CN219981142U - Double-layer overlapped circuit board - Google Patents
Double-layer overlapped circuit board Download PDFInfo
- Publication number
- CN219981142U CN219981142U CN202320317592.4U CN202320317592U CN219981142U CN 219981142 U CN219981142 U CN 219981142U CN 202320317592 U CN202320317592 U CN 202320317592U CN 219981142 U CN219981142 U CN 219981142U
- Authority
- CN
- China
- Prior art keywords
- frame
- circuit board
- heat dissipation
- heat
- rotating rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 239000002355 dual-layer Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a double-layer stacked circuit board, which comprises a first frame, a second frame and a mounting plate, wherein the first frame is internally provided with the first circuit board, the second frame is internally provided with the second circuit board, and the double-layer stacked circuit board further comprises: the heat dissipation connecting portion comprises a heat dissipation assembly and a connecting assembly, the heat dissipation connecting portion is located at a position between the first frame and the second frame, the heat dissipation assembly plays a role in heat dissipation for the first circuit board and the second circuit board, and the connecting assembly is used for connecting the heat dissipation assembly and the circuit board. According to the utility model, the radiating connecting part is arranged, so that the radiating component plays a role in radiating; the first frame and the second frame can rotate on the mounting plate and cannot fall off, and when the first circuit board and the second circuit board need to be overhauled and mounted, the operation is convenient.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a double-layer stacked circuit board.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, an FPC circuit board, which is also called a flexible circuit board, is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. The wiring density is high, the weight is light, the thickness is thin, the flexibility is good. Therefore, the soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related technological requirements through the procedures of pressing and the like and has FPC characteristics and PCB characteristics. The double-layer circuit board that exists in the use of circuit board can bear more components, but double-layer circuit board is when using, and the just relative position of two-layer circuit board is difficult for the heat dissipation, easily leads to the circuit board to be damaged by the heat that produces in the operation, but also easily appears installing unstable condition when installing radiating assembly, easily appears rocking, the problem that drops during the use. In view of this, we propose a double-layered stacked circuit board.
Disclosure of Invention
In order to overcome the defects, the utility model provides a double-layer stacked circuit board.
The technical scheme of the utility model is as follows:
double-deck stack formula circuit board, including first frame, second frame and mounting panel, install first circuit board in the first frame, install the second circuit board in the second frame, still include:
the heat dissipation connecting portion comprises a heat dissipation assembly and a connecting assembly, the heat dissipation connecting portion is located at a position between the first frame and the second frame, the heat dissipation assembly plays a role in heat dissipation for the first circuit board and the second circuit board, and the connecting assembly is used for connecting the heat dissipation assembly and the circuit board.
Preferably, the heat dissipation assembly includes a heat conduction plate located at a position between the first frame and the second frame and fixed on the mounting plate.
Preferably, a heat dissipation cavity is formed between the heat conducting plate and the first frame, a heat dissipation cavity is formed between the heat conducting plate and the second frame, and the two heat dissipation cavities play a role in heat dissipation for the first frame and the second frame.
Preferably, the connecting assembly comprises a first rotating rod and a second rotating rod, both ends of the first rotating rod and both ends of the second rotating rod are fixed on the mounting plate, the first frame rotates on the first rotating rod, and the second frame rotates on the second rotating rod.
Preferably, the four corners of one side of the first frame, which is close to the heat-conducting plate, are provided with first limit posts, the four corners of one side of the second frame, which is close to the heat-conducting plate, are provided with second limit posts, and the heat-conducting plate is provided with limit grooves corresponding to the first limit posts and the second limit posts.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the heat-radiating connecting part is arranged, so that the heat-conducting plate and the heat-radiating cavity play a role in radiating heat for the first frame and the second frame; the first frame and the second frame can rotate on the mounting plate and cannot fall off, when the first circuit board and the second circuit board need to be overhauled and mounted, the operation is convenient, and in order to strengthen the stability of the first circuit board and the second circuit board, the first limiting columns and the second limiting columns enter the limiting grooves to play a stable role on the first circuit board and the second circuit board, so that the first circuit board and the second circuit board are not easy to shake and fall off during use.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
fig. 2 is an exploded view of the present utility model.
In the figure: 1. a first frame; 2. a second frame; 3. a first circuit board; 4. a first mounting groove; 5. a second mounting groove; 6. a first rotating lever; 7. a second rotating lever; 8. a mounting plate; 9. a heat conductive plate; 10. a limit groove; 11. a first limit post; 12. the second limit column; 13. and a second circuit board.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-2, the present utility model is described in detail by the following embodiments:
double-deck stack formula circuit board, including first frame 1, second frame 2 and mounting panel 8, install first circuit board 3 in the first frame 1, install second circuit board 13 in the second frame 2, be equipped with first mounting groove 4 on the first frame 1, be equipped with second mounting groove 5 on the second frame 2, the installation that first mounting groove 4 and second mounting groove 5 made things convenient for first circuit board 3 and second circuit board 13 is used, still includes:
the heat dissipation connecting portion, the heat dissipation connecting portion includes radiator module and coupling assembling, and the position that radiator module is located between first frame 1 and the second frame 2, radiator module play radiating effect to first circuit board 3 and second circuit board 13, and coupling assembling is used for connecting radiator module and circuit board.
The heat dissipation assembly includes a heat conduction plate 9, the heat conduction plate 9 being located at a position between the first frame 1 and the second frame 2 and the heat conduction plate 9 being fixed to the mounting plate 8. The heat-conducting plate 9 is fixedly connected with the mounting plate 8. A heat dissipation cavity is formed between the heat conduction plate 9 and the first frame 1, a heat dissipation cavity is formed between the heat conduction plate 9 and the second frame 2, and the two heat dissipation cavities play a role in heat dissipation for the first frame 1 and the second frame 2.
The connecting assembly comprises a first rotating rod 6 and a second rotating rod 7, both ends of the first rotating rod 6 and the second rotating rod 7 are fixed on a mounting plate 8, the first frame 1 rotates on the first rotating rod 6, and the second frame 2 rotates on the second rotating rod 7. The first rotating rod 6 is hinged with the first frame 1, and the second rotating rod 7 is hinged with the second frame 2. The four corners of one side of the first frame 1 close to the heat-conducting plate 9 are provided with first limit posts 11, the four corners of one side of the second frame 2 close to the heat-conducting plate 9 are provided with second limit posts 12, and the heat-conducting plate 9 is provided with limit grooves 10 corresponding to the first limit posts 11 and the second limit posts 12. The first limit column 11 is fixedly connected with the first frame 1, and the second limit column 12 is fixedly connected with the second frame 2.
When the novel electric power tool is used, the first rotating rod 6 and the first frame 1 are in hinged connection, the second rotating rod 7 and the second frame 2 are in hinged connection, the first frame 1 and the second frame 2 can rotate on the mounting plate 8 and cannot fall off, and when the first circuit board 3 in the first frame 1 and the second circuit board 13 in the second frame 2 need to be overhauled and mounted, the operation is convenient. The heat conducting plate 9 is arranged between the first circuit board 3 and the second circuit board 13 to play a role in radiating heat to the first circuit board 3 and the second circuit board 13, meanwhile, a heat radiating cavity is formed between the heat conducting plate 9 and the first frame 1, a heat radiating cavity is formed between the heat conducting plate 9 and the second frame 2, and the two heat radiating cavities play a role in radiating heat to the first frame 1 and the second frame 2. When the first circuit board 3 and the second circuit board 13 operate, in order to strengthen the stability of the first circuit board 3 and the second circuit board 13, the four corners of one side, close to the heat-conducting plate 9, of the first frame 1 are provided with first limit posts 11, the four corners of one side, close to the heat-conducting plate 9, of the second frame 2 are provided with second limit posts 12, the first limit posts 11 and the second limit posts 12 enter the limit grooves 10 to play a role in stabilizing the first circuit board 3 and the second circuit board 13, and the condition that the first circuit board 3 and the second circuit board 13 are not easy to shake and fall off in use is guaranteed.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (3)
1. Double-deck stack formula circuit board, including first frame (1), second frame (2) and mounting panel (8), install first circuit board (3) in first frame (1), install second circuit board (13) in second frame (2), its characterized in that still includes:
the heat dissipation connecting part comprises a heat dissipation component and a connecting component, the heat dissipation connecting part is positioned between the first frame (1) and the second frame (2), the heat dissipation component plays a role in heat dissipation for the first circuit board (3) and the second circuit board (13), and the connecting component is used for connecting the heat dissipation component and the circuit board;
the heat dissipation assembly comprises a heat conduction plate (9), wherein the heat conduction plate (9) is positioned between the first frame (1) and the second frame (2) and is fixed on the mounting plate (8), a heat dissipation cavity is formed between the heat conduction plate (9) and the first frame (1), a heat dissipation cavity is formed between the heat conduction plate (9) and the second frame (2), and the two heat dissipation cavities play a role in heat dissipation for the first frame (1) and the second frame (2).
2. The dual-layer stacked circuit board of claim 1, wherein: the connecting assembly comprises a first rotating rod (6) and a second rotating rod (7), wherein both ends of the first rotating rod (6) and both ends of the second rotating rod (7) are fixed on the mounting plate (8), the first frame (1) rotates on the first rotating rod (6), and the second frame (2) rotates on the second rotating rod (7).
3. The dual-layer stacked circuit board of claim 2, wherein: the heat conducting plate is characterized in that first limiting columns (11) are arranged on four corners of one side, close to the heat conducting plate (9), of the first frame (1), second limiting columns (12) are arranged on four corners of one side, close to the heat conducting plate (9), of the second frame (2), and limiting grooves (10) corresponding to the first limiting columns (11) and the second limiting columns (12) are formed in the heat conducting plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320317592.4U CN219981142U (en) | 2023-02-27 | 2023-02-27 | Double-layer overlapped circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320317592.4U CN219981142U (en) | 2023-02-27 | 2023-02-27 | Double-layer overlapped circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219981142U true CN219981142U (en) | 2023-11-07 |
Family
ID=88583447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320317592.4U Active CN219981142U (en) | 2023-02-27 | 2023-02-27 | Double-layer overlapped circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219981142U (en) |
-
2023
- 2023-02-27 CN CN202320317592.4U patent/CN219981142U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |