CN202679794U - Flexible printed circuit board and electronic module adopting same - Google Patents
Flexible printed circuit board and electronic module adopting same Download PDFInfo
- Publication number
- CN202679794U CN202679794U CN 201220347245 CN201220347245U CN202679794U CN 202679794 U CN202679794 U CN 202679794U CN 201220347245 CN201220347245 CN 201220347245 CN 201220347245 U CN201220347245 U CN 201220347245U CN 202679794 U CN202679794 U CN 202679794U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- layer
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a flexible printed circuit board and an electronic module adopting the same. The flexible printed circuit board comprise an electrical conducting layer, a substrate body and a grounding shielding layer, wherein the electrical conducting layer and the grounding shielding layer are respectively arranged on two opposite side surfaces of the substrate body, the grounding shielding layer is a silver foil layer, and the silver foil layer is arranged in a manner of being mutually insulated with the electrical conducting layer. The flexible printed circuit board provided by the utility model has good reliability and excellent flexibility.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB) and electronics module thereof, especially relates to a kind of flexible printed circuit board and electronics module thereof of tool function of shielding.
Background technology
Along with the develop rapidly of electronic industry, seem more and more important as the manufacturing technology of the printed circuit board (PCB) of electronic product basic building block.Printed circuit board (PCB) (Printed Circuit Board, PCB) comprise rigid printed circuit board (Rigid Printed Circuit Board, Rigid PCB), the printed circuit board (PCB) (Rigid Flexible PCB) of flexible printed circuit board (Flexible Printed Circuit Board, Flexible PCB) and soft or hard combination.Therefore printed circuit board (PCB) is widely used in all kinds of electronic building bricks because have the characteristics such as distribution density is high, lightweight, thin thickness.
Printed circuit board (PCB) generally by copper-clad base plate through cut, the series of process such as boring, etching, exposure, development, pressing, moulding is made.Usually, the outer field earthing circuit layer of printed circuit board (PCB) need to form the anti-welding cover layer protection circuit of one deck; Then, make earth shield structure in the anti-welding tectal outside and be electrically connected circuit board to be carried out the earth shield processing with this earthing circuit layer, thereby with the electrostatic guide that produces in the circuit board out to eliminate the static in the circuit board, and shield electromagnetic interference mutual between this circuit board and extraneous other electronic devices and components, improve the job stability of circuit board or extraneous other electronic devices and components.
Existing electrically conductive shield structure mainly is to use metal-core printed circuit board structure (Metal Core PCB, MCPCB).Described printed circuit board (PCB) comprises Copper Foil (circuit) layer, insulation (dielectric) layer and three kinds of stacking formation of unlike material of metal substrate (metallic core) layer that stacking formation successively is connected, it mainly utilizes metallic core to be connected with ground connection weld pad in the circuit layer, so that ground connection weld pad and aluminium base realize being electrically connected, thereby with the derivation of the static in the circuit board and play electromagnetic shielding action.Simultaneously, described metallic core can also play electromagnetic shielding and effective heat conducting effect.
Yet above-mentioned electrically conductive shield structure may be able to not be derived elimination with the static in the circuit board fully fully, and partial electrostatic may remain in the conductive adhesive of bonding insulation (dielectric) layer and aluminium base, can't effectively eliminate.And, along with frivolous miniaturization and the flexible type trend of circuit board, being subject to the wiring area of circuit board, metal substrate also requires to do more and more thinlyyer.Like this, owing to increasing technology difficulty.Simultaneously, because metal base increases the bend resistance coefficient of whole circuit board, be difficult to satisfy good bending demand.
Given this, defective how to improve above-mentioned printed circuit board (PCB) is the industry problem demanding prompt solution.
The utility model content
The technical problem not good for prior art flexible printed circuit board reliability performance, that pliability is poor, the utility model provide a kind of good reliability, pliability good flexible printed circuit board.
Simultaneously, the utility model also provides a kind of electronics module of using above-mentioned flexible printed circuit board.
A kind of flexible printed circuit board, it comprises electrically conductive layer, substrate body and ground shield, described electrically conductive layer and described ground shield are separately positioned on the two opposite sides surface of described substrate body, described ground shield is the silver foil layer, described silver foil layer and the setting insulated from each other of described electrically conductive layer.
As the further improvement of above-mentioned flexible printed circuit board, described electrically conductive layer is calendering copper layer or copper electroplating layer, and it is bonding to be arranged on described substrate body one side surface.
As the further improvement of above-mentioned flexible printed circuit board, the bonding opposite side surface that is arranged on described substrate body of described silver foil layer.
As the further improvement of above-mentioned flexible printed circuit board, described flexible printed circuit board also comprises surface insulation layer, and it is stacked to be arranged on described electrically conductive layer outer surface.
A kind of electronics module, it comprises flexible printed circuit board, described flexible printed circuit board comprises electrically conductive layer, substrate body and ground shield, described electrically conductive layer and described ground shield are separately positioned on the two opposite sides surface of described substrate body, described ground shield is the silver foil layer, described silver foil layer and the setting insulated from each other of described electrically conductive layer.
Compared to prior art, flexible printed circuit board of the present utility model and electronics module, the Copper Foil or the silver that adopt silver foil to replace prior art are starched, as the ground shield of flexible printed circuit board, when improving the whole bend resistance intensity of described flexible printed circuit board, also improve its pliability.The thickness of described silver foil is less, thereby so that the integral thickness of described flexible printed circuit board reduces, meets frivolous technology trends, and, the physical characteristic of silver foil self is better than the silver slurry that mode of printing forms, and avoids causing because of bending the possibility of electrical defective, improves production reliability.
Description of drawings
Fig. 1 is a kind of flexible printed circuit board side structure of the utility model schematic diagram.
Embodiment
Below in conjunction with accompanying drawing the utility model is elaborated.
Seeing also Fig. 1, is that the utility model discloses a kind of flexible printed circuit board side structure schematic diagram.Described flexible printed circuit board 12 comprises electrically conductive layer 121, substrate body 122 and ground shield 123.
Described substrate body 122 is the insulated base material layer that adopt polyimides (Polymide, PI) material or PETG (Polyethylene Terephthalate, PET) material to make.Described substrate body 122 provides the basis of physical support and electrical connection as main carriers for other components and parts.Described insulated substrate can comprise the folded base material of establishing of multilayer.For adapting to different application demands, described substrate body 122 can also be the stacked formation of multilayer insulation base material, to satisfy intensity or bending demand in various degree.
Described electrically conductive layer 121 is arranged on described substrate body 122 surfaces, in order to realize electric signal transmission.Described electrically conductive layer 121 comprises conductive pattern layer and a plurality of components and parts (not shown).Described conductive pattern layer is that copper foil layer cooperates colloid to be bonded in described substrate body 122 surface formation.Described copper foil layer can be that calendering copper also can be copper electroplating layer.The components and parts such as described components and parts such as resistance, electric capacity, inductance.Different components and parts or the corresponding circuit blocks that forms certain function of its combination.
Described ground shield 123 is to adopt the silver foil material to be formed on the opposite side surface of described basic body 122, described ground shield 123 and the described substrate body 122 of described electrically conductive layer 121 sandwiched, surround sandwich structure, described substrate body 122 sandwicheds therebetween, described ground shield 123 is insulated from each other with described electrically conductive layer 121.
In the present embodiment, the silver foil material is set in described substrate body 122 surfaces, forms ground shield 123.Replace silver foil screen of the prior art, simplified manufacturing technique, convenient processing.Simultaneously, because silver foil forms the thickness of ground shield 123 much smaller than the thickness of other metal levels, thereby reduce the integral thickness of described flexible printed circuit board 12, reduce the bend resistance performance of described flexible printed circuit board 12, lifter flexible type energy.
Described printed circuit board (PCB) body 12 can also comprise the surface insulation layer that covers described electrically conductive layer 121 surface, the material of described surface insulation layer can be polyimides (Polyimide, be called for short PI), polyimides has non-flammable, physical dimension is stable, have higher bend resistance intensity, and have the ability of the welding temperature of bearing.
Further, the utility model also provides a kind of electronics module, and described electronics module comprises as mentioned above flexible printed circuit board 12.Adopt the electronics module of described flexible printed circuit board 12, have equally better pliability and production reliability.
Only be better case study on implementation of the present utility model below, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. flexible printed circuit board, it comprises:
The electrically conductive layer;
Substrate body; And
Ground shield, described electrically conductive layer and described ground shield are separately positioned on the two opposite sides surface of described substrate body, and it is characterized in that: described ground shield is the silver foil layer, described silver foil layer and the setting insulated from each other of described electrically conductive layer.
2. flexible printed circuit board according to claim 1 is characterized in that: described electrically conductive layer is calendering copper layer or copper electroplating layer, and it is bonding to be arranged on described substrate body one side surface.
3. flexible printed circuit board according to claim 1 is characterized in that: the bonding opposite side surface that is arranged on described substrate body of described silver foil layer.
4. flexible printed circuit board according to claim 1, it is characterized in that: described flexible printed circuit board also comprises surface insulation layer, it is stacked to be arranged on described electrically conductive layer outer surface.
5. electronics module, it comprises flexible printed circuit board, it is characterized in that: the described flexible printed circuit board of any one among described flexible printed circuit board such as the claim 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220347245 CN202679794U (en) | 2012-07-17 | 2012-07-17 | Flexible printed circuit board and electronic module adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220347245 CN202679794U (en) | 2012-07-17 | 2012-07-17 | Flexible printed circuit board and electronic module adopting same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202679794U true CN202679794U (en) | 2013-01-16 |
Family
ID=47500661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220347245 Expired - Lifetime CN202679794U (en) | 2012-07-17 | 2012-07-17 | Flexible printed circuit board and electronic module adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202679794U (en) |
-
2012
- 2012-07-17 CN CN 201220347245 patent/CN202679794U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |
|
| CX01 | Expiry of patent term |