CN212305751U

CN212305751U - High-efficient radiating multilayer circuit board

Info

Publication number: CN212305751U
Application number: CN202020689392.8U
Authority: CN
Inventors: 龙光泽
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2021-01-05
Anticipated expiration: 2030-04-29

Abstract

The utility model provides a high-efficient radiating multilayer circuit board, including lower plywood, lower plywood upper end is equipped with first semicoagulation piece, first semicoagulation piece upper end is equipped with first ceramic heat-conducting plate, core plywood, second ceramic heat-conducting plate, core plywood middle part upside is equipped with the groove of stepping down, it is fixed with heat abstractor to step down the inslot, core plywood upper end is equipped with first circuit layer, the welding has the chip on the first circuit layer, the chip is located under the heat abstractor. The utility model discloses a multilayer circuit board with the chip bonding in core plate upper end to set up a groove of stepping down that is used for holding heat abstractor, can reduce the holistic volume of circuit board.

Description

High-efficient radiating multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field, concretely relates to high-efficient radiating multilayer circuit board.

Background

Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board. In the circuit board of the prior art, usually, in order to improve the heat dissipation performance of the circuit board, a small fan needs to be added around the chip, however, the volume of the whole circuit board is easily larger due to the larger volume of the small fan, which is not favorable for the development trend of light and thin circuit boards.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a high-efficient radiating multilayer circuit board welds the chip in core layer board upper end to set up a groove of stepping down that is used for holding heat abstractor, can reduce the holistic volume of circuit board.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a high-efficient radiating multilayer circuit board, includes the bottom plate, the bottom plate upper end is equipped with first prepreg, first prepreg upper end is equipped with first ceramic heat-conducting plate, core layer board, second ceramic heat-conducting plate, first ceramic heat-conducting plate upper end and a core layer board edge upside is equipped with the second prepreg, second prepreg upper end is equipped with first upper plate, second ceramic heat-conducting plate upper end and a core layer board opposite edge upside is equipped with the third prepreg, third prepreg upper end is equipped with the second upper plate, core layer board middle part upside is equipped with the groove of stepping down, it is fixed with heat abstractor to step down the inslot, core layer board upper end is equipped with first circuit layer, the welding has the chip on the first circuit layer, the chip is located under the heat abstractor.

Specifically, a second circuit layer is arranged at the upper end of the first upper plate, and a first metallization hole is connected between the second circuit layer and the first circuit layer.

Specifically, a third circuit layer is arranged at the upper end of the second upper plate, and a second metalized hole is connected between the third circuit layer and the first circuit layer.

Specifically, the lower floor plate lower extreme is equipped with the fourth circuit layer, the fourth circuit layer with be connected with the third metallization hole between the first circuit layer.

Specifically, two ends of the heat dissipation device are respectively fixedly connected with the first upper plate and the second upper plate through bolts.

Specifically, the heat dissipation device is a small fan.

Specifically, the first circuit layer is further connected with a female socket, and the lower end of the heat dissipation device is connected with a plug-in connector matched with the female socket.

The utility model has the advantages that:

firstly, the multilayer circuit board of the utility model welds the chip on the upper end of the core layer board, and the upper end of the core layer board is provided with the abdicating groove for accommodating the heat dissipation device, thus reducing the whole volume of the circuit board and being beneficial to the development trend of lightness and thinness of the circuit board;

the second, increased first ceramic heat-conducting plate, second ceramic heat-conducting plate in core plywood both sides, first ceramic heat-conducting plate, second ceramic heat-conducting plate have excellent heat conductivility, can derive the heat that the core plywood produced from both sides fast to shorten the width of core plywood, reduced the material cost of core plywood.

Drawings

Fig. 1 is a schematic structural diagram of a high-efficiency heat-dissipating multilayer circuit board of the present invention.

The reference signs are: the heat dissipation device comprises a lower plate 1, a first semi-cured sheet 2, a first ceramic heat conduction plate 3, a core plate 4, a second ceramic heat conduction plate 5, a second prepreg 6, a first upper plate 7, a third prepreg 8, a second upper plate 9, a relief groove 10, a heat dissipation device 11, a first circuit layer 12, a chip 13, a second circuit layer 14, a first metalized hole 15, a third circuit layer 16, a second metalized hole 17, a fourth circuit layer 18, a third metalized hole 19, a female socket 20 and a plug joint 21.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

Referring to FIG. 1:

a high-efficiency heat-dissipation multilayer circuit board comprises a lower board 1, wherein a first semi-cured sheet 2 is arranged at the upper end of the lower board 1, a first ceramic heat-conducting plate 3, a core board 4 and a second ceramic heat-conducting plate 5 are arranged at the upper end of the first semi-cured sheet 2, the first ceramic heat-conducting plate 3 and the second ceramic heat-conducting plate 5 have excellent heat-conducting performance, heat generated by the core board 4 can be quickly led out from two sides, the width of the core board 4 is shortened, the material cost of the core board 4 is reduced, a second prepreg 6 is arranged at the upper end of the first ceramic heat-conducting plate 3 and at the upper side of one edge of the core board 4, a first upper board 7 is arranged at the upper end of the second prepreg 6, a third prepreg 8 is arranged at the upper end of the second ceramic heat-conducting plate 5 and at the upper side of the other edge of the core board 4, a second upper board 9 is arranged at the upper, the heat dissipation device 11 is fixed in the yielding groove 10, the first circuit layer 12 is arranged at the upper end of the core layer plate 4, the chip 13 is welded on the first circuit layer 12, the chip 13 is located under the heat dissipation device 11, the heat dissipation effect of the heat dissipation device 11 is utilized, heat generated by the chip 13 can be rapidly led out, the heat dissipation device 11 is arranged on the inner side of the yielding groove 10, the overall size of the multilayer circuit board can be effectively reduced, and the light and thin development trend of the circuit board is facilitated.

Preferably, the second circuit layer 14 is arranged at the upper end of the first upper plate 7, the first metalized hole 15 is connected between the second circuit layer 14 and the first circuit layer 12, and a copper film is plated on the inner wall of the first metalized hole 15, so that bridge electric connection between the second circuit layer 14 and the first circuit layer 12 can be realized.

Preferably, a third circuit layer 16 is arranged at the upper end of the second upper plate 9, a second metalized hole 17 is connected between the third circuit layer 16 and the first circuit layer 12, and a copper film is plated on the inner wall of the second metalized hole 17, so that bridge electric connection between the third circuit layer 16 and the first circuit layer 12 can be realized.

Preferably, the lower end of the lower plate 1 is provided with a fourth circuit layer 18, a third metallized hole 19 is connected between the fourth circuit layer 18 and the first circuit layer 12, and a copper film is plated on the inner wall of the third metallized hole 19, so that bridge electrical connection between the fourth circuit layer 18 and the first circuit layer 12 can be realized.

Preferably, two ends of the heat sink 11 are fixedly connected with the first upper plate 7 and the second upper plate 9 through bolts.

Preferably, the heat sink 11 is a small fan.

Preferably, the first circuit layer 12 is further connected to an insertion female socket 20, and the lower end of the heat sink 11 is connected to an insertion plug 21 matched with the insertion female socket 20.

The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The high-efficiency heat-dissipation multilayer circuit board is characterized by comprising a lower board (1), wherein a first prepreg (2) is arranged at the upper end of the lower board (1), a first ceramic heat-conducting plate (3), a core board (4) and a second ceramic heat-conducting plate (5) are arranged at the upper end of the first prepreg (2), a second prepreg (6) is arranged at the upper end of the first ceramic heat-conducting plate (3) and at the upside of one edge of the core board (4), a first upper board (7) is arranged at the upper end of the second prepreg (6), a third prepreg (8) is arranged at the upper end of the second ceramic heat-conducting plate (5) and at the upside of the other edge of the core board (4), a second upper board (9) is arranged at the upper end of the third prepreg (8), a yielding groove (10) is arranged at the upside of the middle part of the core board (4), and a heat-dissipation device (11) is fixed in the yielding groove, the heat dissipation device is characterized in that a first circuit layer (12) is arranged at the upper end of the core plate (4), a chip (13) is welded on the first circuit layer (12), and the chip (13) is located under the heat dissipation device (11).

2. An efficient heat dissipation multilayer circuit board as claimed in claim 1, characterized in that a second circuit layer (14) is arranged on the upper end of the first upper board (7), and a first metallized hole (15) is connected between the second circuit layer (14) and the first circuit layer (12).

3. An efficient heat-dissipation multilayer circuit board as claimed in claim 1, wherein a third circuit layer (16) is arranged at the upper end of the second upper board (9), and a second metalized hole (17) is connected between the third circuit layer (16) and the first circuit layer (12).

4. A high-efficiency heat-dissipation multilayer circuit board as claimed in claim 1, wherein a fourth circuit layer (18) is arranged at the lower end of the lower plate (1), and a third metallized hole (19) is connected between the fourth circuit layer (18) and the first circuit layer (12).

5. The multilayer circuit board with high heat dissipation efficiency as recited in claim 1, wherein two ends of the heat dissipation device (11) are fixedly connected with the first upper plate (7) and the second upper plate (9) through bolts respectively.

6. A heat efficient multi-layer circuit board according to claim 1, characterized in that the heat sink (11) is a small fan.

7. The multilayer circuit board with efficient heat dissipation according to claim 1, wherein the first circuit layer (12) is further connected with a female socket (20), and the lower end of the heat dissipation device (11) is connected with a plug (21) matched with the female socket (20).