JP4346421B2 - Circuit board connection terminal - Google Patents

Description

  The present invention relates to a circuit board connection terminal for connecting two circuit boards.

  There are two types of circuit board connection terminals for connecting two circuit boards: a socket housing type that can be disassembled after product assembly and a type that is fixed by soldering during product assembly. The following are known as the latter type of soldering and fixing. As shown in FIG. 13, the circuit board connection terminals include a first connection part 1 connected to the main part 2 and the first circuit board, a second circuit board connection 4 connected to the second circuit board, and a second circuit board connection terminal. A lead portion 3 is provided between the connecting portion 4 and the backbone portion 2. The backbone portion 2 includes an auxiliary connection portion 21 formed from a part of the backbone portion 2 and is connected to the first circuit board by connecting the first connection portion 1 and the auxiliary connection portion 21 at two points. Strength is improved.

  As shown in FIG. 14, when the electronic component 7 such as a tuner is connected to a circuit board of an electronic device such as a VTR, the electronic component 7 is arranged upright to reduce the mounting area of the circuit board. Therefore, the first connection portion 1 and the auxiliary connection portion 21 of the circuit board connection terminal are bent in order to draw out the second connection portion 4 from the surface having a small area of the circuit board arranged in parallel with the surface having a large area in the electronic component. And connected to a circuit board in the electronic component.

  As shown in FIG. 15, the conventional circuit board connecting terminal is formed by press-cutting a single conductive plate 5 having a plating layer 6 made of tin, nickel or the like on the front and back surfaces in advance to form an outer shape. Therefore, the cross section of the 1st connection part 1, the 2nd connection part 4, and the auxiliary | assistant connection part 21 is formed in a rectangular shape.

  However, since the plating layer 6 is not formed on the cut surface 11 in the press cutting, the solder wettability is lower than that in which the plating layer is formed on the entire surface. In addition, a certain amount of time elapses between the electronic component having the circuit board connection terminal being shipped to the user and attached to the circuit board of the electronic device. During this time, there is a problem that the solder wettability deteriorates due to oxidation or rusting of the second connection portion of the circuit board connection terminal.

In order to solve the above problem, a method of forming a plating layer on the entire surface of the circuit board connection terminal by re-plating after press cutting has been proposed (for example, Patent Document 1).
Japanese Patent Laid-Open No. 5-121142 (2nd page, FIG. 4)

  However, if the terminal is re-plated, the number of steps increases and the cost increases. In the re-plating process, a barrel plating method is used in which a sample to be plated is put in a barrel-shaped container containing a plating solution and the barrel-shaped container is rotated. In this process, the terminal is deformed. Or entangled, lowering the yield, leading to further cost increase. Furthermore, when a thin conductive plate is used to reduce the cost, the mechanical strength of the circuit board connection terminal is lowered, and there is a problem that the yield is lowered in the manufacturing process and the circuit board mounting process.

  The present invention has been made to solve such a problem, and provides a circuit board connection terminal capable of performing good soldering without performing a re-plating step.

The present invention provides a circuit board connection terminal having a backbone, a first connection part connected to the first circuit board, and a second connection part connected to the second circuit board.
For the circuit board connection terminal, after cutting the conductive plate material provided with the plating layer on the front and back surfaces, the second connection portion is formed in a cross-sectional cylindrical shape so that the plating layer becomes the outer peripheral surface of the second connection portion. It is characterized by that.

  Moreover, it is preferable that the cut surface of both ends of said 2nd connection part has opposed. Furthermore, it is preferable to provide a gap between the cut surfaces at the opposite ends of the second connection portion.

  By forming the plating layer of the second connection portion so as to be the outer peripheral surface, it is possible to improve the solder wettability without performing an extra plating step. Moreover, since the mechanical strength of the circuit board connection terminal can be improved by processing the second connection portion into a cross-sectional cylindrical shape, a conductive plate material thinner than the conventional one can be used, thereby reducing the cost. be able to.

  The circuit board connection terminal of the present invention includes a backbone part 2, a first connection part 1 connected to a first circuit board in an electronic component, and a second circuit connected to a second circuit board in an electronic device. A substrate connection 4, a lead portion 3 between the second connection portion 4 and the backbone portion 2, and an auxiliary connection portion 21 formed from a part of the backbone portion 2 are provided.

  In the circuit board connection terminal of the present invention, after cutting the conductive plate material provided with the plating layers on the front and back surfaces, the second connection portion is formed into a cylindrical cross section so that the plating layer becomes the outer peripheral surface of the second connection portion. Form.

  Here, the cylindrical shape used in the present invention may be any shape that the internal cavity 16 has, and the outer shape is not particularly limited. As an example of a cross-sectional cylinder, a circle, an ellipse, an oval, etc. can be adopted as shown in FIG. The outer shape can be appropriately changed according to the shape of the terminal hole of the second connection circuit.

  Moreover, the plating layer used for the electroconductive board | plate material of this invention will not be specifically limited if it is a material with high electrical conductivity, Gold, silver, copper, nickel, palladium etc. are used. In the following examples, a conductive plate material plated with tin was used.

  Embodiments of the present invention will be described below with reference to the drawings.

  As shown in FIG. 1, the circuit board connection terminal has an outer shape in which the distance (P) between the terminals is 4 mm by press-cutting a conductive plate 13 such as a tin plate having tin plating layers on the front and back surfaces. Formed as follows.

  Then, as shown in FIG. 3, the cut surface 11 in the second connection portion 4 was made to face so that the plating layer became the outer peripheral surface of the second connection portion, and the cross section was processed into a cylindrical shape. Further, as shown in FIG. 4, the cut surface 11 of the lead portion 3 is opposed to be processed so that the cross section is O-shaped, thereby completing a circuit board connection terminal as shown in FIG.

  Further, the first connection portion 1 and the auxiliary connection portion 21 of the terminal are perpendicular to the second connection portion in order to pull out the second connection portion 4 in the vertical direction from the circuit board arranged in the horizontal direction of the electronic component. Bending was performed.

  FIG. 5 shows a front view and a top view of the circuit board connection terminal in the second embodiment. As in Example 1, after the outer shape of the circuit board connection terminal was formed by press cutting, as shown in FIG. 6, a gap was provided so that the cut surfaces 11 at both ends of the second connection portion were not in close contact, and the plating layer was The cross section was processed into a mold so as to be the outer peripheral surface of the second connection portion. Thereafter, as shown in FIG. 7, the lead portion was processed by reinforcing the cut surface into a C-shaped cross section to complete a circuit board connection terminal.

  After the outer shape of the conductive plate is formed by press cutting in the same manner as in Example 1, the second connecting portion is first bent at both ends of the cut surface of the second connecting portion at an acute angle as shown in FIG. Then, the cross section was gradually processed into a cylindrical shape, and the cut surface was formed so as to be inside the cylindrical shape. After that, as shown in FIG. 7, the cut surface of the lead portion was processed into a C-shaped cross section and reinforced to complete the circuit board connection terminal.

  In the circuit board connection terminals of Examples 1 to 3, the first connection portion 1 and the auxiliary connection portion 21 are attached to the first circuit board by soldering, and the second connection portion 4 is attached to the second circuit board by soldering. Used.

  With the above configuration, since the cut surface 11 after the press cutting of the conductive plate 13 does not appear on the outer peripheral surface of the second connection portion 4 of the terminal to be soldered, the solder wettability is improved as compared with the conventional product. Can do.

  Further, in the terminal of Example 2, by providing a fine gap between the cut surfaces 11 at both ends of the second connection portion 4, solder can enter the gap due to a capillary phenomenon, and solder wettability can be improved.

  Further, in the terminal of Example 3, the distance from the outer peripheral surface where soldering is performed to the cut surface 11 where plating is not performed is made by bending the cut surface 11 of the second connection portion 4 into a cylindrical shape. Can be provided. Therefore, even if the rust generated with time progresses on the cut surface 11 and erodes to the plated surface, it is difficult for the rust to reach the outer peripheral surface of the second connection portion, so that good soldering can be performed. . This effect can be achieved by forming the cut surface so as to be inside the cylindrical shape. For example, as shown in FIG. 9, the cut surface of the portion where the second connecting portion is soldered is rounded inside the cylindrical shape. The same effect can be obtained with the processed shape.

  When the circuit board connection terminal having a rectangular part to be soldered with the conventional board is inserted into the circular terminal connection hole 14 of the board as shown in FIG. 11, the gap between the soldering part and the circular terminal connection hole The connection strength is weak because the part is not constant and there is a distance. On the other hand, the second connecting portion 4 of the terminal of the present invention is formed in a cylindrical shape as shown in FIG. 10, and therefore the gap 15 with the circular terminal connecting hole 14 is constant. Strength can be improved.

  Moreover, the said terminal which formed the 2nd connection part 4 in the cross-sectional cylinder shape like an Example can improve the mechanical strength of a said 2nd connection part compared with the conventional product which does not add a bending process. Therefore, a conductive material thinner than the conventional product can be used, which leads to cost reduction. Furthermore, the mechanical strength of the terminal can be further improved by applying a bending process such as an O-shaped or C-shaped cross section to the lead portion as in the embodiment.

  In the embodiment, the auxiliary connection part formed from a part of the backbone part is used, and the first connection part and the auxiliary connection part are bent at right angles to the second connection part. The number and shape of the connecting portions are not limited to this, and can be applied within the scope of the claims.

  By using the first connection portion of the terminal of the present invention for an electronic component that is arranged upright such as a tuner, the space on the circuit can be used effectively, and the occurrence of rust and oxidation of the second connection portion of the terminal can be prevented. Can be prevented. Therefore, good soldering can be performed even if a predetermined time elapses after the electronic component is shipped to the user and then attached to the circuit board of the electronic device.

It is a manufacture figure and side view of a circuit board connection terminal in the example of the present invention. FIG. 2 is an enlarged view of a portion A in FIG. 1 and a top view thereof. It is sectional drawing of BB in FIG. It is sectional drawing of DD in FIG. It is the circuit board connection terminal front view and top view in Example 2. It is sectional drawing of BB in FIG. It is sectional drawing of DD in FIG. FIG. 10 is a cross-sectional view showing a process for processing a second connection part in Example 3. It is sectional drawing of the 2nd connection part in another Example. It is sectional drawing which shows the state which inserted the 2nd connection part of Example 1 in the connection hole of a circuit board. It is sectional drawing which shows the state which inserted the 2nd connection part of the conventional product into the connection hole of a circuit board. It is a cross-sectional view of the 2nd connection part in the other Example of this invention. It is the front view and side view of the conventional press molding type | mold terminal. It is an arrangement shape figure of the 1st circuit board arranged on the 2nd circuit board. It is the front-and-back figure which carries out press cutting of the conventional conductive board material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st connection part 2 Core part 21 Auxiliary connection part 3 Lead part 4 Second connection part 5 Conductive board material 6 Plating layer 7 Electronic component 8 First circuit board 9 Second circuit board 10 Circuit board connection terminal 11 Cut surface 13 Conductive plate 14 Terminal connection hole 15 Clearance 16 Internal cavity

Claims (5)

In a circuit board connection terminal having a backbone part, a first connection part connected to the first circuit board, and a second connection part connected to the second circuit board,
The circuit board connection terminal is formed by cutting a conductive plate material provided with plating layers on the front and back surfaces , then bending both ends of the second connection portion, and then the plating layer is an outer peripheral surface of the second connection portion. The circuit board connection terminal is characterized in that the second connection part is formed in a cross-sectional cylindrical shape so that the cut surfaces at both ends of the second connection part are located inside the cylindrical shape . The circuit board connection terminal according to claim 1 , wherein a gap is provided between cut surfaces at both ends of the second connection portion. The circuit board connection terminal according to claim 2 , wherein a lead portion is provided between the backbone portion and the second connection portion, and the lead portion is subjected to bending processing for reinforcement. The circuit board connection terminal according to claim 3 , wherein the bending process forms a cut surface of the lead portion in a cross-sectional O-shape or C-shape. An electronic component comprising a first circuit board to which the first connection portion of the circuit board connection terminal according to claim 1 is connected. The electronic component is placed on a second circuit board arranged in the electronic device. The manufacturing method of the electronic device characterized by attaching.

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