CN217470361U - Circuit board that electric conductivity is high - Google Patents
Circuit board that electric conductivity is high Download PDFInfo
- Publication number
- CN217470361U CN217470361U CN202220055750.9U CN202220055750U CN217470361U CN 217470361 U CN217470361 U CN 217470361U CN 202220055750 U CN202220055750 U CN 202220055750U CN 217470361 U CN217470361 U CN 217470361U
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- Prior art keywords
- circuit board
- pad
- via hole
- gold
- base plate
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Abstract
The utility model discloses a circuit board that electric conductivity is high, which comprises a substrate, the up end of base plate is provided with the pad, the up end of pad is provided with the gilt layer, one side of gilt layer sets up the copper foil, the up end metal via hole of copper foil, one side of metal via hole is provided with non-metallic via hole, the outside fixedly connected with of base plate is bordured, the outside of pad is provided with electric boundary. According to the circuit board with high conductivity, the gold-plated layer is plated on the circuit of the circuit board, so that the conductive wire of the circuit board is improved, the circuit board has a dual conductive function, when the circuit in the circuit board breaks down, the gold-plated layer can continue to conduct electricity for the circuit board, and the using effect of the circuit board is well improved.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board that electric conductivity is high.
Background
The circuit board is also called as a PCB board, an aluminum substrate, a high frequency board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board, etc., and the circuit board makes the circuit miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of electrical appliance layout.
However, the conventional circuit board has low conductive wire, and once an internal circuit is damaged, the whole circuit board cannot conduct electricity.
Disclosure of Invention
An object of the utility model is to provide a circuit board that electric conductivity is high to it is not high to propose current circuit board conductor wire in solving above-mentioned background art, in case when the internal circuit takes place to damage, then the unable electrically conductive problem of whole circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board that electric conductivity is high, includes the base plate, the up end of base plate is provided with the pad, the up end of pad is provided with the gold-plated layer, one side of gold-plated layer sets up the copper foil, the up end metal via hole of copper foil, one side of metal via hole is provided with non-metallic via hole, the outside fixedly connected with of base plate bordures, the outside of pad is provided with electric boundary.
Preferably, mounting holes are formed in four corners of the upper end face of the substrate.
Preferably, the substrate is made of an insulating material.
Preferably, the wrapping edge is made of aluminum.
Preferably, the gold plating layer is plated on the circuit outer side of the upper end of the substrate.
Compared with the prior art, the beneficial effects of the utility model are that: this circuit board that electric conductivity is high is through plating on the circuit of circuit board and be equipped with the gilt layer to improved the conductor wire of circuit board, makeed the circuit board have dual electrically conductive effect, when the circuit in the circuit board breaks down, the gilt layer can continue to be electrically conductive for the circuit board, fine improvement the result of use of circuit board.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
In the figure: 1. a substrate; 2. edge covering; 3. a metal via; 4. a pad; 5. a non-metallic via; 6. copper foil; 7. plating a gold layer; 8. an electrical boundary; 9. and (7) installing holes.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a circuit board that electric conductivity is high, includes base plate 1, the up end of base plate 1 is provided with pad 4, the up end of pad 4 is provided with gold-plated layer 7, one side of gold-plated layer 7 sets up copper foil 6, the up end metal via hole 3 of copper foil 6, one side of metal via hole 3 is provided with nonmetal via hole 5, the outside fixedly connected with of base plate 1 bordures 2, the outside of pad 4 is provided with electric boundary 8.
The working principle is as follows: the gold plating layer 7 is plated on the circuit of the circuit board, so that the conductive wire of the circuit board is improved, the circuit board has a double conductive function, when the circuit in the circuit board breaks down, the gold plating layer 7 can continuously conduct electricity for the circuit board, and the using effect of the circuit board is well improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A wiring board with high conductivity, comprising a substrate (1), characterized in that: the up end of base plate (1) is provided with pad (4), the up end of pad (4) is provided with gold-plated layer (7), one side of gold-plated layer (7) sets up copper foil (6), up end metal via hole (3) of copper foil (6), one side of metal via hole (3) is provided with nonmetal via hole (5), the outside fixedly connected with of base plate (1) is bordured (2), the outside of pad (4) is provided with electric border (8).
2. A wiring board having high conductivity according to claim 1, wherein: mounting holes (9) are formed in four corner positions of the upper end face of the substrate (1).
3. A wiring board having high conductivity according to claim 1, wherein: the substrate (1) is made of an insulating material.
4. A wiring board having high conductivity according to claim 1, wherein: the wrapping edges (2) are made of aluminum materials.
5. A wiring board having high conductivity according to claim 1, wherein: the gold-plated layer (7) is plated on the outer side of the circuit at the upper end of the substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220055750.9U CN217470361U (en) | 2022-01-11 | 2022-01-11 | Circuit board that electric conductivity is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220055750.9U CN217470361U (en) | 2022-01-11 | 2022-01-11 | Circuit board that electric conductivity is high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217470361U true CN217470361U (en) | 2022-09-20 |
Family
ID=83261209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220055750.9U Active CN217470361U (en) | 2022-01-11 | 2022-01-11 | Circuit board that electric conductivity is high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217470361U (en) |
-
2022
- 2022-01-11 CN CN202220055750.9U patent/CN217470361U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230821 Address after: One of the third floors, No. 66 Donghai Second Road, Bogong Community, Dongfeng Town, Zhongshan City, Guangdong Province, 528400 Patentee after: Zhongshan Xiangying Electronic Technology Co.,Ltd. Address before: 204, Office Building, Zhaoqing Huiyitong Electronic Technology Co., Ltd., No. 40, Yingbin Avenue, High-tech Zone, Zhaoqing City, Guangdong Province, 526238 Patentee before: Zhaoqing High-tech Zone Huadi Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |