CN108770190A - The two-sided PCB circuit board structure of multi-layered high-density - Google Patents
The two-sided PCB circuit board structure of multi-layered high-density Download PDFInfo
- Publication number
- CN108770190A CN108770190A CN201810773096.3A CN201810773096A CN108770190A CN 108770190 A CN108770190 A CN 108770190A CN 201810773096 A CN201810773096 A CN 201810773096A CN 108770190 A CN108770190 A CN 108770190A
- Authority
- CN
- China
- Prior art keywords
- hole
- substrate
- wiring board
- conductive
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses the two-sided PCB circuit board structures of multi-layered high-density, including substrate and the second wiring board, one side surface of the substrate is provided with first line plate, and first line plate upper face is provided with the first copper foil plate, first copper foil plate bottom is bonded the first insulation board, first line intralamellar part side is provided with conductive through hole, and copper post is socketed with inside conductive through hole.In the present invention, the device is equipped with substrate, cooling fin, layer of silica gel, the first heat emission hole, the second heat emission hole, first line plate and the second wiring board, pass through the substrate with thermal conduction characteristic, the heat that first line plate and the second wiring board distribute is conducted to cooling fin, heat is discharged by cooling fin again, first line plate and the second wiring board be internally provided with heat emission hole can constantly improve heat dissipation effect, improve the heat-sinking capability of device, increase service using life.
Description
Technical field
The present invention relates to technical field of PCB board more particularly to the two-sided PCB circuit board structures of multi-layered high-density.
Background technology
PCB Chineses are that printed circuit board is cut into certain size using insulation board as base material, it is at least attached thereon there are one
Conductive pattern, and it is furnished with hole (such as component hole, fastener hole, plated through-hole), it is used for replacing the bottom of previous device electronic component
Disk, and realize the interconnection between electronic component, since it is made of electron printing, therefore it is referred to as " printing "
Circuit board, printed board develop to two-sided, multilayer and flexibility from single layer, and remain on respective development trend.Due to not
Disconnectedly develop to high-precision, high density and high reliability direction, constantly reduces volume, reduce cost, improve performance so that printing
Plate still maintains powerful vitality in the development engineering of future electronic equipment.
However the existing two-sided PCB circuit board structure of multi-layered high-density is in use there is some shortcomings,
PCB circuit board when lasting work due to generating heat, if radiated not in time so that PCB circuit board is easy to damage, PCB circuits
Electrical connection connectivity is not high in plate, and the connection between electron element causes centainly to perplex, and veneer deviates in PCB circuit board
Afterwards so that surface texture hole and then deviates, and is not easy to electronic component assembling, and be not easy to the shortcomings of fixed.
Invention content
The purpose of the present invention is to solve disadvantages existing in the prior art, and the two-sided PCB of multi-layered high-density proposed
Circuit board structure.
To achieve the goals above, present invention employs following technical solutions：The two-sided PCB circuit board knot of multi-layered high-density
Structure, including substrate and the second wiring board, one side surface of the substrate are provided with first line plate, and first line plate upper face
It is provided with the first copper foil plate, first copper foil plate bottom is bonded the first insulation board, the setting of first line intralamellar part side
There is conductive through hole, and be socketed with copper post inside conductive through hole, the conductive through hole side is located at first line plate medium position and sets
It is equipped with the first heat emission hole, another side surface of substrate is provided with the second wiring board, and the second wiring board top surface is provided with
Second copper foil plate, second copper foil plate, one the second insulation board of side bonds, the second wiring board interior side are provided with conduction
Through-hole, and copper post is socketed with inside conductive through hole, the conductive through hole side is located at the second wiring board medium position and is provided with
Two heat emission holes.
Preferably, substrate both sides of the edge position is provided with multigroup cooling fin, and multigroup cooling fin is about substrate level
Center line is symmetrical, and the cooling fin is adhesive with layer of silica gel with substrate bonding position.
Preferably, the conductive through hole is provided with multiple, and multiple conductive through holes are symmetrically distributed in first line plate and
Two circuit intralamellar parts.
Preferably, the first line plate and the second wiring board are symmetrical about substrate level center line.
Preferably, first heat emission hole and the second heat emission hole are both provided with multiple, and multiple first heat emission holes and second
Heat emission hole is symmetrical about substrate level center line.
Preferably, the height of the copper post is equal with the thickness of the first copper foil plate, and one side surface of the copper post is arc knot
Structure.
Preferably, four corners of the substrate are both provided with positioning through hole, and positioning through hole is equipped with matched
Locating rod.
Compared with prior art, the beneficial effects of the invention are as follows；First, the device be equipped with substrate, cooling fin, layer of silica gel,
First heat emission hole, the second heat emission hole, first line plate and the second wiring board, by the substrate with thermal conduction characteristic, by First Line
The heat that road plate and the second wiring board distribute is conducted to cooling fin, then heat is discharged by cooling fin, first line plate and
Two circuit intralamellar parts be equipped with heat emission hole can constantly improve heat dissipation effect, improve the heat-sinking capability of device, increase device and use
Service life, secondly, the device are equipped with first line plate, the second wiring board, conductive through hole, copper post, by first line plate and the
Two circuit intralamellar parts are equipped with multiple conductive through holes, are equipped with copper post in multiple conductive through holes, are connected by gold thread between copper post, increase
The more possibilities for having added circuit to be arranged, finally, the device are equipped with substrate, logical by being equipped with positioning in four corners of substrate
Hole is socketed with corresponding positioning column, the case where convenient for preventing wiring board veneer from shifting, while can be played to itself
Certain fixed effect.
Description of the drawings
Fig. 1 is the internal structure schematic diagram of the two-sided PCB circuit board structure of multi-layered high-density proposed by the present invention；
Fig. 2 is the external structure schematic diagram of the two-sided PCB circuit board structure of multi-layered high-density of the present invention；
Fig. 3 is the first line plate structure schematic diagram of the two-sided PCB circuit board structure of multi-layered high-density of the present invention.
Marginal data：
1- substrates, 2- layer of silica gel, 3- cooling fins, 4- first line plate, 5- conductive through holes, 6- copper posts, the first heat emission holes of 7-,
The first copper foil plates of 8-, the first insulation boards of 9-, 10- positioning through hole, the second wiring boards of 11-, the second heat emission holes of 12-, the second copper foils of 13-
Plate, the second insulation boards of 14-.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention；Term " first ", " second ", " third "
It is used for description purposes only, is not understood to indicate or imply relative importance；In addition, unless otherwise specific regulation and limit
Fixed, term " installation ", " connected ", " connection " shall be understood in a broad sense, and can also be detachably to connect for example, it may be being fixedly connected
It connects, or is integrally connected；It can be mechanical connection, can also be electrical connection；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Please refer to Fig. 1-3, the two-sided PCB circuit board structure of multi-layered high-density, including substrate 1 and the second wiring board 11, substrate 1
One side surface is provided with first line plate 4, and 4 upper face of first line plate is provided with the first copper foil plate 8, the first copper foil plate 8
Bottom is bonded the first insulation board 9, and 4 interior side of first line plate is provided with conductive through hole 5, and is socketed with inside conductive through hole 5
Copper post 6,5 side of conductive through hole are located at 4 medium position of first line plate and are provided with the first heat emission hole 7, and 1 another side surface of substrate is set
It is equipped with the second wiring board 11, and 11 top surface of the second wiring board is provided with the second copper foil plate 13,13 side of the second copper foil plate is viscous
The second insulation board 14 is connect, 11 interior side of the second wiring board is provided with conductive through hole 5, and is socketed with copper post inside conductive through hole 5
6,5 side of conductive through hole is located at 11 medium position of the second wiring board and is provided with the second heat emission hole 12.
1 both sides of the edge position of substrate is provided with multigroup cooling fin 3, and multigroup cooling fin 3 is about 1 horizontal central line pair of substrate
Claim, cooling fin 3 and 1 bonding position of substrate are adhesive with layer of silica gel 2, are convenient for heat conduction, and conductive through hole 5 is provided with multiple, and multiple leads
Electric through-hole 5 is symmetrically distributed in inside first line plate 4 and the second wiring board 11, convenient for being attached between electronic component, first
Wiring board 4 and the second wiring board 11 are symmetrical about 1 horizontal central line of substrate, and the first heat emission hole 7 and the second heat emission hole 12 are both provided with
It is multiple, and 7 and second heat emission hole 12 of multiple first heat emission holes is symmetrical about 1 horizontal central line of substrate, convenient for preferably to device sheet
Body radiates, and the height of copper post 6 is equal with the thickness of the first copper foil plate 8, and 6 one side surface of copper post is arcuate structure, convenient for set
It is connected in conductive through hole 5,1 four corners of substrate are both provided with positioning through hole 10, and positioning through hole 10 is equipped with and matches with it
Locating rod, be convenient for fixing device itself, prevent its offset, positioning through hole 10 to be located at 3 side surface location of cooling fin.
Operation principle：In use, the two-sided PCB circuit board of the multi-layered high-density is fixed on specified position, electricity is connected
Source, when circuit is arranged, which is equipped with first line plate 4, the second wiring board 11, conductive through hole 5 and copper post 6, by the
One wiring board 4 and the second wiring board 11 are internally provided with multiple conductive through holes 5, and copper post 6, copper post 6 are equipped in multiple conductive through holes 5
Between connected by gold thread, increase circuit setting more possibilities, when clamped, the device be equipped with substrate 1, by base
1 four corners of plate are equipped with positioning through hole 10, are socketed with corresponding positioning column, convenient for preventing wiring board veneer from shifting
Situation, at the same can play the role of to itself it is certain fixed, when needing heat dissipation, the device be equipped with substrate 1, cooling fin 3,
Layer of silica gel 2, the first heat emission hole 7, the second heat emission hole 12, first line plate 4 and the second wiring board 11, by with thermal conduction characteristic
The heat that first line plate 4 and the second wiring board 11 distribute is conducted to cooling fin 3 by substrate 1, then by cooling fin 3 by heat
Discharge, first line plate 4 and the second wiring board 11 be internally provided with heat emission hole 3 can constantly improve heat dissipation effect, improve device
Heat-sinking capability, increase service using life.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. the two-sided PCB circuit board structure of multi-layered high-density, including substrate (1) and the second wiring board (11), which is characterized in that described
(1) one side surface of substrate is provided with first line plate (4), and first line plate (4) upper face is provided with the first copper foil plate
(8), the first copper foil plate (8) bottom is bonded the first insulation board (9), and first line plate (4) interior side, which is provided with, leads
Electric through-hole (5), and it is socketed with copper post (6) inside conductive through hole (5), conductive through hole (5) side is located at first line plate (4)
Medium position is provided with the first heat emission hole (7), and another side surface of the substrate (1) is provided with the second wiring board (11), and second
Wiring board (11) top surface is provided with the second copper foil plate (13), (13) one the second insulation board of side bonds of second copper foil plate
(14), the second wiring board (11) interior side is provided with conductive through hole (5), and is socketed with copper post inside conductive through hole (5)
(6), conductive through hole (5) side is located at the second wiring board (11) medium position and is provided with the second heat emission hole (12).
2. the two-sided PCB circuit board structure of multi-layered high-density according to claim 1, which is characterized in that the substrate (1) two
Lateral edges position is provided with multigroup cooling fin (3), and multigroup cooling fin (3) is symmetrical about substrate (1) horizontal central line, the heat dissipation
Piece (3) is adhesive with layer of silica gel (2) with substrate (1) bonding position.
3. the two-sided PCB circuit board structure of multi-layered high-density according to claim 1, which is characterized in that the conductive through hole
(5) it is provided with multiple, and to be symmetrically distributed in first line plate (4) and the second wiring board (11) internal for multiple conductive through holes (5).
4. the two-sided PCB circuit board structure of multi-layered high-density according to claim 1, which is characterized in that the first line
Plate (4) and the second wiring board (11) are symmetrical about substrate (1) horizontal central line.
5. the two-sided PCB circuit board structure of multi-layered high-density according to claim 1, which is characterized in that first heat dissipation
Hole (7) and the second heat emission hole (12) are both provided with multiple, and multiple first heat emission holes (7) and the second heat emission hole (12) are about substrate
(1) horizontal central line is symmetrical.
6. the two-sided PCB circuit board structure of multi-layered high-density according to claim 1, which is characterized in that the copper post (6)
Height is equal with the thickness of the first copper foil plate (8), and (6) one side surface of the copper post is arcuate structure.
7. the two-sided PCB circuit board structure of multi-layered high-density according to claim 1, which is characterized in that the substrate (1) four
A corner is both provided with positioning through hole (10), and positioning through hole (10) is equipped with matched locating rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810773096.3A CN108770190A (en) | 2018-07-14 | 2018-07-14 | The two-sided PCB circuit board structure of multi-layered high-density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810773096.3A CN108770190A (en) | 2018-07-14 | 2018-07-14 | The two-sided PCB circuit board structure of multi-layered high-density |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108770190A true CN108770190A (en) | 2018-11-06 |
Family
ID=63973666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810773096.3A Withdrawn CN108770190A (en) | 2018-07-14 | 2018-07-14 | The two-sided PCB circuit board structure of multi-layered high-density |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770190A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111799575A (en) * | 2020-07-31 | 2020-10-20 | 华勤技术有限公司 | Terminal shell conduction structure, terminal shell and terminal |
| CN111839503A (en) * | 2020-06-29 | 2020-10-30 | 华中科技大学 | Skin-attached electrocardiogram acceleration detection system and preparation method thereof |
| CN112969277A (en) * | 2021-02-03 | 2021-06-15 | 深圳市同创鑫电子有限公司 | Multilayer circuit board and preparation method thereof |
| CN113038697A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | 3/3mil precision circuit board |
-
2018
- 2018-07-14 CN CN201810773096.3A patent/CN108770190A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111839503A (en) * | 2020-06-29 | 2020-10-30 | 华中科技大学 | Skin-attached electrocardiogram acceleration detection system and preparation method thereof |
| CN111799575A (en) * | 2020-07-31 | 2020-10-20 | 华勤技术有限公司 | Terminal shell conduction structure, terminal shell and terminal |
| CN112969277A (en) * | 2021-02-03 | 2021-06-15 | 深圳市同创鑫电子有限公司 | Multilayer circuit board and preparation method thereof |
| CN112969277B (en) * | 2021-02-03 | 2023-03-14 | 深圳市同创鑫电子有限公司 | Multilayer circuit board and preparation method thereof |
| CN113038697A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | 3/3mil precision circuit board |
| CN113038697B (en) * | 2021-03-02 | 2022-06-14 | 广德新三联电子有限公司 | 3/3mil precision circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181106 |