CN216414660U - Multilayer circuit board with water-cooling heat dissipation function - Google Patents
Multilayer circuit board with water-cooling heat dissipation function Download PDFInfo
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- CN216414660U CN216414660U CN202122827669.6U CN202122827669U CN216414660U CN 216414660 U CN216414660 U CN 216414660U CN 202122827669 U CN202122827669 U CN 202122827669U CN 216414660 U CN216414660 U CN 216414660U
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- water
- conducting plate
- heat
- circuit board
- heat conducting
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 238000001816 cooling Methods 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000000903 blocking effect Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 31
- 238000009413 insulation Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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Abstract
The utility model provides a water-cooling heat dissipation multilayer circuit board which comprises a first circuit layer, a first substrate, an intermediate insulating layer, a second substrate and a second circuit layer which are sequentially stacked from top to bottom, wherein a chip is arranged on the upper side of the first circuit layer, an avoiding groove is formed in the lower end of the first substrate and is located right below the chip, a first heat conducting plate and a second heat conducting plate are arranged in the intermediate insulating layer, a plurality of heat conducting fins are arranged at the upper end of the first heat conducting plate and the lower end of the second heat conducting plate respectively, a circulating water pipe is arranged between the first heat conducting plate and the second heat conducting plate, two ends of the circulating water pipe are respectively connected with a water inlet interface and a water outlet interface, and the water inlet interface and the water outlet interface are located on the same side of the intermediate insulating layer. The multilayer circuit board adopts the mode that the heat conducting plate and the circulating water pipe are matched for heat dissipation, improves the heat dissipation efficiency of the chip, and has simple structure and low manufacturing cost.
Description
Technical Field
The utility model relates to the technical field of multilayer circuit boards, in particular to a water-cooling heat dissipation multilayer circuit board.
Background
Printed wiring boards are providers of electrical connections for electronic components. The printed circuit board is developed from a single layer to a double-sided board and a multilayer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine lead, small space, high reliability, multilayering, high-speed transmission, light weight and thin type. In order to solve the problem of heat dissipation of a chip, a fan is generally added on the upper side of the chip in the prior art, however, for a chip with high power consumption, the mode of using the fan has the problem of unsatisfactory heat dissipation effect, and the fan has large noise during operation and has a large defect.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems, the utility model provides the water-cooling heat dissipation multilayer circuit board, which adopts the mode of matching the heat conduction plate and the circulating water pipe for heat dissipation, improves the heat dissipation efficiency of the chip, and has simple structure and low manufacturing cost.
In order to achieve the purpose, the utility model is solved by the following technical scheme:
the utility model provides a water-cooling heat dissipation's multilayer circuit board, includes from the top down first circuit layer, first base plate, intermediate insulation layer, second base plate, second circuit layer that stack gradually, first circuit layer with be connected with electrically conductive hole between the second circuit layer, first circuit layer upside is equipped with the chip, first base plate lower extreme is equipped with and dodges the groove, dodge the trench in under the chip, be equipped with first heat-conducting plate, second heat-conducting plate in the intermediate insulation layer, first heat-conducting plate upper end with second heat-conducting plate lower extreme all is equipped with a plurality of conducting strips, first heat-conducting plate with be equipped with circulating pipe between the second heat-conducting plate, the circulating pipe both ends are connected with water inlet interface, water outlet interface respectively, water inlet interface, water outlet interface are located same one side of intermediate insulation layer.
Specifically, the first heat-conducting plate is fixedly connected with the second heat-conducting plate through a third heat-conducting plate.
Specifically, a plurality of heat conduction holes are formed in the first substrate, and the heat conduction holes are located between the avoiding groove and the chip.
Specifically, a water blocking baffle is further fixed on one side of the middle insulating layer and is located on the lower side of the water outlet interface.
Specifically, the conductive hole is filled with hole plugging resin.
Specifically, the lower end of the second circuit layer is provided with a waterproof film layer.
Specifically, the thickness of the middle insulating layer is larger than 5 mm.
The utility model has the beneficial effects that:
according to the multilayer circuit board, the first heat conducting plate and the second heat conducting plate are arranged below the chip, the plurality of heat conducting fins are arranged at the upper end of the first heat conducting plate and at the lower end of the second heat conducting plate, heat generated during operation of the chip is quickly conducted to the first heat conducting plate and the second heat conducting plate through the heat conducting fins, the circulating water pipe is arranged between the first heat conducting plate and the second heat conducting plate and used for introducing cold water into the circulating water pipe, and the heat on the first heat conducting plate and the heat on the second heat conducting plate are quickly conducted to the outside through the cold water, so that the multilayer circuit board is high in heat dissipation efficiency, simple in structure and low in manufacturing cost.
Drawings
Fig. 1 is a schematic structural diagram of a water-cooling heat dissipation multilayer circuit board according to the present invention.
The reference signs are: the heat-conducting module comprises a first circuit layer 1, a first substrate 2, an intermediate insulating layer 3, a second substrate 4, a second circuit layer 5, a conducting hole 6, a chip 7, an avoiding groove 8, a first heat-conducting plate 9, a second heat-conducting plate 10, a heat-conducting fin 11, a circulating water pipe 12, a water inlet interface 13, a water outlet interface 14, a third heat-conducting plate 15, a heat-conducting hole 16, a water blocking baffle 17, plug hole resin 18 and a waterproof film layer 19.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1:
a water-cooling heat-dissipation multilayer circuit board comprises a first circuit layer 1, a first substrate 2, an intermediate insulation layer 3, a second substrate 4 and a second circuit layer 5 which are sequentially stacked from top to bottom, wherein a conductive hole 6 is connected between the first circuit layer 1 and the second circuit layer 5, a chip 7 is arranged on the upper side of the first circuit layer 1, a avoiding groove 8 is arranged at the lower end of the first substrate 2, the avoiding groove 8 is positioned under the chip 7, a first heat conduction plate 9 and a second heat conduction plate 10 are arranged in the intermediate insulation layer 3, a plurality of heat conduction sheets 11 are respectively arranged at the upper end of the first heat conduction plate 9 and the lower end of the second heat conduction plate 10, a circulating water pipe 12 is arranged between the first heat conduction plate 9 and the second heat conduction plate 10, two ends of the circulating water pipe 12 are respectively connected with a water inlet 13 and a water outlet 14, the water inlet 13 and the water outlet 14 are positioned on the same side of the intermediate insulation layer 3, and the chip 7 with high power consumption can generate a large amount of heat when in work, utilize conducting strip 11 to conduct the heat that chip 7 during operation produced fast to first heat-conducting plate 9 and second heat-conducting plate 10 on to be equipped with circulating pipe 12 between first heat-conducting plate 9 and second heat-conducting plate 10, behind the external cold water of interface 13 department of intaking, cold water circulates in the circulating pipe, the heat on first heat-conducting plate 9 and the second heat-conducting plate 10 is taken away out to the circulation in-process, the external drain pipe discharge on the water rethread water interface 14, thereby realize quick heat transfer function.
Preferably, the first heat-conducting plate 9 and the second heat-conducting plate 10 are fixedly connected through a third heat-conducting plate 15.
Preferably, a plurality of heat conduction holes 16 are formed in the first substrate 2, and the heat conduction holes 16 are located between the avoiding groove 8 and the chip 7.
Preferably, because the external water pipes at the water inlet 13 and the water outlet 14 may leak water, in order to avoid the second circuit layer 5 from being short-circuited due to the water wetting on the second circuit layer 5, a water blocking baffle 17 is further fixed on one side of the intermediate insulating layer 3, and the water blocking baffle 17 is located at the lower side of the water outlet 14.
Preferably, the conductive via 6 is filled with a via resin 18.
Preferably, in order to improve the surface waterproof capability of the second circuit layer 5, the lower end of the second circuit layer 5 is provided with a waterproof membrane layer 19.
Preferably, the thickness of the intermediate insulating layer 3 is greater than 5 mm.
The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. A water-cooling heat dissipation multilayer circuit board comprises a first circuit layer (1), a first substrate (2), an intermediate insulating layer (3), a second substrate (4) and a second circuit layer (5) which are sequentially stacked from top to bottom, wherein a conductive hole (6) is connected between the first circuit layer (1) and the second circuit layer (5), a chip (7) is arranged on the upper side of the first circuit layer (1), the water-cooling heat dissipation multilayer circuit board is characterized in that a avoiding groove (8) is arranged at the lower end of the first substrate (2), the avoiding groove (8) is positioned under the chip (7), a first heat conducting plate (9) and a second heat conducting plate (10) are arranged in the intermediate insulating layer (3), a plurality of heat conducting fins (11) are arranged at the upper end of the first heat conducting plate (9) and the lower end of the second heat conducting plate (10), and a circulating water pipe (12) is arranged between the first heat conducting plate (9) and the second heat conducting plate (10), and the two ends of the circulating water pipe (12) are respectively connected with a water inlet connector (13) and a water outlet connector (14), and the water inlet connector (13) and the water outlet connector (14) are positioned on the same side of the middle insulating layer (3).
2. The water-cooled heat dissipation multilayer circuit board of claim 1, characterized in that the first heat conduction plate (9) and the second heat conduction plate (10) are fixedly connected through a third heat conduction plate (15).
3. The multilayer circuit board for water-cooling heat dissipation according to claim 1, wherein a plurality of heat conduction holes (16) are formed in the first substrate (2), and the heat conduction holes (16) are located between the avoiding groove (8) and the chip (7).
4. The multilayer circuit board for water-cooling heat dissipation according to claim 1, wherein a water blocking baffle (17) is further fixed on one side of the intermediate insulating layer (3), and the water blocking baffle (17) is located at the lower side of the water outlet port (14).
5. The multilayer circuit board for water-cooling heat dissipation according to claim 1, wherein the conductive via (6) is filled with a via resin (18).
6. The water-cooling heat dissipation multilayer circuit board according to claim 1, characterized in that the lower end of the second circuit layer (5) is provided with a waterproof membrane layer (19).
7. A water-cooled heat-radiating multilayer circuit board according to claim 1, characterized in that the thickness of the intermediate insulating layer (3) is more than 5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122827669.6U CN216414660U (en) | 2021-11-18 | 2021-11-18 | Multilayer circuit board with water-cooling heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122827669.6U CN216414660U (en) | 2021-11-18 | 2021-11-18 | Multilayer circuit board with water-cooling heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216414660U true CN216414660U (en) | 2022-04-29 |
Family
ID=81301060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122827669.6U Expired - Fee Related CN216414660U (en) | 2021-11-18 | 2021-11-18 | Multilayer circuit board with water-cooling heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216414660U (en) |
-
2021
- 2021-11-18 CN CN202122827669.6U patent/CN216414660U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220429 |