CN212519793U - A kind of PCB board heat dissipation device used in electronics - Google Patents
A kind of PCB board heat dissipation device used in electronics Download PDFInfo
- Publication number
- CN212519793U CN212519793U CN202021260670.4U CN202021260670U CN212519793U CN 212519793 U CN212519793 U CN 212519793U CN 202021260670 U CN202021260670 U CN 202021260670U CN 212519793 U CN212519793 U CN 212519793U
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- heat dissipation
- heat
- cover plate
- spacing
- pcb
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 54
- 238000009434 installation Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004321 preservation Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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Abstract
本实用新型属于印制电路板技术领域，尤其为一种应用于电子的PCB板散热装置，包括第一散热盖板，所述第一散热盖板的下方设有第二散热盖板，所述第一散热盖板与第二散热盖板之间安装有PCB基板。通过设置第一散热盖板和第二散热盖板，一方面能够通过第一散热盖板和第二散热盖板表面预留的第一限位孔和第三限位孔使用螺钉进行连接安装，具有结构简单安装方便的特点，同时通过设置第一散热片和第二散热片能够最大限度的对印制电路板原件所生产的热进行散出，降低印制电路板表面的温度，对印制电路板起到保温防护的作用，另一方面，通过设置排风散热扇和热管散热器能够对能够用于将第一散热片和第二散热片表面传导出的热量进行进一步的排出散热处理。
The utility model belongs to the technical field of printed circuit boards, in particular to a heat dissipation device for a PCB board applied to electronics, comprising a first heat dissipation cover plate, a second heat dissipation cover plate is arranged below the first heat dissipation cover plate, and the A PCB substrate is installed between the first heat dissipation cover plate and the second heat dissipation cover plate. By arranging the first heat dissipation cover plate and the second heat dissipation cover plate, on the one hand, the first limit hole and the third limit hole reserved on the surfaces of the first heat dissipation cover plate and the second heat dissipation cover plate can be used for connection and installation using screws. It has the characteristics of simple structure and convenient installation. At the same time, by setting the first heat sink and the second heat sink, the heat produced by the original printed circuit board can be dissipated to the maximum extent, and the temperature of the surface of the printed circuit board can be reduced, and the printed circuit board can be greatly reduced. The circuit board plays the role of heat preservation and protection. On the other hand, by arranging an exhaust fan and a heat pipe radiator, the heat that can be used to conduct the surface of the first heat sink and the second heat sink can be further discharged and dissipated.
Description
Technical Field
The utility model belongs to the technical field of the printed circuit board, concretely relates to be applied to PCB board heat abstractor of electron.
Background
The printed circuit board is represented by 'PCB', and the printed circuit board, also called printed circuit board, is a provider for electrical connection of electronic components, and the development of the printed circuit board has been over 100 years; the design of the method is mainly layout design; the main advantages of using circuit boards are that wiring and assembly errors are greatly reduced, automation level and production labor rate are improved, single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multilayer circuit boards can be divided according to the number of layers of the circuit boards, and because the printed circuit boards are not general terminal products, the definitions of names are slightly disordered, for example: the motherboard for a personal computer, called motherboard, cannot be directly called circuit board, although the existence of the circuit board exists in the motherboard, but it is not the same, so the two aspects cannot be said to be the same when evaluating the industry, and for example: because of the integrated circuit components mounted on the circuit board, the news media is called an IC board, but it is not substantially identical to a printed circuit board, which is generally referred to as a bare board, i.e., a circuit board without components.
The use of printed circuit board can significantly reduce the mistake of wiring and assembly, improves automatic level and production labor rate, but, current printed circuit board can produce a large amount of heats through the printed circuit board original paper in carrying out the use, if untimely carries out the heat dissipation treatment to printed circuit board, will greatly reduced printed circuit board's operating efficiency, the temperature lasts too high will directly influence printed circuit board's life.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a be applied to PCB board heat abstractor of electron has solved the lower problem of current printed circuit board radiating efficiency.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a be applied to PCB board heat abstractor of electron, includes first heat dissipation apron, the below of first heat dissipation apron is equipped with second heat dissipation apron, install the PCB base plate between first heat dissipation apron and the second heat dissipation apron, the one end of first heat dissipation apron is equipped with heat pipe radiator, one side of heat pipe radiator is equipped with first spacing hole, the bottom of second heat dissipation apron is equipped with the second fin, the one end of second heat dissipation apron is equipped with spacing installation piece, one side of spacing installation piece is equipped with the spacing hole of third, the surface of PCB base plate is equipped with heating element, one side of heating element is equipped with the direction spout.
Preferably, the top of the first heat dissipation cover plate is provided with a first heat dissipation fin, and the surface of the first heat dissipation fin is embedded with an exhaust heat dissipation fan.
Preferably, the inner wall of the second heat dissipation cover plate is uniformly provided with a limiting mounting plate, and the surface of the limiting mounting plate is provided with a second limiting hole.
Preferably, the inner wall of direction spout is equipped with spacing spout, one side slidable mounting of spacing spout has the direction slider, the top threaded connection of direction slider has spacing bolt, the bottom of direction spout inner wall is equipped with the spacing hole of fourth.
Preferably, the second limiting hole and the fourth limiting hole are matched with each other in a structure size and position completely, and the first limiting hole and the third limiting hole are matched with each other in a structure size and position completely.
Preferably, the first radiating fin and the second radiating fin have the same structure.
Compared with the prior art, the beneficial effects of the utility model are that:
through setting up first heat-radiating cover plate and second heat-radiating cover plate, can use the screw to connect the installation through first spacing hole and the spacing hole of third that first heat-radiating cover plate and second heat-radiating cover plate surface were reserved on the one hand, simple structure simple to operate's characteristics have, simultaneously can furthest through setting up first fin and second fin carry out the effluvium to the produced heat of printed circuit board original paper, reduce the temperature on printed circuit board surface, play the effect of heat preservation protection to printed circuit board, on the other hand, can carry out further discharge heat dissipation through setting up heat dissipation fan of airing exhaust and heat pipe radiator and can be used for carrying out the heat that first fin and second fin surface were derived and handle, make printed circuit board's operating temperature can more effluvium.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a three-dimensional structure of the present invention;
FIG. 2 is a sectional view of the three-dimensional structure of the present invention;
fig. 3 is a three-dimensional structure diagram of a first heat dissipation cover plate of the present invention;
fig. 4 is a three-dimensional structure diagram of a second heat dissipation cover plate of the present invention;
FIG. 5 is a three-dimensional structure diagram of the PCB substrate of the present invention;
fig. 6 is a partial enlarged view of a portion a in fig. 5 according to the present invention.
In the figure: 1, a first radiating cover plate; 2 a second heat dissipation cover plate; 3 a first heat sink; 4, an air exhaust heat dissipation fan; 5, a heat pipe radiator; 6 a fourth limiting hole; 7 a first limiting hole; 8 a second heat sink; 9, limiting the mounting plate; 10 a second limiting hole; 11, limiting and mounting a block; 12 a third limiting hole; 13 a PCB substrate; 14 a heating element; 15 a guide chute; 16 limiting sliding chutes; 17 guiding the sliding block; the bolt is retained at 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides the following technical solutions: a PCB heat dissipating double-fuselage applied to electron, including the first heat-radiating cover plate 1, the lower side of the first heat-radiating cover plate 1 has the second heat-radiating cover plate 2, install the PCB base plate 13 between first heat-radiating cover plate 1 and the second heat-radiating cover plate 2, one end of the first heat-radiating cover plate 1 has heat pipe radiators 5, can further discharge the heat that can be used for transmitting the surface of the first air-cooling fin 3 and second air-cooling fin 8 to carry on the heat dissipation treatment through setting up the heat pipe radiator 5, make the operating temperature of the printed-circuit board can be more dispersed, one side of the heat pipe radiator 5 has the first spacing hole 7, the bottom of the second heat-radiating cover plate 2 has the second air-cooling fin 8, can furthest discharge the heat produced to the original paper of the printed-circuit board through setting up the second air-cooling fin 8, reduce the temperature on the surface of the printed-circuit board, play, one end of the second heat dissipation cover plate 2 is provided with a limiting installation block 11, one side of the limiting installation block 11 is provided with a third limiting hole 12, the surface of the PCB substrate 13 is provided with a heating element 14, and one side of the heating element 14 is provided with a guide sliding groove 15.
Specifically, the top of first heat dissipation apron 1 is equipped with first fin 3, and the surface mosaic of first fin 3 installs heat dissipation fan 4 of airing exhaust, and heat produced to the printed circuit board original paper that can furthest is dispelled through setting up first fin 3, reduces the temperature on printed circuit board surface, plays the effect of heat preservation protection to printed circuit board.
Specifically, the inner wall of second heat dissipation apron 2 evenly is equipped with spacing mounting panel 9, and the surface of spacing mounting panel 9 is equipped with the spacing hole 10 of second, can be used for cooperating the installation with PCB base plate 13 through setting up spacing mounting panel 9.
Specifically, the inner wall of guide chute 15 is equipped with spacing spout 16, and one side slidable mounting of spacing spout 16 has guide slider 17, and guide slider 17's top threaded connection has spacing bolt 18, and the bottom of guide chute 15 inner wall is equipped with spacing hole 6 of fourth, can more conveniently install PCB base plate 13 through adopting guide slider 17 and spacing bolt 18 matched with mode.
Specifically, the structure size and the position between the second limit hole 10 and the fourth limit hole 6 are matched in a completely corresponding manner, the structure size and the position between the first limit hole 7 and the third limit hole 12 are matched in a completely corresponding manner, and by arranging the first heat dissipation cover plate 1 and the second heat dissipation cover plate 2, on one hand, the first limit hole 7 and the third limit hole 12 reserved on the surfaces of the first heat dissipation cover plate 1 and the second heat dissipation cover plate 2 can be connected and installed through screws, and the structure is simple and convenient to install.
Specifically, the first heat sink 3 and the second heat sink 8 have the same structure.
The utility model discloses a theory of operation and use flow: the utility model discloses when using, can use the screw to connect the installation through first spacing hole 7 and the spacing hole 12 of third that first heat dissipation apron 1 and 2 surface reservations of second heat dissipation apron, simultaneously through setting up first fin 3 and the produced heat of second fin 8 can furthest to the printed circuit board original paper and go out, reduce the temperature on printed circuit board surface, play the effect of heat preservation protection to printed circuit board, can further discharge heat dissipation processing to the heat that can be used for leading first fin 3 and the 8 surface conduction of second fin through setting up heat dissipation fan 4 of airing exhaust and heat pipe radiator 5, make the operating temperature of printed circuit board can be more effluvium.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a be applied to PCB board heat abstractor of electron, includes first heat dissipation apron (1), its characterized in that: the utility model discloses a PCB heat dissipation structure, including first heat dissipation apron (1), second heat dissipation apron (2), PCB base plate (13) is installed to the below of first heat dissipation apron (1), the one end of first heat dissipation apron (1) is equipped with heat pipe radiator (5), one side of heat pipe radiator (5) is equipped with first spacing hole (7), the bottom of second heat dissipation apron (2) is equipped with second fin (8), the one end of second heat dissipation apron (2) is equipped with spacing installation piece (11), one side of spacing installation piece (11) is equipped with spacing hole of third (12), the surface of PCB base plate (13) is equipped with heating element (14), one side of heating element (14) is equipped with direction spout (15).
2. The PCB heat sink applied to electronics according to claim 1, wherein: the top of the first radiating cover plate (1) is provided with a first radiating fin (3), and the surface of the first radiating fin (3) is embedded with an exhaust radiating fan (4).
3. The PCB heat sink applied to electronics according to claim 1, wherein: the inner wall of second heat dissipation apron (2) evenly is equipped with spacing mounting panel (9), the surface of spacing mounting panel (9) is equipped with spacing hole of second (10).
4. The PCB heat sink applied to electronics according to claim 1, wherein: the inner wall of direction spout (15) is equipped with spacing spout (16), one side slidable mounting of spacing spout (16) has direction slider (17), the top threaded connection of direction slider (17) has spacing bolt (18), the bottom of direction spout (15) inner wall is equipped with spacing hole of fourth (6).
5. The PCB heat sink applied to electronics according to claim 3, wherein: the structure size and the position of the second limiting hole (10) and the fourth limiting hole (6) are completely matched correspondingly, and the structure size and the position of the first limiting hole (7) and the third limiting hole (12) are completely matched correspondingly.
6. The PCB board heat sink applied to electronics as claimed in claim 2, wherein: the first radiating fin (3) and the second radiating fin (8) have the same structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021260670.4U CN212519793U (en) | 2020-06-30 | 2020-06-30 | A kind of PCB board heat dissipation device used in electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021260670.4U CN212519793U (en) | 2020-06-30 | 2020-06-30 | A kind of PCB board heat dissipation device used in electronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212519793U true CN212519793U (en) | 2021-02-09 |
Family
ID=74432760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021260670.4U Expired - Fee Related CN212519793U (en) | 2020-06-30 | 2020-06-30 | A kind of PCB board heat dissipation device used in electronics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212519793U (en) |
-
2020
- 2020-06-30 CN CN202021260670.4U patent/CN212519793U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210209 Termination date: 20210630 |