CN212851186U - Circuit board with insulating layer for automobile - Google Patents

Circuit board with insulating layer for automobile Download PDF

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Publication number
CN212851186U
CN212851186U CN202022021954.4U CN202022021954U CN212851186U CN 212851186 U CN212851186 U CN 212851186U CN 202022021954 U CN202022021954 U CN 202022021954U CN 212851186 U CN212851186 U CN 212851186U
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CN
China
Prior art keywords
fixedly connected
circuit board
heat
insulating layer
heat conducting
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Expired - Fee Related
Application number
CN202022021954.4U
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Chinese (zh)
Inventor
汪杰
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Shenzhen Jianfa Technology Electronics Co ltd
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Shenzhen Jianfa Technology Electronics Co ltd
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Priority to CN202022021954.4U priority Critical patent/CN212851186U/en
Application granted granted Critical
Publication of CN212851186U publication Critical patent/CN212851186U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to the technical field of automobile production and manufacturing, in particular to an automobile circuit board with an insulating layer, which comprises a circuit board main body, heat conducting rods and connecting rods, wherein the heat conducting rods are uniformly distributed in the circuit board main body, the bottom of the heat conducting rods is fixedly connected with a heat radiating plate, the top of the circuit board main body is fixedly connected with an upper heat conducting silica gel layer, the top of the upper heat conducting silica gel layer is fixedly connected with an upper soaking plate, and the top of the upper soaking plate is fixedly connected with an upper insulating layer, reduce the damage to the circuit board main part.

Description

Circuit board with insulating layer for automobile
Technical Field
The utility model relates to an automobile manufacturing technical field specifically is a circuit board with insulating layer for car.
Background
The circuit board is also called as a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board, a PCB, an ultrathin circuit board, a printed (copper etching technology) circuit board and the like, the circuit board enables the circuit to be miniaturized and visualized, plays an important role in mass production of fixed circuits and optimization of electrical appliance layout, and can be called as a printed circuit board or a printed circuit board.
The conventional circuit board is a circuit board, various electronic elements are integrated on the circuit board, and due to the complex use environment of the automobile, a large amount of static electricity can damage the circuit board, so that the circuit board is damaged, the automobile can be damaged, casualties and the like are caused, and therefore the circuit board with the insulating layer for the automobile is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board with insulating layer for car to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a circuit board with an insulating layer for an automobile comprises a circuit board main body, heat conducting rods and connecting rods, wherein the heat conducting rods are uniformly distributed in the circuit board main body, the bottom of each heat conducting rod is fixedly connected with a heat dissipation plate, the top of the circuit board main body is fixedly connected with an upper heat conducting silica gel layer, the top of the upper heat conducting silica gel layer is fixedly connected with an upper soaking plate, the top of the upper soaking plate is fixedly connected with an upper insulating layer, the bottom of the circuit board main body is fixedly connected with a lower heat conducting silica gel layer, the bottom of the lower heat conducting silica gel layer is fixedly connected with a lower soaking plate, the bottom of the lower soaking plate is fixedly connected with a lower insulating layer, the outer side of the circuit board main body is fixedly connected with a graphene layer, the outer side of the graphene layer is fixedly connected, the connecting rod is internally provided with a through hole and is fixedly connected with a fixing rod through the through hole, and the bottom of the fixing rod is spirally connected with a screw.
Preferably, the heat conducting rods are composed of beryllium oxide ceramic blocks, the number of the heat conducting rods is nine, the heat conducting rods are uniformly distributed in the circuit board main body, the outer side of the heat dissipation plate is fixedly connected with the lower insulating layer 3, the heat dissipation block is composed of beryllium oxide ceramic blocks, the heat dissipation block is fixedly connected in the upper insulating layer, and the heat dissipation block is fixedly connected in the lower insulating layer.
Preferably, the outside of the top of the heat conducting rod is provided with an upper heat conducting silica gel layer, the outside of the central position of the heat conducting rod is provided with a lower heat conducting silica gel layer, the outside of the lower part of the heat conducting rod is provided with a lower soaking plate, and the outside of the bottom of the heat conducting rod is provided with a lower insulating layer.
Preferably, the upper heat-conducting silica gel layer is internally provided with through holes which are uniformly distributed, the lower vapor chamber is internally provided with through holes which are uniformly distributed, the lower insulating layer is provided with through holes which are uniformly distributed, and the lower insulating layer is fixedly connected with the connecting rod through the through holes.
Preferably, the top of the fixing block is fixedly connected with the upper heat-conducting silica gel layer, the bottom of the fixing block is fixedly connected with a fixing rod, the connecting rod is composed of a high polymer plastic block, and the fixing rod is composed of a steel block.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, can derive the heat in the circuit board main part to the heating panel through the lower soaking plate, lower heat conduction silica gel layer and the heat conduction pole that set up, derive the heat through the heating panel, can derive the heat in the circuit board main part outside to the radiating block through graphite alkene layer simultaneously, derive the heat through the radiating block, this setting can be effectively when insulating circuit board main part derive the heat, reduce the damage to circuit board main part, make the car can the steady operation, reduce the emergence of accident;
2. the utility model discloses in, through connecting rod, fixed block and the screw that sets up, can fix the circuit board main part on the car, the circuit board can not contact with the car under the supporting role of connecting rod and fixed block, when the car was traveling in the highway section of jolting, can prevent circuit board main part and car bump through connecting rod and fixed block, the shielding layer can prevent the interference of the electromagnetic field of static production in the fixed block to the circuit board main part simultaneously.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the bottom structure of the lower insulating layer of the present invention;
FIG. 3 is a schematic view of the fixing rod mounting structure of the present invention;
fig. 4 is a schematic view of the mounting structure of the heat sink of the present invention.
In the figure: 1-a circuit board main body, 2-an upper insulating layer, 3-a lower insulating layer, 4-an upper soaking plate, 5-an upper heat conduction silica gel layer, 6-a lower soaking plate, 7-a lower heat conduction silica gel layer, 8-a heat conduction rod, 9-a heat dissipation plate, 10-a graphene layer, 11-a heat dissipation block, 12-a connecting rod, 13-a fixing rod, 14-a shielding layer, 15-a fixing block and 16-a screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
a circuit board with an insulating layer for an automobile comprises a circuit board main body 1, heat conducting rods 8 and connecting rods 12, wherein the heat conducting rods 8 are uniformly distributed in the circuit board main body 1, a heat dissipation plate 9 is fixedly connected to the bottom of each heat conducting rod 8, an upper heat conducting silica gel layer 5 is fixedly connected to the top of the circuit board main body 1, an upper soaking plate 4 is fixedly connected to the top of each upper heat conducting silica gel layer 5, an upper insulating layer 2 is fixedly connected to the top of each upper soaking plate 4, a lower heat conducting silica gel layer 7 is fixedly connected to the bottom of the circuit board main body 1, a lower soaking plate 6 is fixedly connected to the bottom of the lower heat conducting silica gel layer 7, a lower insulating layer 3 is fixedly connected to the bottom of the lower soaking plate 6, a graphene layer 10 is fixedly connected to the outer side of the circuit board main body 1, a, the main board is protected, a fixing block 15 is fixedly connected to the top of the circuit board main body 1, a connecting rod 12 is fixedly connected to the bottom of the fixing block 15, a shielding layer 14 is fixedly connected to the inner portion of the connecting rod 12, a through hole is formed in the connecting rod 12, the connecting rod 12 is fixedly connected with a fixing rod 13 through the through hole, a screw 16 is spirally connected to the bottom of the fixing rod 13, and the circuit board main body 1 can be prevented from colliding with an automobile when the circuit board main body 1 is fixed to the automobile through the screw, so that.
The heat conducting rods 8 are composed of beryllium oxide ceramic blocks, the number of the heat conducting rods 8 is nine, the heat conducting rods 8 are uniformly distributed in the circuit board main body 1, the outer side of a heat radiating plate 9 is fixedly connected with the lower insulating layer 3, the heat radiating block 11 is composed of the beryllium oxide ceramic blocks, the heat radiating block 11 is fixedly connected in the upper insulating layer 2, the heat radiating block 11 is fixedly connected in the lower insulating layer 3, heat in the circuit board main body 1 can be led out through the arrangement, the circuit board main body 1 is prevented from being damaged due to overhigh temperature in the circuit board main body 1, the outer side of the top of each heat conducting rod 8 is provided with an upper heat conducting silica gel layer 5, the outer side of the central position of each heat conducting rod 8 is provided with a lower heat conducting silica gel layer 7, the outer side of the lower part of each heat conducting rod 8 is provided with a lower soaking plate 6, the outer side of the bottom, go up and to have seted up in heat conduction silica gel layer 5 and be evenly distributed's through-hole, set up the through-hole that is evenly distributed in lower heat conduction silica gel layer 7, set up the through-hole that is evenly distributed in lower soaking plate 6, the through-hole that is evenly distributed is seted up to lower insulating layer 3, lower insulating layer 3 is through establishing through-hole and connecting rod 12 fixed connection, heat effluvium with in the circuit board main part 1 that can be convenient through this setting, it is more stable when making circuit board main part 1 move, fixed block 15 top and last heat conduction silica gel layer 5 fixed connection, fixed block 15 bottom fixedly connected with dead lever 13, connecting rod 12 comprises the polymer plastic block, dead lever 13 comprises the steel billet, can prevent through this setting that static from getting into circuit board main part 1 through dead lever 13.
The working process is as follows: when the circuit board with the insulating layer is used, firstly, the screw 16 in spiral connection with the bottom of the fixed rod 13 is taken down, then the circuit board is placed at a proper position, at the moment, the screw 16 penetrates through a through hole arranged on an automobile to be contacted with the fixed rod 13, at the moment, the screw 16 is rotated to lead the screw 16 to be in spiral connection with the fixed rod 13, at the moment, other three screws 13 penetrate through limiting holes arranged on the automobile to be in spiral connection with other three fixed rods 13, at the moment, the circuit board is fixedly connected with the automobile through the screw 16 and the fixed rod 13, at the moment, under the action of the connecting rod 12 formed by the polymer plastic block, static electricity in the automobile can be prevented from reaching the circuit board main body 1 through the fixed rod 13, the circuit board main body 1 is prevented from being damaged, meanwhile, through the shielding layer 14, the electromagnetic damage to the circuit board main body 1 can be, meanwhile, a large amount of heat is generated when the circuit board main body 1 works, the circuit board main body 1 is damaged by the heat in the sealed upper insulating layer 2 and the sealed lower insulating layer 3, the heat generated in the circuit board main body 1 is led out through the upper heat-conducting silica gel layer 5 and the lower heat-conducting silica gel layer 7 and enters the upper soaking plate 4 and the lower soaking plate 6, the heat is uniformly transferred to the positions of the upper soaking plate 4 and the lower soaking plate 6 under the action of the upper soaking plate 4 and the lower soaking plate 6, the heat in the upper soaking plate 4 and the lower soaking plate 6 and the upper heat-conducting silica gel layer 5 and the lower heat-conducting silica gel layer 7 are led out downwards to the heat dissipation plate 9 through the heat dissipation plate, and the heat is dissipated through the heat dissipation plate, meanwhile, the graphene layer 10 positioned on the outer side of the circuit board main body 1 can conduct heat on the outer side of the circuit board main body 1 to the heat dissipation block 11, and the heat is conducted out of the upper insulating layer 2 and the lower insulating layer 3 through the heat dissipation block 11.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a circuit board with insulating layer for car, includes circuit board main part (1), heat conduction pole (8) and connecting rod (12), its characterized in that: the heat conducting rod (8) which is uniformly distributed is arranged in the circuit board main body (1), the bottom of the heat conducting rod (8) is fixedly connected with a heat radiating plate (9), the top of the circuit board main body (1) is fixedly connected with an upper heat conducting silica gel layer (5), the top of the upper heat conducting silica gel layer (5) is fixedly connected with an upper soaking plate (4), the top of the upper soaking plate (4) is fixedly connected with an upper insulating layer (2), the bottom of the circuit board main body (1) is fixedly connected with a lower heat conducting silica gel layer (7), the bottom of the lower heat conducting silica gel layer (7) is fixedly connected with a lower soaking plate (6), the bottom of the lower soaking plate (6) is fixedly connected with a lower insulating layer (3), the outer side of the circuit board main body (1) is fixedly connected with a graphene layer (10), the outer side of the graphene layer (10), the fixing block (15) bottom fixedly connected with connecting rod (12), fixedly connected with shielding layer (14) in connecting rod (12), the through-hole has been seted up in connecting rod (12), connecting rod (12) are through establishing through-hole and dead lever (13) fixed connection, dead lever (13) bottom screwed connection has screw (16).
2. The wiring board with an insulating layer for an automobile according to claim 1, characterized in that: the heat conducting rods (8) are composed of beryllium oxide ceramic blocks, the number of the heat conducting rods (8) is nine, the heat conducting rods (8) are uniformly distributed in the circuit board main body (1), the outer side of the heat dissipation plate (9) is fixedly connected with the lower insulating layer (3), the heat dissipation block (11) is composed of the beryllium oxide ceramic blocks, the heat dissipation block (11) is fixedly connected in the upper insulating layer (2), and the heat dissipation block (11) is fixedly connected in the lower insulating layer (3).
3. The wiring board with an insulating layer for an automobile according to claim 1, characterized in that: the solar cell is characterized in that a heat conducting silica gel layer (5) is arranged on the outer side of the top of the heat conducting rod (8), a lower heat conducting silica gel layer (7) is arranged on the outer side of the central position of the heat conducting rod (8), a lower soaking plate (6) is arranged on the outer side of the lower portion of the heat conducting rod (8), and a lower insulating layer (3) is arranged on the outer side of the bottom of the heat conducting rod (8).
4. The wiring board with an insulating layer for an automobile according to claim 1, characterized in that: the improved heat-conducting silicon heat-conducting plate is characterized in that through holes which are uniformly distributed are formed in the upper heat-conducting silicon gel layer (5), the through holes which are uniformly distributed are formed in the lower heat-conducting silicon gel layer (7), the through holes which are uniformly distributed are formed in the lower soaking plate (6), the through holes which are uniformly distributed are formed in the lower insulating layer (3), and the lower insulating layer (3) is fixedly connected with the connecting rod (12) through the formed through holes.
5. The wiring board with an insulating layer for an automobile according to claim 1, characterized in that: fixed block (15) top and last heat conduction silica gel layer (5) fixed connection, fixed block (15) bottom fixedly connected with dead lever (13), connecting rod (12) comprise the polymer plastic piece, dead lever (13) comprise the steel billet.
CN202022021954.4U 2020-09-16 2020-09-16 Circuit board with insulating layer for automobile Expired - Fee Related CN212851186U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022021954.4U CN212851186U (en) 2020-09-16 2020-09-16 Circuit board with insulating layer for automobile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022021954.4U CN212851186U (en) 2020-09-16 2020-09-16 Circuit board with insulating layer for automobile

Publications (1)

Publication Number Publication Date
CN212851186U true CN212851186U (en) 2021-03-30

Family

ID=75150069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022021954.4U Expired - Fee Related CN212851186U (en) 2020-09-16 2020-09-16 Circuit board with insulating layer for automobile

Country Status (1)

Country Link
CN (1) CN212851186U (en)

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210330

Termination date: 20210916