CN208353691U - A kind of double-sided wiring board of perfect heat-dissipating - Google Patents
A kind of double-sided wiring board of perfect heat-dissipating Download PDFInfo
- Publication number
- CN208353691U CN208353691U CN201721828354.0U CN201721828354U CN208353691U CN 208353691 U CN208353691 U CN 208353691U CN 201721828354 U CN201721828354 U CN 201721828354U CN 208353691 U CN208353691 U CN 208353691U
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- Prior art keywords
- heat
- wiring board
- double
- substrate
- hole
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of double-sided wiring boards of perfect heat-dissipating, including wiring board ontology, the wiring board ontology is by Pi heat-conducting double-sided copper foil, heat-conducting glue and substrate composition, the heat-conducting glue is bonded between the Pi heat-conducting double-sided copper foil and the substrate, the Pi heat-conducting double-sided copper foil structure is to press Pi heat-conducting glue among two monolithic copper foils, the through-hole through substrate front and back sides is offered in the substrate, it further include multiple heat release holes, each heat release hole runs through entire wiring board ontology, each heat release hole and throughhole portions are overlapped, heat dissipating silicone grease is filled in heat release hole.Pi heat-conducting glue layer has higher heat conductivity and preferable insulating properties in the utility model, improve the heat dissipation of double-sided wiring board, simultaneously because substrate is provided with the through-hole through front and back sides, it is additionally provided with the heat release hole through entire wiring board, there is the heat dissipating silicone grease of conduction heat in heat release hole, heat release hole conducts heat to through-hole and heat is discharged, so that the heat dissipation performance of entire wiring board greatly improves.
Description
Technical field
The utility model relates to wiring board technology field more particularly to a kind of double-sided wiring boards of perfect heat-dissipating.
Background technique
Currently, most wiring boards is the wiring board of traditional type on the market, common constitute is: single side copper foil+Pi, glue
Layer, single side copper foil+Pi lead glue, and substrate layer is bonded together then by pressing, become double-sided wiring board, this tired
The mode added can allow Double-side line plate thickness to increase, also directly increase the thermal resistance of Double-side line material, lead to the difficulty of heat dissipation
Point.
Utility model content
In order to overcome the above-mentioned deficiencies of the prior art, the utility model provides a kind of double-sided circuit of perfect heat-dissipating
Plate.
The utility model solves technical solution used by its technical problem are as follows:
A kind of double-sided wiring board of perfect heat-dissipating, including wiring board ontology, the wiring board ontology is by Pi heat-conducting double-sided
Copper foil, heat-conducting glue and substrate composition, the heat-conducting glue is bonded between the Pi heat-conducting double-sided copper foil and the substrate, described
Pi heat-conducting double-sided copper foil structure is that Pi heat-conducting glue is pressed among two monolithic copper foils, is offered before and after substrate in the substrate
The through-hole of side, further includes multiple heat release holes, and each heat release hole runs through entire wiring board ontology, each heat release hole and throughhole portions
It is overlapped, heat dissipating silicone grease is filled in heat release hole.
As an improvement of the above technical solution, the substrate is aluminum substrate.
As an improvement of the above technical solution, the cross section of the through-hole is rectangular.
The beneficial effects of the utility model have:
The utility model optimizes double-sided wiring board structure, the structure composition after optimization are as follows: Pi heat-conducting double-sided copper
Foil, heat-conducting glue, substrate layer have imported one layer of Pi heat-conducting glue layer, directly instead of original epoxy resin series glue-line, because of Pi
Heat-conducting glue layer is relatively thin, reduces the thickness of plate, and Pi heat-conducting glue layer has higher heat conductivity and preferable insulating properties, improves
The heat dissipation of double-sided wiring board is additionally provided with through entire wiring board simultaneously because substrate is provided with the through-hole through front and back sides
Heat release hole has the heat dissipating silicone grease of conduction heat in heat release hole, and heat release hole conducts heat to through-hole and heat is discharged, so that whole
The heat dissipation performance of a wiring board greatly improves.
Detailed description of the invention
With reference to the accompanying drawing and specific embodiment the utility model is described in further detail, in which:
Fig. 1 is the structure sectional view of the utility model embodiment.
Specific embodiment
Referring to Fig. 1, a kind of double-sided wiring board of perfect heat-dissipating, it is characterised in that: described including wiring board ontology 1
Wiring board ontology 1 is made of Pi heat-conducting double-sided copper foil 2, heat-conducting glue 3 and substrate 4, and it is thermally conductive double that the heat-conducting glue 3 is bonded in the Pi
Between face copper foil 2 and the substrate 4,2 structure of Pi heat-conducting double-sided copper foil is that pressing Pi is thermally conductive among two monolithic copper foils 5
Glue 6 offers the through-hole 7 through 4 front and back sides of substrate in the substrate 4, further includes multiple heat release holes 8, each heat release hole 8 passes through
Entire wiring board ontology 1 is worn, each heat release hole 8 and through-hole 7 partially overlap, and heat dissipating silicone grease 9 is filled in heat release hole 8.
The substrate 4 is aluminum substrate, and the cross section of the through-hole 7 is rectangular.
The utility model optimizes double-sided wiring board structure, the structure composition after optimization are as follows: Pi heat-conducting double-sided copper foil
2, heat-conducting glue 3, has imported 6 layers of one layer of Pi heat-conducting glue by 4 layers of substrate, directly instead of original epoxy resin series glue-line, because
6 layers of Pi heat-conducting glue are relatively thin, reduce the thickness of plate, and 6 layers of Pi heat-conducting glue have higher heat conductivity and preferable insulating properties,
The heat dissipation of double-sided wiring board is improved, simultaneously because substrate 4 is provided with the through-hole 7 through front and back sides, is additionally provided with through entire line
The heat release hole 8 of road plate, there is the heat dissipating silicone grease 9 of conduction heat in heat release hole 8, and heat release hole 8 conducts heat to through-hole 7 and by heat
Discharge, so that the heat dissipation performance of entire wiring board greatly improves.
The above, the only better embodiment of the utility model, but the utility model is not limited to above-mentioned reality
Example is applied, as long as its technical effect for reaching the utility model with any same or similar means, all should belong to the utility model
Protection scope.
Claims (3)
1. a kind of double-sided wiring board of perfect heat-dissipating, it is characterised in that: including wiring board ontology (1), the wiring board ontology
(1) it is made of Pi heat-conducting double-sided copper foil (2), heat-conducting glue (3) and substrate (4), it is thermally conductive double that the heat-conducting glue (3) is bonded in the Pi
Between face copper foil (2) and the substrate (4), Pi heat-conducting double-sided copper foil (2) structure is pressing among two monolithic copper foils (5)
Pi heat-conducting glue (6), it further includes multiple heat release holes that the substrate (4) is interior, which to offer the through-hole (7) through substrate (4) front and back sides,
(8), each heat release hole (8) runs through entire wiring board ontology (1), and each heat release hole (8) and through-hole (7) partially overlap, heat release hole
(8) heat dissipating silicone grease (9) are filled in.
2. a kind of double-sided wiring board of perfect heat-dissipating according to claim 1, it is characterised in that: the substrate (4) is
Aluminum substrate.
3. a kind of double-sided wiring board of perfect heat-dissipating according to claim 1, it is characterised in that: the through-hole (7)
Cross section is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721828354.0U CN208353691U (en) | 2017-12-22 | 2017-12-22 | A kind of double-sided wiring board of perfect heat-dissipating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721828354.0U CN208353691U (en) | 2017-12-22 | 2017-12-22 | A kind of double-sided wiring board of perfect heat-dissipating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208353691U true CN208353691U (en) | 2019-01-08 |
Family
ID=64873650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721828354.0U Expired - Fee Related CN208353691U (en) | 2017-12-22 | 2017-12-22 | A kind of double-sided wiring board of perfect heat-dissipating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208353691U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949157A (en) * | 2017-12-22 | 2018-04-20 | 珠海快捷中祺电子科技有限公司 | A kind of double-sided wiring board of perfect heat-dissipating |
-
2017
- 2017-12-22 CN CN201721828354.0U patent/CN208353691U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949157A (en) * | 2017-12-22 | 2018-04-20 | 珠海快捷中祺电子科技有限公司 | A kind of double-sided wiring board of perfect heat-dissipating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190108 Termination date: 20201222 |