CN111799575A - Terminal shell conduction structure, terminal shell and terminal - Google Patents

Terminal shell conduction structure, terminal shell and terminal Download PDF

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Publication number
CN111799575A
CN111799575A CN202010756494.1A CN202010756494A CN111799575A CN 111799575 A CN111799575 A CN 111799575A CN 202010756494 A CN202010756494 A CN 202010756494A CN 111799575 A CN111799575 A CN 111799575A
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CN
China
Prior art keywords
blind hole
terminal
copper post
terminal housing
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010756494.1A
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Chinese (zh)
Inventor
谢嗣兵
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Huaqin Technology Co Ltd
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Huaqin Technology Co Ltd
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Filing date
Publication date
Application filed by Huaqin Technology Co Ltd filed Critical Huaqin Technology Co Ltd
Priority to CN202010756494.1A priority Critical patent/CN111799575A/en
Publication of CN111799575A publication Critical patent/CN111799575A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail

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  • Telephone Set Structure (AREA)

Abstract

The application relates to the technical field of terminal structure, and discloses a terminal shell conduction structure, terminal shell and terminal, wherein, terminal shell conduction structure includes: the shell is provided with a blind hole at a conducting part; with blind hole complex copper post, the copper post includes the screens structure that sets up along the circumference of copper post to when copper post and blind hole equipment, screens structure and blind hole cooperation are in order to fix the copper post. The application discloses terminal housing conduction structure forms the conduction structure through the blind hole cooperation that utilizes the copper post and the formation of the position that switches on of casing, is favorable to reducing the occupation space of conduction structure to reduce terminal housing's volume, also the cost is reduced simultaneously, has improved the product yield.

Description

Terminal shell conduction structure, terminal shell and terminal
Technical Field
The application relates to the technical field of terminal structures, in particular to a terminal shell conduction structure, a terminal shell and a terminal.
Background
In the prior art, the conducting structure of the mobile terminal housing is generally formed by welding, and may be specifically a spot-welded copper sheet. However, the spot welding process is complex, the cost is high, and the spot welding spot needs a large area, which is not beneficial to reducing the volume of the mobile terminal and reducing the production cost.
Disclosure of Invention
The invention provides a conduction structure of a terminal shell, which is formed by matching a copper column with a blind hole formed in a conduction part of the shell, so that the occupied space of the conduction structure is reduced, and the cost is also reduced.
In order to achieve the above object, the present invention provides a terminal housing conduction structure, including:
the shell is provided with a blind hole at a conduction part;
with blind hole complex copper post, the copper post includes along the screens structure that the circumference of copper post set up, in order to work as the copper post with during the blind hole equipment, the screens structure with the blind hole cooperation is in order to fix the copper post.
Above-mentioned terminal casing conduction structure, the position that switches on at the casing sets up the blind hole, utilize simultaneously to be provided with the copper post and the blind hole cooperation of screens structure along self circumference, when copper post and blind hole equipment, utilize the press to press the copper post to impress the copper post in the blind hole, utilize the screens structure to interfere between copper post and the blind hole and crowd tightly, the effect that has both guaranteed to switch on, simultaneously because the copper post is compared the occupation space of spot welding copper sheet that uses in prior art little, be favorable to reducing the volume of terminal casing, the reduce cost of being convenient for.
Therefore, the conduction structure of the terminal shell provided by the invention is formed by matching the copper column with the blind hole formed at the conduction part of the shell, so that the occupied space of the conduction structure is favorably reduced, the volume of the terminal shell is reduced, the cost is reduced, in addition, the conduction structure is formed by interference and compaction between the clamping structure of the copper column and the blind hole, the success rate is higher compared with a spot welding mode, and the product yield is improved.
Preferably, the end face of the blind hole is provided with a guide structure arranged along the circumferential direction of the blind hole.
Preferably, the diameter of the guide structure is larger than the diameter of the blind hole.
Preferably, the clamping structure is a knurled structure arranged along the circumferential direction of the copper column.
Preferably, the clamping structure is a plurality of protrusions distributed along the circumferential direction of the copper column in an array manner.
Preferably, the diameter of the copper pillar is the same as the diameter of the blind hole.
Preferably, the depth of the blind hole is greater than the height of the copper pillar.
Preferably, the present invention further provides a terminal housing, comprising the terminal housing conduction structure as described in any one of the above.
Preferably, the present invention further provides a terminal comprising the above terminal housing.
Drawings
Fig. 1 is a schematic structural diagram of a terminal conducting structure in the prior art;
fig. 2 is a schematic structural diagram of a conducting portion of a terminal housing according to the present application;
fig. 3 is a schematic structural diagram of a conducting structure of a terminal housing according to the present application;
fig. 4 is a schematic structural diagram of a copper pillar according to the present application.
In the figure:
1-a shell; 2-conducting site; 3, blind holes; 4-a guide structure; 5-copper columns; 51-clamping structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the prior art, as shown in fig. 1, a spot welding copper sheet is generally used for realizing conduction of a terminal shell, and a spot welding spot needs a large area, which is not beneficial to reducing the volume of the terminal shell, and a spot welding process is complex, which results in high cost, and is not beneficial to reducing production cost.
In view of the above, referring to fig. 2 to fig. 4, the present invention provides a terminal housing conduction structure, including: the shell 1 is provided with a blind hole 3 at a conduction part 2 of the shell 1; with blind hole 3 complex copper post 5, this copper post 5 includes the screens structure 51 that sets up along the circumference of copper post 5 to when copper post 5 assembles with blind hole 3, screens structure 51 cooperates with blind hole 3 in order to fix copper post 5.
Above-mentioned terminal housing conduction structure, 2 the position that switches on at casing 1 sets up blind hole 3, and utilize screens structure 51 and the cooperation of blind hole 3 along self circumference setting, when copper post 5 assembles with blind hole 3, utilize the press to press copper post 5 to impress copper post 5 in blind hole 3, it is crowded tightly to interfere through screens structure 51 between copper post 5 and the blind hole 3, because the material of casing 1 is the alloy, copper post 5's fixed effect has not only been guaranteed, and the effect that switches on has been guaranteed. In addition, in the prior art, when the copper sheet is subjected to spot welding, the design size of the copper sheet is generally 3.2 x 2.2mm, the diameter of the blind hole 3 in the application is about 1.5mm, the occupied space is much smaller than that in the prior art, the purpose of reducing the volume of a terminal can be well achieved, meanwhile, the purpose of conducting is achieved through the copper column 5, the cost is also reduced compared with a spot welding process, and the operation is easier compared with a complex process of spot welding, and the product yield is also improved.
The material of the copper pillar 5 may be a metal or an alloy material other than a copper material.
In the embodiment, the terminal surface of the blind hole 3 of the above-mentioned terminal housing conducting structure has the guide structure 4 that sets up along the circumference of blind hole 3, and the diameter of guide structure 4 is greater than the diameter of blind hole 3, when using the press to assemble copper post 5 in blind hole 3, because the diameter of guide structure 4 is greater than the diameter of blind hole 3, copper post 5 passes through guide structure 4 earlier, under guide structure 4's effect, can help copper post 5 to press into blind hole 3 accurately, thereby utilize the screens structure 51 of copper post 5 to be fixed in blind hole 3, guarantee the effect that switches on.
In one embodiment, as shown in fig. 4, the retaining structure 51 of the copper cylinder 5 may be a knurled structure disposed along the circumferential direction of the copper cylinder 5. When using the press to impress copper post 5 in the blind hole 3, above-mentioned annular knurl structure interferes between the tip of annular knurl and the blind hole 3 tightly under the pore wall effect of blind hole 3, because the material of copper post 5 and blind hole 3 all is metal or alloy, interferes the difficult emergence of crowded tight in-process and warp, can fully guarantee the fixed effect of copper post 5 through interfering crowded tight package assembly to guarantee to switch on the effect.
In an embodiment (not shown in the figure), the above-mentioned clamping structure 51 of copper post 5 can be a plurality of protruding portions that distribute along the circumference array of copper post 5, when using the press to impress copper post 5 in blind hole 3, interfere between the pore wall of a plurality of protruding portions and blind hole 3 and crowd tightly, because the material of copper post 5 and blind hole 3 all is metal or alloy, interfere crowded tight in-process difficult emergence of deformation, and can fully guarantee the fixed effect between copper post 5 and blind hole 3, thereby guarantee to switch on the effect.
It should be noted that, the clamping structure 51 of the copper column 5 in the embodiment of the present application may be in a knurled form, may also be in a form of a protruding portion distributed in an array, and may also be in other forms, and it is only necessary to satisfy that the diameter of the copper column 5 is the same as the diameter of the blind hole 3, and the clamping structure 51 and the blind hole 3 can be used for interference and compaction, when the press is used to press the copper column 5 into the blind hole 3, the copper column 5 can be fixed in the blind hole 3, and the copper column 5 cannot move due to shaking of the terminal housing 1.
Specifically, the depth of the blind hole 3 is greater than the height of the copper pillar 5, so that a gap is prevented from being left between the bottom of the copper pillar 5 and the bottom surface of the blind hole 3 when the copper pillar 5 is pressed into the blind hole 3, the bottom of the copper pillar 5 is not in contact with other structures of the conduction part 2, and the conduction effect is guaranteed.
Based on the same invention idea, the application also provides a terminal shell, which comprises the terminal shell conduction structure, wherein the copper column is pressed into the blind hole by using a press machine through the conduction structure, and the clamping structure on the surface of the copper column is tightly interfered with the blind hole, so that the conduction effect is ensured, the occupied space of the conduction structure is reduced, the size of the conduction shell is favorably reduced, and the cost is reduced.
Based on the same invention idea, the application also provides a terminal, which comprises the terminal shell, wherein the terminal can be a mobile phone.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (9)

1. A terminal housing conduction structure, comprising:
the shell is provided with a blind hole at a conduction part;
with blind hole complex copper post, the copper post includes along the screens structure that the circumference of copper post set up, in order to work as the copper post with during the blind hole equipment, the screens structure with the blind hole cooperation is in order to fix the copper post.
2. A terminal housing feedthrough structure according to claim 1, wherein the end face of the blind bore has a guide structure disposed along the circumference of the blind bore.
3. A terminal housing feedthrough structure according to claim 2, wherein the guide structure has a diameter larger than the diameter of the blind hole.
4. The terminal housing feedthrough structure of claim 1, wherein the detent structure is a knurled structure disposed along a circumference of the copper post.
5. A terminal housing lead-through structure as claimed in claim 1, wherein the detent structure is a plurality of protrusions distributed in a circumferential array along the copper post.
6. A terminal housing via structure according to claim 4 or 5, wherein the diameter of the copper pillar is the same as the diameter of the blind via.
7. The terminal housing via structure of claim 1, wherein the blind via has a depth greater than a height of the copper pillar.
8. A terminal housing, characterized in that it comprises a terminal housing lead-through according to any one of claims 1 to 7.
9. A terminal characterized by comprising a terminal housing according to claim 8.
CN202010756494.1A 2020-07-31 2020-07-31 Terminal shell conduction structure, terminal shell and terminal Pending CN111799575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010756494.1A CN111799575A (en) 2020-07-31 2020-07-31 Terminal shell conduction structure, terminal shell and terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010756494.1A CN111799575A (en) 2020-07-31 2020-07-31 Terminal shell conduction structure, terminal shell and terminal

Publications (1)

Publication Number Publication Date
CN111799575A true CN111799575A (en) 2020-10-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010756494.1A Pending CN111799575A (en) 2020-07-31 2020-07-31 Terminal shell conduction structure, terminal shell and terminal

Country Status (1)

Country Link
CN (1) CN111799575A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010046096A1 (en) * 2010-08-05 2012-02-09 Rohde & Schwarz Gmbh & Co. Kg Contacting unit for producing electrically conductive connection between housing body and mounting body, has insulating layer penetrating into contact member, and contacting housing and mounting bodies that are connected with each other
CN102665378A (en) * 2012-05-18 2012-09-12 上海安费诺永亿通讯电子有限公司 Method for achieving mutual conduction of inner and outer surfaces of plastic component
CN204243200U (en) * 2014-10-31 2015-04-01 东莞宇龙通信科技有限公司 Mobile terminal and antenna structure thereof
CN105491791A (en) * 2014-10-08 2016-04-13 深南电路有限公司 Circuit board with blind hole and processing method of circuit board
CN106879207A (en) * 2017-03-13 2017-06-20 广东欧珀移动通信有限公司 Housing, mobile terminal and method for producing shell
CN108770190A (en) * 2018-07-14 2018-11-06 黄永锋 The two-sided PCB circuit board structure of multi-layered high-density
CN210957027U (en) * 2019-10-15 2020-07-07 信维创科通信技术(北京)有限公司 LDS subassembly structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010046096A1 (en) * 2010-08-05 2012-02-09 Rohde & Schwarz Gmbh & Co. Kg Contacting unit for producing electrically conductive connection between housing body and mounting body, has insulating layer penetrating into contact member, and contacting housing and mounting bodies that are connected with each other
CN102665378A (en) * 2012-05-18 2012-09-12 上海安费诺永亿通讯电子有限公司 Method for achieving mutual conduction of inner and outer surfaces of plastic component
CN105491791A (en) * 2014-10-08 2016-04-13 深南电路有限公司 Circuit board with blind hole and processing method of circuit board
CN204243200U (en) * 2014-10-31 2015-04-01 东莞宇龙通信科技有限公司 Mobile terminal and antenna structure thereof
CN106879207A (en) * 2017-03-13 2017-06-20 广东欧珀移动通信有限公司 Housing, mobile terminal and method for producing shell
CN108770190A (en) * 2018-07-14 2018-11-06 黄永锋 The two-sided PCB circuit board structure of multi-layered high-density
CN210957027U (en) * 2019-10-15 2020-07-07 信维创科通信技术(北京)有限公司 LDS subassembly structure

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Address after: Building 1, No.399 Keyuan Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 201210

Applicant after: Huaqin Technology Co.,Ltd.

Address before: Building 1, No.399 Keyuan Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 201210

Applicant before: Huaqin Technology Co.,Ltd.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20201020