TWI732995B - Shielded printed wiring board and manufacturing method of shielded printed wiring board - Google Patents

Abstract

The object of the present invention is to provide a shielding film that is used in a shielded printed wiring board equipped with a grounding member, and when parts are mounted on the shielded printed wiring board by heating and cooling repeatedly, conductive protrusions or conductive protrusions on the grounding member It is not easy to shift between the shielding layer of the flexible filler and the shielding film.

The shielding film of the present invention is composed of a shielding layer and an insulating layer laminated on the shielding layer, and is characterized in that a first low-melting metal layer is formed between at least a part of the shielding layer and the insulating layer.

Description

Shielded printed wiring board and manufacturing method of shielded printed wiring board

Field of invention

The present invention relates to a manufacturing method of a shielding film, a shielding printed wiring board, and a shielding printed wiring board.

Background technique

In electronic devices such as mobile phones, video cameras, and notebook computers, which are rapidly becoming smaller and more functional, flexible printed wiring boards are often used in order to install circuits in complex mechanisms. Furthermore, using its excellent flexibility will also be used for the connection between the movable part and the control part like a printing head. In these electronic devices, electromagnetic wave shielding measures must be provided. In the flexible printed wiring boards used in the devices, flexible printed wiring boards with electromagnetic wave shielding measures have also begun to be used (hereinafter also referred to as "shielding printed wiring plate").

A general shielding printed wiring board is usually composed of a base film and a shielding film. The base film is formed by sequentially placing a printed circuit and an insulating film on the base film. The shielding film is composed of a conductive layer and a shielding layer laminated on the conductive layer. The layer and the insulating layer are laminated on the conductive layer, and cover the base film in such a way that the conductive layer and the base film are in contact with each other.

In addition, a ground circuit is included in the printed circuit, and the ground circuit is electrically connected to the frame of the electronic device in order to be grounded.

As mentioned above, in the base film of the shielded printed wiring board, an insulating film is provided on the printed circuit including the ground circuit. In addition, the base film is covered with a shielding film having an insulating layer.

Therefore, in order to electrically connect the grounding circuit to the frame of the electronic device, a hole must be made in part of the insulating film and the shielding film in advance.

This will become a major factor hindering the degree of freedom in the design of printed circuits.

Patent Document 1 discloses a shielding film, which is coated on one side of the separation film to form a cover film, and a shielding layer composed of a metal thin film layer and an adhesive layer is provided on the surface of the cover film, and has a grounding The grounding member is formed to have a protrusion pressed on the cover film and passing through the cover film to connect to the shielding layer on one end side, and the other end side is exposed so that it can be connected to a grounding portion nearby.

When the shielding film described in Patent Document 1 is produced, the grounding member is pressed against the cover film so that the projection of the grounding member penetrates the cover film. Therefore, the grounding member can be arranged at any position of the shielding film.

If such a shielding film is used to manufacture a shielded printed wiring board, the grounding circuit can be electrically connected to the frame of the electronic device at any position.

Prior art literature

Patent literature

Patent Document 1: Japanese Patent No. 4201548

Summary of the invention

In order to install the parts, the shielding printing is installed in the reflow soldering step, etc. The wire board is heated and cooled repeatedly.

When parts are mounted on the shielded printed wiring board described in Patent Document 1, if heating and cooling are repeated as described above, the protrusion of the ground member and the shielding layer may be separated due to the volume change due to thermal expansion.

The present invention is an invention made to solve the above-mentioned problems. The object of the present invention is to provide a shielding film that is used in a shielded printed wiring board provided with a grounding member, and the shielded printed wiring board is heated and cooled repeatedly. When installing parts, it is not easy to shift between the conductive protrusions or conductive fillers of the grounding member and the shielding layer of the shielding film.

That is, the shielding film of the present invention is composed of a shielding layer and an insulating layer laminated on the shielding layer, and is characterized in that a first low melting point metal layer is formed at least partly between the shielding layer and the insulating layer.

The shielding film of the present invention is used in a base film, and the base film is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film. At this time, the shielding film of the present invention covers the base film in such a way that the adhesive layer is in contact with the base film.

Furthermore, a grounding member is arranged on the shielding film of the present invention. The grounding member is composed of an external connection member. The external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive. Conductive protrusions or conductive fillers are arranged on the first main surface.

In addition, the grounding member is arranged by pressing on the shielding film of the present invention so that the conductive protrusions or conductive fillers of the grounding member penetrate the insulating layer of the shielding film of the present invention.

Thereby, the shielded printed wiring board provided with the grounding member can be manufactured.

Furthermore, the shielded printed wiring board is subjected to heat treatment. In this heat treatment, the first low-melting-point metal layer is softened and attached to the conductive protrusions or conductive fillers of the grounding member. Therefore, the first low-melting-point metal layer of the shielding film and the conductive protrusions of the grounding member can be improved Or the adhesion of conductive fillers.

Therefore, when the shielded printed wiring board is repeatedly heated and cooled to install parts, it is not easy to shift between the conductive protrusions or conductive fillers of the grounding member and the shielding layer of the shielding film.

In the shielding film of the present invention, the above-mentioned first low melting point metal layer is preferably formed of a metal having a melting point of 300°C or less.

If the first low-melting-point metal layer is formed of a metal with a melting point of 300°C or less, the first low-melting-point metal layer is easy to soften when the grounding member is arranged on the shielded printed wiring board, and the conductive protrusions or the grounding member can be appropriately improved. Adhesion between the conductive filler and the first low melting point metal layer.

If the first low melting point metal layer is formed of a metal having a melting point greater than 300° C., the heating temperature when the grounding member is arranged on the shield printed wiring board will increase. Therefore, the grounding member or the shielding printed wiring board is easily damaged by heat.

In the shielding film of the present invention, the thickness of the first low melting point metal layer is preferably 0.1-10 μm, and more preferably 0.1-5 μm.

If the thickness of the first low melting point metal layer is less than 0.1 μm, the amount of metal forming the first low melting point metal layer is small. Therefore, when the grounding member is arranged on the shielded printed wiring board, the conductive protrusions or conductive fillers of the grounding member With screen The adhesion of the first low-melting-point metal layer of the masking film becomes difficult to improve.

If the thickness of the first low melting point metal layer is greater than 50 μm, when the first low melting point metal layer is softened, the shielding layer becomes easily deformed. As a result, the shielding characteristics of the shielding film become easy to degrade.

In the shielding film of the present invention, the above-mentioned first low melting point metal layer preferably contains a flux.

When the first low-melting-point metal layer contains a flux, when the metal constituting the first low-melting-point metal layer is softened, the metal constituting the low-melting-point metal layer and the conductive protrusions or conductive fillers of the grounding member can easily adhere to each other.

As a result, the adhesion between the first low melting point metal layer and the conductive protrusion or conductive filler of the ground member can be further improved.

It is preferable that the shielding film of the present invention further includes an adhesive layer laminated on the surface of the shielding layer on the opposite side to the surface on which the insulating layer is laminated.

If the shielding film has an adhesive layer, when manufacturing a shielding printed wiring board, the shielding film can be easily attached to the base film.

In the shielding film of the present invention, it is preferable to form a second low-melting-point metal layer in at least a part between the adhesive layer and the shielding layer.

At this time, when manufacturing the shielded printed wiring board, the conductive protrusion or conductive filler of the grounding member penetrates the shielding layer of the shielding film to contact the second low-melting-point metal layer, and then the grounding member is made conductive by heating The conductive protrusions or conductive fillers are connected to the second low melting point metal layer to further improve the adhesion between the grounding member and the shielding film.

In the shielding film of the present invention, the above-mentioned adhesive layer is preferably conductive Electrical adhesive layer.

If the adhesive layer of the shielding film is a conductive adhesive layer, the conductive protrusions or conductive fillers of the grounding member penetrate the insulating layer of the shielding film, and the conductive protrusions or conductive fillers of the grounding member and the conductive adhesive layer It will be in contact, and the external connection member of the grounding member can be electrically connected to the grounding circuit of the base film.

In the shielding film of the present invention, the shielding layer preferably contains at least one selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc, and alloys thereof.

The shielding layer composed of these materials has high conductivity and exhibits a shielding effect that can shield unnecessary radiation from electrical signals or noise from external electromagnetic waves.

In the shielding film of the present invention, the above-mentioned shielding layer may also be a conductive adhesive layer.

When the shielding layer is a conductive adhesive layer, the shielding layer has both the function of adhering the shielding film to the base film and the function of shielding electromagnetic waves.

The shielding printed wiring board of the present invention is characterized by comprising: a base film, which is formed by sequentially arranging a printed circuit including a ground circuit and an insulating film on the base film; and a shielding film, which is composed of a shielding layer and laminated on the shielding layer An insulating layer, and covering the base film such that the shielding layer is arranged on the base film side than the insulating layer; and a grounding member arranged on the insulating layer of the shielding film; the grounding member is external A connecting member and a conductive protrusion, and the external connecting member has a first main surface and a second main surface on the opposite side of the first main surface and is conductive, The conductive protrusions are arranged on the first main surface side; the conductive protrusions of the grounding member penetrate the insulating layer of the shielding film, and the conductive protrusions of the grounding member are connected to the shielding layer of the shielding film through a low melting point metal, The external connection member of the above-mentioned grounding member can be electrically connected to the external ground.

In the shielded printed wiring board of the above-mentioned structure, the conductive protrusion of the ground member is connected to the shielding layer of the shielding film through the low melting point metal.

Therefore, the adhesion between the conductive protrusion of the grounding member and the shielding layer of the shielding film is high.

In the shielded printed wiring board of the present invention, it is preferable that the low-melting-point metal is a first low-melting-point metal layer formed at least part of the shielding layer and the insulating layer of the shielding film.

The shield printed wiring board of the above-mentioned structure is a shield printed wiring board using the shielding film of this invention.

Therefore, when the shielded printed wiring board of the present invention is repeatedly heated and cooled to install components, it is not easy to shift between the conductive protrusions of the grounding member and the shielding layer of the shielding film.

In the shielding printed wiring board of the present invention, the shielding film preferably further includes an adhesive layer laminated on the surface of the shielding layer opposite to the surface on which the insulating layer is laminated, and the adhesive for the shielding film The layer is in contact with the aforementioned base film.

If the shielding film has an adhesive layer, when manufacturing a shielding printed wiring board, the shielding film can be easily attached to the base film.

In the shielded printed wiring board of the present invention, the above-mentioned low melting point The metal is preferably used to form a second low-melting metal layer between at least a part of the adhesive layer of the shielding film and the shielding layer of the shielding film, and the conductive protrusions of the grounding member penetrate the shielding layer of the shielding film, and the conductivity of the grounding member The protrusion is connected to the shielding layer of the shielding film through the low-melting-point metal forming the second low-melting-point metal layer.

At this time, the adhesion between the grounding member and the shielding film can be further improved.

In the shielding printed wiring board of the present invention, in the shielding film, the adhesive layer is preferably a conductive adhesive layer.

If the adhesive layer of the shielding film is a conductive adhesive layer, the conductive protrusions of the grounding member penetrate the insulating layer of the shielding film, and the conductive protrusions of the grounding member and the conductive adhesive layer will be in contact with each other. The external connection member is electrically connected to the ground circuit of the base film.

In the shielding printed wiring board of the present invention, in the shielding film, the shielding layer preferably contains selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc, and alloys thereof. At least 1 in the group.

The shielding layer composed of these materials has high conductivity and exhibits a shielding effect that can shield unnecessary radiation from electrical signals or noise from external electromagnetic waves.

In the shielding printed wiring board of the present invention, in the shielding film, the shielding layer may be a conductive adhesive layer, and the shielding layer of the shielding film is in contact with the base film.

When the shielding layer is a conductive adhesive layer, the shielding layer has both the function of adhering the shielding film to the base film and the function of shielding electromagnetic waves.

The shielding printed wiring board of the present invention is characterized by having Preparation: base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; a shielding film, which is composed of a shielding layer and an insulating layer laminated on the shielding layer, and using the shielding layer Is arranged to cover the base film in a manner closer to the base film side than the insulating layer; and a grounding member is arranged on the insulating layer of the shielding film; the grounding member is composed of an external connection member and a conductive filler, the The external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive, the conductive filler is arranged on the first main surface side; the conductive filler of the ground member penetrates the shielding film The conductive filler of the grounding member is connected to the shielding layer of the shielding film through the low melting point metal, the first low melting point metal layer of the shielding film is connected to the conductive filler of the grounding member, and the grounding member The external connection member can be electrically connected to the external ground.

In the shielded printed wiring board with the above structure, the conductive filler of the grounding member is connected to the shielding layer of the shielding film through the low melting point metal.

Therefore, the adhesion between the conductive filler of the grounding member and the shielding layer of the shielding film is high.

In the shielded printed wiring board of the present invention, the low-melting-point metal is preferably a first low-melting-point metal layer formed between at least a part of the shielding layer and the insulating layer of the shielding film.

The shield printed wiring board of the above-mentioned structure is a shield printed wiring board using the shielding film of this invention.

Therefore, when the shielded printed wiring board of the present invention is repeatedly heated and cooled to install parts, the conductive filler of the grounding member and the shielding layer of the shielding film It is not easy to produce offset between.

In the shielding printed wiring board of the present invention, the shielding film preferably further includes an adhesive layer laminated on the surface of the shielding layer opposite to the surface on which the insulating layer is laminated, and the adhesive for the shielding film The layer is in contact with the aforementioned base film.

If the shielding film has an adhesive layer, when manufacturing a shielding printed wiring board, the shielding film can be easily attached to the base film.

In the shielded printed wiring board of the present invention, the low-melting-point metal preferably forms a second low-melting-point metal layer between at least a part of the adhesive layer of the shielding film and the shielding layer of the shielding film, and the conductive filler of the grounding member penetrates The shielding layer of the shielding film and the conductive filler of the grounding member are connected to the shielding layer of the shielding film through the low melting point metal forming the second low melting point metal layer.

At this time, the adhesion between the grounding member and the shielding film can be further improved.

In the shielding printed wiring board of the present invention, in the shielding film, the adhesive layer is preferably a conductive adhesive layer.

If the adhesive layer of the shielding film is a conductive adhesive layer, the conductive filler of the grounding member penetrates the insulating layer of the shielding film, and the conductive filler of the grounding member and the conductive adhesive layer will be in contact with each other. The external connection member is electrically connected to the ground circuit of the base film.

In the shielding printed wiring board of the present invention, in the shielding film, the shielding layer preferably contains selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc, and alloys thereof. At least 1 in the group.

The shielding layer composed of these materials has high conductivity and shows that it can shield A shielding effect to shield unnecessary radiation from electrical signals or noise from external electromagnetic waves.

In the shielding printed wiring board of the present invention, in the shielding film, the shielding layer may be a conductive adhesive layer, and the shielding layer of the shielding film is in contact with the base film.

When the shielding layer is a conductive adhesive layer, the shielding layer has both the function of adhering the shielding film to the base film and the function of shielding electromagnetic waves.

The manufacturing method of the shielding printed wiring board of the present invention, the shielding printed wiring board manufactured by the manufacturing method is provided with: a base film formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; and the shielding film of the present invention described above And a grounding member arranged on the insulating layer of the shielding film; the grounding member is composed of an external connecting member and a conductive protrusion, and the external connecting member has a first main surface and a second second on the opposite side of the first main surface The main surface is electrically conductive, and the conductive protrusions are arranged on the first main surface side; the manufacturing method of the shielded printed wiring board is characterized by the following steps: a step of placing a shielding film on the shielding layer of the shielding film The shielding film is placed on the base film side rather than the insulating layer of the shielding film on the base film; the grounding member arranging step is such that the conductive protrusions of the grounding member face the insulating layer side of the shielding film, Disposing the grounding member on the shielding film; a pressing step of pressing the grounding member so that the conductive protrusions of the grounding member penetrate the insulating layer of the shielding film; and a heating step of heating the first low melting point metal of the grounding member Layer and soften it.

By using the above-mentioned shielding film of the present invention, the present invention can be manufactured Mingzhi shielded printed wiring board.

In the manufacturing method of the shielded printed wiring board of the present invention, the above-mentioned pressing step and the above-mentioned heating step may also be performed at the same time.

By performing these steps at the same time, the manufacturing efficiency can be improved.

The manufacturing method of the shielding printed wiring board of the present invention, the shielding printed wiring board manufactured by the manufacturing method is provided with: a base film formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; and the shielding film of the present invention described above And a grounding member arranged on the insulating layer of the shielding film; the grounding member is composed of an external connection member, a conductive filler and an adhesive resin, and the external connection member has a first main surface and the first main surface is opposite The conductive filler is arranged on the side of the first major surface, and the adhesive resin fixes the conductive filler on the first major surface; the manufacturing method of the shielded printed wiring board It is characterized in that it has the following steps: a shielding film placing step, placing the shielding film on the base film in such a way that the shielding layer of the shielding film is arranged on the base film side than the insulating layer of the shielding film; The disposing step is to arrange the grounding member on the shielding film such that the conductive filler of the grounding member faces the insulating layer side of the shielding film; and the pressing step is to press the grounding member to make the conductive filler of the grounding member Penetrating the insulating layer of the shielding film; and a heating step of heating the first low melting point metal layer of the grounding member to soften it.

By using the above-mentioned shielding film of the present invention, the shielding printed wiring board of the present invention can be manufactured.

Manufacturing method of shielded printed wiring board of the present invention In this case, the above-mentioned pressurization step and the above-mentioned heating step may also be performed at the same time.

By performing these steps at the same time, the manufacturing efficiency can be improved.

1.101: Grounding member

10.110: External connection member

11, 111: the first main surface

12, 112: the second main surface

20: Conductive protrusions

21: Low melting point metal layer

50, 50a, 50b, 150a, 150b, 250a, 250b, 350a, 350b, 450a, 450b: shielded printed wiring board

60: base membrane

61: Basement membrane

62: Printed Circuit

62a: Grounding circuit

63: insulating film

63a: Hole

70, 170, 270, 370, 470: shielding film

71, 171, 271, 371: Adhesive layer

72, 172, 272, 372, 472: shielding layer

73, 173, 273, 373, 473: insulating layer

74, 174, 274, 374, 474: the first low melting point metal layer

130: conductive filler

135: Adhesive resin

175: The second low melting point metal layer

272a: Convex

272b: recess

GND: external ground

Fig. 1 is a cross-sectional view schematically showing an example of a shielding film according to the first embodiment of the present invention.

Fig. 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the shielding film of the first embodiment of the present invention.

Fig. 3 is a cross-sectional view schematically showing an example of a grounding member for a shielded printed wiring board using the shielding film of the first embodiment of the present invention.

4(a) and (b) are cross-sectional views schematically showing an example of a shielded printed wiring board using the grounding member shown in FIG. 3.

5 is a step diagram schematically showing the manufacturing method of the shielded printed wiring board of the present invention in the order of steps.

Fig. 6 is a step diagram schematically showing the manufacturing method of the shielded printed wiring board of the present invention in the sequence of steps.

FIG. 7 is a step diagram schematically showing the manufacturing method of the shielded printed wiring board of the present invention in the order of the steps.

FIG. 8 is a step diagram schematically showing the manufacturing method of the shielded printed wiring board of the present invention in the order of the steps.

9(a) and (b) are cross-sectional views schematically showing an example of a grounding member used in a shielded printed wiring board using the shielding film of the present invention.

Figs. 10(a) and (b) are cross-sectional views schematically showing an example of a shielded printed wiring board using the grounding member shown in Fig. 9.

Figure 11 is a cross-sectional view schematically showing the screen of the second embodiment of the present invention An example of masking film.

Fig. 12 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the shielding film of the second embodiment of the present invention.

Fig. 13 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the second embodiment of the present invention.

Fig. 14 is a cross-sectional view schematically showing an example of the shielding film according to the third embodiment of the present invention.

Fig. 15 schematically shows an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Fig. 16 schematically shows an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Fig. 17 schematically shows an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Fig. 18 schematically shows an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Fig. 19 schematically shows an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Fig. 20 schematically shows an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

FIG. 21 shows schematically an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Fig. 22 shows schematically an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

Figure 23 is a cross-sectional view schematically showing the screen of the fourth embodiment of the present invention An example of masking film.

Fig. 24 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the fourth embodiment of the present invention.

Fig. 25 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the shielding film of the fourth embodiment of the present invention.

Fig. 26 is a cross-sectional view schematically showing an example of the shielding film of the fifth embodiment of the present invention.

Fig. 27 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the fifth embodiment of the present invention.

Fig. 28 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the fifth embodiment of the present invention.

The form used to implement the invention

Hereinafter, the shielding film of the present invention will be specifically explained. However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied within a range that does not change the gist of the present invention.

(First Embodiment)

First, the shielding film 70 according to the first embodiment of the present invention will be described.

Fig. 1 is a cross-sectional view schematically showing an example of a shielding film according to the first embodiment of the present invention.

As shown in FIG. 1, the shielding film 70 is composed of an adhesive layer 71, a shielding layer 72 laminated on the adhesive layer 71, and an insulating layer 73 laminated on the shielding layer 72, and is characterized by: the shielding layer 72 and the insulating layer A first low melting point metal layer 74 is formed between 73.

In addition, the adhesive layer 71 is a conductive adhesive layer.

The shielding film 70 uses a base film in which a printed circuit including a ground circuit and an insulating film are sequentially arranged on a base film, and after making a shielding printed wiring board, a grounding member of a predetermined shape is arranged.

First, the structure of the shielding printed wiring board using the shielding film 70 will be explained using the drawings.

Fig. 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the shielding film of the first embodiment of the present invention.

As shown in FIG. 2, the shielding printed wiring board 50 is composed of a base film 60 and a shielding film 70.

In the shielding printed wiring board 50, the base film 60 is a thin film formed by sequentially placing a printed circuit 62 including a ground circuit 62a and an insulating film 63 on a base film 61.

In the shielding printed wiring board 50, the shielding film 70 covers the base film 60 in such a way that the adhesive layer 71 of the shielding film 70 is in contact with the base film 60.

Next, using the drawings, the situation of the predetermined grounding member used in the shielded printed wiring board 50 is explained.

Fig. 3 is a cross-sectional view schematically showing an example of a grounding member for a shielded printed wiring board using the shielding film of the first embodiment of the present invention.

4(a) and (b) are cross-sectional views schematically showing an example of a shielded printed wiring board using the grounding member shown in FIG. 3.

As shown in FIG. 3, the ground member 1 is formed with an external connection member 10 and a conductive protrusion 20. The external connection member 10 has a first main surface 11 and a second main surface 12 opposite to the first main surface 11 and is conductive. , The aforementioned conductivity The protrusion 20 is arranged on the first main surface 11 side.

The grounding member 1 will be arranged on the shielding printed wiring board 50. At this time, as shown in FIG. 4(a), the conductive protrusions 20 of the grounding member 1 can penetrate the insulating layer 73 and the shielding layer 72 of the shielding film 70 to connect the ground The member 1 is pressed against the shielding film 70 to be arranged. Furthermore, as shown in FIG. 4(b), the conductive protrusion 20 of the grounding member 1 may penetrate the insulating layer 73 of the shielding film 70 but not the shielding layer 72 of the shielding film 70, and the grounding member 1 may be pressed against the shielding film. 70 comes up to configure.

In addition, as shown in FIGS. 4(a) and (b), the external connection member 10 of the ground member 1 is connected to the external ground GND.

The shield printed wiring board 50 provided with the ground member 1 is further subjected to heat treatment. In this heat treatment, the first low-melting-point metal layer 74 is softened and attached to the conductive protrusion 20 of the ground member 1 to be connected. Therefore, the adhesion between the first low melting point metal layer 74 and the conductive protrusion 20 of the ground member 1 can be improved.

Therefore, when parts are mounted on the shielded printed wiring board 50 using the shielding film 70 and equipped with the grounding member 1 by repeated heating and cooling, the resistance between the ground circuit 62a of the base film 60 and the external ground GND can be suppressed from increasing.

In addition, when the metal constituting the first low melting point metal layer 74 and the metal constituting the conductive protrusion 20 of the ground member 1 can form an alloy, by forming an alloy with these metals, the first low melting point metal layer 74 can be further improved. Adhesion to the conductive protrusion 20 of the ground member 1.

In the shielding film 70, the first low melting point metal layer 74 is preferably formed of a metal having a melting point of 300°C or less.

If the first low-melting-point metal layer 74 is formed of a metal with a melting point of 300° C. or less, when the grounding member 1 is arranged on the shielded printed wiring board 50, the first low-melting-point metal layer 74 is easily softened, and the grounding member can be appropriately lifted Adhesion between the conductive protrusion 20 of 1 and the first low-melting-point metal layer 74.

If the first low melting point metal layer is formed of a metal having a melting point greater than 300° C., the heating temperature when the grounding member is arranged on the shield printed wiring board will increase. Therefore, the grounding member or the shielding printed wiring board is easily damaged by heat.

In the shielding film 70, the metal forming the first low melting point metal layer 74 is not particularly limited, and preferably contains at least one selected from the group consisting of indium, tin, lead, and bismuth.

These metals have suitable melting points and conductivity for forming the first low melting point metal layer 74.

In the shielding film 70, the thickness of the first low melting point metal layer 74 is preferably 0.1-10 μm, and more preferably 0.1-5 μm.

If the thickness of the first low melting point metal layer is less than 0.1 μm, the amount of metal forming the first low melting point metal layer is small. Therefore, when the grounding member is arranged on the shielding printed wiring board, the conductive protrusion of the grounding member and the shielding film The adhesion of the first low-melting-point metal layer becomes difficult to improve.

If the thickness of the first low melting point metal layer is greater than 50 μm, when the first low melting point metal layer is softened, the shielding layer becomes easily deformed. As a result, the shielding characteristics of the shielding film become easy to degrade.

In the shielding film 70, the first low melting point metal layer 74 preferably contains a flux.

Since the first low-melting-point metal layer 74 contains a flux, when the metal constituting the first low-melting-point metal layer 74 is softened, the metal constituting the first low-melting-point metal layer 74 and the conductive protrusion 20 of the ground member 1 are easily adhered .

As a result, the adhesion between the first low melting point metal layer 74 and the conductive protrusion 20 of the ground member 1 can be further improved.

The flux is not particularly limited, and known ones such as polycarboxylic acid, lactic acid, citric acid, oleic acid, stearic acid, glutamic acid, benzoic acid, glycerin, rosin, etc. can be used.

In addition, when the first low-melting-point metal layer 74 is made of tin, a nickel layer is preferably formed between the shielding layer 72 and the first low-melting-point metal layer 74.

When the first low melting point metal layer 74 is made of tin, it may form an alloy with the metal that constitutes the shield layer 72.

However, if a nickel layer is formed between the shielding layer 72 and the first low melting point metal layer 74, the formation of such an alloy can be prevented.

As a result, the tin constituting the first low melting point metal layer 74 and the conductive protrusion 20 of the ground member 1 can form an alloy efficiently. Therefore, the amount of tin used in the first low melting point metal layer 74 can be reduced.

The adhesive layer 71 is a conductive adhesive layer composed of resin and conductive fine particles.

The resin constituting the adhesive layer 71 is not particularly limited, and is preferably acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber resin, polyester resin, urethane resin, or the like.

In addition, the adhesive layer 71 may also contain fatty acid hydrocarbon resins, C5/C9 mixed resins, rosin, rosin derivatives, terpene resins, and aromatic hydrocarbon resins. Adhesive agents such as grease and heat-reactive resin. If these adhesiveness imparting agents are contained, the adhesiveness of the adhesive layer 71 can be improved.

The conductive fine particles constituting the adhesive layer 71 are not particularly limited, including copper powder, silver powder, nickel powder, silver-coated copper powder (Ag-coated Cu powder), gold-coated copper powder, and silver-coated nickel powder (Ag-coated Ni Powder), gold-coated nickel powder, these metal powders can be produced by atomization method, carbonyl method, etc. In addition to the above, it is also possible to use metal powder-coated resin particles and resin-coated metal powder particles. In addition, the conductive fine particles are preferably Ag-coated Cu powder or Ag-coated Ni powder. The reason is that low-cost materials can be used to produce conductive fine particles with stable conductivity.

In addition, the shape of the conductive particles need not be limited to the spherical shape. For example, they may be dendritic, flake, spike, rod, fiber, needle, etc.

Since the adhesive layer 71 of the shielding film 70 is a conductive adhesive layer, the conductive protrusions 20 of the grounding member 1 penetrate the insulating layer 73 of the shielding film 70, and the conductive protrusions 20 of the grounding member 1 and the shielding film 70 The shielding layer 72 of the grounding member 1 is in contact with the adhesive layer 71, or the conductive protrusion 20 of the grounding member 1 is in contact with the shielding layer 72 of the shielding film 70, and the external connection member 10 of the grounding member 1 can be connected to the grounding circuit of the base film 60 62a is electrically connected.

Furthermore, the adhesive layer 71 may be an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer, and the anisotropic conductive adhesive layer is more preferable. When the adhesive layer 71 is an anisotropic conductive adhesive layer, it is preferable to contain conductive fine particles in a range of 3 to 39% by weight with respect to the total amount of the adhesive layer 71. In addition, the average particle size of the conductive fine particles should preferably be in the range of 2 to 20 μm, and it should be in accordance with the size of the anisotropic conductive adhesive layer. Thickness, choose the most appropriate size.

In addition, when the adhesive layer 71 is an isotropic conductive adhesive layer, it is preferable to contain conductive fine particles in a range of more than 39% by weight and 95% by weight relative to the total amount of the adhesive layer 71. The average particle size of the conductive fine particles can be selected the same as the anisotropic conductive adhesive layer.

The shielding layer 72 of the shielding film 70 can be made of any material as long as it can exhibit a shielding effect that can shield unnecessary radiation from electrical signals or noise from outside electromagnetic waves. For example, the shielding layer 72 may also be made of isotropic conductive resin or metal.

When the shielding layer 72 is made of metal, it may be a metal layer such as a metal foil or a vapor-deposited film, or it may be an assembly of conductive particles formed in a layered form. When the shielding layer 72 is a metal layer, the material constituting the metal should preferably contain at least one selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc and their alloys .

When the shielding layer 72 is an aggregate of conductive particles, the same conductive fine particles as the conductive fine particles constituting the adhesive layer 71 described above can be used.

These materials have high electrical conductivity and are suitable materials for shielding layers.

In the shielding film 70, the shielding layer 72 preferably contains at least one selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc, and alloys thereof.

The shielding layer 72 composed of these materials has high conductivity and exhibits a shielding effect that can shield unnecessary radiation from electrical signals or noise from outside electromagnetic waves.

The thickness of the shielding layer 72 of the shielding film 70 should be 0.01~10μm.

If the thickness of the shielding layer 72 is less than 0.01 μm, it is difficult to obtain a sufficient shielding effect.

If the thickness of the shielding layer 72 is greater than 10 μm, it is not easy to be flexed.

The material of the insulating layer 73 of the shielding film 70 is not particularly limited, and preferably epoxy resin, polyester resin, acrylic resin, phenol resin, urethane resin, etc.

The thickness of the insulating layer 73 of the shielding film 70 is preferably 1-10 μm.

If the thickness of the insulating layer is less than 0.01 μm, the insulating layer is easily damaged and the insulation is not easily sufficient.

If the thickness of the insulating layer is greater than 10 μm, the conductive protrusions of the grounding member cannot easily penetrate the insulating layer 73.

Next, the manufacturing method of the shielded printed wiring board using the shielding film 70 is demonstrated.

In addition, the manufacturing method of the shielding printed wiring board is also an example of the manufacturing method of the shielding printed wiring board of the present invention.

The shielding printed wiring board manufactured by the manufacturing method of the shielding printed wiring board of the present invention includes: a base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; and a shielding film, which is composed of a shielding layer And an insulating layer laminated on the shielding layer, and covering the base film so that the adhesive layer is in contact with the base film; and a grounding member disposed on the insulating layer of the shielding film; and the following steps : (1) Shielding film placement step; (2) Grounding member placement step; (3) Pressurizing step; and (4) Heating step.

Hereinafter, each step will be explained using diagrams.

5 to 8 are step diagrams, which schematically show the manufacturing method of the shielded printed wiring board of the present invention in the order of the steps.

(1) Steps for placing shielding film

In this step, first, a base film 60 is prepared. The base film 60 is formed by sequentially arranging a printed circuit 62 including a ground circuit 62 a and an insulating film 63 on the base film 61.

Furthermore, as shown in FIG. 5, the shielding film 70 is placed so that the adhesive layer 71 is attached to the base film 60.

The materials of the base film 61 and the insulating film 63 constituting the base film 60 are not particularly limited, and are preferably made of engineering plastics. Examples of such engineering plastics include polyethylene terephthalate, polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide, and polyetherimide. , Polyphenylene sulfide and other resins.

In addition, among these engineering plastics, when flame retardancy is required, polyphenylene sulfide film is preferable, and when heat resistance is required, polyimide film is preferable. In addition, the thickness of the base film 61 is preferably 10-40 μm, and the thickness of the insulating film 63 is preferably 10-30 μm.

In addition, a hole 63a for exposing a part of the printed circuit 62 is formed in the insulating film 63.

The method of forming the hole portion 63a is not particularly limited, and conventional methods such as laser processing can be used.

(2) Configuration steps of grounding components

In this step, as shown in Figure 6, the conductive protrusions of the grounding member 1 The grounding member 1 is arranged on the shielding film 70 in such a way that the 20 faces the insulating layer 73 side of the shielding film 70.

The ground member 1 is formed with an external connection member 10 and a conductive protrusion 20. The external connection member 10 has a first main surface 11 and a second main surface 12 opposite to the first main surface 11 and is conductive. The conductive protrusion 20 It is arranged on the first main surface 11 side.

In the grounding member 1, the external connection member 10 and the conductive protrusion 20 preferably contain at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel.

These materials are suitable materials for electrically connecting the grounding member with the external ground.

In addition, a low melting point metal layer can also be formed on the surface of the conductive protrusion 20 of the ground member 1.

When a low-melting-point metal layer is formed on the surface of the conductive protrusion 20 of the grounding member 1, the low-melting-point metal layer of the grounding member 1 will soften and be connected to the shielding layer of the shielding film 70 in the heating step described later.

Therefore, the adhesion between the ground member 1 and the shielding film 70 can be further improved.

The metal forming the low melting point metal layer of the grounding member 1 is not particularly limited, and preferably contains at least one selected from the group consisting of indium, tin, lead, and bismuth.

(3) Pressurization step

In this step, as shown in FIG. 7, in order to electrically connect the external connection member 10 of the ground member 1 and the ground circuit 62a of the base film 60, the ground member 1 is pressed so that the conductive protrusion 20 of the ground member 1 penetrates the shielding film 70 insulating layer 73 and shielding layer 72. Thereby, the conductive protrusion 20 of the grounding member 1 will contact the adhesive layer 71 and the shielding layer 72 of the shielding film 70.

The pressure during pressurization should be 0.5MPa~10MPa.

In addition, in this step, the conductive protrusions 20 of the grounding member 1 may penetrate the insulating layer 73 of the shielding film 70 so that the conductive protrusions 20 of the grounding member 1 and the shielding layer 72 of the shielding film 70 are in contact.

(4) Heating step

In this step, as shown in FIG. 8, in order to connect the low melting point metal layer 21 of the grounding member 1 to the shielding layer 72 of the shielding film 70, the low melting point metal layer 21 of the grounding member 1 is heated to soften it.

The temperature at which the low melting point metal layer 21 of the grounding member 1 is softened is not particularly limited, and it is preferably 100 to 300°C.

Thereby, the adhesion between the conductive protrusion 20 of the grounding member 1 and the shielding layer 72 of the shielding film 70 and the adhesion between the conductive protrusion 20 of the grounding member 1 and the adhesive layer 71 of the shielding film 70 can be improved.

In addition, in the manufacturing method of the shielded printed wiring board of the present invention, the heating step can be performed at any stage as long as the low-melting-point metal layer of the conductive protrusion of the ground member can be softened and connected to the shielding layer of the shielding film.

For example, it can be carried out simultaneously with the above-mentioned pressurization step, or can be carried out as a separate step.

By performing the pressurizing step and the heating step at the same time, the manufacturing efficiency can be improved.

In addition, the heating step may be performed in the step of mounting the parts on the shield printed wiring board after the pressing step. For example, in order to install When using solder for parts, a reflow soldering step is performed. It is also possible to soften the low melting point metal layer by the heat during the reflow in the reflow step. At this time, the heating step and the installation of parts can be carried out at the same time.

Through the above steps, the shielded printed wiring board 50a provided with the ground member 1 can be manufactured. The shield printed wiring board 50a provided with the ground member 1 manufactured in this manner is an example of the shield printed wiring board of the present invention.

Next, a case where the following grounding member 101 is used will be explained.

9(a) and (b) are cross-sectional views schematically showing an example of a grounding member used in a shielded printed wiring board using the shielding film of the present invention.

Figs. 10(a) and (b) are cross-sectional views schematically showing an example of a shielded printed wiring board using the grounding member shown in Fig. 9.

As shown in Figure 9 (a) and (b), the grounding member 101 is composed of an external connecting member 110, a conductive filler 130, and an adhesive resin 135. The external connecting member 110 has a first main surface 111 and the first The second main surface 112 on the opposite side of the main surface 111 is conductive, the conductive filler 130 is arranged on the side of the first main surface 111, and the adhesive resin 135 fixes the conductive filler 130 to the first main surface. 111.

In addition, as shown in FIG. 9(a), the conductive filler 130 may be coated with the adhesive resin 135, or as shown in FIG. 9(b), a part of the conductive filler 130 may be exposed from the adhesive resin 135.

By using the ground member 101, the shielded printed wiring board 50b shown in FIGS. 10(a) and (b) can be manufactured.

At this time, as shown in FIG. 10(a), the conductive filler 130 of the grounding member 101 can penetrate the insulating layer 73 and the shielding layer 72 of the shielding film 70 to connect the The ground member 101 is pressed against the shielding film 70 to be arranged. Moreover, as shown in FIG. 10(b), the conductive filler 130 of the grounding member 101 may penetrate the insulating layer 73 of the shielding film 70 but not the shielding layer 72 of the shielding film 70, and the grounding member 101 may be pressed against the shielding film. 70 comes up to configure.

In addition, as shown in FIGS. 10(a) and (b), the external connection member 110 of the ground member 101 is connected to the external ground GND.

In the grounding member 101, the external connection member 110 preferably contains at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel.

These materials are suitable materials for electrically connecting the grounding member with the external ground.

In the grounding member 101, the conductive filler 130 is preferably selected from the group consisting of copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, nickel-coated copper powder, and nickel-coated copper powder. At least one of the group consisting of silver powder and resin-coated metal powder particles.

These particles are excellent in conductivity and therefore suitable as conductive fillers.

The shape of the conductive filler 130 is not particularly limited, and may be spherical, dendritic, flake, spike, rod, fiber, needle, etc.

In the grounding member 101, the adhesive resin 135 is not particularly limited. It is preferably made of acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber resin, polyester resin, and urethane resin. Composed of resin, etc.

These resins have excellent adhesion.

Use grounding member 101 to manufacture shielded printed wiring board The method is as follows: in the step of (2) grounding member arranging in the above-mentioned "Method for manufacturing shielded printed wiring board using shielding film 70", grounding member 101 is used instead of grounding member 1.

In addition, a low melting point metal layer may also be formed on the surface of the conductive filler 130 of the grounding member 101.

When a low-melting-point metal layer is formed on the surface of the conductive filler 130 of the grounding member 101, the low-melting-point metal layer of the grounding member 101 will soften and be connected to the shielding layer of the shielding film 70 in the above heating step.

Therefore, the adhesion between the ground member 1 and the shielding film 70 can be further improved.

The metal forming the low melting point metal layer of the grounding member 101 is not particularly limited, and preferably contains at least one selected from the group consisting of indium, tin, lead, and bismuth.

(Second Embodiment)

Next, the shielding film 170 according to the second embodiment of the present invention will be explained.

Fig. 11 is a cross-sectional view schematically showing an example of the shielding film of the second embodiment of the present invention.

As shown in FIG. 11, the shielding film 170 is composed of an adhesive layer 171, a shielding layer 172 laminated on the adhesive layer 171, and an insulating layer 173 laminated on the shielding layer 172, and is characterized by: the shielding layer 172 and the insulating layer A first low-melting-point metal layer 174 is formed between 173, and a second low-melting-point metal layer 175 is formed between the adhesive layer 171 and the shielding layer 172.

In addition, the adhesive layer 171 is a conductive adhesive layer.

In the shielding film 170, a second low melting point metal layer 175 is formed between the adhesive layer 171 and the shielding layer 172. Therefore, in the manufacture of shielding printing When wiring boards, the conductive protrusions or conductive fillers of the grounding member penetrate the shielding layer 172 of the shielding film 170 to contact the second low-melting-point metal layer 175, and then the conductive protrusions or conductive fillers of the grounding member are made conductive by heating. The flexible filler is connected to the second low melting point metal layer 175, which can further improve the adhesion between the grounding member and the shielding film 170.

In addition, when the metal constituting the second low melting point metal layer 175 and the metal constituting the conductive protrusion or conductive filler of the ground member can form an alloy, by forming an alloy with these metals, the second low melting point metal can be further improved The adhesion between the layer 175 and the conductive protrusions or conductive fillers of the grounding member.

In the shielding film 170, the second low melting point metal layer 175 is preferably formed of a metal having a melting point of 300°C or less.

If the second low-melting-point metal layer 175 is formed of a metal with a melting point of 300°C or less, the second low-melting-point metal layer 175 is easy to soften when the grounding member is arranged on the shielded printed wiring board, and the conductivity of the grounding member can be appropriately improved The adhesion between the protrusion or the conductive filler and the second low melting point metal layer 175.

If the second low melting point metal layer is formed of a metal having a melting point greater than 300° C., the heating temperature when the grounding member is arranged on the shield printed wiring board will increase. Therefore, the grounding member or the shielding printed wiring board is easily damaged by heat.

In the shielding film 170, the metal forming the second low melting point metal layer 175 is not particularly limited, and preferably contains at least one selected from the group consisting of indium, tin, lead, and bismuth.

These metals have suitable melting points and conductivity for forming the second low melting point metal layer 175.

In the shielding film 170, the thickness of the second low melting point metal layer 175 is preferably 0.1-10 μm, and more preferably 0.1-5 μm.

If the thickness of the second low melting point metal layer is less than 0.1 μm, the amount of metal forming the second low melting point metal layer is small. Therefore, when the grounding member is arranged on the shielded printed wiring board, the conductive protrusions or conductive fillers of the grounding member The adhesion with the second low-melting-point metal layer of the shielding film becomes difficult to improve.

If the thickness of the second low melting point metal layer is greater than 50 μm, when the second low melting point metal layer is softened, the shielding layer 172 becomes easily deformed. As a result, the shielding characteristics of the shielding film 170 tend to be degraded.

In the shielding film 170, the second low melting point metal layer 175 preferably contains a flux.

Since the second low melting point metal layer 175 contains a flux, when the metal constituting the second low melting point metal layer 175 is softened, the conductive protrusions or conductive fillers between the metal and the grounding member constituting the second low melting point metal layer 175 become Easy to close.

As a result, the adhesion between the second low melting point metal layer 175 and the conductive protrusions and conductive fillers of the ground member can be further improved.

In addition, when the first low-melting-point metal layer 174 and the second low-melting-point metal layer 175 are made of tin, it is suitable between the shielding layer 172 and the first low-melting-point metal layer 175 and between the shielding layer 172 and the second low-melting-point metal layer 175 A nickel layer is formed.

When the first low melting point metal layer 174 and the second low melting point metal layer 175 are made of tin, they may form an alloy with the metal constituting the shielding layer 172.

However, if the nickel layer is formed as described above, the formation of such a compound can be prevented. gold.

As a result, the tin constituting the first low-melting-point metal layer 174 and the second low-melting-point metal layer 175 and the conductive protrusions and conductive fillers of the grounding member can efficiently form an alloy. Therefore, the amount of tin used in the first low melting point metal layer 174 and the second low melting point metal layer 175 can be reduced.

In addition, the materials of the adhesive layer 171, the shielding layer 172, the insulating layer 173, and the first low-melting-point metal layer 174 of the shielding film 170 are preferably compatible with the adhesive layer 71, the shielding layer 72, the insulating layer 73 and the first low-melting-point metal layer 174 of the shielding film 70. The ideal material of the low melting point metal layer 74 is the same.

Next, the shielding printed wiring board 150a using the base film 60, the shielding film 170, and the ground member 1 is demonstrated.

Fig. 12 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the shielding film of the second embodiment of the present invention.

As shown in FIG. 12, the shielding printed wiring board 150a is a shielding printed wiring board composed of a base film 60, a shielding film 170, and a ground member 1.

In the shielding printed wiring board 150a, the adhesive layer 171 of the shielding film 170 is placed in contact with the base film 60.

In addition, the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 173 and the shielding layer 172 of the shielding film 170.

Then, the first low melting point metal layer 174 and the second low melting point metal layer 175 of the shielding film 170 are connected to the conductive protrusion 20 of the ground member 1.

Furthermore, the external connection member 10 of the ground member 1 is connected to the external ground GND.

Next, the use of the base film 60, the shielding film 170, and the connection The shielding printed wiring board 150b of the ground member 101.

Fig. 13 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the second embodiment of the present invention.

As shown in FIG. 13, the shielding printed wiring board 150b is a shielding printed wiring board composed of a base film 60, a shielding film 170, and a ground member 101.

In the shielding printed wiring board 150a, the adhesive layer 171 of the shielding film 170 is placed in contact with the base film 60.

In addition, the conductive filler 130 of the ground member 101 penetrates the insulating layer 173 and the shielding layer 172 of the shielding film 170.

Then, the first low melting point metal layer 174 and the second low melting point metal layer 175 of the shielding film 170 are connected to the conductive filler 130 of the ground member 101.

Furthermore, the external connection member 110 of the ground member 101 is connected to the external ground GND.

(Third Embodiment)

Next, the shielding film 270 according to the third embodiment of the present invention will be explained.

Fig. 14 is a cross-sectional view schematically showing an example of the shielding film according to the third embodiment of the present invention.

As shown in FIG. 14, the shielding film 270 is composed of an adhesive layer 271, a shielding layer 272 laminated on the adhesive layer 271, and an insulating layer 273 laminated on the shielding layer 272, and is characterized by: the shielding layer 272 and the insulating layer A first low melting point metal layer 274 is formed between 273.

In addition, the shielding layer 272 has a wavy shape having a convex portion 272a and a concave portion 272b.

In addition, the adhesive layer 271 of the shielding film 270 may or may not be conductive.

The materials of the shielding layer 272, the insulating layer 273, and the first low-melting-point metal layer 274 of the shielding film 270 are preferably the same as the ideal materials of the shielding layer 72, the insulating layer 73, and the first low-melting-point metal layer 74 of the shielding film 70.

When the adhesive layer 271 of the shielding film 270 has conductivity, the material of the adhesive layer 271 is preferably the same as the adhesive layer 71 of the shielding film.

When the adhesive layer 271 of the shielding film 270 is not conductive, the adhesive layer 271 is not particularly limited, and is preferably acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber resin, polyester Based resins, urethane based resins, etc.

In addition, the adhesive layer 271 may contain adhesiveness imparting agents such as fatty acid hydrocarbon resins, C5/C9 mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and thermoreactive resins. If the adhesiveness imparting agent is contained, the adhesiveness of the adhesive layer 271 can be improved.

The manufacturing method of the shielding printed wiring board 250a (refer FIG. 18) using the base film 60, the shielding film 270, and the grounding member 1 is demonstrated.

Figures 15 to 18 schematically show an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

As shown in FIG. 15, when manufacturing the shielding printed wiring board 250 a, first, the shielding film 270 is placed on the base film 60.

As described above, the base film 60 is a thin film formed by sequentially placing the printed circuit 62 including the ground circuit 62 a and the insulating film 63 on the base film 61.

In addition, the shielding film 270 is composed of an adhesive layer 271 laminated on the adhesive layer 271 The shielding layer 272 and the insulating layer 273 laminated on the shielding layer 272 are thin films composed of the shielding layer 272. The shielding layer 272 has a wavy shape with a convex portion 272a and a concave portion 272b.

Next, as shown in FIG. 16, the base film 60 on which the shielding film 270 is placed under pressure. During this pressurization, the convex portion 272a of the shielding layer 272 of the shielding film 270 pushes away the adhesive layer 271 and is connected to the ground circuit 62a of the base film 60.

Next, as shown in FIG. 17, the grounding member 1 is arranged on the shielding film 270 so that the conductive protrusion 20 of the grounding member 1 faces the insulating layer 273 side of the shielding film 270.

Then, the ground member 1 is pressed so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 273 of the shielding film 270. Thereby, the conductive protrusion 20 of the grounding member 1 is in contact with the first low-melting-point metal layer 274 of the shielding film 270.

In addition, the pressure during pressurization should be 0.5MPa~10MPa.

Next, as shown in FIG. 18, in order to connect the first low melting point metal layer 274 of the shielding film 270 to the conductive protrusion 20 of the ground member 1, the first low melting point metal layer 274 of the shielding film 270 is heated and softened.

In this way, the shielded printed wiring board 250a can be manufactured.

Next, the manufacturing method of the shielding printed wiring board 250b using the base film 60, the shielding film 270, and the grounding member 101 is demonstrated.

Figures 19 to 22 schematically show an example of a manufacturing method of a shielded printed wiring board using the shielding film of the third embodiment of the present invention.

As shown in FIG. 19, when manufacturing the shielding printed wiring board 250a, first, the shielding film 270 is placed on the base film 60. As shown in FIG.

As mentioned above, the base film 60 is arranged on the base film 61 with grounding electric A thin film formed by the printed circuit 62 and the insulating film 63 of the circuit 62a.

In addition, the shielding film 270 is a thin film composed of an adhesive layer 271, a shielding layer 272 laminated on the adhesive layer 271, and an insulating layer 273 laminated on the shielding layer 272. The shielding layer 272 is a wave with convex portions 272a and concave portions 272b.状形。 Like shape.

Next, as shown in FIG. 20, the base film 60 on which the shielding film 270 is placed under pressure. During this pressurization, the convex portion 272a of the shielding layer 272 of the shielding film 270 pushes away the adhesive layer 271 and is connected to the ground circuit 62a of the base film 60.

Next, as shown in FIG. 21, the grounding member 101 is arranged on the shielding film 270 so that the conductive filler 130 of the grounding member 101 faces the insulating layer 273 side of the shielding film 270.

Then, the ground member 101 is pressed so that the conductive filler 130 of the ground member 101 penetrates the insulating layer 273 of the shielding film 270. Thereby, the conductive filler 130 of the grounding member 101 contacts the first low melting point metal layer 274 of the shielding film 270.

In addition, the pressure during pressurization should be 0.5MPa~10MPa.

Next, as shown in FIG. 22, in order to connect the first low melting point metal layer 274 of the shielding film 270 to the conductive filler 130 of the ground member 101, the first low melting point metal layer 274 of the shielding film 270 is heated and softened.

In this way, the shielded printed wiring board 250b can be manufactured.

Furthermore, as shown in FIG. 22, in the shielded printed wiring board 250b, the external connection member 110 of the ground member 101 is connected to the external ground GND.

(Fourth Embodiment)

Next, the shielding film 370 according to the fourth embodiment of the present invention will be explained.

Fig. 23 is a cross-sectional view schematically showing an example of the shielding film of the fourth embodiment of the present invention.

As shown in FIG. 23, the shielding film 370 is composed of an adhesive layer 371, a shielding layer 372 laminated on the adhesive layer 371, and an insulating layer 373 laminated on the shielding layer 372, and is characterized by: the shielding layer 372 and the insulating layer A first low melting point metal layer 374 is formed between 373.

In addition, the adhesive layer 371 of the shielding film 370 does not have conductivity.

In addition, the materials of the shielding layer 372, the insulating layer 373, and the first low-melting-point metal layer 374 of the shielding film 370 are preferably the same as the ideal materials of the shielding layer 72, the insulating layer 73, and the first low-melting-point metal layer 74 of the shielding film 70.

The adhesive layer 371 is not particularly limited, and is preferably acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber resin, polyester resin, urethane resin, or the like.

In addition, the adhesive layer 371 may contain adhesiveness imparting agents such as fatty acid hydrocarbon resins, C5/C9 mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and thermoreactive resins. If the adhesiveness imparting agent is contained, the adhesiveness of the adhesive layer 371 can be improved.

Next, the shielding printed wiring board 350a using the base film 60, the shielding film 370, and the ground member 1 is demonstrated.

Fig. 24 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the fourth embodiment of the present invention.

As shown in FIG. 24, the shielding printed wiring board 350a is a shielding printed wiring board composed of a base film 60, a shielding film 370, and a ground member 1.

In the shielding printed wiring board 350a, the adhesive layer 371 of the shielding film 370 is placed in contact with the base film 60.

In addition, the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 373 of the shielding film 370.

Then, the first low-melting-point metal layer 374 of the shielding film 370 is connected to the conductive protrusion 20 of the ground member 1.

Furthermore, the external connection member 10 of the ground member 1 is connected to the external ground GND.

In the shielded printed wiring board 350a in which the grounding member 1 is arranged in this way, the shielding layer 372 of the shielding film 370 is electrically connected to the external ground GND. Therefore, the shielding layer 372 can appropriately function as an electromagnetic wave shield for shielding electromagnetic waves.

Next, the shielding printed wiring board 350b using the base film 60, the shielding film 370, and the ground member 101 is demonstrated.

Fig. 25 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the shielding film of the fourth embodiment of the present invention.

As shown in FIG. 25, the shielding printed wiring board 350b is a shielding printed wiring board composed of a base film 60, a shielding film 370, and a ground member 101.

In the shielding printed wiring board 350b, the adhesive layer 371 of the shielding film 370 is placed in contact with the base film 60.

In addition, the conductive filler 130 of the ground member 101 penetrates the insulating layer 373 of the shielding film 370.

Then, the first low melting point metal layer 374 of the shielding film 370 is connected to the ground The conductive filler 130 of the member 101 is connected.

Furthermore, the external connection member 110 of the ground member 101 is connected to the external ground GND.

In the shielded printed wiring board 350b in which the grounding member 1 is arranged in this way, the shielding layer 372 of the shielding film 370 is electrically connected to the external ground GND. Therefore, the shielding layer 372 can appropriately function as an electromagnetic wave shield for shielding electromagnetic waves.

(Fifth Embodiment)

Next, the shielding film 470 according to the fifth embodiment of the present invention will be explained.

Fig. 26 is a cross-sectional view schematically showing an example of the shielding film of the fifth embodiment of the present invention.

As shown in FIG. 26, the shielding film 470 is composed of a shielding layer 472 and an insulating layer 473 laminated on the shielding layer 472, and is characterized in that a first low melting point metal layer 474 is formed between the shielding layer 472 and the insulating layer 473.

In addition, in the shielding film 470, the shielding layer 472 is a conductive adhesive.

Since the shielding layer 472 of the shielding film 470 is a conductive adhesive, it has both the function of adhering the shielding film 470 to the base film 60 and the function of shielding electromagnetic waves.

In addition, the shielding layer 472 of the shielding film 470 is a conductive adhesive layer composed of resin and conductive fine particles.

The resin constituting the shielding layer 472 is not particularly limited, and is preferably acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber resin, polyester resin, urethane resin, or the like.

In addition, the shielding layer 472 may also contain fatty acid hydrocarbon resin, C5/C9 Adhesive imparting agents such as mixed resins, rosin, rosin derivatives, terpene resins, aromatic hydrocarbon resins, and thermoreactive resins. If the adhesiveness imparting agent is contained, the adhesiveness of the shielding layer 472 can be improved.

There are no special restrictions on the conductive particles constituting the shielding layer 472, including copper powder, silver powder, nickel powder, silver-coated copper powder (Ag-coated Cu powder), gold-coated copper powder, and silver-coated nickel powder (Ag-coated Ni powder) ), gold-coated nickel powder, these metal powders can be produced by atomization method, carbonyl method, etc. In addition to the above, it is also possible to use metal powder-coated resin particles and resin-coated metal powder particles. In addition, the conductive fine particles are preferably Ag-coated Cu powder or Ag-coated Ni powder. The reason is that low-cost materials can be used to produce conductive fine particles with stable conductivity.

In addition, the shape of the conductive particles need not be limited to the spherical shape. For example, they may be dendritic, flake, spike, rod, fiber, needle, etc.

Furthermore, the shielding layer 472 of the shielding film 470 is preferably an isotropic conductive adhesive layer.

In this case, it is preferable to contain conductive fine particles in a range of more than 39% by weight and 95% by weight or less with respect to the total amount of the shielding layer. The average particle size of the conductive particles is preferably 2-20μm.

In addition, the materials of the insulating layer 473 and the first low-melting-point metal layer 474 of the shielding film 470 are preferably the same as the ideal materials of the insulating layer 73 and the first low-melting-point metal layer 74 of the shielding film 70.

Next, the shielding printed wiring board 450a using the base film 60, the shielding film 470, and the ground member 1 is demonstrated.

Figure 27 is a cross-sectional view schematically showing the use of the fifth embodiment of the present invention An example of the shielding printed wiring board of the shielding film.

As shown in FIG. 27, the shielding printed wiring board 450a is a shielding printed wiring board composed of a base film 60, a shielding film 470, and a ground member 1.

In the shielding printed wiring board 450a, the shielding layer 472 of the shielding film 470 is placed in contact with the base film 60.

In addition, the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 473 of the shielding film 470.

Then, the first low melting point metal layer 474 of the shielding film 470 is connected to the conductive protrusion 20 of the ground member 1.

Furthermore, the external connection member 10 of the ground member 1 is connected to the external ground GND.

Next, the shield printed wiring board 450b using the base film 60, the shield film 470, and the ground member 101 is demonstrated.

Fig. 28 is a cross-sectional view schematically showing an example of a shielding printed wiring board using the shielding film of the fifth embodiment of the present invention.

As shown in FIG. 28, the shielding printed wiring board 450b is a shielding printed wiring board composed of a base film 60, a shielding film 470, and a ground member 101.

In the shielding printed wiring board 450b, the shielding layer 472 of the shielding film 470 is placed in contact with the base film 60.

In addition, the conductive filler 130 of the ground member 101 penetrates the insulating layer 473 of the shielding film 470.

Then, the first low melting point metal layer 474 of the shielding film 470 is connected to the conductive filler 130 of the ground member 101.

Furthermore, the external connection member 110 of the ground member 101 is connected to the external ground GND.

(Other embodiments)

In the shielded printed wiring board of the present invention, when the first low-melting-point metal layer and/or the second low-melting-point metal layer are made of tin, they are located between the shielding layer and the first low-melting-point metal layer and/or between the shielding layer and the second low-melting-point metal layer. Preferably, a nickel layer is formed between the melting point metal layers.

If such a nickel layer is formed, it can prevent forming an alloy with the metal constituting the first low-melting-point metal layer and the shielding layer and/or with the metal constituting the second low-melting-point metal layer and the shielding layer.

In addition, in the shielded printed wiring board of the present invention, the conductive protrusion or conductive filler of the grounding member only needs to be connected to the shielding layer of the shielding film through the low melting point metal.

That is, the shielding printed wiring board described below is the shielding printed wiring board of the present invention, and the shielding printed wiring board includes: a base film in which a printed circuit including a ground circuit and an insulating film are sequentially arranged on the base film; and shielding A film consisting of a shielding layer and an insulating layer laminated on the shielding layer, and covering the base film in such a way that the shielding layer is arranged on the base film side than the insulating layer; and a grounding member which is arranged on the On the insulating layer of the shielding film; the grounding member is composed of an external connection member and a conductive protrusion, the external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive, the The conductive protrusions are arranged on the first main surface side; the conductive protrusions of the grounding member penetrate the insulating layer of the shielding film, and the conductive protrusions of the grounding member penetrate the low melting point The point metal is connected to the shielding layer of the shielding film, and the external connection member of the grounding member can be electrically connected to the external ground.

In addition, the shielding printed wiring board described below is also the shielding printed wiring board of the present invention, and the shielding printed wiring board includes: a base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; A shielding film is composed of a shielding layer and an insulating layer laminated on the shielding layer, and covering the base film in such a way that the shielding layer is arranged on the base film side than the insulating layer; and a grounding member is arranged at On the insulating layer of the shielding film; the grounding member is composed of an external connection member and a conductive filler, the external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive, The conductive filler is arranged on the first main surface side; the conductive filler of the grounding member penetrates the insulating layer of the shielding film, and the conductive filler of the grounding member is connected to the shielding layer of the shielding film through a low melting point metal, The first low melting point metal layer of the shielding film is connected to the conductive filler of the grounding member, and the external connecting member of the grounding member can be electrically connected to the external ground.

50: shielded printed wiring board

60: base membrane

61: Basement membrane

62: Printed Circuit

62a: Grounding circuit

63: insulating film

70: Shielding film

71: Adhesive layer

72: shielding layer

73: Insulation layer

74: The first low melting point metal layer

Claims (8)

A shielded printed wiring board is characterized by having: a base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; a shielding film, which is composed of a shielding layer and insulation laminated on the aforementioned shielding layer Layer, and cover the base film in such a way that the shielding layer is arranged on the base film side than the insulating layer; and the grounding member is arranged on the insulating layer of the shielding film; the grounding member is externally connected The external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive, and the conductive protrusion is arranged on the first main surface side; the ground The conductive protrusion of the member penetrates the insulating layer of the shielding film, and the conductive protrusion of the grounding member is connected to the shielding layer of the shielding film through the low melting point metal, and the external connection member of the grounding member can be electrically connected to the external ground; In addition, the low-melting-point metal is a first low-melting-point metal layer formed at least part of the shielding layer and the insulating layer of the shielding film, the first low-melting-point metal layer is formed of a metal with a melting point of 300°C or less, and the shielding film A nickel layer is formed between the shielding layer and the aforementioned first low melting point metal layer. A shielded printed wiring board, which is characterized by having: a base film on which a printed circuit containing a grounding circuit is sequentially arranged on the base film A circuit and an insulating film are formed; a shielding film is composed of a shielding layer and an insulating layer laminated on the shielding layer, and covering the base film in such a way that the shielding layer is arranged on the side of the base film than the insulating layer; And a grounding member arranged on the insulating layer of the shielding film; the grounding member is composed of an external connecting member and a conductive protrusion, and the external connecting member has a first main surface and a second second on the opposite side of the first main surface. The main surface is electrically conductive, the conductive protrusions are arranged on the first main surface side; the conductive protrusions of the grounding member penetrate the insulating layer of the shielding film, and the conductive protrusions of the grounding member are connected to through the low melting point metal The shielding layer of the shielding film; the shielding film is further provided with an adhesive layer laminated on the surface of the shielding layer opposite to the surface on which the insulating layer is laminated, and the adhesive layer of the shielding film and the substrate Film contact; wherein the low melting point metal is at least a part between the adhesive layer of the shielding film and the shielding layer of the shielding film to form a second low melting point metal layer, and the conductive protrusions of the grounding member penetrate the shielding layer of the shielding film The conductive protrusions of the grounding member are connected to the shielding layer of the shielding film through the low-melting-point metal forming the second low-melting-point metal layer, and the second low-melting-point metal layer is formed of a metal with a melting point of 300°C or less, A nickel layer is formed between the shielding layer of the shielding film and the second low melting point metal layer. A shielded printed wiring board is characterized by having: a base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; a shielding film, which is composed of a shielding layer and insulation laminated on the aforementioned shielding layer Layer, and cover the base film in such a way that the shielding layer is arranged on the base film side than the insulating layer; and the grounding member is arranged on the insulating layer of the shielding film; the grounding member is externally connected A member and a conductive filler, the external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive, and the conductive filler is arranged on the first main surface side; the ground The conductive filler of the member penetrates the insulating layer of the shielding film, and the conductive filler of the grounding member is connected to the shielding layer of the shielding film through the low melting point metal, and the first low melting point metal layer of the shielding film is connected to the grounding member The external connection member of the grounding member can be electrically connected to the external ground; and the low-melting-point metal is a first low-melting-point metal layer formed at least part of the shielding layer and the insulating layer of the shielding film. The first low-melting-point metal layer is formed of a metal having a melting point of 300° C. or less, and a nickel layer is formed between the shielding layer of the shielding film and the first low-melting-point metal layer. A shielded printed wiring board, which is characterized by having: a base film on which a printed circuit containing a grounding circuit is sequentially arranged on the base film A circuit and an insulating film are formed; a shielding film is composed of a shielding layer and an insulating layer laminated on the shielding layer, and covering the base film in such a way that the shielding layer is arranged on the side of the base film than the insulating layer; And a grounding member arranged on the insulating layer of the shielding film; the grounding member is composed of an external connecting member and a conductive filler, and the external connecting member has a first main surface and a second second on the opposite side of the first main surface. The conductive filler on the main surface is electrically conductive, and the conductive filler is arranged on the first main surface side; the conductive filler of the grounding member penetrates the insulating layer of the shielding film, and the conductive filler of the grounding member is connected to the ground member through a low melting point metal. The shielding layer of the shielding film, the low melting point metal is a first low melting point metal layer formed at least part of the shielding layer and the insulating layer of the shielding film, and the first low melting point metal layer of the shielding film is connected to the grounding member Conductive filler, and the external connection member of the grounding member can be electrically connected to the external ground; the shielding film is further provided with an adhesive layer laminated on the surface of the shielding layer on the opposite side to the surface on which the insulating layer is laminated , And the adhesive layer of the shielding film is in contact with the base film; the low-melting-point metal forms a second low-melting-point metal layer between at least a part of the adhesive layer of the shielding film and the shielding layer of the shielding film, and the grounding member The conductive filler penetrates the shielding layer of the shielding film, and the conductive filler of the grounding member is connected to the shielding layer of the shielding film through the low melting point metal forming the second low melting point metal layer; The first low melting point metal layer is formed of a metal having a melting point of 300°C or less, and the second low melting point metal layer is formed of a metal having a melting point of 300°C or less. The shielding layer of the shielding film is formed of the first low melting point metal. A nickel layer is formed between the layers, and a nickel layer is formed between the shielding layer of the shielding film and the second low melting point metal layer. A manufacturing method of a shielded printed wiring board, characterized in that the shielded printed wiring board is provided with: a base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; and the shielding film is composed of a shielding layer And is composed of an insulating layer laminated on the shielding layer, a first low melting point metal layer is formed between at least a part of the shielding layer and the insulating layer, and a nickel layer is formed between the shielding layer and the first low melting point metal layer; and The grounding member is arranged on the insulating layer of the shielding film; the first low melting point metal layer is formed of a metal with a melting point of 300°C or less; the grounding member is composed of an external connecting member and a conductive protrusion, the external connecting member It has a first main surface and a second main surface opposite to the first main surface and is conductive, and the conductive protrusions are arranged on the first main surface side; the manufacturing method of the shielding printed wiring board has the following steps: shielding film The placement step is to configure the shielding layer of the aforementioned shielding film on the screen The insulating layer of the masking film is closer to the base film side, and the shielding film is placed on the base film; the grounding member placement step is to place the conductive protrusions of the grounding member toward the insulating layer side of the shielding film. The grounding member is disposed on the shielding film; the pressing step is to press the grounding member so that the conductive protrusions of the grounding member penetrate the insulating layer of the shielding film; and the heating step is to heat the first low melting point metal layer to make it soften. Such as the manufacturing method of the shielded printed wiring board of claim 5, which simultaneously performs the said pressurization step and the said heating step. A manufacturing method of a shielded printed wiring board, characterized in that the shielded printed wiring board is provided with: a base film, which is formed by sequentially arranging a printed circuit containing a ground circuit and an insulating film on the base film; and the shielding film is composed of a shielding layer And is composed of an insulating layer laminated on the shielding layer, a first low melting point metal layer is formed between at least a part of the shielding layer and the insulating layer, and a nickel layer is formed between the shielding layer and the first low melting point metal layer; and The grounding member is arranged on the insulating layer of the shielding film; the first low-melting-point metal layer is formed of a metal with a melting point of 300°C or less; the grounding member is composed of an external connection member, a conductive filler, and an adhesive resin, The external connection member has a first main surface and a second main surface opposite to the first main surface and is conductive, and the conductive filler is arranged On the first main surface side, the adhesive resin fixes the conductive filler on the first main surface. In addition, the manufacturing method of the shielding printed wiring board has the following steps: a shielding film placement step, using the shielding film The shielding layer is arranged on the base film side than the insulating layer of the shielding film, and the shielding film is placed on the base film; the grounding member placement step is to use the conductive filler of the grounding member toward the insulation of the shielding film On the layer side, the grounding member is arranged on the shielding film; the pressing step is to press the grounding member so that the conductive filler of the grounding member penetrates the insulating layer of the shielding film; and the heating step is to heat the first low Melting the metal layer to soften it. Such as the manufacturing method of the shielded printed wiring board of claim 7, which simultaneously performs the said pressurization process and the said heating process.

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