CN219780509U - Ceramic circuit board - Google Patents
Ceramic circuit board Download PDFInfo
- Publication number
- CN219780509U CN219780509U CN202320597947.XU CN202320597947U CN219780509U CN 219780509 U CN219780509 U CN 219780509U CN 202320597947 U CN202320597947 U CN 202320597947U CN 219780509 U CN219780509 U CN 219780509U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- ceramic
- insulating heat
- ceramic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 46
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims abstract 4
- 230000017525 heat dissipation Effects 0.000 claims description 11
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a ceramic circuit board, which comprises a ceramic base plate, wherein an installation bottom plate is arranged below the ceramic base plate, an insulating heat conducting layer is arranged at the upper end of the installation bottom plate, the upper end of the insulating heat conducting layer is in fit with the lower end of the ceramic base plate, a graphene heat radiating layer is arranged below the insulating heat conducting layer, and the graphene heat radiating layer is also in fit with the insulating heat conducting layer.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a ceramic circuit board.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances;
the existing ceramic circuit board structure in the market comprises a bare ceramic plate and a circuit board covered on the upper surface of the bare ceramic plate, wherein the existing ceramic circuit board is doped with a high-proportion glass material and an organic binder, and the production process needs a high-temperature environment, so that the manufacturing cost is high, the qualification rate is low, and the heat conductivity of the ceramic circuit board is greatly reduced due to the doping of the high-proportion glass material and the organic binder.
Disclosure of Invention
The utility model aims to provide a ceramic circuit board, which solves the problem that the doping of the ceramic circuit board is formed by high-proportion glass materials and organic binders in the prior art, and greatly reduces the thermal conductivity of the ceramic circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme that the ceramic circuit board comprises a ceramic base layer board, wherein a mounting bottom plate is arranged below the ceramic base layer board, an insulating heat conducting layer is arranged at the upper end of the mounting bottom plate, the upper end of the insulating heat conducting layer is attached to the lower end of the ceramic base layer board, and a graphene heat dissipation layer is arranged below the insulating heat conducting layer;
the graphene heat dissipation layer is also bonded with the insulating heat conduction layer.
As a further description of the above technical solution: the surface of the ceramic matrix laminate is provided with a nickel-gold layer.
As a further description of the above technical solution: and the two ends of the mounting bottom plate are fixedly connected with mounting pieces.
As a further description of the above technical solution: and through holes are formed in the two ends of the mounting bottom plate in a penetrating mode.
The utility model has the following beneficial effects:
1. compared with the prior art, the ceramic circuit board has the advantages that the ceramic substrate is adopted, so that the heat dissipation performance and the high-frequency performance of the circuit board are improved, the signal loss is reduced, meanwhile, the graphene heat dissipation coating is provided with high heat conductivity, the heat transferred by the metal substrate layer can be quickly transferred to the air, and the heat conductivity of the ceramic circuit board is further improved;
2. compared with the prior art, the ceramic circuit board has the advantages that the nickel-gold layer is arranged on the outer surface of the circuit layer, so that the oxidation of the circuit layer can be effectively prevented, the service life of the circuit board is prolonged, the influence on the precision of the circuit layer due to the oxidation of the circuit layer can be avoided, and the normal use of the circuit board is influenced.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The utility model is further illustrated by the following figures and examples;
FIG. 1 is a schematic diagram of the overall structure of a ceramic circuit board according to the present utility model;
fig. 2 is a cross-sectional view of a ceramic circuit board according to the present utility model.
Legend description:
1. a ceramic matrix laminate; 2. a nickel-gold layer; 3. a mounting base plate; 4. an insulating heat conducting layer; 5. a graphene heat dissipation layer; 6. a mounting member; 7. and a through hole.
Detailed Description
Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.
Referring to fig. 1-2, one embodiment provided by the present utility model is: the utility model provides a ceramic circuit board, including ceramic base layer board 1, ceramic base layer board 1's below is provided with mounting plate 3, can install ceramic base layer board 1 fast through setting up mounting plate 3 and installed part 6, mounting plate 3's upper end is provided with insulating heat conduction layer 4, insulating heat conduction layer 4's upper end and ceramic base layer board 1's lower extreme laminating sets up, insulating heat conduction layer 4's below is provided with graphite alkene heat dissipation layer 5, the circuit board is after insulating heat conduction layer 4 lays the encapsulation, after the application, heat that the circuit board work produced is led into insulating heat conduction layer 4, insulating heat conduction layer 4 can spread the heat rapidly along the horizontal direction, transfer to ceramic base layer board 1 in the vertical direction simultaneously and carry out secondary heat conduction and heat dissipation, increase the heat dissipation power and the effect of whole circuit board;
the graphene heat dissipation layer 5 is also bonded with the insulating heat conduction layer 4, the nickel-gold layer 2 is arranged on the surface of the ceramic base layer plate 1, and the nickel-gold layer 2 is arranged on the outer surface of the circuit layer, so that oxidation of the circuit layer can be effectively prevented, the use precision of the circuit board is improved, and the service life of the circuit board is prolonged;
the both ends fixedly connected with installed part 6 of mounting plate 3 can cooperate through installed part 6 and install, and the both ends of mounting plate 3 run through and are provided with through-hole 7, can make things convenient for whole circuit board to carry out wiring work through setting up through-hole 7, and whole ceramic matrix board 1 has improved the heat dispersion and the high frequency performance of circuit board simultaneously through adopting ceramic matrix, reduces the loss of signal.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.
Claims (4)
1. The ceramic circuit board comprises a ceramic base layer plate (1), and is characterized in that an installation bottom plate (3) is arranged below the ceramic base layer plate (1), an insulating heat conducting layer (4) is arranged at the upper end of the installation bottom plate (3), the upper end of the insulating heat conducting layer (4) is attached to the lower end of the ceramic base layer plate (1), and a graphene heat dissipation layer (5) is arranged below the insulating heat conducting layer (4);
the graphene heat dissipation layer (5) is also attached to the insulating heat conduction layer (4).
2. A ceramic circuit board according to claim 1, characterized in that the surface of the ceramic base plate (1) is provided with a nickel-gold layer (2).
3. A ceramic circuit board according to claim 1, wherein the mounting base plate (3) is fixedly connected at both ends with mounting members (6).
4. A ceramic circuit board according to claim 1, characterized in that the mounting base plate (3) is provided with through holes (7) at both ends thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320597947.XU CN219780509U (en) | 2023-03-24 | 2023-03-24 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320597947.XU CN219780509U (en) | 2023-03-24 | 2023-03-24 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780509U true CN219780509U (en) | 2023-09-29 |
Family
ID=88133144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320597947.XU Active CN219780509U (en) | 2023-03-24 | 2023-03-24 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780509U (en) |
-
2023
- 2023-03-24 CN CN202320597947.XU patent/CN219780509U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |