CN211980602U - High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product - Google Patents

High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product Download PDF

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Publication number
CN211980602U
CN211980602U CN202020563070.9U CN202020563070U CN211980602U CN 211980602 U CN211980602 U CN 211980602U CN 202020563070 U CN202020563070 U CN 202020563070U CN 211980602 U CN211980602 U CN 211980602U
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heat dissipation
chip
bottom heat
base plate
semiconductor product
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CN202020563070.9U
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Chinese (zh)
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曹周
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Great Team Backend Foundry Dongguan Co Ltd
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Great Team Backend Foundry Dongguan Co Ltd
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Abstract

The utility model discloses a high heat dissipation semiconductor product with bottom heating panel, be in including base plate, setting the chip of base plate top and be used for the encapsulation the epoxy of chip, the base plate has relative base plate upper surface and the base plate lower surface that sets up, be provided with on the base plate and run through the fin mounting through-hole of base plate, be provided with the bottom fin in the fin mounting through-hole, the lower surface of bottom fin with the base plate lower surface flushes, the chip passes through bonding material to be fixed on the bottom fin. The radiating fin mounting through holes are formed in the substrate, and the radiating fins are arranged in the radiating fin mounting through holes, so that heat generated in the working process of the chip can be well transmitted to the radiating fins and can be transmitted to electronic products such as a circuit board and the like through the radiating fins.

Description

High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product
Technical Field
The utility model relates to a semiconductor product technical field especially relates to a high heat dissipation semiconductor product and use its electronic product with bottom heating panel.
Background
The semiconductor is a material with a conductive capability between a conductor and a non-conductor, and the semiconductor element belongs to a solid-state element according to the characteristics of the semiconductor material, the volume of the semiconductor element can be reduced to a small size, so the power consumption is low, the integration level is high, the semiconductor element is widely applied in the field of electronic technology, and the heat dissipation performance becomes one of important indexes of the semiconductor element along with the gradual increase of the operating power of the semiconductor element, and under the high-heat working environment, the maintenance of the working reliability of the semiconductor element is a very important problem.
Because the power IC chip needs more leading-out terminals, the package is mostly carried out by adopting a substrate, the package appearance is LGA and BGA, but the substrate has poor heat dissipation effect, and the package development of the IC is restricted.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an aim at: the invention provides a high-heat-dissipation semiconductor product with a bottom heat dissipation plate and an electronic product using the same, which can solve the problems in the prior art.
In order to achieve the purpose, the utility model adopts the following technical proposal:
on the one hand, provide a high heat dissipation semiconductor product with bottom heating panel, be in including base plate, setting the chip of base plate top and be used for the encapsulation the epoxy of chip, the base plate has relative base plate upper surface and the base plate lower surface that sets up, be provided with on the base plate and run through the fin mounting through-hole of base plate, be provided with the bottom fin in the fin mounting through-hole, the lower surface of bottom fin with the base plate lower surface flushes, the chip passes through bonding material to be fixed on the bottom fin.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, the heat dissipation plate mounting through hole includes a first mounting hole located on one side of the upper surface of the substrate and a second mounting hole located on one side of the lower surface of the substrate, the first mounting hole is communicated with the second mounting hole, and an outer dimension of the first mounting hole is larger than an outer dimension of the second mounting hole.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, the bottom heat dissipation plate includes a first boss corresponding to the shape and size of the first mounting hole and a second boss corresponding to the shape and size of the second mounting hole, and the first boss and the second boss are of an integral structure.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, the lower surface of the bottom heat dissipation plate is provided with a plurality of heat dissipation grooves, and the distances between adjacent heat dissipation grooves are the same.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, a plurality of the heat dissipation plate mounting through holes are provided, and at least one bottom heat dissipation plate is respectively provided in each of the heat dissipation plate mounting through holes.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, the chip is in contact with all the bottom heat dissipation plates at the same time.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, the bottom heat dissipation plate is made of graphene, graphene-modified copper, metallic copper, aluminum or a ceramic material.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, the chip includes an upper chip surface and a lower chip surface that are oppositely disposed, the lower chip surface is disposed toward the upper substrate surface, and the upper chip surface is electrically connected to the outside through a metal wire.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, an in-substrate copper line penetrating through the substrate is disposed on the substrate, the upper surface of the chip is electrically connected to the in-substrate copper line through the metal wire, and the high heat dissipation semiconductor product with the bottom heat dissipation plate is electrically connected to the outside through the in-substrate copper line.
In another aspect, an electronic product is provided, which has the high heat dissipation semiconductor product with the bottom heat dissipation plate as described above.
The utility model has the advantages that: the radiating fin mounting through holes are formed in the substrate, and the radiating fins are arranged in the radiating fin mounting through holes, so that heat generated in the working process of the chip can be well transmitted to the radiating fins and can be transmitted to electronic products such as a circuit board and the like through the radiating fins.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a schematic structural diagram of a high heat dissipation semiconductor product having a bottom heat dissipation plate according to an embodiment of the present invention.
Fig. 2 is an enlarged view of fig. 1 at I.
Fig. 3 is a schematic view of another structure of a high heat dissipation semiconductor product with a bottom heat dissipation plate according to an embodiment of the present invention.
Fig. 4 is a schematic view of another structure of a high heat dissipation semiconductor product with a bottom heat dissipation plate according to an embodiment of the present invention.
In the figure:
100. a substrate; 110. the radiating fins are provided with through holes; 111. a first mounting hole; 112. a second mounting hole; 200. a chip; 300. an epoxy resin; 400. a bottom heat sink; 500. a bonding material; 600. a copper line in the substrate; 700. a metal wire.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 and 2, the present embodiment provides a high heat dissipation semiconductor product with a bottom heat dissipation plate, including a substrate 100, a chip 200 disposed above the substrate 100, and an epoxy resin 300 for encapsulating the chip 200, where the substrate 100 has an upper surface of the substrate 100 and a lower surface of the substrate 100 that are disposed opposite to each other, a heat dissipation plate mounting through hole 110 penetrating the substrate 100 is disposed on the substrate 100, a bottom heat dissipation plate 400 is disposed in the heat dissipation plate mounting through hole 110, a lower surface of the bottom heat dissipation plate 400 is flush with a lower surface of the substrate 100, and the chip 200 is fixed on the bottom heat dissipation plate 400 by an adhesive material 500.
The heat dissipation performance of the power IC chip can be greatly improved by the design that the heat dissipation performance of the heat dissipation sheet is higher than that of the substrate 100 because the heat dissipation performance of the heat dissipation sheet is higher than that of the substrate 100.
Since the heat sink mounting through-hole 110 for mounting the bottom heat sink 400 allows the chip 200 to be in direct contact with the bottom heat sink 400, the heat transfer effect is maximized.
Specifically, in this embodiment, the heat sink mounting through hole 110 includes a first mounting hole 111 located on one side of the upper surface of the substrate 100 and a second mounting hole 112 located on one side of the lower surface of the substrate 100, the first mounting hole 111 is communicated with the second mounting hole 112, and the external dimension of the first mounting hole 111 is greater than the external dimension of the second mounting hole 112.
The bottom heat sink 400 includes a first boss corresponding to the first mounting hole 111 in shape and size and a second boss corresponding to the second mounting hole 112 in shape and size, and the first boss and the second boss are integrated.
In the present embodiment, the heat sink mounting through hole 110 is formed in a step shape, and the opening on the side close to the epoxy resin 300 is large, and the bottom heat sink 400 is formed in a step shape corresponding to the step shape, so that the bottom heat sink 400 can be stably fixed between the substrate 100 and the epoxy resin 300 without using a structure thereof when being mounted in the heat sink mounting through hole 110.
As a preferable technical solution of the high heat dissipation semiconductor product with the bottom heat dissipation plate, in the embodiment shown in fig. 3, a plurality of heat dissipation grooves are arranged on the lower surface of the bottom heat dissipation plate 400, and the distances between adjacent heat dissipation grooves are the same.
The heat sink is disposed on the lower surface of the bottom heat sink 400, so that the heat sink has a heat exchange space for exchanging heat with air, and the heat of the bottom heat sink 400 can be rapidly diffused into the air, thereby rapidly dissipating heat from the chip 200.
In the high heat dissipation semiconductor product having a bottom heat dissipation plate according to the above-described embodiment, one of the heat dissipation plate mounting through holes 110 is provided, and the bottom heat dissipation plate 400 having an integral structure is provided thereon.
It should be noted that, in other embodiments, a plurality of the heat sink mounting through holes 110 may be provided, and at least one of the bottom heat sinks 400 is respectively provided in each of the heat sink mounting through holes 110. The chip 200 is in contact with all of the bottom heat sinks 400 at the same time.
As shown in fig. 4, there are two heat sink mounting through holes 110, and one bottom heat sink 400 is disposed in each of the two heat sink mounting through holes 110.
In this scheme bottom fin 400 can adopt graphite alkene, graphite alkene modified copper, metallic copper, aluminium or ceramic material to make.
Specifically, in this embodiment, the bottom heat sink 400 is made of a graphene material.
Meanwhile, in the high heat dissipation semiconductor product with the bottom heat dissipation plate according to the embodiment, the chip 200 includes an upper surface of the chip 200 and a lower surface of the chip 200, which are oppositely disposed, the lower surface of the chip 200 is disposed toward the upper surface of the substrate 100, and the upper surface of the chip 200 is electrically connected to the outside through the metal wire 700. The substrate 100 is provided with an in-substrate copper circuit 600 penetrating through the substrate 100, the upper surface of the chip 200 is electrically connected with the in-substrate copper circuit 600 through the metal wire 700, and the high heat dissipation semiconductor product with the bottom heat dissipation plate is electrically connected with the outside through the in-substrate copper circuit 600.
Meanwhile, the embodiment also provides an electronic product which is provided with the high-heat-dissipation semiconductor product with the bottom heat dissipation plate.
In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used merely for convenience in description and simplicity in operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (10)

1. The utility model provides a high heat dissipation semiconductor product with bottom heating panel, includes base plate (100), sets up chip (200) above base plate (100) and is used for the encapsulation epoxy (300) of chip (200), its characterized in that, base plate (100) have relative base plate (100) upper surface and base plate (100) lower surface that sets up, be provided with on base plate (100) and run through heat dissipation piece mounting through hole (110) of base plate (100), be provided with bottom heat dissipation piece (400) in heat dissipation piece mounting through hole (110), the lower surface of bottom heat dissipation piece (400) with base plate (100) lower surface flushes, chip (200) are fixed through adhesive material (500) on bottom heat dissipation piece (400).
2. The high heat dissipation semiconductor product with a bottom heat dissipation plate as recited in claim 1, wherein the heat sink mounting through-hole (110) includes a first mounting hole (111) at a side of an upper surface of the substrate (100) and a second mounting hole (112) at a side of a lower surface of the substrate (100), the first mounting hole (111) communicates with the second mounting hole (112), and an outer dimension of the first mounting hole (111) is larger than an outer dimension of the second mounting hole (112).
3. The high heat dissipation semiconductor product with a bottom heat dissipation plate as recited in claim 2, wherein the bottom heat dissipation plate (400) comprises a first boss corresponding to the shape and size of the first mounting hole (111) and a second boss corresponding to the shape and size of the second mounting hole (112), and the first boss and the second boss are of an integral structure.
4. The high heat dissipation semiconductor product with bottom heat dissipation plate as recited in claim 3, wherein the bottom surface of the bottom heat dissipation plate (400) is provided with a plurality of heat dissipation grooves, and the distances between adjacent heat dissipation grooves are the same.
5. The high heat dissipation semiconductor product with a bottom heat dissipation plate as recited in claim 1, wherein the heat sink mounting through-hole (110) is provided in plurality, and at least one bottom heat sink (400) is provided in each of the heat sink mounting through-holes (110).
6. The high heat dissipation semiconductor product with bottom heat dissipation plate as recited in claim 5, wherein the chip (200) is in contact with all the bottom heat sinks (400) at the same time.
7. The high heat dissipation semiconductor product with bottom heat dissipation plate as recited in claim 1, wherein the bottom heat dissipation plate (400) is made of graphene, graphene-modified copper, metallic copper, aluminum, or a ceramic material.
8. The high heat dissipation semiconductor product with bottom heat dissipation plate as recited in claim 1, wherein the chip (200) comprises an upper surface of the chip (200) and a lower surface of the chip (200) which are oppositely disposed, the lower surface of the chip (200) is disposed toward the upper surface of the substrate (100), and the upper surface of the chip (200) is electrically connected with the outside through a metal wire (700).
9. The semiconductor product with bottom heat dissipation plate as recited in claim 8, wherein an intra-substrate copper trace penetrating through the substrate (100) is disposed on the substrate (100), the upper surface of the chip (200) is electrically connected to the intra-substrate copper trace through the metal wire (700), and the semiconductor product with bottom heat dissipation plate is electrically connected to the outside through the intra-substrate copper trace.
10. An electronic product, characterized in that, the high heat dissipation semiconductor product with the bottom heat dissipation plate of any one of claims 1-9 is provided.
CN202020563070.9U 2020-04-15 2020-04-15 High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product Active CN211980602U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020563070.9U CN211980602U (en) 2020-04-15 2020-04-15 High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020563070.9U CN211980602U (en) 2020-04-15 2020-04-15 High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product

Publications (1)

Publication Number Publication Date
CN211980602U true CN211980602U (en) 2020-11-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020563070.9U Active CN211980602U (en) 2020-04-15 2020-04-15 High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product

Country Status (1)

Country Link
CN (1) CN211980602U (en)

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