CN202269094U - Printed circuit board module group and electronic equipment - Google Patents
Printed circuit board module group and electronic equipment Download PDFInfo
- Publication number
- CN202269094U CN202269094U CN 201120380985 CN201120380985U CN202269094U CN 202269094 U CN202269094 U CN 202269094U CN 201120380985 CN201120380985 CN 201120380985 CN 201120380985 U CN201120380985 U CN 201120380985U CN 202269094 U CN202269094 U CN 202269094U
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- electro
- screen layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a printed circuit board module group, which comprises a printed circuit board body and an electromagnetic shielding layer, wherein the printed circuit board body and the electromagnetic shielding layer form an integral structure, the electromagnetic shielding layer is positioned at the outer side edge of the printed circuit board body, and the shielding layer and the printed circuit board body are in contact and are mutually isolated. The utility model also provides electronic equipment adopting the printed circuit board module group. The printed circuit board module group and the electronic equipment have the advantages that the electromagnetic shielding layer and the printed circuit board body form the integral structure, the effect of shielding the electromagnetic interference can be realized, the heat radiation effect can also be enhanced, and the whole size of the printed circuit board module group and the electronic equipment adopting the printed circuit board module group can be reduced.
Description
Technical field
The utility model relates to electronic technology field, relates in particular to a kind of electromagnetic shielding and good heat dissipation effect, the printed circuit board (PCB) that simultaneously volume is little (Printed Circuit Board, PCB) module and the electronic equipment of using said printed circuit board (PCB) module.
Background technology
, numerous advantages such as integrated level high, portability and versatility low along with cost, printed circuit board (PCB) has occupied numerous products highland in industrialization epoch at present.
Follow the development of technology, constantly promote for the specification requirement of printed circuit board (PCB), it is exactly effectiveness that one of them important techniques requires.So-called electromagnetic shielding is exactly to be surrounded with the signal emitting-source of shield with components and parts, circuit, sub-assembly, cable or whole system, prevents that interfere with electromagnetic field is to outdiffusion; Perhaps receiving circuit, equipment or system are surrounded, prevent that them from receiving the influence of external electromagnetic field with shield.
Because printed circuit board (PCB) is when work; Constantly externally discharge electromagnetic interference; In the time of in being applied to numerous products such as electronic equipment, electrical equipment; The electromagnetic interference of printed circuit board (PCB) possibly cause the undesired of other elements, even produces serious functional fault, has reduced reliability of products and interference free performance.Therefore effectiveness how to carry out the printed circuit board (PCB) module is an extremely important research topic.
The utility model content
To the electromagnetic shielding and the bad problem of radiating effect of prior art printed circuit board (PCB), the utility model provides a kind of electromagnetic shielding and good heat dissipation effect, simultaneously the less printed circuit board (PCB) module of volume.
The utility model provides a kind of printed circuit board (PCB) module; Said printed circuit board (PCB) module comprises printed circuit board (PCB) body and electro-magnetic screen layer; Said printed circuit board (PCB) body and said electro-magnetic screen layer are integrally formed structure; Said electro-magnetic screen layer is positioned at the outside of said printed circuit board (PCB) body, and said electro-magnetic screen layer contacts and mutually insulated with said printed circuit board (PCB) body.
As the further improvement of above-mentioned printed circuit board (PCB) module, said electro-magnetic screen layer is a metal level.
As the further improvement of above-mentioned printed circuit board (PCB) module, the material of said electro-magnetic screen layer is a metallic copper material.
As the further improvement of above-mentioned printed circuit board (PCB) module, said electro-magnetic screen layer is the chemical deposition layer.
As the further improvement of above-mentioned printed circuit board (PCB) module, said electro-magnetic screen layer is an electrodeposited coating.
As the further improvement of above-mentioned printed circuit board (PCB) module, said printed circuit board (PCB) body comprises insulated substrate and is arranged on the components and parts on the said insulated substrate.
As the further improvement of above-mentioned printed circuit board (PCB) module, the thickness of said printed circuit board (PCB) body is smaller or equal to 2.0mm.
Simultaneously; The utility model also provides a kind of electronic equipment; Said electronic equipment comprises the printed circuit board (PCB) module, and said printed circuit board (PCB) module comprises printed circuit board (PCB) body and electro-magnetic screen layer, and said printed circuit board (PCB) body and said electro-magnetic screen layer are integrally formed structure; Said electro-magnetic screen layer is positioned at the outer ledge of said printed circuit board (PCB) body, and said electro-magnetic screen layer contacts but mutually insulated with said printed circuit board (PCB) body.
Printed circuit board (PCB) module of the utility model and the electro-magnetic screen layer in the electronic equipment and printed circuit board (PCB) body are integrally formed structure; Not only can play the effect of shield electromagnetic interference, the overall volume that can also reduce the printed circuit board (PCB) module and use the electronic equipment of said printed circuit board (PCB) module.In addition, because electro-magnetic screen layer adopts the good conductor of heat usually, so; When printed circuit board (PCB) is worked; The corresponding heat energy that produces of components and parts running that is provided with on it can in time conduct in the outside air through electro-magnetic screen layer, avoids heat accumulation, enhances product performance.
Description of drawings
Fig. 1 is the plan cross-section structural representation of the utility model printed circuit board (PCB) module one preferred embodiment.
Fig. 2 is the side structure sketch map of printed circuit board (PCB) module shown in Figure 1.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiment of the utility model is set forth in detail, thereby the protection range of the utility model is made more explicit defining so that advantage of the utility model and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1 and Fig. 2, wherein Fig. 1 is the plan cross-section structural representation of the utility model printed circuit board (PCB) module one preferred embodiment, and Fig. 2 is the side structure sketch map of printed circuit board (PCB) module shown in Figure 1.The printed circuit board (PCB) module 10 of the utility model is applied in the electronic equipment (figure does not show), and said printed circuit board (PCB) module 10 comprises printed circuit board (PCB) body 12 and electro-magnetic screen layer 14.
Said printed circuit board (PCB) body 12 is the chief component of said printed circuit board (PCB) module 10, and its thickness can be smaller or equal to 2.0mm, and concrete actual size is decided according to the product process requirements, and through verification experimental verification, its integral thickness can be less than 2.0mm at present.Said printed circuit board (PCB) body 12 comprises insulated substrate, conductive layer and is arranged on a plurality of components and parts (figure does not show) on the said insulated substrate, components and parts such as said components and parts such as resistance, electric capacity, inductance.Said insulated substrate provides the basis of physical support and electrical connection as main carrier for other components and parts.Said insulated substrate can comprise the folded base material of establishing of multilayer.The shape of said insulated substrate can be the required shape of product designs such as rectangle, pentagon.Said conductive layer is positioned at the surface of said insulated substrate, and its material is generally metallic copper.Further; Said printed circuit board (PCB) body 12 can also comprise the surface insulation layer that covers said conductive layer surface, and the material of said surface insulation layer can be polyimides (Polyimide is called for short PI); Polyimides has non-flammable; Physical dimension is stable, has higher tear resistance, and has the ability of the welding temperature of bearing.
Said electro-magnetic screen layer 14 is integrally formed structure with said printed circuit board (PCB) body 12, and said electro-magnetic screen layer 14 is positioned at the outer ledge of said printed circuit board (PCB) body 12, and coats the outer ledge of said printed circuit board (PCB) body 12 fully.Further, said electro-magnetic screen layer 14 is positioned at the outer ledge of said insulated substrate, and it contacts but mutually insulated with the said insulated substrate of said printed circuit board (PCB) body 12.
Preferably, said electro-magnetic screen layer 14 can be metal level, for example metallic copper material.
Preferably, said electro-magnetic screen layer 14 can be the chemical deposition layer, and promptly said electro-magnetic screen layer 14 can be formed on said printed circuit board (PCB) module 10 surfaces through chemical deposition.In addition, said electro-magnetic screen layer 14 can also be electrodeposited coating, and promptly said electro-magnetic screen layer 14 can be formed on said printed circuit board (PCB) module 10 surfaces through electric plating method.
Components and parts on the said printed circuit board (PCB) body 12 are to be embedded in the plate of said printed circuit board (PCB) body 12; So said electro-magnetic screen layer 14 and components and parts mutually insulated; And can effectively shield the electromagnetic interference of external interference source to the components and parts of said printed circuit board (PCB) module 10, also can effectively shield the external electromagnetic interference of said printed circuit board (PCB) module 10.Because said electro-magnetic screen layer 14 is integrally formed structure with said printed circuit board (PCB) body 12; Be that said printed circuit board (PCB) module 10 does not need independently electromagnetic screen of extra setting, so the printed circuit board (PCB) module 10 of the utility model have the advantage that effectiveness is good and overall volume is less.In addition, the material of said electro-magnetic screen layer 14 is generally metal layer material, so its radiating effect is also preferable, thereby the corresponding integral heat sink effect that promotes said printed circuit board (PCB) module 10 is avoided heat accumulation.
The invention also discloses a kind of electronic equipment (figure does not show) of using above-mentioned printed circuit board (PCB) module 10, said printed circuit board (PCB) module 10 electrically connects with other interior one or more electronic components of said electronic equipment.
Certainly, in said printed circuit board (PCB) module 10, said electro-magnetic screen layer 14 can also be the structure that only coats the side edge region of said printed circuit board (PCB) body 12.
Printed circuit board (PCB) module of the utility model and the electro-magnetic screen layer in the electronic equipment and printed circuit board (PCB) body are integrally formed structure; Not only can play the effect of shield electromagnetic interference, the overall volume that can also reduce printed circuit board (PCB) module 10 and use the electronic equipment of said printed circuit board (PCB) module.
More than be merely the preferred case study on implementation of the utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various changes and variation.All within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.
Claims (8)
1. printed circuit board (PCB) module; Comprise the printed circuit board (PCB) body; It is characterized in that said printed circuit board (PCB) module further comprises electro-magnetic screen layer, said printed circuit board (PCB) body and said electro-magnetic screen layer are integrally formed structure; Said electro-magnetic screen layer is positioned at the outer ledge of said printed circuit board (PCB) body, and said electro-magnetic screen layer contacts and mutually insulated with said printed circuit board (PCB) body.
2. printed circuit board (PCB) module according to claim 1 is characterized in that, said electro-magnetic screen layer is a metal level.
3. printed circuit board (PCB) module according to claim 2 is characterized in that, the material of said electro-magnetic screen layer is a metallic copper material.
4. printed circuit board (PCB) module according to claim 1 is characterized in that, said electro-magnetic screen layer is the chemical deposition layer.
5. printed circuit board (PCB) module according to claim 1 is characterized in that, said electro-magnetic screen layer is an electrodeposited coating.
6. printed circuit board (PCB) module according to claim 1 is characterized in that, said printed circuit board (PCB) body comprises insulated substrate and is arranged on the components and parts on the said insulated substrate.
7. printed circuit board (PCB) module according to claim 1 is characterized in that the thickness of said printed circuit board (PCB) body is less than or equal to 2.0mm.
8. an electronic equipment is characterized in that, said electronic equipment comprises the arbitrary described printed circuit board (PCB) module of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120380985 CN202269094U (en) | 2011-09-30 | 2011-09-30 | Printed circuit board module group and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120380985 CN202269094U (en) | 2011-09-30 | 2011-09-30 | Printed circuit board module group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202269094U true CN202269094U (en) | 2012-06-06 |
Family
ID=46159873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120380985 Expired - Lifetime CN202269094U (en) | 2011-09-30 | 2011-09-30 | Printed circuit board module group and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202269094U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486919A (en) * | 2014-11-18 | 2015-04-01 | 广德宝达精密电路有限公司 | Printed panel and case |
| CN109041559A (en) * | 2018-08-10 | 2018-12-18 | 深圳市信维通信股份有限公司 | Shielding construction manufacturing method in band-like radio-frequency transmission line/micro-strip radio-frequency transmission line |
-
2011
- 2011-09-30 CN CN 201120380985 patent/CN202269094U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486919A (en) * | 2014-11-18 | 2015-04-01 | 广德宝达精密电路有限公司 | Printed panel and case |
| CN109041559A (en) * | 2018-08-10 | 2018-12-18 | 深圳市信维通信股份有限公司 | Shielding construction manufacturing method in band-like radio-frequency transmission line/micro-strip radio-frequency transmission line |
| CN109041559B (en) * | 2018-08-10 | 2020-11-24 | 深圳市信维通信股份有限公司 | Manufacturing method of shielding structure in strip radio frequency transmission line/microstrip radio frequency transmission line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ran Yanxiang Inventor after: Cai Zhihao Inventor before: Ran Yanxiang |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151103 Address after: 523000 Shijie, Dongguan, Liu Zhen Town, No. science and technology road, No. 161 Patentee after: DONGGUAN HAOYUAN ELECTRONICS CO., LTD. Address before: 523000 Shijie, Dongguan, Liu Zhen Town, No. science and technology road, No. 161 Patentee before: Dongguan Wuzhu Electronic Technology Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120606 |
|
| CX01 | Expiry of patent term |