CN212660370U

CN212660370U - Waterproof structure of circuit board

Info

Publication number: CN212660370U
Application number: CN202021909650.5U
Authority: CN
Inventors: 廖林
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-09-03
Filing date: 2020-09-03
Publication date: 2021-03-05
Anticipated expiration: 2030-09-03

Abstract

The utility model discloses a waterproof construction of circuit board relates to circuit board technical field, and its technical scheme's main points are: the waterproof structure of circuit board, which comprises a plate body, the both sides of plate body are seted up flutedly, the fixed mounting of the inside of recess has the heat conduction piece, the top fixed mounting of heat conduction piece has the layer that absorbs water, the bottom of heat conduction piece is connected with the heat conduction line, the outside of plate body is provided with the water proof membrane, the outside of water proof membrane is provided with the radiating film, can save water through the recess, and the layer that absorbs water simultaneously can absorb water, and then discharges through the heat of heat conduction piece, can carry out the separation to water through the water proof membrane, prevents that water from getting into to the plate body inside, can play the harm to the internal circuit of plate.

Description

Waterproof structure of circuit board

Technical Field

The utility model relates to a circuit board technical field, in particular to waterproof construction of circuit board.

Background

The circuit board is also called a printed circuit board, is an important electronic component, is a support body of an electronic component, and is a carrier for electrical connection of the electronic component. It is called a "printed" circuit board because it is made using electronic printing.

But the waterproof construction of current circuit board when using, can only carry out the separation to water, does not have independent standing groove, and then can't carry out centralized processing to water, causes the inside water treatment effeciency of circuit board slower.

Disclosure of Invention

To the deficiency that prior art exists, the utility model aims to: the waterproof structure of solving current circuit board when using, can only carry out the separation to water, is not provided with independent standing groove, and then can't carry out centralized processing to water, causes the inside water treatment efficiency of circuit board slower.

The technical scheme includes that the waterproof structure of the circuit board comprises a board body, grooves are formed in two sides of the board body, heat conducting blocks are fixedly mounted inside the grooves, water absorbing layers are fixedly mounted at the tops of the heat conducting blocks, and heat conducting wires are connected to the bottoms of the heat conducting blocks.

Through above-mentioned technical scheme, can save water through the recess, the layer that absorbs water simultaneously can absorb water to water, and then discharges through the heat of heat conduction piece.

Preferably, a waterproof film is arranged outside the plate body, and a heat dissipation film is arranged outside the waterproof film.

Through above-mentioned technical scheme, can carry out the separation to water through the water proof membrane, prevent that water from entering into plate body inside, can play the harm to the internal circuit of plate body.

Preferably, a CPU socket is fixedly mounted on the top of the board body, and a CPU is movably connected inside the CPU socket.

Through the technical scheme, the CPU can be installed through the CPU plug room, and then the running work of the circuit is ensured.

Preferably, a chip set is fixedly mounted on the top of the board and on one side of the CPU socket.

Through the technical scheme, the CPU can be connected with the external equipment through the chip set, and the running work of the electric appliance is guaranteed.

Preferably, a plurality of PCL expansion slots are fixedly arranged on the top of the plate body and positioned on one side of the chip set.

Through the technical scheme, almost all functions which can be realized by a computer can be obtained by inserting different expansion cards into the PCL expansion slot.

To sum up the utility model discloses following technological effect has:

can save water through the recess, the layer that absorbs water simultaneously can absorb water to water, and then discharges through the heat of heat conduction piece.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a waterproof structure of a circuit board according to an embodiment;

FIG. 2 is a schematic diagram of a board structure of a waterproof structure of a circuit board according to an embodiment;

FIG. 3 is a schematic view of the internal structure of a board body of the waterproof structure of the circuit board according to the embodiment;

reference numerals: 1. a plate body; 11. a CPU plug-in room; 12. a chipset; 13. a PCL expansion slot; 14. a water-resistant film; 15. a heat dissipating film; 16. a thermally conductive wire; 2. a groove; 21. a heat conducting block; 22. a water-absorbing layer.

Detailed Description

In the embodiment of the method, the first step,

as shown in fig. 1 and 3, the waterproof structure of the circuit board includes a board body 1, grooves 2 are formed in two sides of the board body 1, heat-conducting blocks 21 are fixedly mounted inside the grooves 2, water-absorbing layers 22 are fixedly mounted on the tops of the heat-conducting blocks 21, heat-conducting lines 16 are connected to the bottoms of the heat-conducting blocks 21, waterproof films 14 are arranged outside the board body 1, heat-dissipating films 15 are arranged outside the waterproof films 14, CPU sockets 11 are fixedly mounted on the tops of the board body 1, CPUs are movably connected inside the CPU sockets 11, the tops of the board body 1 are fixedly mounted on one sides of the CPU sockets 11, chip groups 12 are fixedly mounted on the tops of the board body 1, and are fixedly mounted on one sides of the chip groups 12, and are uniformly distributed PCL expansion grooves 13.

With plate body 1 installation and electronic equipment inside, in the process of using, when the circuit board got into water, the waterproof layer can carry out the separation to water, make water be the water droplet state setting, make electrical equipment be in vertical state simultaneously, and make the water droplet get into to inside recess 2, the layer 22 that absorbs water of recess 2 inside can absorb water simultaneously, furthermore, plate body 1 can get into to 16 inside heat-conducting wires at the thermal partly of during operation production, and get into to 21 inside heat-conducting blocks through heat-conducting

wires

16, 21 can evaporate the meeting of absorbing the layer inside simultaneously heat-conducting blocks, and then clear up the water of plate body 1 inside, guarantee going on of plate body 1 operation work.

In this embodiment, recess 2 is provided with a plurality ofly, can be effectual collect the inside water in circuit board two sides, and then guarantee going on of processing work.

In this embodiment, the groove 2 is opposite to the heat dissipation opening, and then the heated water is discharged to the outside through the heat dissipation opening, so as to ensure the cleanness of the plate body 1

To sum up, firstly, the board body 1 is taken out, the CPU is inserted into the CPU insertion chamber 11, the expansion card is inserted into the PCL expansion slot 13, further, the board body 1 is installed inside the electronic device and connected with the external device through the chipset 12, and when the board body is installed, the groove 2 is opposite to the heat dissipation port, when the circuit board enters water during the use of the electrical appliance, the waterproof layer can obstruct the water to enable the water to be arranged in a water drop state, the electrical device is in a vertical state and enable the water to enter the groove 2, meanwhile, the water absorption layer 22 inside the groove 2 can absorb the water, further, a part of heat generated by the board body 1 during the operation can enter the heat conduction line 16 and enter the heat conduction block 21 through the heat conduction line 16, and meanwhile, the heat conduction block 21 can evaporate the water inside the absorption layer, and further, the water inside the board body 1 can be cleaned, the operation of the plate body 1 is ensured, and meanwhile, the heat dissipation film 15 can increase the heat dissipation capacity of the plate body 1 and prolong the service life of the plate body 1.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Claims

1. Waterproof construction of circuit board, including plate body (1), its characterized in that: the improved water-absorbing heat-conducting plate is characterized in that grooves (2) are formed in two sides of the plate body (1), heat-conducting blocks (21) are fixedly mounted inside the grooves (2), a water-absorbing layer (22) is fixedly mounted at the tops of the heat-conducting blocks (21), and heat-conducting wires (16) are connected to the bottoms of the heat-conducting blocks (21).

2. The waterproof structure of a circuit board according to claim 1, characterized in that: the waterproof plate is characterized in that a waterproof film (14) is arranged outside the plate body (1), and a heat dissipation film (15) is arranged outside the waterproof film (14).

3. The waterproof structure of a circuit board according to claim 1, characterized in that: the top of the plate body (1) is fixedly provided with a CPU insertion chamber (11), and the interior of the CPU insertion chamber (11) is movably connected with a CPU.

4. The waterproof structure of a circuit board according to claim 3, characterized in that: and a chip set (12) is fixedly arranged at the top of the plate body (1) and positioned at one side of the CPU plug-in chamber (11).

5. The waterproof structure of a circuit board according to claim 4, characterized in that: the top of the plate body (1) is fixedly provided with a plurality of PCL expansion grooves (13) which are uniformly distributed on one side of the chip group (12).