CN216614501U

CN216614501U - Heat dissipation film for electronic product

Info

Publication number: CN216614501U
Application number: CN202123445710.XU
Authority: CN
Inventors: 周二风; 刘建会; 江点
Original assignee: Yancheng Jiuzhi New Material Technology Co ltd
Current assignee: Yancheng Jiuzhi New Material Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-05-27
Anticipated expiration: 2031-12-30

Abstract

The utility model discloses a heat dissipation film for an electronic product, which comprises: PET substrate layer and graphite alkene layer, the surface coating that PET substrate layer and graphite alkene layer carried on the back mutually has the mute black ink layer of a heat conduction, be connected through first heat conduction adhesive layer between graphite alkene layer and the PET substrate layer, the PET substrate layer has plated the first metal wire that the parallel interval of a plurality of set up and the second metal wire that the parallel interval of a plurality of set up towards the surface on graphite alkene layer, first metal wire and second metal wire are the setting of crossing, graphite alkene layer and PET substrate layer back of the body surface coating mutually have a second heat conduction adhesive layer, one from the surface that the material layer subsides in second heat conduction adhesive layer. The heat dissipation film for the electronic product can effectively shield the interference of an external electromagnetic field on the electronic product while realizing the cooling and heat conduction of the electronic product, thereby improving the reliability of the electronic product in use.

Description

Heat dissipation film for electronic product

Technical Field

The utility model relates to a heat dissipation film for an electronic product, and belongs to the technical field of heat dissipation films.

Background

On the one hand, along with the acceleration of the present upgrading of electronic product, the popularization of high power, high thermal chip, on the other hand, the rapid development of science and technology, electronic device is miniaturized gradually, and the dominant frequency of chip is higher and higher, and power is bigger and bigger, leads to heat flux density to increase sharply, produces a large amount of heats. The failure to process the heat in a timely manner affects the operation of the electronic device, reduces the component life, and may present safety concerns. In the prior art, a heat dissipation film is used to improve the heat dissipation problem of an electronic device, but the prior heat dissipation film still has a lot of technical spaces which can be improved in the technology.

Disclosure of Invention

The utility model aims to provide a heat dissipation film for an electronic product, which overcomes the defect that the existing film is easily interfered by an external electromagnetic field to the electronic product while improving the cooling and heat conduction of the electronic product, thereby improving the reliability of the electronic product in use.

In order to solve the technical problems, the utility model adopts the technical scheme that: a heat dissipation film for an electronic product, comprising: PET substrate layer and graphite alkene layer, the surface coating that PET substrate layer and graphite alkene layer carried on the back mutually has the mute black ink layer of a heat conduction, be connected through first heat conduction adhesive layer between graphite alkene layer and the PET substrate layer, the PET substrate layer has plated the first metal wire that the parallel interval of a plurality of set up and the second metal wire that the parallel interval of a plurality of set up towards the surface on graphite alkene layer, first metal wire and second metal wire are the setting of crossing, graphite alkene layer and PET substrate layer back of the body surface coating mutually have a second heat conduction adhesive layer, one from the surface that the material layer subsides in second heat conduction adhesive layer.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the first metal wire and the second metal wire are both silver wires or aluminum wires.

2. In the above scheme, the first metal wire and the second metal wire are vertically arranged.

3. In the scheme, the thickness of the heat-conducting matte black ink layer is 10-30 microns.

4. In the above scheme, the release material layer is release paper or a release film.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

according to the heat dissipation film for the electronic product, the surface of the PET substrate layer, which is opposite to the graphene layer, is coated with the heat conduction matte black ink layer, the surface of the PET substrate layer, which faces the graphene layer, is plated with the first metal wires arranged in parallel at intervals and the second metal wires arranged in parallel at intervals, and the first metal wires and the second metal wires are arranged in a crossed manner.

Drawings

FIG. 1 is a schematic structural view of a heat dissipation film for an electronic product according to the present invention;

FIG. 2 is a schematic structural diagram of a PET substrate layer in the heat dissipation film for electronic products.

In the above drawings: 1. a PET substrate layer; 2. a graphene layer; 3. a thermally conductive matte black ink layer; 4. a first thermally conductive adhesive layer; 5. a first metal line; 6. a second metal line; 7. a release material layer; 8. a second thermal adhesive layer.

Detailed Description

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1: a heat dissipation film for an electronic product, comprising: PET substrate layer 1 and graphite alkene layer 2, the surface coating that PET substrate layer 1 and graphite alkene layer 2 carried on the back has the mute black ink layer 3 of a heat conduction, be connected through first heat conduction gluing layer 4 between graphite alkene layer 2 and the PET substrate layer 1, PET substrate layer 1 has plated the first metal wire 5 that the parallel interval of a plurality of set up and the second metal wire 6 that the parallel interval of a plurality of set up towards graphite alkene layer 2's surface, first metal wire 5 and second metal wire 6 are the setting of crossing, graphite alkene layer 2 and the surface coating that PET substrate layer 1 carried on the back have a second heat conduction gluing layer 8, one from type material layer 7 pastes in the surface of second heat conduction gluing layer 8.

The first metal wire 5 and the second metal wire 6 are both aluminum wires.

The first metal line 5 and the second metal line 6 are vertically disposed.

The thickness of the heat-conducting matte black ink layer 3 is 20 micrometers, and the release material layer 7 is release paper.

Example 2: a heat dissipation film for an electronic product, comprising: PET substrate layer 1 and graphite alkene layer 2, the surface coating that PET substrate layer 1 and graphite alkene layer 2 carried on the back has the mute black ink layer 3 of a heat conduction, be connected through first heat conduction gluing layer 4 between graphite alkene layer 2 and the PET substrate layer 1, PET substrate layer 1 has plated the first metal wire 5 that the parallel interval of a plurality of set up and the second metal wire 6 that the parallel interval of a plurality of set up towards graphite alkene layer 2's surface, first metal wire 5 and second metal wire 6 are the setting of crossing, graphite alkene layer 2 and the surface coating that PET substrate layer 1 carried on the back have a second heat conduction gluing layer 8, one from type material layer 7 pastes in the surface of second heat conduction gluing layer 8.

The first metal wire 5 and the second metal wire 6 are both silver wires.

The first metal wire 5 and the second metal wire 6 are arranged at an included angle of 60 degrees.

The thickness of the heat-conducting matte black ink layer 3 is 12 micrometers, and the release material layer 7 is a release film.

When adopting above-mentioned electronic product is with heat dissipation pad pasting, the surface coating that its PET substrate layer and graphite alkene layer carried on the back mutually has the mute black ink layer of a heat conduction, the PET substrate layer has plated the first metal wire that the parallel interval of a plurality of set up and the second metal wire that the parallel interval of a plurality of set up towards the surface on graphite alkene layer, first metal wire and second metal wire are the setting of crossing, high durability and convenient use, tear the back off the profile material layer, directly paste in electronic product's heat source surface, when the realization is cooled down the heat conduction to electronic product, also can effectively shield external electromagnetic field and disturb electronic product, thereby reliability when having improved electronic product's use.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a heat dissipation pad pasting for electronic product which characterized in that: the method comprises the following steps: PET substrate layer (1) and graphite alkene layer (2), PET substrate layer (1) and graphite alkene layer (2) the surface coating that carries on the back mutually have one and lead mute black ink layer (3), be connected through first heat conduction adhesive layer (4) between graphite alkene layer (2) and PET substrate layer (1), PET substrate layer (1) has plated first metal wire (5) that a plurality of parallel interval set up and second metal wire (6) that a plurality of parallel interval set up towards the surface of graphite alkene layer (2), first metal wire (5) and second metal wire (6) are the cross setting, graphite alkene layer (2) and PET substrate layer (1) the surface coating that carries on the back have a second heat conduction adhesive layer (8), one from type (7) paste and apply in the surface of second heat conduction adhesive layer (8).

2. The heat dissipation film for electronic products of claim 1, wherein: the first metal wire (5) and the second metal wire (6) are both silver wires or aluminum wires.

3. The heat dissipation film for electronic products of claim 1, wherein: the first metal wire (5) and the second metal wire (6) are vertically arranged.

4. The heat dissipation film for electronic products of claim 1, wherein: the thickness of the heat-conducting matte black ink layer (3) is 10-30 mu m.

5. The heat dissipation film for electronic products of claim 1, wherein: the release material layer (7) is release paper or a release film.