CN220511320U - Inverter multilayer PCB structure convenient to heat dissipation - Google Patents
Inverter multilayer PCB structure convenient to heat dissipation Download PDFInfo
- Publication number
- CN220511320U CN220511320U CN202322150694.4U CN202322150694U CN220511320U CN 220511320 U CN220511320 U CN 220511320U CN 202322150694 U CN202322150694 U CN 202322150694U CN 220511320 U CN220511320 U CN 220511320U
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- Prior art keywords
- mounting
- pcb
- heat dissipation
- inverter
- plates
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 239000000428 dust Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 239000007779 soft material Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract 1
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an inverter multilayer PCB structure convenient for heat dissipation, which relates to the technical field of PCB, and comprises a mounting seat; two mounting plates are symmetrically fixed at the top of the mounting seat; a plurality of placing plates are fixed at the opposite ends of the two mounting plates; the top of the placing plate is provided with a PCB main body; the two just opposite ends of installation board all are equipped with the mounting, the mounting is used for fixing the PCB board main part, and the PCB board main part in the utility model adopts the layering to separate the design, has certain distance between a plurality of PCB board main parts, has avoided a plurality of PCB board main part heat to influence each other like this to improve the radiating efficiency of PCB board main part, avoided PCB board main part high temperature to influence its life and work efficiency, when dismantling the change to one of them PCB board main part, need not holistic change, greatly reduced the cost of PCB board main part.
Description
Technical Field
The utility model relates to the technical field of PCB boards, in particular to an inverter multilayer PCB board structure convenient for heat dissipation.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, the English name is (Printed Circuit Board) PCB, the (Flexible Printed Circuit board) FPC circuit board (the FPC circuit board is also called a flexible circuit board) is a novel product which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good flexibility) and a flexible-rigid board (reeshas, soft and hard combination plate) -the birth and development of FPC and PCB and the promotion of the flexible-rigid board. Therefore, the soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related process requirements through pressing and other procedures, wherein the multi-layer PCB is one of the PCB, the multi-layer PCB is widely applied to an inverter at present, but most of the existing multi-layer PCB is of an integrated structure, after one of the multi-layer PCB breaks down, the multi-layer PCB needs to be replaced integrally, the cost is high, the heat of the plurality of PCB in the multi-layer PCB is affected mutually, the heat dissipation efficiency of the multi-layer PCB is not ideal, and the working efficiency and the service life of the multi-layer PCB can be affected due to overhigh temperature of the multi-layer PCB.
Disclosure of Invention
The utility model aims to solve the technical problems of providing an inverter multi-layer PCB structure convenient for heat dissipation, which aims to solve the problems that most of existing multi-layer PCBs provided in the background art are of an integrated structure, when one of the multi-layer PCBs fails, the multi-layer PCBs must be replaced integrally, the cost is high, the heat of the multi-layer PCBs is affected mutually, the heat dissipation efficiency of the multi-layer PCBs is not ideal, and the working efficiency and the service life of the multi-layer PCBs can be affected due to the fact that the temperature of the multi-layer PCBs is too high.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
an inverter multilayer PCB board structure facilitating heat dissipation, comprising:
a mounting base;
two mounting plates are symmetrically fixed at the top of the mounting seat;
a plurality of placing plates are fixed at the opposite ends of the two mounting plates;
the top of the placing plate is provided with a PCB main body;
and two opposite ends of the mounting plates are respectively provided with a fixing piece, and the fixing pieces are used for fixing the PCB main body.
As a further scheme of the utility model, the fixing piece comprises connecting plates which are fixed at the opposite ends of the two mounting plates, the top of each connecting plate is provided with a threaded hole, and the threaded holes are internally and spirally connected with threaded rods.
As a further scheme of the utility model, a rotating bar is fixed at the top of the threaded rod, and an abutting plate is fixed at the bottom of the threaded rod;
the abutting plate is abutted with the top of the PCB main body.
As a further aspect of the present utility model, the abutment plate is made of a soft material.
As a further aspect of the present utility model, the mounting base is made of a heat insulating material.
As a further scheme of the utility model, the front end surface and the rear end surface of the two mounting plates are provided with L-shaped dustproof nets;
clamping grooves are formed in the surfaces of the front end and the rear end of the two mounting plates;
the one end that L type dust screen is close to the mounting panel is fixed with the fixture block, L type dust screen passes through fixture block cooperation draw-in groove joint at the front and back end surface of two mounting panels.
As a further scheme of the utility model, sealing strips are arranged at the opposite ends of the two L-shaped dustproof nets and at the ends contacted with the tops of the two mounting plates.
Compared with the prior art, the utility model has the beneficial effects that:
the PCB main bodies are designed in a layered and spaced manner, and a certain distance exists among the PCB main bodies, so that the mutual influence of heat of the PCB main bodies is avoided, the heat dissipation efficiency of the PCB main bodies is improved, and the influence of the overhigh temperature of the PCB main bodies on the service life and the working efficiency of the PCB main bodies is avoided;
when any PCB main body is disassembled, only the rotating bar corresponding to the rotating bar is required to rotate, the rotating bar can drive the threaded rod to ascend in the threaded hole, the abutting plate is driven to ascend correspondingly when the threaded rod ascends, and the PCB main body can be disassembled after the abutting plate is not abutted with the PCB main body, so that the PCB main body does not need to be integrally replaced when one PCB main body is disassembled and replaced, and the cost of the PCB main body is greatly reduced.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic view of a portion of the structure of the present utility model;
FIG. 3 is a schematic view of a threaded hole in the present utility model;
fig. 4 is a schematic structural view of an L-shaped dust-proof net according to the present utility model.
In the figure: 1. a mounting base; 2. a mounting plate; 3. placing a plate; 4. a PCB main body; 5. a connecting plate; 6. a threaded hole; 7. a threaded rod; 8. rotating the strip; 9. an abutting plate; 10. an L-shaped dust screen; 11. a clamping groove; 12. a clamping block; 13. and (5) a sealing strip.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1
Referring to fig. 1-3, the present utility model provides a technical solution: an inverter multilayer PCB structure convenient for heat dissipation comprises a mounting seat 1; two mounting plates 2 are symmetrically fixed at the top of the mounting seat 1; a plurality of placing plates 3 are fixed at the opposite ends of the two mounting plates 2; the top of the placing plate 3 is provided with a PCB main body 4; the right opposite ends of the two mounting plates 2 are respectively provided with a fixing piece, the fixing pieces are used for fixing the PCB main body 4, each fixing piece comprises a connecting plate 5 which is respectively fixed at the right opposite ends of the two mounting plates 2, the top of each connecting plate 5 is provided with a threaded hole 6, the threaded holes 6 are internally and threadedly connected with threaded rods 7, the tops of the threaded rods 7 are fixedly provided with rotating bars 8, and the bottoms of the threaded rods 7 are fixedly provided with abutting plates 9; the abutting plate 9 abuts against the top of the PCB main body 4, the abutting plate 9 is made of soft materials, and the mounting seat 1 is made of heat insulation materials.
Specifically, the PCB main bodies 4 are designed in a layered and spaced manner, and a certain distance exists among the PCB main bodies 4, so that the mutual influence of the heat of the PCB main bodies 4 is avoided, the heat dissipation efficiency of the PCB main bodies 4 is improved, and the influence of the overhigh temperature of the PCB main bodies 4 on the service life and the working efficiency of the PCB main bodies is avoided;
when any PCB main body 4 is dismounted, only the rotating bar 8 corresponding to the rotating bar is required to rotate, the rotating bar 8 can drive the threaded rod 7 to ascend in the threaded hole 6, the abutting plate 9 can be driven to ascend correspondingly when the threaded rod 7 ascends, and the PCB main body 4 can be dismounted after the abutting plate 9 is not abutted against the PCB main body 4, so that when one PCB main body 4 is dismounted and replaced, the whole replacement is not required, and the cost of the PCB main body 4 is greatly reduced;
since the abutting plate 9 is made of soft materials, the abutting plate 9 does not damage the PCB main body 4 when abutting against the PCB main body 4;
because mount pad 1 is made by thermal insulation material, so the heat of PCB board main part 4 can not direct contact with the heat of dc-to-ac converter, indirect improvement dc-to-ac converter, the radiating efficiency of PCB board main part 4.
Example 2
Referring to fig. 1, 2 and 4, the present utility model provides a technical solution: an inverter multilayer PCB structure convenient for heat dissipation is provided, wherein the front end surface and the rear end surface of two mounting plates 2 are respectively provided with an L-shaped dustproof net 10; clamping grooves 11 are formed in the front end surface and the rear end surface of the two mounting plates 2; the one end that L type dust screen 10 is close to mounting panel 2 is fixed with fixture block 12, and L type dust screen 10 passes through fixture block 12 cooperation draw-in groove 11 joint at the front and back end surface of two mounting panels 2, and the just opposite one end of two L type dust screens 10 and the one end that contacts with two mounting panel 2 tops all are equipped with sealing strip 13.
Specifically, the L-shaped dustproof net 10 is clamped to the front end surface and the rear end surface of the two mounting plates 2 through the clamping blocks 12 and the clamping grooves 11, and at the moment, the PCB main body 4 can be sealed under the common cooperation of the two L-shaped dustproof nets 10, so that the influence of dust in the air on the PCB main body 4 is avoided, and the working efficiency and the service life of the PCB main body 4 are improved;
because the sealing strips 13 are arranged at the opposite ends of the two L-shaped dustproof nets 10 and the ends contacted with the tops of the two mounting plates 2, the sealing strips 13 can improve the tightness of the two L-shaped dustproof nets 10 and the contact positions of the two L-shaped dustproof nets 10 and the mounting plates 2, and further improve the dustproof and sealing effects on the PCB main body 4.
Working principle:
firstly, the PCB main bodies 4 are designed in a layered separation manner, and a certain distance exists among the PCB main bodies 4, so that the mutual influence of the heat of the PCB main bodies 4 is avoided, the heat dissipation efficiency of the PCB main bodies 4 is improved, and the influence of the overhigh temperature of the PCB main bodies 4 on the service life and the working efficiency of the PCB main bodies is avoided;
when any PCB main body 4 is dismounted, only the rotating bar 8 corresponding to the rotating bar is required to rotate, the rotating bar 8 can drive the threaded rod 7 to ascend in the threaded hole 6, the abutting plate 9 can be driven to ascend correspondingly when the threaded rod 7 ascends, and the PCB main body 4 can be dismounted after the abutting plate 9 is not abutted against the PCB main body 4, so that when one PCB main body 4 is dismounted and replaced, the whole replacement is not required, and the cost of the PCB main body 4 is greatly reduced;
finally, the L-shaped dustproof net 10 is clamped to the front end face and the rear end face of the two mounting plates 2 through the clamping blocks 12 and the clamping grooves 11, and at the moment, the PCB main body 4 can be sealed under the joint of the two L-shaped dustproof nets 10, so that the influence of dust in the air on the PCB main body 4 is avoided, and the working efficiency and the service life of the PCB main body 4 are improved.
The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, and yet fall within the scope of the utility model.
Claims (7)
1. An inverter multilayer PCB structure convenient to heat dissipation, which is characterized by comprising:
a mounting base (1);
two mounting plates (2) are symmetrically fixed at the top of the mounting seat (1);
a plurality of placing plates (3) are fixed at the opposite ends of the two mounting plates (2);
a PCB main body (4) is arranged at the top of the placing plate (3);
the two just opposite ends of mounting panel (2) all are equipped with the mounting, the mounting is used for fixing PCB board main part (4).
2. The multi-layer PCB structure of the inverter convenient for heat dissipation according to claim 1, wherein the fixing piece comprises connecting plates (5) which are fixed at the right opposite ends of the two mounting plates (2), threaded holes (6) are formed in the tops of the connecting plates (5), and threaded rods (7) are connected in the threaded holes (6) in a threaded mode.
3. The multi-layer PCB structure of the inverter convenient for heat dissipation according to claim 2, wherein a rotating bar (8) is fixed at the top of the threaded rod (7), and an abutting plate (9) is fixed at the bottom of the threaded rod (7);
the abutting plate (9) abuts against the top of the PCB main body (4).
4. A multi-layer PCB structure of an inverter for facilitating heat dissipation according to claim 3, wherein the abutment plate (9) is made of soft material.
5. The inverter multilayer PCB structure facilitating heat dissipation according to claim 1, wherein the mounting base (1) is made of a heat insulating material.
6. The multi-layer PCB structure of the inverter for facilitating heat dissipation according to claim 1, wherein the front and rear end surfaces of the two mounting plates (2) are provided with L-shaped dustproof nets (10);
clamping grooves (11) are formed in the front end surface and the rear end surface of the two mounting plates (2);
the one end that L type dust screen (10) is close to mounting panel (2) is fixed with fixture block (12), L type dust screen (10) are through fixture block (12) cooperation draw-in groove (11) joint at the front and back end surface of two mounting panel (2).
7. The multi-layer PCB structure of the inverter for facilitating heat dissipation according to claim 6, wherein the two L-shaped dustproof nets (10) are provided with sealing strips (13) at opposite ends and at the ends contacting the tops of the two mounting plates (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322150694.4U CN220511320U (en) | 2023-08-10 | 2023-08-10 | Inverter multilayer PCB structure convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322150694.4U CN220511320U (en) | 2023-08-10 | 2023-08-10 | Inverter multilayer PCB structure convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511320U true CN220511320U (en) | 2024-02-20 |
Family
ID=89881694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322150694.4U Active CN220511320U (en) | 2023-08-10 | 2023-08-10 | Inverter multilayer PCB structure convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511320U (en) |
-
2023
- 2023-08-10 CN CN202322150694.4U patent/CN220511320U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |