CN212848393U

CN212848393U - Anti-interference radio frequency chip

Info

Publication number: CN212848393U
Application number: CN202021547378.0U
Authority: CN
Inventors: 成传湘; 梁广军; 朱晓磊; 刘栋; 郭潇潇; 曹鑫; 庞宗山
Original assignee: HEBEI JINGHE ELECTRONIC TECHNOLOGY CO LTD
Current assignee: HEBEI JINGHE ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2020-07-30
Filing date: 2020-07-30
Publication date: 2021-03-30
Anticipated expiration: 2030-07-30

Abstract

The utility model discloses an anti-interference radio frequency chip, which comprises a substrate, the substrate is of a square structure, the four sides of the substrate are wrapped with antistatic rubber sleeves, the four corners of the substrate are provided with fastening screws, the four sides of the substrate are provided with a plurality of openings, the middle of the substrate is of a grid shape and is provided with a plurality of ceramic chips, the ceramic chips are of a square structure and comprise a ceramic base, chips and a metal layer, and the ceramic base is wrapped with a copper net; the utility model has the advantages of reasonable design, the integrated level is high, and border cover at the base plate has antistatic rubber sleeve, utilizes antistatic rubber sleeve to provide the protection for the base plate, causes its damage to appear when also can avoiding other metal equipment and base plate contact simultaneously, and inside chip then adopts the copper mesh to carry out the secondary protection, avoids external electromagnetism to cause the interference to the metal connecting strip in the connecting hole in the ceramic base, improves the interference killing feature of chip, reduces the instability that appears when it uses.

Description

Anti-interference radio frequency chip

Technical Field

The utility model belongs to the technical field of the dress technology chip of making pottery, specifically be an anti-interference radio frequency chip.

Background

The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology. The existing ceramic process chip is generally not protected by any object, when the chip is installed in equipment, various conductive parts in the equipment can generate certain electromagnetic radiation, and the radiation easily interferes with a metal connecting strip in a ceramic base, so that the chip is unstable in the using process.

For the problems in the related art, no effective solution is provided at present, and therefore an anti-interference radio frequency chip is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an anti-interference radio frequency chip has advantages such as convenient to use, stability are strong, has solved current dress technology chip poor stability, interference immunity subalternation problem of making pottery.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: an anti-interference radio frequency chip comprises a substrate, wherein the substrate is of a square structure, four sides of the substrate are wrapped with antistatic rubber sleeves, fastening screws are arranged at four corners of the substrate, a plurality of openings are formed in the four sides of the substrate, a plurality of ceramic chips are arranged in the middle of the substrate in a grid shape, and the ceramic chips are of a square structure;

the ceramic chip comprises a ceramic base, a chip and a metal layer, wherein a copper net wraps the ceramic base, the metal layer is fixed above and below the ceramic base, the chip is arranged above the metal layer, the chip is connected with the metal layer through a connecting wire, and the metal layer at the bottom of the ceramic base is connected with the metal layer at the top through a metal connecting strip.

In a further improvement, the metal connecting strip is electrically connected with the metal layer.

In a further improvement, the chip is electrically connected with the metal layer through a connecting wire.

In a further improvement mode, the antistatic rubber sleeve is fixedly bonded with the substrate through glue.

In a further improvement mode, four corners of the antistatic rubber sleeve are rounded corners.

(III) advantageous effects

Compared with the prior art, the utility model provides a dress technology chip makes pottery possesses following beneficial effect:

1. this kind of ceramic art chip, the integrated level is high, has antistatic rubber sleeve at the border cover of base plate, utilizes antistatic rubber sleeve to provide the protection for the base plate, also can avoid simultaneously causing its damage to appear when other metal equipment contacts with the base plate, and inside chip then adopts the copper mesh to carry out the secondary protection, avoids external electromagnetism to cause the interference to the metal connecting strip in the connecting hole in the ceramic base, improves the interference killing feature of chip, reduces the instability that appears when it uses.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the ceramic base of the present invention;

fig. 3 is a side view of the ceramic base of the present invention.

In the figure: 1. a substrate; 2. an antistatic rubber sleeve; 3. fastening screws; 4. an opening; 5. a ceramic chip; 501. a ceramic base; 502. a chip; 503. a connecting wire; 504. a metal connecting strip; 505. a copper mesh; 506. a metal layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an anti-interference radio frequency chip comprises a substrate 1, wherein the substrate 1 is of a square structure, four sides of the substrate 1 are wrapped with antistatic rubber sleeves 2, four corners of the substrate 1 are respectively provided with a fastening screw 3, four sides of the substrate 1 are respectively provided with a plurality of openings 4, the middle of the substrate 1 is provided with a plurality of ceramic chips 5 in a grid shape, and the ceramic chips 5 are of a square structure;

ceramic chip 5 includes ceramic base 501, chip 502, metal level 506, the parcel has copper mesh 505 on the ceramic base 501, ceramic base 501 top and below all are fixed with metal level 506, the top metal level 506 top is provided with chip 502, chip 502 is connected with metal level 506 through connecting wire 503, the metal level 506 and the metal connecting strip 504 of ceramic base 501 bottom are connected in the metal level 506 at top.

As shown in fig. 2, the metal connecting strip 504 is electrically connected to the metal layer 506, and the chip 502 is electrically connected to the metal layer 506 through a connecting wire 503.

As shown in fig. 1, the antistatic rubber sleeve 2 is fixedly bonded with the substrate 1 through glue, and four corners of the antistatic rubber sleeve 2 are rounded corners to replace a conventional right-angle structure, so that the safety of the substrate is improved.

The working principle is as follows: at first, provide the protection for 1 four corners of base plate through antistatic rubber sleeve 2, avoid other circuit boards to cause the interference to base plate 1, also can avoid base plate 1 four sides to cause the damage to other in the installation, improve the security. On the ceramic chip 5, the metal connecting strip 504 in the ceramic chip 5 is protected by the anti-shielding effect of the copper mesh 505, so that the interference of external electromagnetic signals on the metal connecting strip is avoided, and the stability of the metal connecting strip in the use process is improved.

To sum up, the utility model discloses rational in infrastructure, the integrated level is high, border cover at base plate 1 has antistatic rubber sleeve 2, utilize antistatic rubber sleeve 2 to provide the protection for base plate 1, cause its damage to appear when also can avoiding other metal equipment to contact with base plate 1 simultaneously, and inside chip 502 then adopts copper mesh 505 to carry out the secondary protection, avoid external electromagnetism to cause the interference to the metal connecting strip 504 in the connecting hole in ceramic base 501, improve chip 502's interference killing feature, reduce the instability that appears when it uses.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An anti-interference radio frequency chip comprises a substrate (1), and is characterized in that: the substrate (1) is of a square structure, the four sides of the substrate (1) are wrapped with antistatic rubber sleeves (2), fastening screws (3) are arranged at the four corners of the substrate (1), a plurality of openings (4) are arranged at the four sides of the substrate (1), a plurality of ceramic chips (5) are arranged in the middle of the substrate (1) in a grid shape, and the ceramic chips (5) are of a square structure;

ceramic chip (5) include ceramic base (501), chip (502), metal level (506), the parcel has copper mesh (505) on ceramic base (501), ceramic base (501) top and below all are fixed with metal level (506), top metal level (506) top is provided with chip (502), chip (502) are connected with metal level (506) through connecting wire (503), metal level (506) and the metal connecting strip (504) of ceramic base (501) bottom are connected in metal level (506) at top.

2. The anti-jamming radio frequency chip according to claim 1, wherein: the metal connecting strip (504) is electrically connected with the metal layer (506).

3. The anti-jamming radio frequency chip according to claim 1, wherein: the chip (502) and the metal layer (506) are electrically connected through a connecting wire (503).

4. The anti-jamming radio frequency chip according to claim 1, wherein: the antistatic rubber sleeve (2) is fixedly bonded with the substrate (1) through glue.

5. The anti-jamming radio frequency chip according to claim 1, wherein: four corners of the antistatic rubber sleeve (2) are fillets.