JP2004200154A - Circuit board connecting terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting terminal whereof solder wettability is enhanced and strength at a part connected to a circuit board is enhanced without increasing surface treatment processes such as plating and the like, in a circuit board connecting terminal having a basic part, a first connecting part to be connected to a fist circuit board, and a second connecting part to be connected to a second circuit board. <P>SOLUTION: In this circuit board connecting terminal, the second connecting part is formed so as to make its cross section cylindrical after cutting a conductive plate material provided with plated layers on its front and back surfaces, and the plated layers are disposed on the outer peripheral surface of the second connecting part. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a circuit board connection terminal for connecting two circuit boards.

  As circuit board connection terminals for connecting two circuit boards, there are a socket housing type that can be disassembled even after product assembling and a type that is fixed by soldering during product assembling. The following type is known as the latter type which is fixed by soldering. As shown in FIG. 13, the circuit board connection terminal includes a first connection portion 1 connected to the main body 2 and the first circuit board, a second circuit board connection 4 connected to the second circuit board, And a lead portion (3) located between the connection portion (4) and the trunk portion (2). The main body 2 includes an auxiliary connecting portion 21 formed from a part of the main body 2, and is connected to the first circuit board by connecting the first connecting portion 1 and the auxiliary connecting portion 21 at two points. Strength has been improved.

  As shown in FIG. 14, when the electronic component 7 such as a tuner is connected to a circuit board of an electronic device such as a VTR, the electronic component 7 is arranged upright to reduce the mounting area of the circuit board. Therefore, in order to pull out the second connection portion 4 from the small surface of the circuit board arranged in parallel with the large surface in the electronic component, the first connection portion 1 and the auxiliary connection portion 21 of the circuit board connection terminal are bent. And connected to a circuit board in the electronic component.

  As shown in FIG. 15, the conventional circuit board connection terminal is formed by press-cutting a single conductive plate material 5 in which a plating layer 6 of tin, nickel or the like is formed on the front and back surfaces in advance. Therefore, the cross section of the first connection part 1, the second connection part 4, and the auxiliary connection part 21 is formed in a rectangular shape.

  However, since the plating layer 6 is not formed on the cut surface 11 in the press cutting, the solder wettability is lower than that in which the plating layer is formed on the entire surface. In addition, a certain period of time elapses between an electronic component provided with a circuit board connection terminal and shipment to a user and attachment to a circuit board of an electronic device. During that time, the second connection portion of the circuit board connection terminal is oxidized or rusted, which causes a problem that the solder wettability is reduced.

In order to solve the above problem, there has been proposed a method of forming a plating layer on the entire surface of a circuit board connection terminal by performing re-plating after press cutting (for example, Patent Document 1).
JP-A-5-121142 (page 2, FIG. 4)

  However, when the terminals are re-plated, the number of steps increases and the cost increases. In the re-plating step, a barrel plating method is generally used in which a sample to be plated is placed in a barrel-shaped container containing a plating solution and the barrel-shaped container is rotated. In this step, the terminals are deformed. The entanglement or entanglement lowers the yield, leading to further cost increases. Further, if a thin conductive plate is used to reduce the cost, the mechanical strength of the circuit board connection terminal is reduced, and there is a problem that the yield is reduced in the manufacturing process and the process of attaching to the circuit board.

  The present invention has been made to solve such a problem, and provides a circuit board connection terminal capable of performing good soldering without performing a replating step.

The present invention provides a main board, a first connection portion connected to the first circuit board, and a circuit board connection terminal having a second connection portion connected to the second circuit board,
The circuit board connection terminal is formed by cutting a conductive plate material provided with a plating layer on the front and back surfaces, and then forming the second connection portion into a cross-sectional cylindrical shape so that the plating layer becomes an outer peripheral surface of the second connection portion. It is characterized by having done.

  Further, it is preferable that cut surfaces at both ends of the second connection portion face each other. Furthermore, it is preferable to provide a gap between the cut surfaces at both ends of the second connecting portion facing each other.

  By forming the plating layer of the second connection portion on the outer peripheral surface, the solder wettability can be improved without performing an extra plating step. In addition, by processing the second connection portion into a cylindrical cross section, the mechanical strength of the circuit board connection terminal can be improved, so that a thinner conductive plate material than before can be used, thereby reducing costs. be able to.

  The circuit board connection terminal of the present invention includes a main unit 2, a first connection unit 1 connected to a first circuit board in an electronic component, and a second circuit connected to a second circuit board in an electronic device. It has a board connection 4, a lead portion 3 between the second connection portion 4 and the main portion 2, and an auxiliary connection portion 21 formed from a part of the main portion 2.

  The circuit board connection terminal of the present invention, after cutting the conductive plate material provided with a plating layer on the front and back, the second connection portion into a tubular cross section so that the plating layer becomes the outer peripheral surface of the second connection portion. Form.

  Here, the cylindrical shape used in the present invention may be any shape as long as the internal cavity 16 has, and the outer shape is not particularly limited. As an example of the cylindrical section, a circle, an ellipse, an oval, or the like can be adopted as shown in FIG. The outer shape can be appropriately changed according to the shape of the terminal hole of the second connection circuit.

  Further, the plating layer used for the conductive plate material of the present invention is not particularly limited as long as it is a material having high conductivity, and gold, silver, copper, nickel, palladium or the like is used. In the following examples, a conductive material plated with tin was used.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the outer shape of the circuit board connection terminal is such that the interval (P) between the terminals becomes 4 mm by press cutting a conductive plate material 13 such as a tin plate having a tin plating layer on the front and back surfaces. Formed as follows.

  Thereafter, as shown in FIG. 3, the cut surface 11 of the second connection portion 4 was opposed to the outer peripheral surface of the second connection portion so that the cross section was processed into a cylindrical shape. Further, as shown in FIG. 4, the cut surfaces 11 of the lead portions 3 were opposed to each other and processed so as to have an O-shaped cross section, thereby completing a circuit board connection terminal as shown in FIG.

  In addition, the first connection part 1 and the auxiliary connection part 21 of the terminal are drawn perpendicularly to the second connection part in order to draw out the second connection part 4 from the circuit board arranged in the horizontal direction of the electronic component in the vertical direction. It was bent.

  FIG. 5 shows a front view and a top view of the circuit board connection terminal in the second embodiment. After forming the outer shape of the circuit board connection terminal by press cutting in the same manner as in Example 1, as shown in FIG. 6, a gap is provided so that the cut surfaces 11 at both ends of the second connection portion do not adhere to each other, and the plating layer is formed. The cross section was machined so as to be the outer peripheral surface of the second connection part. Thereafter, as shown in FIG. 7, the lead section was processed into a C-shaped cross section and reinforced to complete the circuit board connection terminal.

  After forming the outer shape of the conductive plate material by press cutting in the same manner as in Example 1, first, as shown in FIG. 8, both ends of the cut surface of the second connection portion are bent at an acute angle, and then several steps are performed. , The cross section was gradually processed into a cylindrical shape, and the cut surface was formed so as to be inside the cylindrical shape. Thereafter, as shown in FIG. 7, the cut surface of the lead portion was processed into a C-shaped cross section and reinforced to complete a circuit board connection terminal.

  In the circuit board connection terminals of the first to third embodiments, the first connection part 1 and the auxiliary connection part 21 are attached to the first circuit board by soldering, and the second connection part 4 is attached to the second circuit board by soldering. Used.

  According to the above configuration, since the cut surface 11 of the conductive plate 13 after press cutting does not appear on the outer peripheral surface of the second connection portion 4 of the terminal to be soldered, the solder wettability is improved as compared with the conventional product. Can be.

  In the terminal according to the second embodiment, by providing a minute gap between the cut surfaces 11 at both ends of the second connection portion 4, the solder can enter the gap due to a capillary phenomenon and the solder wettability can be improved.

  Further, the terminal of the third embodiment bends the cut surface 11 of the second connection portion 4 into the inside of the cylindrical shape to reduce the distance from the outer peripheral surface where soldering is performed to the cut surface 11 where plating is not applied. Can be provided. Therefore, even if the rust generated with time on the cut surface 11 progresses and erodes the plated surface, the rust hardly reaches the outer peripheral surface of the second connection portion, so that good soldering can be performed. . This effect can be achieved by forming the cut surface inside the cylindrical shape. For example, as shown in FIG. 9, the cut surface of the portion where the second connection portion is to be soldered is rounded inside the cylindrical shape. The same effect can be obtained with the shape processed as described above.

  When a circuit board connection terminal having a rectangular shape to be soldered to a conventional board is inserted into a circular terminal connection hole 14 of the board as shown in FIG. 11, a gap between the soldered portion and the circular terminal connection hole is formed. However, the connection strength is weak because there is a portion where the distance is not constant. On the other hand, the second connection portion 4 of the terminal of the present invention has a cylindrical cross section as shown in FIG. 10, so that the gap 15 between the circular terminal connection hole 14 is constant. Strength can be improved.

  Further, the terminal in which the second connecting portion 4 is formed in a cylindrical shape in cross section as in the embodiment can improve the mechanical strength of the second connecting portion as compared with a conventional product in which bending is not performed. Therefore, a conductive material thinner than a conventional product can be used, which leads to cost reduction. Further, the mechanical strength of the terminal can be further improved by applying a bending process such as an O-shaped cross section or a C-shaped cross section to the lead portion as in the embodiment.

  In the embodiment, an auxiliary connecting portion formed from a part of the main portion is used, and the first connecting portion and the auxiliary connecting portion are used by bending the second connecting portion at a right angle. The number and shape of the connections are not limited to this, but are applicable within the scope of the claims.

  By using the first connection portion of the terminal of the present invention for an electronic component such as a tuner or the like arranged upright, a space on a circuit can be effectively used, and rust generation and oxidation of the second connection portion of the terminal can be reduced. Can be prevented. Therefore, good soldering can be performed even if a certain time elapses after the electronic component is shipped to the user and then mounted on the circuit board of the electronic device.

It is a manufacturing drawing and a side view of a circuit board connection terminal in an example of the present invention. It is the enlarged view of the A section in FIG. 1, and its top view. It is sectional drawing of BB in FIG. It is sectional drawing of DD in FIG. It is the front view and top view of the circuit board connection terminal in Example 2. It is sectional drawing of BB in FIG. It is sectional drawing of DD in FIG. FIG. 13 is a cross-sectional view illustrating a processing step of a second connection portion in the third embodiment. It is sectional drawing of the 2nd connection part in other Examples. FIG. 5 is a cross-sectional view illustrating a state where the second connection portion of the first embodiment is inserted into the connection hole of the circuit board. It is sectional drawing which shows the state which inserted the 2nd connection part of the conventional product in the connection hole of a circuit board. FIG. 10 is a cross-sectional view of a second connecting portion according to another embodiment of the present invention. It is the front view and side view of the conventional press-molding-type terminal. FIG. 5 is an arrangement shape diagram of a first circuit board arranged on a second circuit board. It is a figure before and after pressing and cutting the conventional conductive plate material.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 First connection part 2 Main part 21 Auxiliary connection part 3 Lead part 4 Second connection part 5 Conductive plate material 6 Plating layer 7 Electronic component 8 First circuit board 9 Second circuit board 10 Circuit board connection terminal 11 Cut surface 13 conductive plate material 14 terminal connection hole 15 gap 16 internal cavity

Claims (9)

In the circuit board connection terminal having a trunk portion, a first connection portion connected to the first circuit board, and a second connection portion connected to the second circuit board,
The circuit board connection terminal is formed by cutting a conductive plate material provided with a plating layer on the front and back surfaces, and then forming the second connection portion into a cross-sectional cylindrical shape so that the plating layer becomes an outer peripheral surface of the second connection portion. A circuit board connection terminal, characterized in that: The circuit board connection terminal according to claim 1, wherein cut surfaces at both ends of the second connection portion face each other. 3. The circuit board connection terminal according to claim 2, wherein a gap is provided between the cut surfaces at both ends of the second connection portion facing each other. 4. The circuit board connection terminal according to claim 3, further comprising a lead portion between the base portion and the second connection portion, wherein the lead portion is subjected to a bending process for reinforcement. 5. The circuit board connection terminal according to claim 4, wherein the bending process forms a cut surface of the lead portion into an O-shaped or C-shaped cross section. In the circuit board connection terminal having a trunk portion, a first connection portion connected to the first circuit board, and a second connection portion connected to the second circuit board,
The circuit board connection terminal is formed by cutting a conductive plate material provided with a plating layer on the front and back surfaces, and then forming the second connection portion into a cross-sectional cylindrical shape so that the plating layer becomes an outer peripheral surface of the second connection portion. A circuit board connection terminal, wherein the second connection portion is bent such that a cut surface is located inside the cylindrical shape. The circuit board connection terminal according to claim 6, further comprising a lead portion between the base portion and the second connection portion, wherein the lead portion is bent. The circuit board connection terminal according to claim 7, wherein the bending process forms a cut surface of the lead portion into an O-shaped or C-shaped cross section. An electronic component comprising a first circuit board to which the first connection portion of the circuit board connection terminal according to claim 1 is connected, and the electronic component is set up on a second circuit board arranged in an electronic device. A method for manufacturing an electronic device, comprising:

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