CN1893061A - Package structure of power power-supply module - Google Patents
Package structure of power power-supply module Download PDFInfo
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- CN1893061A CN1893061A CNA2005100835153A CN200510083515A CN1893061A CN 1893061 A CN1893061 A CN 1893061A CN A2005100835153 A CNA2005100835153 A CN A2005100835153A CN 200510083515 A CN200510083515 A CN 200510083515A CN 1893061 A CN1893061 A CN 1893061A
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- power
- substrate
- lead frame
- supply module
- encapsulating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The packaging structure fabricates control circuit on a circuit board instead of base plate so as to reduce appropriative area of base plate, and save manufacturing cost. In addition, power components are setup in material with high heat transmission. Thus, heat generated from power components are transferred and emitted quickly. The invention raises reliability of power module.
Description
Technical field
The present invention is relevant for a kind of encapsulating structure of power power-supply module, particularly relevant for the encapsulating structure of the power power-supply module of the high heat radiation of a kind of tool, high density feature.
Background technology
Dwindle and the increasingly sophisticated of design of volume be the common trend of each electronic product, so except the dwindling of electronic component volume, how the important topic that maximum elements and lead have become semiconductor packages are set in limited space.Yet under the more and more high encapsulating structure of the density of element and lead, the high density components that drives this encapsulating structure will produce a large amount of heat.Especially for power model, this a large amount of heat can influence the life-span and the running of electronic product.Therefore, the heat dissipation problem that how to solve this high-density packages structure also becomes an important topic.
With reference to Fig. 1, it is the generalized section of known power power-supply module (power module) encapsulating structure.Wherein comprise the tool high-cooling property substrate 100 that utilizes polymeric dielectric layer and metal aluminum foil layer to be constituted, and the circuit (not shown) of this power power-supply module is made in fully on this substrate 100.The power component 110a of power power-supply module, control element 110b and other element 110c all are arranged on the substrate, lead frame (leadframe) 121,122 is arranged above substrate 100 in addition, and the mode of utilizing routing to engage promptly electrically connects each element 110a, 110b, 110c by many leads 111,112,113; Surface lines on lead frame 121,122 and the substrate 100.And with the perfusion sealing or utilize sizing shaped (molding) method to wait element and circuit on the hermetic sealing substrate 100, and the lead frame 121,122 of this power power-supply module and only expose the pin of lead frame.This power power-supply module encapsulating structure has because of it is simple in structure makes easy advantage.But it all is arranged at all element 110a, 110b, 110c and circuit on the substrate 100, and therefore, the current densities of this power power-supply module can't improve, and also thereby need the bigger substrate of an area, causes the also relative raising of its cost.The heat that power component 110a, 110b, 110c in this power power-supply module produced is to reach the substrate 100 outer thermal transpiration elements (heat sink) that connect again via substrate 100, but conduct heat by thermal grease between substrate 100 and the thermal transpiration element, though therefore substrate 100 is a high-cooling property material, still can't have moment and a large amount of good heat transfer functions.
With reference to Fig. 2, it is the generalized section of another known power power-supply module encapsulating structure.The encapsulating structure of power model shown in it is similar to Fig. 1, wherein comprise equally utilize that polymeric dielectric layer and metal aluminum foil layer constituted have whole circuit and a high-cooling property substrate 100, power component 110a, control element 110b and other element 110c are set equally thereon, reaching has lead frame 121,122 above substrate 100, and the mode of utilizing routing to engage forms many leads 111,112,113 and electrically connects each element 110a, 110b, 110c; Surface lines on lead frame 121,122 and the substrate 100.And with perfusion sealing or utilize sizing shaped methods such as (molding) to come element and circuit on the hermetic sealing substrate 100, and the lead frame 121,122 of this power power-supply module and only expose the pin of lead frame.But this power model is connected with a metallic plate 200 with different its lower surface at substrate 100 that are of Fig. 1.This power power-supply module (power module) encapsulating structure has because of it is simple in structure equally makes easy advantage, and has a metallic plate 200, and therefore the high thermal conduction characteristic of metallic plate 200 can provide good moment and a large amount of heat transmission function.But it is arranged at all element 110a, 110b, 110c and circuit on the substrate 100 equally, and therefore, this power power-supply module also has current densities and can't improve, and reaches problems such as cost raising.
With reference to Fig. 3, be the generalized section of another known power power-supply module (power module) encapsulating structure.Wherein comprise the tool high-cooling property substrate 100 that utilizes polymeric dielectric layer and metal aluminum foil layer to be constituted, and this encapsulating structure is different with Fig. 1, Fig. 2.The power component 110a of power power-supply module, control element 110b all utilize direct welding or alternate manner to be arranged on the lead frame 121,122, and this lead frame 121,122 is above substrate 100 and both do not link to each other.And the mode of utilizing routing to engage, promptly by many leads 111,112... electrically connect each element 110a, 110b; Lead frame 121,122 and on surface lines.And with perfusion sealing or utilize sizing shaped methods such as (molding) to come element and circuit on the hermetic sealing substrate 100, and the lead frame 121,122 of this power power-supply module and only expose the pin of lead frame.This power power-supply module (power module) encapsulating structure has because of it is simple in structure makes easy advantage.But therefore this power power-supply module has limited the density and the precision of circuit and encapsulating structure because of lead frame and entire circuit layout formation one.The heat that power component 110a in this power power-supply module is produced is to reach substrate 100 via lead frame through package material, but is conducted heat by thermal grease between substrate 100 and the thermal transpiration element, so thermal conduction effect is not good.
Therefore, how improving the density of encapsulating structure and then saving cost is an important topic, and in the density that improves encapsulating structure simultaneously, how to solve because of high-density packages structure and heat dissipation problem that power component brought also be another important topic.
Summary of the invention
In above-mentioned technical background, the problem that encapsulating structure current densities and radiating efficiency are not good, the present invention discloses and a kind ofly circuit is manufactured on circuit board and is put up the encapsulating structure that a heap Stacked structure and source element have a good heat conductive approach with lead, uses to improve in the known technology because of the encapsulating structure bad institute poor heat radiation that causes and current densities and problem such as can't improve.
The objective of the invention is to circuit is set on the substrate by being substituted on the circuit board (circuit plate), and this circuit sheetpile Stacked is provided with and becomes a heap Stacked structure on the part lead frame, so on substrate, do not have circuit layout or circuit board, admittedly can improve its current densities and reduction encapsulating structure.Therefore, can reduce required substrate area, relative cost also can reduce.
The objective of the invention is to be arranged on power component on the height heat radiation material on the substrate or directly be arranged on the substrate of the high heat dissipation characteristics of a tool, a large amount of heat that produces when making the power component running, can conduct to substrate fast and be dissipated into the external world through this high heat radiation material is arranged, need not through the not good encapsulating material of heat conductivity, its heat conduction efficiency is splendid.Well can bear the high heat that instantaneous large-current passes through to be produced admittedly because of its heat conduction efficiency, avoid therefore high heat can't conduct fast to disperse and cause power power-supply module impaired.
According to above-mentioned purpose, the invention provides the encapsulating structure of the power power-supply module of a tool high density and high heat dissipation characteristics.The substrate that comprises the high heat dissipation characteristics of a tool, this substrate front side is provided with a lead frame.One has the circuit board (circuit plate) of the circuit layout of this power power-supply, is arranged at the part lead frame and forms Yi Dui Stacked structure.And there are several (or only having one) control elements to be arranged on the circuit board, and several power components are arranged on the substrate on the high heat radiation material, for example lead frame or metal derby, or directly be arranged on the substrate of the high heat dissipation characteristics of this tool and form a good heat conduction approach.And several wires is arranged, connect this circuit board and this lead frame, this circuit board and this first element, this first element and this lead frame.Each element, lead frame, circuit board etc. on one sealing hermetic unit substrate, the substrate.
Therefore, by above-mentioned encapsulating structure, be not set directly on the substrate because circuit is arranged on the circuit board, and become Yi Dui Stacked structure with lead frame and substrate, the therefore required substrate area that takies reduces, so can effectively reduce encapsulation volume.And this source element is arranged on the height heat radiation material on high heat-radiating substrate or the substrate, the good heat conduction approach that forms can be effectively and a large amount of heats of being produced when apace source element being worked conduct to the external world or heat abstractor.
Description of drawings
Fig. 1 to Fig. 3 is respectively the generalized section of encapsulating structure of the power resistor of three kinds of known technologies.
Fig. 4 A and Fig. 4 B are the generalized section of encapsulating structure of the power resistor of one embodiment of the invention, and its circuit board and each element all are arranged on the lead frame.
Fig. 5 A to Fig. 5 C is respectively the embodiment of lead frame of the present invention in same plane and Different Plane.
Fig. 7 is the generalized section of encapsulating structure of the power resistor of one embodiment of the invention, and its source element directly is arranged on the front of substrate.
Fig. 8 is the generalized section of encapsulating structure of the power resistor of one embodiment of the invention, and its power component is arranged on the metal derby and is connected with substrate.
Symbol description among the figure:
400 substrates
The 410a power component
The 410b control element
411,412,413,414,415,416 leads
417 glue materials
420 lead frames
The 420a first surface
The 420b second surface
421,422 pins
Position, 423a both sides is at conplane lead frame
The downward-sloping lead frame in position, 423b both sides
Perk on one side direction of position, 423c both sides, the lead frame that opposite side is downward-sloping
424 metal derbies
425 circuit boards
426 sealings
430 metallic plates
Embodiment
Please refer to Fig. 4 A, be the generalized section of the power power-supply module encapsulating structure of one embodiment of the present of invention.This encapsulating structure comprises a substrate 400 with high heat radiation and insulation characterisitic, and this substrate 400 has a positive 400a and corresponding this positive back side 400b.One has the lead frame 420 of a plurality of pins 421,422... (other is not shown in the figures), is connected with the positive 400a of substrate 400 and is arranged on this substrate 400 with its second surface 420b.One circuit board (circuit plate) 425 connects the first surface 420a of lead frame 420 with its two ends and is provided with on it, is arranged on the substrate 400 and form Yi Dui Stacked structure, so can reduce the required substrate area that takies, reduces the volume of encapsulating structure.There are one second element 410b (also can be) and a plurality of first element 410a to be arranged at respectively on the circuit board 425 on the first surface 420a with lead frame 420 in addition, and electrically connect circuit (not shown), lead frame 420 on each element 410b, 410a, the circuit boards 425 by several wires 411,412,413,414,415,416... etc. with the routing juncture for a plurality of at other embodiment.And with each element, lead frame (except the pin), circuit board etc. on a sealing hermetic unit substrate, the substrate.
In the above-mentioned encapsulating structure, all circuit arrangement connect to manufacture in replacing on the circuit board 425 to manufacture on substrate 400 and with lead frame 420 and substrate 400 and form Yi Dui Stacked structure, so can reduce the required substrate area that takies, reduce the volume of encapsulating structure.And the disclosed substrate 400 of the present invention can be the insulation material, for example pottery (ceramic) material; Or comprise metallic composite, also or single face or the two-sided composite material that comprises metal.Moreover the disclosed circuit board material of the present invention also is insulation material, for example epoxides glass fibre material (glass fiberepoxy) or pottery (ceramic) material.
In addition in the present embodiment, respectively with glue material 417, elargol for example is as wire circuit plate 425 and the be formed by connecting Yi Dui Stacked structure of frame 420 with substrate 400.But also can directly connect in other embodiments of the invention with welding manner (solder).
The disclosed first element 410a of the present invention is a power component, is meant the element that can produce high heat when the power power-supply module start.These power components 410a is arranged on the lead frame 420 and forms a good heat conduction approach, can apace thermal conductance to substrate 400 and extraneous heat abstractor be dispelled the heat by lead frame 420.In addition, more can be shown in Fig. 4 B again the back side 400b of substrate 400 metallic plate 430 be set increase radiating efficiencys.As for the second element 410b is control element, accuses the element of system power component action.These control elements 410b is arranged on the circuit board 425, forms lead by the routing mode and electrically connects circuit on the circuit board 425, reaches the action of power controlling element 410a again via lead electric connection power component 410a.
In addition, though lead frame 420 in the disclosed encapsulating structure of present embodiment, its both sides all make progress.Yet, but do not represent conducting wire frame structure of the present invention to only limit to this structure, but can be on same plane or on Different Plane.The following example will disclose the various lead frame framework of the present invention, but not as limit.Knowing this operator can be changed, but still does not take off scope of the present invention.
Shown in Fig. 5 A, this encapsulating structure and the foregoing description (with reference to Fig. 4) are described roughly the same.Institute's difference is in its lead frame 423a at grade, is that a planar structure does not have any perk up or down.Encapsulating structure that can certainly be shown in Fig. 5 B, it is the same with Fig. 4, and lead frame is positioned on the Different Plane, but lead frame all is upturned at the position, both sides unlike lead frame shown in Figure 4, but lead frame 423b has downward-sloping structure at the position, both sides; Or its lead frame 423c is positioned on the Different Plane shown in Fig. 5 C, Yi Bian its position, both sides for to have the structure of being upturned, another side then has downward-sloping knot.In addition, also has other variation but all applicable according to spirit of the present invention.
With reference to Fig. 6 is the generalized section of another embodiment of the present invention, and one has first surface 420a and second surface 420b, and has (other are not shown in the figures) such as a plurality of pins 421,422.This encapsulating structure also comprise the high heat dissipation characteristics of a tool and a positive 400a with one with the substrate 400 of corresponding this positive back side 400b, an and circuit board 425.Lead frame 420 partly is connected with circuit board 425 with second surface 420b and is provided with and forms a heap Stacked structure thereon, and another part is with the positive 400a binding of second surface 420b and substrate 400 and be provided with on it.This circuit board 425 is arranged on the metallic plate 430 with lead frame 420 formed Dui Stacked structures, and substrate 400 connects this metallic plate with back side 400b and is provided with on it.One second element 410b is a control element (also can be for a plurality of at other embodiment) and a plurality of first element 410a are that source element is arranged at respectively on the circuit board 425 on the first surface 420a with lead frame 420, and electrically connects circuit (not shown), lead frame 420 on each element 410b, 410a, the circuit boards 425 with the routing juncture by several wires 411,412,413,414,415,416... etc.And with each element, lead frame (except the pin), circuit board etc. on a sealing hermetic unit substrate, the substrate.
This embodiment equally connects all circuit arrangement to manufacture in replacing on the circuit board 425 and manufactures on substrate 400, and forms Yi Dui Stacked structure with lead frame 420, so can reduce the required substrate area that takies, reduces the volume of encapsulating structure.Source element 410a is arranged on the good thermal conductivity characteristic by lead frame 420 of heat on the lead frame 420 heat is distributed to the external world or heat abstractor through substrate 400 and metallic plate 430.Certainly, also embodiment is the same on same plane or on Different Plane as the aforementioned for the lead frame of present embodiment.
With reference to Fig. 7 is the encapsulating structure generalized section of the power power-supply module of further embodiment of this invention.This packaging mechanism comprises a lead frame 420 and has first surface 420a and second surface 420b, and has at least one pin, and for example 421,422 etc.One circuit board 425 is connected with the first surface 420a of part lead frame 420 and is provided with on it and forms Yi Dui Stacked structure, and Ci Dui Stacked structure also can be a circuit board 425 and the second surface 420b of part lead frame 420 is formed by connecting in other embodiments.A high heat dissipation characteristics of one tool and a positive 400a with one with the substrate 400 of corresponding this positive back side 400b, another partly lead frame 420 be connected with the positive 400b of substrate 400 with second surface 420b and be provided with on it.One second element 410b is that control element (also can be for a plurality of at other embodiment) is arranged on the circuit board 425, with a plurality of first element 410a be that source element directly is arranged on the positive 400a of substrate 400, and electrically connect circuit (not shown), lead frame 420 on each element 410b, 410a, the circuit board 425 with routing juncture mat several wires 411,412,413,414,415,416... etc.And with each element, lead frame (except the pin), circuit board etc. on a sealing hermetic unit substrate, the substrate.
This embodiment equally connects all circuit arrangement to manufacture in replacing on the circuit board 425 to manufacture on substrate 400 and with lead frame 420 and substrate 400 and forms Yi Dui Stacked structure, so can reduce the required substrate area that takies, reduces the volume of encapsulating structure.Source element 410a directly is provided with the good thermal conductivity characteristic by substrate 400 of heat on the substrate 400 heat is distributed to the external world or heat abstractor.Certainly, also embodiment is the same on same plane or on Different Plane as the aforementioned for the lead frame of present embodiment.
With reference to Fig. 8 is the encapsulating structure generalized section of the power power-supply module of another embodiment of the present invention.This encapsulating structure comprises the substrate 400 of high heat radiation of a tool and insulation characterisitic, and this substrate 400 has a positive 400a and corresponding this positive back side 400b.The lead frame 420 of a plurality of pins 421 of tool, 422... (other is not shown in the figures) is connected with the positive 400a of substrate 400 and is arranged on this substrate 400 with its second surface 420b.Secondly, also have a plurality of high heat radiation material pieces 424 to be arranged on the positive 400a of substrate 400.One circuit board (circuit plate), 425 1 ends connect the first surface 420a of lead frame 420 and formation Yi Dui Stacked structure on it are set, the other end connects hithermost high heat radiation material piece 424 and is provided with on it, so can reduce the required substrate area that takies, reduce the volume of encapsulating structure.Have in addition a plurality of control element 410b and a plurality of power component 410a be arranged at respectively on the circuit board 425 with height heat radiation material piece 424 on, and electrically connect circuit (not shown), lead frame 420 on power component 410a, the circuit boards 425 by several wires 412,413,414,415,416... etc. with the routing juncture.In addition, be connected with a metallic plate 430 (also can not need having this metallic plate) at the back side of substrate 400 400b at other embodiment.And with each element, lead frame 420 (except the pin), circuit board 425 etc. on a sealing hermetic unit substrate 400, the substrate.
Its used substrate 400 of above-mentioned disclosed encapsulating structure (shown in Figure 8) is identical with aforesaid other embodiment with circuit board 425.So its circuit board 425 forms Yi Dui Stacked structures with lead frame 420 and is arranged on the substrate 400, because of its Dui Stacked to some extent each other, reaches the effect of the volume of minimizing encapsulating structure can reduce the required substrate area that takies too.
Moreover power component 410a is arranged on the height heat radiation material piece 424 on the substrate 400, and the back side 400b of substrate 400 is connected with a metallic plate.Therefore, a large amount of heats that power component 410a start is produced can conduct to substrate 400 and metallic plate 430 via height heat radiation material piece 424 apace, by the metallic plate heat abstractor that thermal transpiration is extremely extraneous or external (figure does not show).So encapsulating structure can further bear moment by a large amount of heats that big electric current produced.And this high heat radiation material piece 424 is generally a metal derby.
Secondly, in other embodiments, control element 410b also can be not in the routing mode but directly and circuit board 425 do electric connection.Circuit board 425 and lead frame 420 are to do with glue material 417 to electrically connect and get and treat lead, and this glue material 417 is generally a conductive material, for example elargol.Certainly the lead frame of this encapsulating structure also can be as aforesaid other embodiment, need be at grade according to it, or on Different Plane.
The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention.Still can be changed in the category that does not break away from flesh and blood of the present invention and implemented, these variations should still belong to scope of the present invention.Therefore, category of the present invention is defined by following claim.
Claims (10)
1. a power power-supply module encapsulating structure is characterized in that, comprises:
One lead frame, have a first surface with to second surface that should first surface, and have at least one pin;
One circuit board connects into a stacked structure with this lead frame of part;
One substrate has a positive and back side, and this lead frame of part is arranged on this front with this second surface;
At least one first element is arranged on this substrate;
At least one second element is arranged on this circuit board; And
Plural wires connects this circuit board and this lead frame, this circuit board and this first element, this first element and this lead frame.
2. power power-supply module encapsulating structure as claimed in claim 2, it is characterized in that, this substrate is the insulation material, and this insulation material is to be selected from by single face to comprise the hybrid system that comprises metal in group family that the hybrid system of metal and the two-sided hybrid system that comprises metal form.
3. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, this circuit board is to be selected from the insulation material of group in the family of being formed by epoxides glass fibre material and for pottery.
4. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, this first element and this second element are respectively power component and control element.
5. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, this circuit board is connected with this first surface of this lead frame of part and is provided with and forms this stacked structure thereon.
6. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, this circuit board is connected with this second surface of this lead frame of part and is provided with and forms this stacked structure thereon.
7. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, this stacked structure is arranged on this front of this substrate.
8. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, more comprises on this back side that a metallic plate is arranged at this substrate.
9. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, more comprises at least one metal derby between this first element and this substrate.
10. power power-supply module encapsulating structure as claimed in claim 1 is characterized in that, wherein this lead frame of part is between this first element and this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100835153A CN100456473C (en) | 2005-07-08 | 2005-07-08 | Package structure of power power-supply module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100835153A CN100456473C (en) | 2005-07-08 | 2005-07-08 | Package structure of power power-supply module |
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| CN1893061A true CN1893061A (en) | 2007-01-10 |
| CN100456473C CN100456473C (en) | 2009-01-28 |
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| CNB2005100835153A Active CN100456473C (en) | 2005-07-08 | 2005-07-08 | Package structure of power power-supply module |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130571A (en) * | 2011-03-21 | 2011-07-20 | 华为技术有限公司 | Power supply package and device thereof |
| CN102354688A (en) * | 2011-10-11 | 2012-02-15 | 深圳市威怡电气有限公司 | Power module |
| CN105405830A (en) * | 2015-12-09 | 2016-03-16 | 西安华为技术有限公司 | System-level packaging module and packaging method |
| CN106684065A (en) * | 2016-09-07 | 2017-05-17 | 四川上特科技有限公司 | Novel integrated Mini rectifier bridge structure and fabrication process thereof |
| CN107301955A (en) * | 2010-09-24 | 2017-10-27 | 半导体元件工业有限责任公司 | Circuit arrangement and its manufacture method |
| CN107924893A (en) * | 2015-09-01 | 2018-04-17 | 罗姆股份有限公司 | The joint method of power module, the heat-dissipating structure of power module and power module |
| CN110676225A (en) * | 2018-07-02 | 2020-01-10 | 朋程科技股份有限公司 | Power element packaging structure |
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| TW201042208A (en) * | 2009-05-27 | 2010-12-01 | Hong Yuan Technology Co Ltd | Lamp system and method for manufacturing multi-chip package of LED |
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| JPH11233712A (en) * | 1998-02-12 | 1999-08-27 | Hitachi Ltd | Semiconductor device, its manufacture and electric apparatus using the semiconductor device |
| JP3674333B2 (en) * | 1998-09-11 | 2005-07-20 | 株式会社日立製作所 | Power semiconductor module and electric motor drive system using the same |
| SG120879A1 (en) * | 2002-08-08 | 2006-04-26 | Micron Technology Inc | Packaged microelectronic components |
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| CN107301955A (en) * | 2010-09-24 | 2017-10-27 | 半导体元件工业有限责任公司 | Circuit arrangement and its manufacture method |
| CN102130571A (en) * | 2011-03-21 | 2011-07-20 | 华为技术有限公司 | Power supply package and device thereof |
| CN102130571B (en) * | 2011-03-21 | 2013-12-04 | 华为技术有限公司 | Power supply package and device thereof |
| CN102354688A (en) * | 2011-10-11 | 2012-02-15 | 深圳市威怡电气有限公司 | Power module |
| CN107924893A (en) * | 2015-09-01 | 2018-04-17 | 罗姆股份有限公司 | The joint method of power module, the heat-dissipating structure of power module and power module |
| CN105405830A (en) * | 2015-12-09 | 2016-03-16 | 西安华为技术有限公司 | System-level packaging module and packaging method |
| CN106684065A (en) * | 2016-09-07 | 2017-05-17 | 四川上特科技有限公司 | Novel integrated Mini rectifier bridge structure and fabrication process thereof |
| US11232992B2 (en) | 2018-06-25 | 2022-01-25 | Actron Technology Corporation | Power device package structure |
| CN110676225A (en) * | 2018-07-02 | 2020-01-10 | 朋程科技股份有限公司 | Power element packaging structure |
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