CN216600196U

CN216600196U - Circuit board for conducting heat through embedded ceramic

Info

Publication number: CN216600196U
Application number: CN202122793427.XU
Authority: CN
Inventors: 张金友
Original assignee: Zhuhai Hejin Zhaofeng Electronic Technology Co ltd
Current assignee: Zhuhai Hejin Zhaofeng Electronic Technology Co ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-05-24
Anticipated expiration: 2031-11-15

Abstract

The utility model discloses a circuit board conducting heat through embedded ceramics, which comprises a first insulating substrate and a second insulating substrate which are distributed up and down, wherein the first insulating substrate and the second insulating substrate are bonded through an insulating bonding layer, a vertical channel penetrating through the first insulating substrate, the second insulating substrate and the insulating bonding layer is arranged in the circuit board, a ceramic body convenient for heat conduction is arranged in the vertical channel, the lower end of the ceramic body is provided with an insulating heat conduction layer, the upper end of the ceramic body is flush with the upper surface of the first insulating substrate to form a first plane, the lower surface of the insulating heat conduction layer is flush with the lower surface of the second insulating substrate to form a second plane, a first metal layer used for connecting heating components is laid on the first plane, and a second metal layer convenient for heat dissipation is laid on the second plane.

Description

Circuit board for conducting heat through embedded ceramic

Technical Field

The present invention relates to a circuit board conducting heat by embedding ceramic.

Background

At present, a circuit board as a carrier of electronic components is bound to have a large number of components mounted thereon, the electronic components are often accompanied with heat generation during working, if the heat is accumulated on the circuit board, the service life of the circuit board is greatly influenced, therefore, the circuit board can be used as a heat-conducting medium to quickly release the heat to the environment through embedding metal, and due to the conductive characteristic of the metal, the voltage resistance of the circuit board can be reduced after the embedding metal.

Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model overcomes the defects of the technology and provides a circuit board for heat conduction by embedding ceramic.

In order to realize the purpose, the utility model adopts the following technical scheme:

a circuit board for conducting heat by embedding ceramic comprises a first insulating substrate 1 and a second insulating substrate 2 which are distributed up and down, the first insulating substrate 1 and the second insulating substrate 2 are bonded through an insulating bonding layer 3, a vertical channel 4 penetrating through the first insulating substrate 1, the second insulating substrate 2 and the insulating bonding layer 3 is arranged in the circuit board, a ceramic body 5 convenient for heat conduction is arranged in the vertical channel 4, the lower end of the ceramic body 5 is provided with an insulating heat conduction layer 6, the upper end of the ceramic body is flush with the upper surface of the first insulating substrate 1 to form a first plane 7, the lower surface of the insulating and heat conducting layer 6 is flush with the lower surface of the second insulating substrate 2 to form a second plane 8, the first plane 7 is paved with a first metal layer 9 for connecting a heating element and a second metal layer 10 convenient for heat dissipation.

Preferably, the first insulating substrate 1 is provided with a first through hole 11, the second insulating substrate 2 is provided with a second through hole 21 corresponding to the first through hole 11, and the insulating adhesive layer 3 extends to the inner wall surfaces of the first through hole 11 and the second through hole 21 to form a vertical channel 4.

Preferably, the vertical channel 4 is provided with a step 41 near one end of the second insulating base plate 2 to facilitate the positioning of the ceramic body 5, and the insulating and heat conducting layer 6 is located in the section of the vertical channel 4 where the step 41 is located.

Preferably, the first metal layer 9 is etched with circuitry.

Preferably, the insulating adhesive layer 3 is a prepreg, and the insulating heat conduction layer 6 is a prepreg or a heat conduction glue.

Compared with the prior art, the utility model has the beneficial effects that:

inlay in the present case circuit board and have the ceramic body, the ceramic body upper end is direct to be in contact with first metal layer, the components and parts that generate heat during the use are connected on first metal layer, and the ceramic body lower extreme is equipped with insulating heat-conducting layer, insulating heat-conducting layer is direct to be in contact with the second metal layer, consequently, the heat accessible ceramic body that the components and parts during operation that generate heat produced distributes from first metal layer to second metal layer then, avoid components and parts operational environment high temperature, because ceramic non-conducting characteristic, the withstand voltage performance of circuit board also can be guaranteed to the ceramic body upper end can be direct to be in contact with first metal layer under the condition that does not additionally increase the insulating layer.

Drawings

Fig. 1 is a schematic cross-sectional view of a circuit board for conducting heat through a damascene ceramic according to the present invention.

Fig. 2 is a schematic cross-sectional view of the vertical channel of the present disclosure.

Detailed Description

The features of the present invention and other related features are further described in detail below by way of examples to facilitate understanding by those skilled in the art:

as shown in fig. 1 to 2, a circuit board for conducting heat by embedding ceramic includes a first insulating substrate 1 and a second insulating substrate 2 which are disposed up and down, the first insulating substrate 1 and the second insulating substrate 2 are bonded through an insulating bonding layer 3, a vertical channel 4 penetrating through the first insulating substrate 1, the second insulating substrate 2 and the insulating bonding layer 3 is arranged in the circuit board, a ceramic body 5 convenient for heat conduction is arranged in the vertical channel 4, the lower end of the ceramic body 5 is provided with an insulating heat conduction layer 6, the upper end of the ceramic body is flush with the upper surface of the first insulating substrate 1 to form a first plane 7, the lower surface of the insulating and heat conducting layer 6 is flush with the lower surface of the second insulating substrate 2 to form a second plane 8, the first plane 7 is paved with a first metal layer 9 for connecting a heating element and a second metal layer 10 convenient for heat dissipation.

As above, inlay in the present case circuit board and have ceramic body 5, 5 upper ends of ceramic body are direct and the contact of first metal level 9, the components that generate heat are connected on first metal level 9 during the use, and 5 lower extremes of ceramic body are equipped with insulating heat-conducting layer 6, insulating heat-conducting layer 6 is direct and the contact of second metal level 10, consequently, the accessible ceramic body 5 that the components that generate heat during operation produced transmits second metal level 10 from first metal level 9 and then gives off, avoid components and parts operational environment high temperature, because the ceramic is non-conductive characteristic, the withstand voltage performance of circuit board also can be guaranteed to 5 upper ends of ceramic body can be direct and first metal level 9 contact under the condition that does not additionally increase the insulating layer.

As shown in fig. 1 to 2, preferably, the first insulating substrate 1 is provided with a first through hole 11, the second insulating substrate 2 is provided with a second through hole 21 corresponding to the first through hole 11, and the insulating adhesive layer 3 extends to the inner wall surfaces of the first through hole 11 and the second through hole 21 to form a vertical channel 4.

As shown in fig. 1 to 2, preferably, the vertical channel 4 is provided with a step 41 near one end of the second insulating substrate 2 to facilitate the positioning of the ceramic body 5, and the insulating and heat conducting layer 6 is located in the section of the vertical channel 4 where the step 41 is located.

As shown in fig. 1, the first metal layer 9 is preferably etched with circuitry.

As shown in fig. 1, preferably, the insulating adhesive layer 3 is a prepreg, and the insulating heat conductive layer 6 is a prepreg or a heat conductive adhesive.

As described above, the present disclosure is directed to a circuit board for conducting heat by embedding ceramic, and all technical solutions identical or similar to the present disclosure should be considered as falling within the scope of the present disclosure.

Claims

1. A circuit board conducting heat through embedded ceramic is characterized by comprising a first insulating substrate (1) and a second insulating substrate (2) which are distributed up and down, wherein the first insulating substrate (1) and the second insulating substrate (2) are bonded through an insulating bonding layer (3), a vertical channel (4) penetrating through the first insulating substrate (1), the second insulating substrate (2) and the insulating bonding layer (3) is arranged in the circuit board, a ceramic body (5) convenient for conducting heat is installed in the vertical channel (4), the lower end of the ceramic body (5) is provided with an insulating heat conduction layer (6), the upper end of the insulating heat conduction layer is flush with the upper surface of the first insulating substrate (1) to form a first plane (7), the lower surface of the insulating heat conduction layer (6) is flush with the lower surface of the second insulating substrate (2) to form a second plane (8), a first metal layer (9) used for connecting heating components on the first plane (7) is paved on the first plane, and a second metal layer (10) convenient for heat dissipation is laid on the second plane.

2. The circuit board conducting heat through embedded ceramic according to claim 1, wherein the first insulating substrate (1) is provided with a first through hole (11), the second insulating substrate (2) is provided with a second through hole (21) corresponding to the first through hole (11), and the insulating adhesive layer (3) extends to the inner wall surfaces of the first through hole (11) and the second through hole (21) to form a vertical channel (4).

3. A circuit board for conducting heat through ceramic mounting according to claim 1, wherein the vertical channel (4) is provided with a step (41) near one end of the second insulating substrate (2) to facilitate the positioning of the ceramic body (5), and the insulating and heat conducting layer (6) is located in the section of the vertical channel (4) where the step (41) is located.

4. A circuit board conducting heat by means of a damascene ceramic according to claim 1, characterised in that the first metal layer (9) is etched with circuitry.

5. The circuit board for conducting heat through ceramic damascene according to any of claims 1-4, wherein the insulating adhesive layer (3) is prepreg and the insulating heat conducting layer (6) is prepreg or heat conducting glue.