CN204362488U - Compound fin - Google Patents
Compound fin Download PDFInfo
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- CN204362488U CN204362488U CN201420863312.0U CN201420863312U CN204362488U CN 204362488 U CN204362488 U CN 204362488U CN 201420863312 U CN201420863312 U CN 201420863312U CN 204362488 U CN204362488 U CN 204362488U
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- layer
- fin
- metal fin
- graphite radiating
- compound
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Abstract
The utility model discloses a kind of compound fin.Described compound fin comprises metal fin and graphite radiating layer; Described metal fin or graphite radiating are folded layer by layer to be arranged; Wherein, among described metal fin or graphite radiating layer, one of them is planted and has plural layer or wherein a kind ofly have more layer; Described plural layer or have compared with the metal fin of multilayer or graphite radiating layer parcel non-complex layer or the metal fin of small layers or graphite radiating layer.Compound heat radiating fin structure of the present utility model is simple, very thin thickness, very light in weight, and has excellent heat-conducting effect.
Description
Technical field
The utility model relates to a kind of fin, particularly relates to a kind of compound fin being applied to electronic component.
Background technology
Along with height is integrated and the fast development of high performance electronics, electronic devices and components volume is more and more less, speed and the efficiency requirements of work are more and more higher, accordingly, the caloric value of electronic devices and components is also increasing, metal species heat conduction and heat radiation assembly known has at present been subjected to the restriction of its material and self heat conduction and heat radiation limit, and the heat conduction and heat radiation material of advanced heat conduction and heat radiation technique and excellent performance must be adopted effectively to take away heat, ensures that electronic product effectively works.
In equal backing or fin technology, for accelerating heat-conducting effect, high-thermal conductive metal material is adopted to make.Current fin is many by aluminium alloy, and brass or bronze make sheet material, sheet, splintery etc.If reach the effect of quick heat radiating, must have certain thickness, therefore heavier, this does not meet the lightening integrated growth requirement of electronic product.It is little that graphite has density, good heat conduction effect a little, therefore also someone proposes the fin adopting graphite flake to make, but processing technology is complicated, and graphite flake lacks pliability and ductility, easy breakage, graphite bits easily come off and enter in the middle of electronic devices and components, may cause short circuit or the fault of electronic component.
Need novel compound fin badly to solve the problem.
Utility model content
The utility model proposes to solve above-mentioned each problem, and object is to provide a kind of good heat dissipation effect, and quality is lighter, and heat conduction is compound fin faster.
It is lighter that another object of the present utility model is to provide a kind of quality, and have better flexible compound fin.
To achieve these goals, compound fin of the present utility model, comprises metal fin and graphite radiating layer; Described metal fin or graphite radiating are folded layer by layer to be arranged; Wherein, among described metal fin or graphite radiating layer, one of them is planted and has plural layer or wherein a kind ofly have more layer; Described plural layer or have compared with the metal fin of multilayer or graphite radiating layer parcel non-complex layer or the metal fin of small layers or graphite radiating layer.
Preferably, compound fin of the present utility model comprises double layer of metal fin and one deck graphite radiating layer, the area of described graphite radiating layer be less than described metal fin area and to be arranged between described double layer of metal fin and wrap up by described metal fin.
Preferably, compound fin of the present utility model comprises two-layer graphite radiating layer and layer of metal fin, and described layer of metal fin to be arranged between described two-layer graphite radiating layer and to be wrapped up by described graphite radiating layer.
Preferably, compound fin of the present utility model can comprise the metal fin of plural layer and the graphite radiating layer of plural layer; The metal fin of described plural layer is arranged with spaced superposition of the graphite radiating layer of described plural layer.
Preferably, described metal fin and described graphite radiating layer are bonding by heat-conducting glue.
Preferably, the thickness of described metal fin is 0.015mm ~ 0.3mm, and the thickness of described graphite radiating layer is 0.01mm ~ 0.05mm.
Preferably, described metal fin has matsurface, and the roughness of described matsurface is 3 μm ~ 8 μm.
Preferably, described metal fin is copper film, Copper Foil, copper sheet, aluminium film, aluminium foil or aluminium flake.
Preferably, described metal fin surface arranges thermal radiation coating.
The compound fin that the utility model provides, combine metal fin and graphite heat radiation fin advantage separately, the shortcomings and limitations that it has respectively as fin are evaded, there is very high conductive coefficient, improve the radiating rate of fin, improve the pliability of fin, reduce the thickness of fin, alleviate the quality of same volume fin, be conducive to meeting the lightening integrated demand of electronic product, bring larger space to the mechanism design of electronic product.
Accompanying drawing explanation
Fig. 1 shows the first example structure schematic diagram of compound fin of the present utility model.
Fig. 2 shows the second example structure schematic diagram of compound fin of the present utility model.
Fig. 3 shows the 3rd example structure schematic diagram of compound fin of the present utility model.
Fig. 4 shows the structural representation of the metal fin of compound fin of the present utility model.
Fig. 5 shows another structural representation of the metal fin of compound fin of the present utility model.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Before the technical scheme describing various embodiments of the present invention in detail, involved noun and term are explained.It should be noted that in this manual, the parts that title is identical or label is identical represent similar or identical structure, and are only limitted to the object of signal.
Fig. 1 shows the first example structure schematic diagram of compound fin of the present utility model.As shown in Figure 1, compound fin of the present utility model comprises metal fin 14 and graphite radiating layer 12; Described metal fin 11 or the alternately laminated setting of graphite radiating layer 12; Wherein, among described metal fin 11 or graphite radiating layer 12, one of them is planted and has plural layer or wherein a kind ofly have more layer; Described plural layer or there is metal fin 11 that is that wrap up non-complex layer compared with the metal fin 11 of multilayer or graphite radiating layer 12 or small layers or graphite radiating layer 12.
It should be noted that, the structure of double layer of metal fin 11 and one deck graphite radiating layer 12 compound has been shown in the embodiment in Fig. 1.Those skilled in the art are to be understood that, according to description and the enlightenment of this specification, compound fin of the present utility model also can comprise three-layer metal fin 11 and two-layer graphite radiating layer 12, or three layers of graphite radiating layer 12 and double layer of metal fin 11, that is, metal fin 11 is different with the number of plies of graphite radiating layer, arranging like this can make heat dissipating layer that the number of plies is many or the few heat dissipating layer of the fin parcel number of plies or fin, multiple layer metal fin 11 is such as utilized to wrap up graphite radiating layer, outermostly be set to metal fin 11.Certainly, outside metal fin, thermal radiation coating 14 can be applied with heat radiation speed.
Fig. 2 shows the second example structure schematic diagram of compound fin of the present utility model.As shown in Figure 2, compound fin of the present utility model comprises double layer of metal fin 11 and one deck graphite radiating layer 12, the area of described graphite radiating layer 11 can be set to be less than described metal fin 11 area and to be arranged between described double layer of metal fin 11 and wrap up by described metal fin 11.As shown in Figure 2, heat-conducting glue 15 is set between metal fin 11 and graphite radiating layer 12 and around graphite radiating layer, makes described metal fin 11 comprise described graphite radiating layer 12 bonding.Thermal radiation coating 14 is set on the surface of described metal fin, with heat radiation speed.Compound fin of the present utility model, metal fin 11 is adopted to wrap up the structure of graphite radiating layer, on the one hand, metal fin 11 has good ductility and pliability, can accomplish as far as possible lightening, on the other hand, graphite radiating layer has excellent heat conduction and heat radiation performance, and the little quality of density is light, and wrap up by metal fin 11, can cause graphite consider to be worth doing come off, therefore compound fin of the present utility model can improve radiating rate, and alleviate heat sink mass, reduce fin thickness.
Fig. 3 shows the 3rd example structure schematic diagram of compound fin of the present utility model.Compound fin of the present utility model can also be set to comprise two-layer graphite radiating layer 12 and layer of metal fin 11, and described layer of metal fin 11 is arranged between described two-layer graphite radiating layer 12.As shown in Figure 2, the area of described graphite radiating layer 12 is slightly less than the area of described metal fin 11.At the outer surface of described graphite radiating layer 12 and periphery, thermal radiation coating 14 is set, to wrap up described graphite radiating layer 12.Compound fin of the present utility model utilizes the structure of double-layer graphite heat dissipating layer 12, because graphite radiating layer has excellent bright heat-conductive characteristic, adopt double-layer graphite radiator structure, heat conduction and radiating effect better, faster, on the other hand, described graphite radiating layer 12 is attached on described metal fin 11, improvement graphite radiating layer mechanical structure can be made to lack flexible shortcoming, fin can be made to have certain ductility and pliability.
In addition, it should be noted that, compound fin of the present utility model can also comprise the metal fin 11 of plural layer and the graphite radiating layer 12 of plural layer; The metal fin 11 of described plural layer alternately superposes setting with the graphite radiating layer 12 of described plural layer.
As shown in Figure 3, the described metal fin 11 of compound fin of the present utility model is bonding by heat-conducting glue with described graphite radiating layer 12.In addition, in order to take into account pliability and the radiating effect of fin, preferably, the thickness of described metal fin can be set to 0.015mm ~ 0.3mm, and the thickness of described graphite radiating layer is 0.01mm ~ 0.05mm.
Fig. 4 and Fig. 5 shows the surface texture of metal fin 11 of the present utility model.As shown in Figure 4 and Figure 5, the surface of described metal fin 11 of the present utility model has matsurface, and the roughness of described matsurface is 3 μm ~ 8 μm, and described matsurface can be arranged on the single or double of described metal fin 11.The surface of described metal fin is set to matsurface 111, can increase area of dissipation thus improves radiating effect or face the heat-conducting effect of junction with other heat dissipating layers.In addition, described metal fin is copper film, Copper Foil, copper sheet, aluminium film, aluminium foil or aluminium flake.As shown in Fig. 1, Fig. 2 and Fig. 3, the surface of described metal fin can arrange thermal radiation coating.
The compound fin that the utility model provides, combine metal fin and graphite heat radiation fin advantage separately, the shortcomings and limitations that it has respectively as fin are evaded, there is very high conductive coefficient, improve the radiating rate of fin, improve the pliability of fin, reduce the thickness of fin, alleviate the quality of same volume fin, be conducive to meeting the lightening integrated demand of electronic product, bring larger space to the mechanism design of electronic product.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; and be not used in restriction protection range of the present utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (9)
1. a compound fin, comprises metal fin and graphite radiating layer; It is characterized in that, described metal fin or the alternately laminated setting of graphite radiating layer; Wherein, among described metal fin or graphite radiating layer, one of them is planted and has plural layer or wherein a kind ofly have more layer; Described plural layer or have compared with the metal fin of multilayer or graphite radiating layer parcel non-complex layer or the metal fin of small layers or graphite radiating layer.
2. compound fin according to claim 1, it is characterized in that, comprise double layer of metal fin and one deck graphite radiating layer, the area of described graphite radiating layer be less than described metal fin area and to be arranged between described double layer of metal fin and wrap up by described metal fin.
3. compound fin according to claim 1, is characterized in that, comprises two-layer graphite radiating layer and layer of metal fin, and described layer of metal fin to be arranged between described two-layer graphite radiating layer and to be wrapped up by described graphite radiating layer.
4. compound fin according to claim 1, is characterized in that, comprises the metal fin of plural layer and the graphite radiating layer of plural layer; The metal fin of described plural layer is arranged with spaced superposition of the graphite radiating layer of described plural layer.
5. the compound fin according to any one of Claims 1 to 4 claim, is characterized in that, it is bonding that described metal fin and described graphite radiating layer pass through heat-conducting glue.
6. the compound fin according to any one of Claims 1 to 4 claim, is characterized in that, the thickness of described metal fin is 0.015mm ~ 0.3mm, and the thickness of described graphite radiating layer is 0.01mm ~ 0.05mm.
7. the compound fin according to any one of Claims 1 to 4 claim, is characterized in that, described metal fin has matsurface, and the roughness of described matsurface is 3 μm ~ 8 μm.
8. the compound fin according to any one of Claims 1 to 4 claim, is characterized in that, described metal fin is copper film, Copper Foil, copper sheet, aluminium film, aluminium foil or aluminium flake.
9. the compound fin according to any one of Claims 1 to 4 claim, is characterized in that, the surface of described metal fin arranges thermal radiation coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420863312.0U CN204362488U (en) | 2014-12-31 | 2014-12-31 | Compound fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420863312.0U CN204362488U (en) | 2014-12-31 | 2014-12-31 | Compound fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204362488U true CN204362488U (en) | 2015-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420863312.0U Expired - Fee Related CN204362488U (en) | 2014-12-31 | 2014-12-31 | Compound fin |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105415789A (en) * | 2015-10-16 | 2016-03-23 | 奇华光电（昆山）股份有限公司 | Artificial graphite/aluminum complex heat sink and preparation method thereof |
| CN105611719A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Printed circuit board (PCB) structure with high heat conduction and dissipation |
| CN106364013A (en) * | 2016-08-30 | 2017-02-01 | 苏州格优碳素新材料有限公司 | Heat conduction and heat insulating material and preparation method and application thereof |
| WO2017045232A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电（昆山）股份有限公司 | Natural graphite/aluminum composite heat sink |
| WO2017045233A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电（昆山）股份有限公司 | Natural graphite/copper composite heatsink |
| CN109548388A (en) * | 2019-01-02 | 2019-03-29 | 苏州沛德导热材料有限公司 | A kind of bound edge graphite flake |
| CN111432595A (en) * | 2019-01-09 | 2020-07-17 | 可成科技股份有限公司 | Heat dissipation structure and manufacturing method thereof |
-
2014
- 2014-12-31 CN CN201420863312.0U patent/CN204362488U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017045232A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电（昆山）股份有限公司 | Natural graphite/aluminum composite heat sink |
| WO2017045233A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电（昆山）股份有限公司 | Natural graphite/copper composite heatsink |
| CN105415789A (en) * | 2015-10-16 | 2016-03-23 | 奇华光电（昆山）股份有限公司 | Artificial graphite/aluminum complex heat sink and preparation method thereof |
| CN105611719A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Printed circuit board (PCB) structure with high heat conduction and dissipation |
| CN106364013A (en) * | 2016-08-30 | 2017-02-01 | 苏州格优碳素新材料有限公司 | Heat conduction and heat insulating material and preparation method and application thereof |
| CN109548388A (en) * | 2019-01-02 | 2019-03-29 | 苏州沛德导热材料有限公司 | A kind of bound edge graphite flake |
| CN111432595A (en) * | 2019-01-09 | 2020-07-17 | 可成科技股份有限公司 | Heat dissipation structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 Termination date: 20211231 |