CN220342294U - F-shaped filter base - Google Patents
F-shaped filter base Download PDFInfo
- Publication number
- CN220342294U CN220342294U CN202322021936.XU CN202322021936U CN220342294U CN 220342294 U CN220342294 U CN 220342294U CN 202322021936 U CN202322021936 U CN 202322021936U CN 220342294 U CN220342294 U CN 220342294U
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- Prior art keywords
- external
- conducting strip
- filter
- conductive
- conducting
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a filter technology, in particular to an F-shaped filter base. The base comprises a substrate, and an input conducting strip, an output conducting strip and a grounding conducting strip are paved on the front surface of the substrate; the back of the substrate is paved with a first external conducting strip, a second external conducting strip and a third external conducting strip, the substrate is provided with a plurality of conducting holes penetrating from the front of the substrate to the back of the substrate, the input conducting strip is electrically connected with the first external conducting strip through at least one conducting hole, the output conducting strip is electrically connected with the third external conducting strip through at least one conducting hole, and the grounding conducting strip is electrically connected with the second external conducting strip through at least one conducting hole. The assembly of the base and the filter can be produced by using an automatic chip mounter, so that the automation degree of production is improved, time consumption is reduced, the production efficiency is improved, and the production cost is reduced.
Description
Technical Field
The utility model relates to a filter technology, in particular to an F-shaped filter base.
Background
Digital filters are a common type of electronic component, mainly used in signal processing circuits. The conventional F-type filter (FIR filter) adopts a DIP package form. In the conventional technology, the F-type filter of the DIP package is provided with pins, and when the F-type filter is assembled, the pins are inserted onto the PCB board, and then circuit connection is achieved through wave soldering or manual electric soldering. Such assembly is time consuming, resulting in relatively low production efficiency and relatively high manufacturing costs, which are to be improved.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide an F-shaped filter base so as to reduce assembly time consumption and improve production efficiency.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the F-shaped filter base comprises a base plate, wherein an input conducting plate, an output conducting plate and a grounding conducting plate are paved on the front surface of the base plate, the input conducting plate is used for being attached to and electrically connected with an input pin of a filter, the output conducting plate is used for being attached to and electrically connected with an output pin of the filter, and the grounding conducting plate is used for being attached to and electrically connected with a grounding pin of the filter; the back of the substrate is paved with a first external conducting strip, a second external conducting strip and a third external conducting strip, the substrate is provided with a plurality of conducting holes penetrating from the front of the substrate to the back of the substrate, the input conducting strip is electrically connected with the first external conducting strip through at least one conducting hole, the output conducting strip is electrically connected with the third external conducting strip through at least one conducting hole, and the grounding conducting strip is electrically connected with the second external conducting strip through at least one conducting hole.
The second external conductive sheets are two and each second external conductive sheet is electrically connected with the grounding conductive sheet through at least one conductive hole.
The first external conductive sheet, the second external conductive sheet and the third external conductive sheet are all long-strip-shaped and are parallel to each other.
The inner wall of the conductive hole is provided with a metal plating layer for realizing the electric connection between the front surface and the back surface. The conductive holes are filled with resin.
The input conductive sheet, the output conductive sheet and the grounding conductive sheet are copper foils with nickel plating and gold plating on the surfaces.
The first external conductive sheet, the second external conductive sheet and the third external conductive sheet are copper foils with nickel plating and gold plating on the surfaces.
The substrate is an FR4 circuit board or a resin circuit board.
Compared with the prior art, the utility model has the beneficial effects that: through setting up conducting strip and the conducting strip correspondence on both sides respectively on the base plate front and the back, the filter can be fixed on the base plate front through the encapsulation mode laminating of SMD paster and correspond laminating electricity with positive conducting strip and be connected, and external circuit then corresponds to be connected to the base plate back conducting strip and can realize the electricity with the filter and be connected, so the assembly of base and filter can use automatic chip mounter production, has improved the degree of automation of production, has reduced consuming time, has improved production efficiency, has reduced manufacturing cost. And the filter has no longer pin, so that the space can be saved.
The foregoing description is only an overview of the present utility model, and is intended to be more clearly understood as being carried out in accordance with the following description of the preferred embodiments, as well as other objects, features and advantages of the present utility model.
Drawings
Fig. 1 is a front view of a base according to a first embodiment of the present utility model.
Fig. 2 is a back view of a base of a first embodiment of the present utility model.
Fig. 3 is a side view of a base of a first embodiment of the present utility model.
Fig. 4 is a front view of a base according to a second embodiment of the present utility model.
Fig. 5 is a back view of a base of a second embodiment of the present utility model.
Fig. 6 is a side view of a base of a second embodiment of the present utility model.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and the detailed description, in order to make the objects, technical solutions and advantages of the present utility model more apparent.
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
First embodiment
The first embodiment is an F-type filter base, and its specific structure is shown in fig. 1 to 3.
As shown in fig. 1, the base includes a substrate 10, and the substrate 10 may be an FR4 circuit board or a resin circuit board. An input conductive sheet 21, an output conductive sheet 23 and a ground conductive sheet 22 are laid on the front surface of the substrate 10, the input conductive sheet 21 and the output conductive sheet 23 are provided on both sides of the ground conductive sheet 22, and the input conductive sheet 21 and the output conductive sheet 23 are symmetrical to each other. The input conductive sheet 21 is used for being in fit electrical connection with the input pin of the filter, the output conductive sheet 23 is used for being in fit electrical connection with the output pin of the filter, and the grounding conductive sheet 22 is used for being in fit electrical connection with the grounding pin of the filter. Preferably, the input conductive sheet 21, the output conductive sheet 23 and the ground conductive sheet 22 are copper foils, and the surfaces of the copper foils are plated with nickel and then gold.
As shown in fig. 2, a first external conductive sheet 31, a second external conductive sheet 32, and a third external conductive sheet 33 are laid on the back surface of the substrate 10. The number of the second external conductive sheets 32 is two, and the first external conductive sheet 31, the second external conductive sheet 32 and the third external conductive sheet 33 are elongated and parallel to each other. Preferably, the first external conductive sheet 31, the second external conductive sheet 32 and the third external conductive sheet 33 are all copper foils, and the surfaces of the copper foils are plated with nickel and gold.
As shown in fig. 1 to 3, 8 conductive holes 11 are provided in the substrate 10, and extend from the front surface of the substrate 10 to the back surface of the substrate. The input conductive sheet 21 is electrically connected to the first external conductive sheet 31 through the 2 conductive holes 11, the output conductive sheet 23 is electrically connected to the third external conductive sheet 33 through the 2 conductive holes 11, and the ground conductive sheet 22 is electrically connected to each of the second external conductive sheets 32 through the 2 conductive holes 11, respectively. In application, the external circuit can be correspondingly connected to the first external conductive sheet 31 (input), the second external conductive sheet 32 (ground) and the third external conductive sheet 33 (output) on the back side of the substrate 10, so as to be electrically connected with the filter chip on the front side of the substrate 10.
Further, as shown in fig. 3, the inner wall of the conductive via 11 is provided with a metal plating layer (not shown) for making electrical connection between the front surface and the back surface of the substrate 10, and the metal plating layer is preferably an electroless copper plating layer. And, the inside resin 111 that fills of conductive hole 11, when the positive fixed guard shield that pastes of base plate 10, the filter chip is surrounded by the guard shield, because conductive hole 11 is sealed by resin 111, can promote the inside sealing performance of guard shield, realize dustproof and waterproof, promote the protection to the filter chip.
The base filter of the first embodiment can be attached and fixed on the front surface of the substrate 10 in an SMD patch packaging mode and is correspondingly attached and electrically connected with the front conductive sheet, so that the base and the filter can be assembled by using an automatic chip mounter, the automation degree of production is improved, time consumption is reduced, the production efficiency is improved, and the production cost is reduced.
Second embodiment
The second embodiment is an F-type filter base, and its specific structure is shown in fig. 4 to 6.
As shown in fig. 4, the base includes a substrate 10, and the substrate 10 may be an FR4 circuit board or a resin circuit board. An input conductive sheet 21, an output conductive sheet 23, and a ground conductive sheet 22 are laid on the front surface of the substrate 10, and the input conductive sheet 21 and the output conductive sheet 23 are provided on both sides of the ground conductive sheet 22. The input conductive sheet 21 is adapted to be in electrical contact with the filter input pin, the output conductive sheet 23 is adapted to be in electrical contact with the filter output pin, and the ground conductive sheet 22 is adapted to be in electrical contact with the filter ground pin. Preferably, the input conductive sheet 21, the output conductive sheet 23 and the ground conductive sheet 22 are copper foils, and the surfaces of the copper foils are plated with nickel and then gold.
As shown in fig. 5, a first external conductive sheet 31, a second external conductive sheet 32, and a third external conductive sheet 33 are laid on the back surface of the substrate 10. The number of the second external conductive sheets 32 is two, and the first external conductive sheet 31, the second external conductive sheet 32 and the third external conductive sheet 33 are elongated and parallel to each other. Preferably, the first external conductive sheet 31, the second external conductive sheet 32 and the third external conductive sheet 33 are all copper foils, and the surfaces of the copper foils are plated with nickel and gold.
As shown in fig. 4 to 6, 4 conductive holes 11 are provided in the substrate 10, and extend from the front surface of the substrate 10 to the back surface of the substrate. The input conductive sheet 21 is electrically connected to the first external conductive sheet 31 through 1 conductive hole 11, the output conductive sheet 23 is electrically connected to the third external conductive sheet 33 through 1 conductive hole 11, and the ground conductive sheet 22 is electrically connected to each of the second external conductive sheets 32 through 1 conductive hole 11, respectively. In application, the external circuit can be correspondingly connected to the first external conductive sheet 31 (input), the second external conductive sheet 32 (ground) and the third external conductive sheet 33 (output) on the back side of the substrate 10, so as to be electrically connected with the filter chip on the front side of the substrate 10.
Further, as shown in fig. 6, the inner wall of the conductive via 11 is provided with a metal plating layer (not shown) for making electrical connection of the front surface and the back surface, and the metal plating layer is preferably an electroless copper plating layer. Moreover, the inside of the conductive hole 11 is filled with resin, and when the shield is fixed on the periphery of the front face of the substrate 10, the conductive hole 11 is sealed by the resin, so that the sealing performance of the inside of the shield can be improved, dust prevention and water prevention are realized, and the protection of the filter chip is improved.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms should not be understood as necessarily being directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, one skilled in the art can combine and combine the different embodiments or examples described in this specification.
The foregoing examples are provided to further illustrate the technical contents of the present utility model for the convenience of the reader, but are not intended to limit the embodiments of the present utility model thereto, and any technical extension or re-creation according to the present utility model is protected by the present utility model. The protection scope of the utility model is subject to the claims.
Claims (8)
1. The F-shaped filter base is characterized by comprising a base plate, wherein an input conducting plate, an output conducting plate and a grounding conducting plate are paved on the front surface of the base plate, the input conducting plate is used for being attached and electrically connected with an input pin of a filter, the output conducting plate is used for being attached and electrically connected with an output pin of the filter, and the grounding conducting plate is used for being attached and electrically connected with a grounding pin of the filter; the back of base plate has laid first external conducting strip, second external conducting strip and third external conducting strip, the base plate is equipped with a plurality of from the positive conductive hole that runs through to the base plate back of base plate, the input conducting strip forms electric connection with first external conducting strip through at least one conductive hole, the output conducting strip forms electric connection with third external conducting strip through at least one conductive hole, the ground connection conducting strip forms electric connection with second external conducting strip through at least one conductive hole.
2. The F-filter chassis of claim 1, wherein there are two of said second external conductive strips and each second external conductive strip is electrically connected to said ground conductive strip through at least one conductive via.
3. The F-filter base of claim 1, wherein the first, second and third external conductive strips are elongated and parallel to each other.
4. The F-filter base of claim 1, wherein the inner walls of the conductive vias are provided with a metal plating for making electrical connection of the front and back surfaces.
5. The F-filter base of claim 4, wherein the conductive holes are filled with resin.
6. The F-filter base of any one of claims 1-5, wherein the input conductive pad, the output conductive pad, and the ground conductive pad are copper foils with nickel-plated and gold-plated surfaces.
7. The F-filter base as claimed in any one of claims 1-5, wherein the first, second and third external conductive sheets are copper foils with nickel-plated and gold-plated surfaces.
8. The F-filter base of any one of claims 1-5, wherein the substrate is an FR4 circuit board or a resin circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322021936.XU CN220342294U (en) | 2023-07-30 | 2023-07-30 | F-shaped filter base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322021936.XU CN220342294U (en) | 2023-07-30 | 2023-07-30 | F-shaped filter base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220342294U true CN220342294U (en) | 2024-01-12 |
Family
ID=89459147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322021936.XU Active CN220342294U (en) | 2023-07-30 | 2023-07-30 | F-shaped filter base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220342294U (en) |
-
2023
- 2023-07-30 CN CN202322021936.XU patent/CN220342294U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |