CN102548191A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN102548191A CN102548191A CN2011101122197A CN201110112219A CN102548191A CN 102548191 A CN102548191 A CN 102548191A CN 2011101122197 A CN2011101122197 A CN 2011101122197A CN 201110112219 A CN201110112219 A CN 201110112219A CN 102548191 A CN102548191 A CN 102548191A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000011810 insulating material Substances 0.000 claims description 72
- 230000004888 barrier function Effects 0.000 claims description 69
- 238000000034 method Methods 0.000 claims description 27
- 238000013459 approach Methods 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 description 26
- 239000007921 spray Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000077 insect repellent Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention relates to a circuit board and a manufacturing method thereof. The circuit board comprises a circuit layer, a heat conducting plate and an insulating layer. The heat conducting plate comprises a plate body with a plate surface and at least one convex block which extends and protrudes from the plate surface and is connected with the plate body. The projection has a top surface and a side surface surrounding the periphery of the top surface, and the side surface is connected between the top surface and the plate surface. The insulating layer is disposed on the plate surface, and contacts the side surface and exposes the top surface. The circuit layer is disposed on the insulating layer and electrically insulated from the bump. In addition, the invention also provides a manufacturing method of the circuit board.
Description
Technical field
The present invention relates to a kind of wiring board and manufacturing approach thereof, particularly relate to a kind of wiring board and the manufacturing approach thereof that can accelerate thermal energy transfer speed.
Background technology
Electronic installations (electronic device) such as mobile phone now and computer; And electrical home appliances such as TV and refrigerator all comprise a plurality of electronic components (electronic component), and it for example is active member (active component) or passive device (passive component).These electronic components are assembled in the circuit board mostly, and the signal of telecommunication is exported and received to the circuit that utilizes wiring board to have.So, the signal of telecommunication is able between these electronic components, transmit.
Yet electronic component all can produce some heat energy when running, and some electronic component, and for example (Light Emitting Diode LED) with power component (power device), when running, can produce great amount of heat energy to light-emitting diode especially.Therefore, how accelerating to transmit the speed of the heat energy of electronic component, is that present wiring board field is worth the problem inquired into.
Summary of the invention
The present invention provides a kind of wiring board, and it can accelerate to transmit the speed of the heat energy of electronic component.
The present invention provides a kind of manufacturing approach of wiring board, and it can make above-mentioned wiring board.
The object of the invention and solve its technical problem and adopt following technical scheme to realize.A kind of wiring board according to the present invention proposes comprises a line layer, a heat-conducting plate and an insulating barrier.Heat-conducting plate comprises the projection that has the plate body of a plate face and extend at least one connection plate body of protrusion from the plate face.Projection has an end face and around the side that connects the end face periphery, and the side is connected between end face and the plate face.Insulating barrier is configured on the plate face, and contacts the side and expose end face.Line layer is configured on the insulating barrier, and line layer and projection are electrically insulated.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
Aforesaid wiring board, wherein said line layer comprise at least one connection pad that is configured on the insulating barrier, and connection pad contact tab not.
Aforesaid wiring board, wherein said insulating barrier comprise at least one first insulating material and one second insulating material.The local overlay face of first insulating material, and contact side.Second insulating material covers the plate face that is not covered by first insulating material, and wherein the thermal conductivity of first insulating material (thermal conductivity) is greater than the thermal conductivity of second insulating material.
Aforesaid wiring board, wherein said connection pad is configured on first insulating material.
Aforesaid wiring board also comprises at least one heat conducting element (thermal conductive component) that is configured on the end face, wherein heat conducting element contact end face.
Aforesaid wiring board, the distance between wherein said end face to the plate face is more than or equal to the thickness of insulating barrier.
The object of the invention and solve its technical problem and also adopt following technical scheme to realize.The manufacturing approach of a kind of wiring board that proposes according to the present invention.At first, provide one have a plane heat-conducting substrate.Then, remove the part heat-conducting substrate of position at plane place, to form a plate face and at least one projection, wherein projection has an end face and and is connected the side between end face and the plate face.Afterwards, formation one exposes the insulating barrier of end face, wherein insulating barrier contact plate face and side on the plate face.Then, on insulating barrier, form a line layer, wherein line layer and projection are electrically insulated.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
The manufacturing approach of aforesaid wiring board; The method that wherein forms insulating barrier comprises; On the plate face, form at least one first insulating material and one second insulating material; The wherein local overlay face of first insulating material, and contact side, and second insulating material covers the plate face that is not covered by first insulating material.The thermal conductivity of first insulating material is greater than the thermal conductivity of second insulating material.
The manufacturing approach of aforesaid wiring board, wherein said insulating barrier are lazy flow film (low flow prepreg) or do not have mobile film (non-flow prepreg).
The manufacturing approach of aforesaid wiring board, the distance between wherein said end face to the plate face is more than or equal to the thickness of insulating barrier.
The manufacturing approach of aforesaid wiring board, the method for wherein said formation line layer comprise, at first, and pressing one tinsel (metal foil) on insulating barrier.Then, remove the part metals paillon foil, to expose insulating barrier and end face.
Based on above-mentioned; Because projection and plate body are formed in one; Therefore after at least one electronic component was assembled on the wiring board, electronic component can heat couple (thermally coupling to) heat-conducting plate, so that heat-conducting plate can be accelerated the speed of the heat energy of transmission electronic component.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of specification, and for let of the present invention above-mentioned with other purposes, feature and advantage can be more obviously understandable, below special act embodiment; And conjunction with figs., specify as follows.
Description of drawings
Figure 1A is the generalized section of wiring board behind the assembling electronic component of one embodiment of the invention.
Figure 1B is the generalized section of wiring board after otherwise assembling electronic component among Figure 1A.
Fig. 1 C is the generalized section of wiring board after otherwise assembling electronic component among Figure 1A.
Fig. 2 A to Fig. 2 E is the flow process generalized section of the manufacturing approach of wiring board among Figure 1A.
10,20,30: electronic component 12,14,22,24,34,112,321,322: connection pad
31: chip 32: support plate
33: sealing 100: wiring board
110: line layer 114: cabling
120: heat-conducting plate 122: plate body
122a: plate face 124: projection
124s: side 124t: end face
130: 132: the first insulating material of insulating barrier
Insulating material 140 in 134: the second: heat conducting element
210: tinsel 220: heat-conducting substrate
222: planar S 1: solder bump
T1: apart from T2: thickness
W1, W2: bonding wiring
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and embodiment; To wiring board and its embodiment of manufacturing approach, structure, method, step, characteristic and the effect thereof that proposes according to the present invention, specify as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can be known to appear in the following detailed description that cooperates with reference to graphic embodiment.Explanation through embodiment; Should be to reach technological means that predetermined purpose takes and effect to obtain one more deeply and concrete understanding to the present invention; Yet appended graphic only provide reference with the explanation used, be not to be used for the present invention is limited.
Figure 1A is the generalized section of wiring board behind the assembling electronic component of one embodiment of the invention.See also shown in Figure 1A, wiring board 100 comprises a line layer 110, a heat-conducting plate 120 and an insulating barrier 130.Heat-conducting plate 120 comprises a plate body 122 and at least one projection 124, and projection 124 connects plate body 122.In the embodiment of Figure 1A, projection 124 only illustrates one, but in other embodiments, wiring board 100 can comprise a plurality of projections 124, so the quantity of the projection shown in Figure 1A 124 only supplies to illustrate, and non-limiting the present invention.
In addition; When to overlook when watching wiring board 100; The shape of projection 124 can be in fact the geometry of irregular geometry or rule, and irregular geometry can be the uneven triangle in three limits, the uneven quadrangle in four limits or the asymmetric figure (for example cloud shape) with camber line etc.The geometry of rule can be to have symmetric figure; And this symmetry comprises point symmetry or line symmetry, and for example the geometry of rule can be equilateral triangle, isosceles triangle, isosceles trapezoid, rhombus, square, rectangle, regular pentagon, regular hexagon, positive heptagon, circle, ellipse, water droplet shape, fan-shaped or star etc.In addition, the shape of projection 124 also can be the scroll of picture as the mosquito-repellent incense.Hence one can see that, and the shape of projection 124 can be designed to multiple.
Heat-conducting plate 120 has high heat conductance, and it is for example greater than 50W/MK.What must explain is that the thermal conductivity of being mentioned in specification of the present invention and the claim is meant the thermal conductivity when absolute temperature 300K (about 27 ℃) entirely.The material that constitutes plate body 122 for example is carbon or metal; Therefore plate body 122 can be metallic plate or material with carbon element plate (carbon-material board); Wherein material with carbon element plate general reference mainly is the sheet material that is made up of carbon, and it for example is carbon fiber board (carbon fiber board) or graphite cake (graphite board).In addition, because projection 124 is formed in one with plate body 122, so it is also identical with the material that constitutes plate body 122 to constitute the material of projection 124, the material that promptly constitutes projection 124 also can be carbon or metal.
Insulating barrier 130 is configured between line layer 110 and the plate face 122a, and is configured on the plate face 122a.Insulating barrier 130 is separated line layer 110 and plate body 122, wherein insulating barrier 130 contact plate face 122a and side 124s, and expose the end face 124t of projection 124.Line layer 110 is configured on the insulating barrier 130, and is electrically insulated with projection 124, and owing to projection 124 and plate body 122 are formed in one, so line layer 110 also is electrically insulated with plate body 122.In addition, end face 124t between the plate face 122a can be apart from T1 more than or equal to the thickness T 2 of insulating barrier 130, so projection 124 can more protrude from insulating barrier 130, or the end face 124t of projection 124 trims with the surface of insulating barrier 130 in fact.
Insulating barrier 130 can be to be made up of single kind of insulating material, perhaps also can be to be made up of multiple insulating material.When insulating barrier 130 is when being made up of multiple insulating material, insulating barrier 130 can comprise at least one first insulating material 132 and one second insulating material 134, and wherein first insulating material 132 and second insulating material, 134 the two material are different.
The thermal conductivity of first insulating material 132 is greater than the thermal conductivity of second insulating material 134, so the speed of first insulating material, 132 transferring heat energy can be greater than the speed of second insulating material, 134 transferring heat energy.For example, the thermal conductivity of first insulating material 132 can be higher than 2.0W/MK, and the thermal conductivity of second insulating material 134 can be lower than 1W/MK, and for example the thermal conductivity of second insulating material 134 is between between the 0.3W/MK to 0.5W/MK.
First insulating material 132 and all local overlay face of second insulating material 134 122a, the side 124s of first insulating material, 132 contact tabs 124 wherein, and second insulating material 134 covers the plate face 122a that is not covered by first insulating material 132.In the present embodiment, the shape of first insulating material 132 can be closed ring (closed loop), and first insulating material 132 is fully around projection 124, so that second insulating material 134 contact tab 124 not.
Yet; In other embodiments, the shape of first insulating material 132 can be annular or other the annular shape in addition with breach, and for example the shape of first insulating material 132 can be the C font; And second insulating material 134 can extend in the above-mentioned breach, and then contact tab 124.Therefore, stress that at this present invention does not limit the shape of first insulating material 132.
Hot coupling mode between connection pad 14 and the projection 124 has multiple, and in the present embodiment, projection 124 heat conducting element 140 heat capable of using couple connection pad 14.In detail, wiring board 100 can more comprise at least one heat conducting element 140, and heat conducting element 140 has high heat conductance, and it is greater than 2W/MK.Heat conducting element 140 not only is configured on the end face 124t, and contact end face 124t, so heat conducting element 140 can be passed to projection 124 with heat energy from electronic component 10 apace.
Must explanation be, though the wiring board 100 among Figure 1A comprises heat conducting element 140, in other embodiments, connection pad 14 is direct contact tab 124 also, thus heat couples projection 124.Therefore, heat conducting element 140 is merely the selection element of wiring board 100, and inessential element, so the heat conducting element 140 shown in Figure 1A only supplies to illustrate and non-limiting the present invention.
Based on the above; Because heat-conducting plate 120 has high heat conductance; And projection 124 is formed in one with plate body 122, does not have any interface between the two basically, so heat energy can transmit between projection 124 and plate body 122 with the mode of heat conduction (thermal conduction) apace.So, when the electronic component 10 when running produced heat energy, heat-conducting plate 120 can be accelerated the transfer rate of heat energy, to reduce the probability that overheated (overheating) takes place electronic component 10.
In addition, because that the shape of projection 124 can be designed to is multiple, for example random geometry or regular geometric shapes, so the shape of projection 124 can cooperate the external form of connection pad 14 to design.So, projection 124 can couple with connection pad 14 heat fully, so that heat-conducting plate 120 can be accelerated the transfer rate of heat energy effectively.
What deserves to be mentioned is that though the wiring board 100 shown in Figure 1A is to be assembled on the wiring board 100 with the mode of falling the core, in other embodiments, electronic component also can be assembled on the wiring board 100, shown in Figure 1B with other modes.
Seeing also shown in Figure 1B, is the generalized section of wiring board after otherwise assembling electronic component among Figure 1A.Except falling the core; Electronic component 20 can utilize bonding line (wire bonding) mode to be assembled on the wiring board 100; Wherein electronic component 20 can be active member or passive device, and for example electronic component 20 can be the chip that has encapsulated, chip, light-emitting diode, power component, electric capacity or the inductance of not encapsulation.Electronic component 20 has a plurality of connection pads 22 and at least one connection pad 24, and connection pad 22 is with respect to connection pad 24, and wherein connection pad 22 is the work connection pad, and connection pad 24 can be illusory connection pad or ground mat.
After wiring board 100 and electronic component 20 were assembled, each connection pad 112 can electrically connect a connection pad 22 via a bonding wiring W1, so that wiring board 100 can electrically connect electronic component 20.Connection pad 24 can heat couple projection 124, and for example connection pad 24 couples projection 124 via heat conducting element 140 heat, or direct contact tab 124, thereby heat couples projection 124.So, electronic component 20 can be passed to the external environment from heat-conducting plate 120 at the heat energy that running the time is produced.Because heat-conducting plate 120 can be accelerated the transfer rate of heat energy, thereby can reduce the overheated probability of electronic component 20 generations.
Seeing also shown in Fig. 1 C, is the generalized section of wiring board after otherwise assembling electronic component among Figure 1A.It shows: when electronic component was the chip that has encapsulated, wiring board 100 is the assembling between the electronic component therewith.In detail, the chip of electronic component 30 for having encapsulated, and be example with Fig. 1 C, electronic component 30 for example is a light-emitting diode.But, in the embodiment that other do not illustrate, electronic component 30 also can be power component or other can produce the element of great amount of heat energy.
In addition; Heat conducting element 140 can be connected between projection 124 and the connection pad 34; Couple projection 124 so that electronic component 30 is able to heat, the heat energy that lets electronic component 30 when running, produced can be passed to the external environment from projection 124, connection pad 112 and first insulating material 132.So, when the electronic component 30 when running produced heat energy, heat-conducting plate 120 can be accelerated the transfer rate of heat energy, to reduce electronic component 30 overheated probability took place.
Below only introduce the structure of wiring board 100 and the assembling between wiring board 100 and electronic component 10,20 or 30.Next, will cooperate Fig. 2 A to Fig. 2 E, introduce the manufacturing approach of wiring board 100 in detail.
Fig. 2 A to Fig. 2 E is the flow process generalized section of the manufacturing approach of wiring board among Figure 1A.See also shown in Fig. 2 A, in the manufacturing approach of wiring board 100, at first, provide one have a plane 222 heat-conducting substrate 220, and heat-conducting substrate 220 has high heat conductance, it is for example greater than 50W/MK.The material that constitutes heat-conducting substrate 220 can be carbon or metal, and for example heat-conducting substrate 220 can be material with carbon element plates such as metallic plate, or carbon fiber board or graphite cake.
See also shown in Fig. 2 A and Fig. 2 B, then, remove the part heat-conducting substrate 220 at 222 places, position,, thereby form heat-conducting plate 120 with formation plate face 122a and at least one projection 124 with end face 124t and side 124s on the plane.The method that removes part heat-conducting substrate 220 has multiple, and in the present embodiment, the method that removes part heat-conducting substrate 220 comprises little shadow and etching.When part heat-conducting substrate 220 utilized little shadow and etching and is removed, part plane 222 can be retained, thereby becomes the end face 124t of projection 124.
See also shown in Fig. 2 C; Then; On plate face 122a, form one expose end face 124t insulating barrier 130, the side 124s of insulating barrier 130 contact plate face 122a and projection 124 wherein, and end face 124t between the plate face 122a can be apart from T1 more than or equal to the thickness T 2 of insulating barrier 130; Be that projection 124 can protrude from insulating barrier 130, or the end face 124t of projection 124 trim with the surface of insulating barrier 130 in fact.The method of formation insulating barrier 130 has multiple, and in the present embodiment, the method that forms insulating barrier 130 can comprise printing (printing) or pressing (lamination).
Above-mentioned printing comprises multiple implementation method, and the method for for example printing insulating barrier 130 can comprise coating (apply) or ink-jet (inkjet).When insulating barrier 130 is mode printings with coating when forming, insulating barrier 130 can be the coating of coating at least a liquid state, colloidal state or paste and forming, and wherein this coating can have viscosity, and for example is resin (resin) or contain the coating of resinous principle.
When insulating barrier 130 is mode printings with ink-jet when forming, an ink jet printer capable of using (not illustrating) spraying one spray material on plate face 122a, thereby form insulating barrier 130.Spray material for example is that the nozzle by ink jet printer spray, and nozzle can move, so in the process that sprays, nozzle can be controlled the position that spray material institute will spray, so that insulating barrier 130 ability part exposure plate face 122a.
In addition, more than be used to form the coating and spray material of insulating barrier 130, the two material can be identical or different.When above-mentioned coating and spray material were different, the viscosity of coating (viscosity) can be greater than the viscosity of spray material, and for example coating can be liquid, colloidal state or paste; And the spray material can be liquid state or colloidal state, but is not paste.So, the spray material is easy to flow than coating, so that nozzle will spray the material ejection easily.
But, look the specification of ink jet printer, for example the bore of power output or nozzle sprays material and also can have higher viscosity, and for example the spray material also can be a kind of paste material.Therefore, about the relative different of spray material with the two viscosity of coating, the present invention does not limit.
When insulating barrier 130 is when forming with pressing, insulating barrier 130 can be an at least a semi-solid preparation film of pressing and forming, and wherein this semi-solid preparation film can be the lazy flow film or not have mobile film.
Insulating barrier 130 can be made up of one or more insulating material.When insulating barrier 130 was made up of multiple insulating material, insulating barrier 130 can adopt following method to form.On plate face 122a, form at least one first insulating material 132 and second insulating material 134.First insulating material, 132 local overlay face 122a, and the side 124s of contact tab 124, and second insulating material 134 covers the plate face 122a that is not covered by first insulating material 132.In addition, the thermal conductivity of first insulating material 132 is greater than the thermal conductivity of second insulating material 134.
First insulating material 132 and second insulating material 134 all can utilize printing or pressing to form; For example first insulating material 132 and second insulating material 134 can be that the coating that is coated with multiple liquid state, colloidal state or paste forms; Or the multiple semi-solid preparation film of pressing forms, and wherein these semi-solid preparation films also can be the lazy flow films or not have mobile film.
See also shown in Fig. 2 D, then, pressing a slice tinsel 210 on insulating barrier 130, wherein tinsel 210 covers the end face 124t of insulating barrier 130 and projection 124 comprehensively.In Fig. 2 D, because projection 124 protrudes from insulating barrier 130, so tinsel 210 can receive the compressing of projection 124 and is out of shape after pressing.In addition, tinsel 210 for example be Copper Foil, aluminium foil, tinfoil paper, silver foil, goldleaf or gum Copper Foil (Resin Coated Copper, RCC).
See also shown in Fig. 2 D and Fig. 2 E; Then; Remove part metals paillon foil 210, exposing the end face 124t of insulating barrier 130 and projection 124, and on insulating barrier 130, form line layer 110; Wherein line layer 110 is electrically insulated with projection 124, and the method that removes part metals paillon foil 210 can comprise little shadow (photolithography) and etching (etching).So far, wiring board 100 has been made completion basically.
In the process of pressing tinsel 210; Colloid in the insulating barrier 130 can flow; To such an extent as to colloid may penetrate between tinsel 210 and the end face 124t and (see also Fig. 2 D), cause after removing part metals paillon foil 210, end face 124t goes up can residual glue slag.To this; Can be after removing part metals paillon foil 210; The end face 124t of cleaning projection 124; To remove de-smear, wherein the method for cleaning (clean) end face 124t can comprise the slag that removes photoresist (desmear), laser treatment (laser treatment) or Cement Composite Treated by Plasma (plasma treatment).The heat that so, can improve between projection 124 and the electronic component (for example electronic component 10,20 or 30) couples quality.
But; Owing to insulating barrier 130 can be at least a lazy flow film of pressing or not have mobile film and form; Therefore when insulating barrier 130 was by the lazy flow film or does not have mobile film and form, in the process of pressing tinsel 210, insulating barrier 130 interior colloids can not penetrate between tinsel 210 and the end face 124t basically and (see also Fig. 2 D); To such an extent as to after removing part metals paillon foil 210, can clean end face 124t.Hence one can see that, and present embodiment not necessarily will be after forming line layer 110, cleaning end face 124t.
What deserves to be mentioned is, the manufacturing approach of the wiring board 100 that is disclosed according to above Fig. 2 D and Fig. 2 E, line layer 110 is to be formed by pressing tinsel 210.Yet in other embodiments, the method that forms line layer 110 can comprise electroless-plating (electroless plating) and electroplate (electroplating), and line layer 110 is not necessarily and will be formed by pressing tinsel 210.
In detail, line layer 110 can be to form via semi-additive process or addition process.When line layer 110 is by semi-additive process or addition process and when forming; Can on insulating barrier 130, form the thin partially metal level of a layer thickness earlier; And this metal for example is the tinsel 210 of thickness attenuation; Or, wherein let the method for tinsel 210 thickness attenuation comprise etching or grinding (grinding) by sputter (sputtering) or the formed metallic film of electroless-plating.
Then, form a local mask pattern layer that covers above-mentioned metal level, and dry film that this mask pattern layer for example is little movie queen (dry film) or photoresist layer.Afterwards, carry out electroless-plating and plating.At electroless-plating and after electroplating, carry out microetch (micro-etching).So, line layer 110 is able to form.Hence one can see that, and the method for utilizing pressing tinsel 210 to form line layer 110 shown in Fig. 2 D and Fig. 2 E only supplies to illustrate, and non-limiting the present invention.
The above only is embodiments of the invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the method for above-mentioned announcement capable of using and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from technical scheme of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.
Claims (11)
1. wiring board is characterized in that it comprises:
One heat-conducting plate; Comprise one have the plate body of a plate face and certainly this plate face extend the projection of at least one this plate body of connection of protrusion; Wherein this projection has an end face and around the side that connects this end face periphery, and wherein this side is connected between this end face and this plate face;
One insulating barrier is configured on this plate face, and contacts this side and expose this end face; And
One line layer is configured on this insulating barrier, and this line layer and this projection are electrically insulated.
2. wiring board according to claim 1 is characterized in that wherein said line layer comprises at least one connection pad that is configured on this insulating barrier, and this connection pad does not contact this projection.
3. wiring board according to claim 2 is characterized in that wherein said insulating barrier comprises:
At least one first insulating material, local this plate face of covering, and contact this side; And
One second insulating material covers this plate face that is not covered by this first insulating material, and wherein the thermal conductivity of this first insulating material is greater than the thermal conductivity of this second insulating material.
4. wiring board according to claim 3 is characterized in that wherein said connection pad is configured on this first insulating material.
5. wiring board according to claim 1 is characterized in that also comprising at least one heat conducting element that is configured on this end face, wherein this this end face of heat conducting element contact.
6. wiring board according to claim 1 is characterized in that distance between wherein said end face to this plate face is more than or equal to the thickness of this insulating barrier.
7. the manufacturing approach of a wiring board is characterized in that it may further comprise the steps:
Provide one have a plane heat-conducting substrate;
Remove position this heat-conducting substrate of part at place, this plane, to form a plate face and at least one projection, wherein this projection has an end face and and is connected the side between this end face and this plate face;
Formation one exposes the insulating barrier of this end face on this plate face, wherein this insulating barrier this plate face of contact and this side; And
On this insulating barrier, form a line layer, wherein this line layer and this projection are electrically insulated.
8. the manufacturing approach of wiring board according to claim 7 is characterized in that the method that wherein forms this insulating barrier comprises:
On this plate face, form at least one first insulating material and one second insulating material; Wherein this first insulating material part covers this plate face; And contact this side; This second insulating material covers this plate face that is not covered by this first insulating material, and the thermal conductivity of this first insulating material is greater than the thermal conductivity of this second insulating material.
9. according to the manufacturing approach of claim 7 or 8 described wiring boards, it is characterized in that wherein said insulating barrier is the lazy flow film or does not have mobile film.
10. the manufacturing approach of wiring board according to claim 7 is characterized in that distance between wherein said end face to this plate face is more than or equal to the thickness of this insulating barrier.
11. the manufacturing approach of wiring board according to claim 7 is characterized in that the method that wherein forms this line layer comprises:
Pressing one tinsel on this insulating barrier; And
Remove this tinsel of part, to expose this insulating barrier and this end face.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099143687 | 2010-12-14 | ||
| TW099143687A TWI505765B (en) | 2010-12-14 | 2010-12-14 | Wiring board and method for fabricating the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102548191A true CN102548191A (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101122197A Pending CN102548191A (en) | 2010-12-14 | 2011-04-27 | Circuit board and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5723609B2 (en) |
| CN (1) | CN102548191A (en) |
| TW (1) | TWI505765B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| CN104254190A (en) * | 2013-06-26 | 2014-12-31 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI501370B (en) * | 2013-03-21 | 2015-09-21 | 矽品精密工業股份有限公司 | Semiconductor package and method of manufacture |
| TWI488268B (en) * | 2013-03-28 | 2015-06-11 | Ind Tech Res Inst | Semiconductor device |
| JPWO2015059967A1 (en) * | 2013-10-24 | 2017-03-09 | 住友電気工業株式会社 | Heat dissipation circuit board and manufacturing method thereof |
| KR20150136914A (en) * | 2014-05-28 | 2015-12-08 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
| TWI580084B (en) * | 2015-12-31 | 2017-04-21 | 綠點高新科技股份有限公司 | A light emitting assembly and manufacturing method thereof |
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| CN104254190A (en) * | 2013-06-26 | 2014-12-31 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof |
| CN104254190B (en) * | 2013-06-26 | 2017-12-01 | 陈丽专 | The preparation method of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201225828A (en) | 2012-06-16 |
| JP2012129483A (en) | 2012-07-05 |
| JP5723609B2 (en) | 2015-05-27 |
| TWI505765B (en) | 2015-10-21 |
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Application publication date: 20120704 |