CN215773702U - High heat dissipating double-deck circuit board - Google Patents
High heat dissipating double-deck circuit board Download PDFInfo
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- CN215773702U CN215773702U CN202122142804.3U CN202122142804U CN215773702U CN 215773702 U CN215773702 U CN 215773702U CN 202122142804 U CN202122142804 U CN 202122142804U CN 215773702 U CN215773702 U CN 215773702U
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- main board
- mainboard
- dissipation plate
- circuit board
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Abstract
The utility model relates to the technical field of circuit boards, and discloses: the utility model provides a high heat dissipating double-deck circuit board, includes mainboard and last mainboard down, be provided with heat dissipation mechanism down between mainboard and the last mainboard, heat dissipation mechanism includes the heating panel, the bottom of mainboard is under in the heating panel installation, the middle part of heating panel is provided with the through-hole, both ends link up with the front and back both ends of heating panel around both ends of through-hole, and the bottom of heating panel is provided with the recess, the recess communicates with the bottom of heating panel. According to the utility model, the heat dissipation plate is arranged at the bottom of the lower main board, and the cavity is arranged in the middle of the heat dissipation plate, so that when the lower main board and the upper main board work, heat can be transferred to the heat dissipation plate, and external cold air can enter the cavity to exchange with the heat on the heat dissipation plate, thereby achieving a heat dissipation effect and solving the problem of poor heat dissipation performance of the double-layer main board in the prior art.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-heat-dissipation double-layer circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The Circuit Board may be referred to as a Printed Circuit Board or a Printed Circuit Board, and the english term (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Board (FPC Board is also referred to as a Flexible Circuit Board) is a Flexible Printed Circuit Board which is made of polyimide or polyester film as a base material and has high reliability and is excellent.
Because of the improvement of modern science and technology, the integration level of electronic products is higher and higher, so double-deck mainboard has appeared on the market, but the not enough of prior art's bilayer is: the heat dissipation performance is poor, and the mainboard cannot obtain enough heat dissipation space.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In view of the deficiencies of the prior art, the present invention provides a high heat dissipation double-layer circuit board to solve the problems mentioned in the background art.
(II) technical scheme
In order to achieve the purpose, the utility model provides the following technical scheme: a high-heat-dissipation double-layer circuit board comprises a lower main board and an upper main board, wherein a heat dissipation mechanism is arranged between the lower main board and the upper main board;
the heat dissipation mechanism comprises a heat dissipation plate, the heat dissipation plate is installed at the bottom of the lower main plate, a through hole is formed in the middle of the heat dissipation plate, and the front end and the rear end of the through hole are communicated with the front end and the rear end of the heat dissipation plate.
Preferably, the bottom of heating panel is provided with the recess, the recess communicates with the bottom of heating panel, go up the middle part of mainboard and seted up the cavity, the cavity runs through the both ends of going up the mainboard, through set up the recess in the bottom of heating panel to make the area of contact of heating panel and air increase, thereby can improve radiating efficiency.
Preferably, the cross section of the groove is semicircular, the heat dissipation plate is made of metal, and the metal has good heat conduction performance, so that heat generated by the mainboard can be transferred to the heat dissipation plate, and a good heat dissipation effect is achieved.
Preferably, the heat dissipation plate is made of copper alloy, the copper alloy is an excellent heat dissipation material, the cost is low, and the heat conduction efficiency is high, so that the heat dissipation performance can be improved.
Preferably, the bottom of the lower main board is provided with a mounting groove, the shape of the mounting groove is matched with that of the heat dissipation plate, the heat dissipation plate is connected with the mounting groove through composite glue, heat dissipation silicone grease is arranged at the contact position of the heat dissipation plate and the mounting groove, and heat on the lower main board can be fully transferred to the heat dissipation plate through the heat dissipation silicone grease, so that the heat dissipation effect is achieved.
Preferably, the corner at mainboard top is connected with the supporting shoe down, the supporting shoe inclines to the middle part of lower mainboard, the top of supporting shoe is connected with the grafting piece, the inserting groove has been seted up to the bottom of going up the mainboard, the grafting piece is pegged graft with the inserting groove, when the grafting piece is pegged graft with the inserting groove, can form certain gap between lower mainboard and the last mainboard to can let outside cold air enter into the gap, reach radiating effect, and owing to let produce the gap between mainboard and the last mainboard down, so when receiving the collision or letting fall, can not interact between lower mainboard and the last mainboard, thereby be difficult to damage.
Preferably, one side of the inserting block is connected with an extruding block, the extruding block is made of elastic materials, the elastic materials are rubber, plastic or cloth, the inserting block and the inserting groove can be tightly inserted and connected through the extruding block, looseness is not prone to occurring, and stability is improved.
Compared with the prior art, the utility model provides a high-heat-dissipation double-layer circuit board which has the following beneficial effects:
1. according to the utility model, the heat dissipation plate is arranged at the bottom of the lower main board, and the cavity is arranged in the middle of the heat dissipation plate, so that when the lower main board and the upper main board work, heat can be transferred to the heat dissipation plate, and external cold air can enter the cavity to exchange with the heat on the heat dissipation plate, thereby achieving a heat dissipation effect and solving the problem of poor heat dissipation performance of the double-layer main board in the prior art.
2. According to the utility model, the lower main board and the upper main board form a certain gap through the insertion of the insertion block and the insertion groove, so that external cold air can enter the gap to achieve a heat dissipation effect, and the lower main board and the upper main board cannot interact with each other when the lower main board and the upper main board are collided or fall off due to the gap formed between the lower main board and the upper main board, so that the lower main board and the upper main board are not easy to damage.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a bottom block diagram of the present invention;
FIG. 3 is an enlarged schematic view of the present invention A;
FIG. 4 is an enlarged view of the present invention B.
In the figure: the structure comprises a lower main board 1, an upper main board 2, a through hole 301, a mounting groove 302, a heat dissipation plate 303, a groove 304, a cavity 305, a supporting block 306, an insertion block 307, an extrusion block 308 and an insertion groove 309.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, the present invention provides a technical solution: a high heat dissipation double-layer circuit board comprises a lower main board 1 and an upper main board 2, wherein a heat dissipation mechanism is arranged between the lower main board 1 and the upper main board 2;
heat dissipation mechanism includes heating panel 303, heating panel 303 installs the bottom at mainboard 1 down, the middle part of heating panel 303 is provided with cavity 305, both ends link up with heating panel 303's front and back both ends around cavity 305, through-hole 301 has been seted up at the middle part of going up mainboard 2, through-hole 301 runs through the both ends of going up mainboard 2, bottom through mainboard 1 under sets up heating panel 303, and be provided with cavity 305 at the middle part of heating panel 303, thereby when mainboard 1 and last mainboard 2 work down, the heat can be transmitted to on the heating panel 303, and outside cold air can get into in the cavity 305, exchange with the heat production on the heating panel 303, reach radiating effect, the problem that the double-deck mainboard heat dispersion of prior art is not good is solved.
The bottom of the heat dissipation plate 303 is provided with a groove 304, the groove 304 is communicated with the bottom of the heat dissipation plate 303, and the groove 304 is arranged at the bottom of the heat dissipation plate 303, so that the contact area of the heat dissipation plate 303 and air is increased, and the heat dissipation efficiency can be improved.
The cross section of the groove 304 is semicircular, the heat dissipation plate 303 is made of metal, and the metal has good heat conduction performance, so that heat generated by the mainboard can be transferred to the heat dissipation plate 303, and a good heat dissipation effect is achieved.
The heat sink 303 is made of copper alloy, which is an excellent heat sink, and has low cost and high heat conduction efficiency, thereby improving heat dissipation performance.
The corner at mainboard 1 top is connected with supporting shoe 306 down, the middle part slope of mainboard 1 down of supporting shoe 306, the top of supporting shoe 306 is connected with plug block 307, inserting groove 309 has been seted up to the bottom of going up mainboard 2, plug block 307 is pegged graft with inserting groove 309, when plug block 307 is pegged graft with inserting groove 309, can form certain gap between lower mainboard 1 and the last mainboard 2, thereby can let outside cold air enter into in the gap, reach radiating effect, and owing to let produce the gap between mainboard 1 and the last mainboard 2 down, so when receiving the collision or letting fall, can not interact between lower mainboard 1 and the last mainboard 2, thereby be difficult to damage.
One side of the insertion block 307 is connected with an extrusion block 308, the extrusion block 308 is made of an elastic material, the elastic material is rubber, plastic or cloth, the insertion block 307 and the insertion groove 309 can be tightly inserted through the extrusion block 308, looseness is not prone to occurring, and stability is improved.
When using, when mainboard 1 and last mainboard 2 work down, the heat can be transmitted on the heating panel 303, and outside cold air can get into in the cavity 305, exchange with the heat production on the heating panel 303, reach radiating effect, the problem that the double-deck mainboard heat dispersion of prior art is not good has been solved, peg graft with inserting groove 309 through inserting block 307, thereby let and form certain gap between mainboard 1 and the last mainboard 2 down, thereby can let outside cold air enter into in the gap, reach radiating effect, and owing to let and produce the gap between mainboard 1 and the last mainboard 2 down, so when receiving the collision or letting fall, can not interact between lower mainboard 1 and the last mainboard 2, thereby be difficult to damage.
In summary, the present invention provides a heat sink 303 disposed on the bottom of the lower motherboard 1, and a cavity 305 disposed in the middle of the heat sink 303, so that, when the lower main board 1 and the upper main board 2 operate, heat can be transferred to the heat dissipation plate 303, and the external cold air can enter the cavity 305 to exchange with the heat on the heat dissipation plate 303, so as to achieve the heat dissipation effect, solve the problem of poor heat dissipation of the double-layer mainboard in the prior art, and through the insertion of the insertion block 307 and the insertion groove 309, thereby a certain gap is formed between the lower main board 1 and the upper main board 2, so that the cold air from the outside can enter into the gap to achieve the effect of heat dissipation, and because the gap is generated between the lower main board 1 and the upper main board 2, so when being collided or dropped, the lower main board 1 and the upper main board 2 do not interact with each other, and thus are not easily damaged.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A high heat dissipation double-layer circuit board comprises a lower main board (1) and an upper main board (2), and is characterized in that: a heat dissipation mechanism is arranged between the lower main board (1) and the upper main board (2);
the heat dissipation mechanism comprises a heat dissipation plate (303), the heat dissipation plate (303) is installed at the bottom of the lower main plate (1), a cavity (305) is arranged in the middle of the heat dissipation plate (303), and the front end and the rear end of the cavity (305) are communicated with the front end and the rear end of the heat dissipation plate (303).
2. The double-layer circuit board with high heat dissipation performance of claim 1, wherein: the bottom of heating panel (303) is provided with recess (304), recess (304) and the bottom intercommunication of heating panel (303), through-hole (301) have been seted up at the middle part of going up mainboard (2), both ends of mainboard (2) are run through in through-hole (301).
3. The double-layer circuit board with high heat dissipation performance of claim 2, wherein: the cross section of the groove (304) is semicircular, and the heat dissipation plate (303) is made of metal.
4. The double-layer circuit board with high heat dissipation performance of claim 3, wherein: the heat dissipation plate (303) is made of copper alloy.
5. The double-layer circuit board with high heat dissipation performance of claim 1, wherein: the bottom of the lower main board (1) is provided with a mounting groove (302), the shape of the mounting groove (302) is matched with that of the heat dissipation plate (303), the heat dissipation plate (303) is connected with the mounting groove (302) through composite glue, and heat dissipation silicone grease is arranged at the contact position of the heat dissipation plate (303) and the mounting groove (302).
6. The double-layer circuit board with high heat dissipation performance of claim 1, wherein: the corner at the top of the lower main board (1) is connected with a supporting block (306), the supporting block (306) inclines towards the middle of the lower main board (1), the top of the supporting block (306) is connected with an insertion block (307), the bottom of the upper main board (2) is provided with an insertion groove (309), and the insertion block (307) is inserted into the insertion groove (309).
7. The double-layer circuit board with high heat dissipation performance of claim 6, wherein: one side of the insertion block (307) is connected with an extrusion block (308), and the extrusion block (308) is made of an elastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122142804.3U CN215773702U (en) | 2021-09-07 | 2021-09-07 | High heat dissipating double-deck circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122142804.3U CN215773702U (en) | 2021-09-07 | 2021-09-07 | High heat dissipating double-deck circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215773702U true CN215773702U (en) | 2022-02-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122142804.3U Active CN215773702U (en) | 2021-09-07 | 2021-09-07 | High heat dissipating double-deck circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215773702U (en) |
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2021
- 2021-09-07 CN CN202122142804.3U patent/CN215773702U/en active Active
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