circuit layer, is located the protective layer of circuit layer one side and being located the protective layer is kept away from the shielding layer of circuit layer one side, its characterized in that, the circuit board still includes a plurality of electronic component and a plurality of shielding unit, electronic component with circuit layer electric connection, one shielding unit covers at least one the exposed surface of electronic component, one be provided with at least one conducting strip around the electronic component, the conducting strip not with electronic component contacts, shielding unit passes through the conducting strip with shielding layer electric connection.
5. The circuit board of claim 4, wherein the shielding unit is made of silver paste, the conductive sheet is disposed on a surface of the shielding layer away from the protective layer, and the shielding unit covers a side of the conductive sheet away from the shielding layer and is electrically connected to the conductive sheet.
6. The circuit board of claim 5, wherein at least two of the conductive pads are disposed around each electronic component, the at least two conductive pads being disposed on opposite sides of the electronic component.
7. The circuit board of claim 6, wherein the conductive sheet is a composite gold foil comprising a conductive adhesive, a copper foil layer, a gold foil layer, and a protective layer, which are sequentially stacked.
8. The circuit board of claim 1 or 4, wherein the circuit layer includes a plurality of mounting areas, a portion of the circuit layer corresponding to the mounting areas is not covered by the protection layer and the shielding layer, the circuit layer is provided with a plurality of traces corresponding to the mounting areas, and the electronic component is electrically connected to the traces through a dielectric unit.
9. The circuit board of claim 8, wherein the thickness of the circuit layer corresponding to the mounting region is less than the thickness of the other regions, and one of the dielectric elements fills a region corresponding to one of the mounting regions, and the dielectric element is anisotropic conductive paste.
10. The circuit board according to claim 1 or 4, wherein the protective layer is provided with a plurality of through holes, and the shielding layer extends into the through holes and is electrically connected with the circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811152665.9A CN110972389B (en) | 2018-09-29 | 2018-09-29 | Circuit board |
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| CN201811152665.9A CN110972389B (en) | 2018-09-29 | 2018-09-29 | Circuit board |
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| CN110972389A true CN110972389A (en) | 2020-04-07 |
| CN110972389B CN110972389B (en) | 2023-07-21 |
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| CN105336629A (en) * | 2014-08-08 | 2016-02-17 | 日月光半导体制造股份有限公司 | Fabrication method of electronic package module and electronic package module |
| CN107431048A (en) * | 2015-04-07 | 2017-12-01 | 天津威盛电子有限公司 | Semiconductor package assembly and a manufacturing method thereof |
| US20180233457A1 (en) * | 2017-02-10 | 2018-08-16 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
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