CN217789971U - Circuit board that heat dispersion is good for localization tracking ware - Google Patents
Circuit board that heat dispersion is good for localization tracking ware Download PDFInfo
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- CN217789971U CN217789971U CN202221386755.6U CN202221386755U CN217789971U CN 217789971 U CN217789971 U CN 217789971U CN 202221386755 U CN202221386755 U CN 202221386755U CN 217789971 U CN217789971 U CN 217789971U
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- dissipation guide
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Abstract
The utility model discloses a circuit board that heat dispersion is good for localization tracking ware, concretely relates to circuit board field, including the circuit board main part, the middle part of circuit board main part is equipped with the heat-conducting plate, the fixed horizontal heat dissipation guide arm that is equipped with in upper end of heat-conducting plate, the fixed first ceramic fiber base plate that is equipped with in upper end of horizontal heat dissipation guide arm, the fixed first ceramic fiber bonding piece that is equipped with in upper end of first ceramic fiber base plate, the fixed first copper foil layer that is equipped with in upper end of first ceramic fiber bonding piece. The utility model discloses in the in-service use time, can increase circuit board main part's radiating efficiency through the clearance between a plurality of horizontal heat dissipation guide arms that set up, the radiating efficiency of increase circuit board main part that clearance between a plurality of vertical heat dissipation guide arms through setting up can be further, can increase circuit board main part's intensity simultaneously overlooking the direction at horizontal heat dissipation guide arm and vertical heat dissipation guide arm and being the vertically state under, avoid circuit board main part structural strength to descend, cause the rupture easily.
Description
Technical Field
The utility model relates to a circuit board field, more specifically say, the utility model relates to a circuit board that heat dispersion is good for localization tracking ware.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The Circuit Board can be called as a Printed Circuit Board or a Printed Circuit Board, and the english name (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Circuit Board (FPC Circuit Board is also called as a Flexible Circuit Board) which is a Flexible Printed Circuit Board made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. At present in the information era, as the electronic technology is gradually deepened in each application field, the integrated circuit board is an important element of electric appliances and intelligent machines and is widely applied to the electronic industry, but the existing integrated circuit board has disadvantages in practical application, firstly, when the integrated circuit board is applied to a speed regulation original device, the speed regulator can generate heat when in operation due to the fact that the speed regulation circuit board does not have good heat dissipation performance, the speed regulator is damaged, and economic loss is caused, in addition, the circuit board does not have corrosion resistance, the circuit board can be corroded, secondly, the circuit board is complex in the installation process, the circuit board can be fixed by means of welding, the circuit board is not beneficial to later-stage disassembly and maintenance, a high-degree integrated packaging module requires a good heat dissipation bearing system, the disadvantages of the traditional circuit boards FR-4 and CEM-3 on TC (thermal conductivity coefficient) become a bottleneck restricting the development of the electronic technology, and the circuit board is often prepared by adopting materials with good heat dissipation performance such as metal and ceramic. However, the circuit board generates a large amount of heat during the use process, and the heat can seriously affect the operation of the circuit board. In the circuit board industry at present, the heat technology of the circuit board becomes a technical problem to be solved.
Disclosure of Invention
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a circuit board that heat dispersion is good for localization tracker, the utility model aims to solve the technical problem that: how to make things convenient for the cigarette holder to dismantle and avoid children to produce the mistake and eat the phenomenon simultaneously and adjust.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board that heat dispersion is good for localization tracking ware, includes circuit board main part, the middle part of circuit board main part is equipped with the heat-conducting plate, the fixed horizontal heat dissipation guide arm that is equipped with in upper end of heat-conducting plate, the fixed first ceramic fiber base plate that is equipped with in upper end of horizontal heat dissipation guide arm, the fixed first copper foil layer that is equipped with in upper end of first ceramic fiber bonding piece, the fixed vertical heat dissipation guide arm that is equipped with of lower extreme of heat-conducting plate, the fixed second ceramic fiber base plate that is equipped with of lower extreme of vertical heat dissipation guide arm, the fixed second ceramic fiber bonding piece that is equipped with of lower extreme of second ceramic fiber base plate, the fixed second copper foil layer that is equipped with of lower extreme of second ceramic fiber bonding piece.
In a preferred embodiment, the heat conducting plate, the transverse heat dissipation guide rod, the first ceramic fiber substrate, the first ceramic fiber bonding sheet, the first copper foil layer, the vertical heat dissipation guide rod, the second ceramic fiber substrate, the second ceramic fiber bonding sheet and the second copper foil layer are respectively and correspondingly provided with a mounting and fixing hole at the end face.
In a preferred embodiment, the number of the mounting fixing holes is multiple, and the mounting fixing holes are correspondingly arranged at four corners of the circuit board main body in a top view direction.
In a preferred embodiment, the number of the transverse heat dissipation guide rods is multiple, and the transverse heat dissipation guide rods are correspondingly arranged in an array on two sides of the vertical central axis of the side view direction of the circuit board main body.
In a preferred embodiment, the number of the vertical heat dissipation guide rods is multiple, and the vertical heat dissipation guide rods are correspondingly arranged in an array on two sides of a vertical central axis of the circuit board main body in the front view direction.
In a preferred embodiment, the thicknesses of the first copper foil layer and the second copper foil layer, the first ceramic fiber bonding sheet and the second ceramic fiber bonding sheet, the first ceramic fiber substrate and the second ceramic fiber substrate, and the transverse heat dissipation guide rod and the vertical heat dissipation guide rod are respectively the same.
The utility model discloses a technological effect and advantage:
this use is novel when in-service use, can increase the radiating efficiency of circuit board main part through the clearance between a plurality of horizontal heat dissipation guide arms that set up, the radiating efficiency of increase circuit board main part that can step forward through the clearance between a plurality of vertical heat dissipation guide arms that set up, can increase circuit board main part's intensity simultaneously at horizontal heat dissipation guide arm and vertical heat dissipation guide arm when overlooking the direction and being the vertically state, avoid circuit board main part structural strength to descend, cause the rupture easily.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic view of the overall main view structure of the present invention
Fig. 3 is a schematic view of the overall connection structure of the present invention.
Fig. 4 is an enlarged schematic view of a portion a of fig. 1 according to the present invention.
The reference signs are: the circuit board comprises a circuit board main body 1, a mounting fixing hole 2, a heat conducting plate 3, a transverse heat dissipation guide rod 4, a first ceramic fiber substrate 5, a first ceramic fiber bonding sheet 6, a first copper foil layer 7, a vertical heat dissipation guide rod 8, a second ceramic fiber substrate 9, a second ceramic fiber bonding sheet 10 and a second copper foil layer 11.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings, in which the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure
The utility model provides a circuit board that localization tracking ware heat dispersion is good as shown in fig. 1-4, including circuit board main part 1, the middle part of circuit board main part 1 is equipped with heat-conducting plate 3, the fixed horizontal heat dissipation guide arm 4 that is equipped with in upper end of heat-conducting plate 3, the fixed first ceramic fiber base plate 5 that is equipped with in upper end of horizontal heat dissipation guide arm 4, the fixed first ceramic fiber bonding sheet 6 that is equipped with in upper end of first ceramic fiber bonding sheet 6, the fixed first copper foil layer 7 that is equipped with in upper end of heat-conducting plate 3, the fixed vertical heat dissipation guide arm 8 that is equipped with of lower extreme of vertical heat dissipation guide arm 8, the fixed second ceramic fiber base plate 9 that is equipped with of lower extreme of second ceramic fiber base plate 9, the fixed second ceramic fiber bonding sheet 10 that is equipped with of lower extreme of second ceramic fiber bonding sheet 10, the fixed second copper foil layer 11 that is equipped with of lower extreme of second ceramic fiber bonding sheet 10.
Further, in the above scheme, the end faces of the heat conducting plate 3, the transverse heat dissipation guide rod 4, the first ceramic fiber substrate 5, the first ceramic fiber bonding sheet 6, the first copper foil layer 7, the vertical heat dissipation guide rod 8, the second ceramic fiber substrate 9, the second ceramic fiber bonding sheet 10 and the second copper foil layer 11 are correspondingly provided with the mounting fixing holes 2.
Furthermore, in the above scheme, the number of the mounting and fixing holes 2 is multiple, and the mounting and fixing holes are correspondingly arranged at four corners of the overlooking direction of the circuit board main body 1, so that the device can be conveniently mounted and fixed.
Furthermore, in the above scheme, the number of the transverse heat dissipation guide rods 4 is provided with a plurality of, and the two sides of the vertical central axis of the side view direction of the circuit board main body 1 are correspondingly arranged in an array manner, so that the heat dissipation efficiency of the circuit board main body 1 can be increased conveniently through gaps between a plurality of adjacent transverse heat dissipation guide rods 4.
Further, in the above scheme, the number of the vertical heat dissipation guide rods 8 is provided with a plurality of vertical heat dissipation guide rods, and the two sides of the vertical central axis of the main viewing direction of the circuit board main body 1 correspond to the array arrangement, so that the heat dissipation efficiency of the circuit board main body 1 can be increased conveniently through gaps between the plurality of adjacent vertical heat dissipation guide rods 8, and the thicknesses of the first copper foil layer 7, the second copper foil layer 11, the first ceramic fiber bonding sheet 6, the second ceramic fiber bonding sheet 10, the first ceramic fiber substrate 5, the second ceramic fiber substrate 9, the transverse heat dissipation guide rods 4 and the vertical heat dissipation guide rods 8 are all the same correspondingly, so that the thickness of the circuit board main body 1 can be conveniently controlled.
The utility model discloses the theory of operation:
the utility model discloses when installing the use, with placing circuit board main part 1 behind the mounted position, through outside screw card in the upper end of installation fixed orifices 2 afterwards, after it is fixed stable afterwards, can use circuit board main part 1, circuit board main part 1 distributes the heat easily when the device uses for a long time afterwards, set up under the corresponding setting state of horizontal heat dissipation guide arm 4 and vertical heat dissipation guide arm 8 at circuit board main part 1 middle part, can increase circuit board main part 1's radiating efficiency through the clearance between horizontal heat dissipation guide arm 4 and the vertical heat dissipation guide arm 8.
The points to be finally explained are: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to common designs, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the foregoing is illustrative of the preferred embodiments of the present invention, and is not to be construed as limiting the invention, and any modifications, equivalent alterations, improvements and the like made within the spirit and principle of the invention are intended to be included within the scope of the invention.
Claims (6)
1. The utility model provides a circuit board that heat dispersion is good for localization tracking ware, includes circuit board main part (1), its characterized in that: the middle part of circuit board main part (1) is equipped with heat-conducting plate (3), the fixed horizontal heat dissipation guide arm (4) that is equipped with in upper end of heat-conducting plate (3), the fixed first ceramic fiber base plate (5) that is equipped with in upper end of horizontal heat dissipation guide arm (4), the fixed first ceramic fiber bonding piece (6) that is equipped with in upper end of first ceramic fiber base plate (5), the fixed first copper foil layer (7) that is equipped with in upper end of first ceramic fiber bonding piece (6), the lower extreme of heat-conducting plate (3) is fixed and is equipped with vertical heat dissipation guide arm (8), the fixed second ceramic fiber base plate (9) that is equipped with of lower extreme of vertical heat dissipation guide arm (8), the fixed second ceramic fiber bonding piece (10) that is equipped with of lower extreme of second ceramic fiber base plate (9), the fixed second copper foil layer (11) that is equipped with of lower extreme of second ceramic fiber bonding piece (10).
2. The circuit board for the localization tracker according to claim 1, characterized in that: the heat-conducting plate (3), the transverse heat-radiating guide rod (4), the first ceramic fiber substrate (5), the first ceramic fiber bonding sheet (6), the first copper foil layer (7), the vertical heat-radiating guide rod (8), the second ceramic fiber substrate (9), the second ceramic fiber bonding sheet (10) and the end face of the second copper foil layer (11) are correspondingly provided with mounting and fixing holes (2).
3. The circuit board for the localization tracker according to claim 2, characterized in that: the number of the mounting and fixing holes (2) is multiple, and the mounting and fixing holes are correspondingly arranged at four corners of the overlooking direction of the circuit board main body (1).
4. The circuit board for the localization tracker according to claim 1, characterized in that: the number of the transverse heat dissipation guide rods (4) is multiple, and the two sides of the vertical central axis in the side view direction of the circuit board main body (1) are correspondingly arranged in an array mode.
5. The circuit board for the localization tracker according to claim 1, characterized in that: the number of the vertical heat dissipation guide rods (8) is multiple, and the vertical heat dissipation guide rods are arranged on two sides of a vertical central axis of the circuit board main body (1) in the main view direction in a corresponding array mode.
6. The circuit board for the localization tracker according to claim 1, characterized in that: the thickness of the first copper foil layer (7), the second copper foil layer (11), the first ceramic fiber bonding sheet (6), the second ceramic fiber bonding sheet (10), the first ceramic fiber substrate (5), the second ceramic fiber substrate (9), the transverse heat dissipation guide rod (4) and the vertical heat dissipation guide rod (8) are the same correspondingly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221386755.6U CN217789971U (en) | 2022-06-06 | 2022-06-06 | Circuit board that heat dispersion is good for localization tracking ware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221386755.6U CN217789971U (en) | 2022-06-06 | 2022-06-06 | Circuit board that heat dispersion is good for localization tracking ware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217789971U true CN217789971U (en) | 2022-11-11 |
Family
ID=83911758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221386755.6U Active CN217789971U (en) | 2022-06-06 | 2022-06-06 | Circuit board that heat dispersion is good for localization tracking ware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217789971U (en) |
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2022
- 2022-06-06 CN CN202221386755.6U patent/CN217789971U/en active Active
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