CN219322643U

CN219322643U - Heat dissipation type packaging structure for PCB

Info

Publication number: CN219322643U
Application number: CN202223543378.5U
Authority: CN
Inventors: 王彦智; 杜彪
Original assignee: Shengqing Yongzhi Semiconductor Equipment Suzhou Co ltd
Current assignee: Shengqing Yongzhi Semiconductor Equipment Suzhou Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-07-07
Anticipated expiration: 2032-12-30

Abstract

The utility model discloses a heat dissipation type packaging structure for a PCB (printed Circuit Board), which comprises a heat dissipation substrate and a PCB main body arranged on the outer side surface of the heat dissipation substrate, wherein a heat dissipation cavity is formed in the inner side of the heat dissipation substrate, a heat dissipation pipe is arranged in the heat dissipation cavity, an upper port and a lower port of the heat dissipation pipe are respectively leveled with the upper end surface and the lower end surface of the heat dissipation substrate, first jacks are formed at the upper end and the lower end of the two side surfaces of the heat dissipation substrate, and second jacks penetrating through the first jacks are formed on the side surface of the heat dissipation substrate, and the heat dissipation type packaging structure has the beneficial effects that: the heat dissipation cavity is formed in the inner side of the heat dissipation substrate, the heat dissipation pipes are arranged in the heat dissipation cavity, the PCB main body is arranged on the two side surfaces of the heat dissipation substrate, and the side surfaces of the PCB are contacted with the end surfaces of the heat conducting rods, so that in the use process, heat generated during the working of the PCB is transferred to the heat dissipation pipes through the heat conducting rods, and the heat is dissipated through the heat dissipation pipes rapidly and effectively.

Description

Heat dissipation type packaging structure for PCB

Technical Field

The utility model relates to the technical field of PCB packaging, in particular to a heat dissipation type packaging structure for a PCB.

Background

The names of the circuit boards are: circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etch technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, a PCB, an FPC circuit board (the FPC circuit board is also called a flexible circuit board which is made of polyimide or polyester film as a base material and has high reliability, the flexible printed circuit board has the characteristics of high wiring density, light weight, thin thickness and good flexibility), and the soft and hard combined board FPC and PCB are produced and developed, so that the soft and hard combined board is a new product. Therefore, the soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related technological requirements through pressing and other procedures, and has FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, and the PCB can generate heat when in operation, and if the heat cannot be timely emitted, the service life of the PCB can be reduced, and even the use effect can be influenced.

The patent number 201621221028.9 discloses a PCB board paster packaging structure, including the PCB board body, PCB board body lower surface is equipped with insulating heat conduction cloth, and insulating heat conduction cloth below is equipped with the radiator, the lower surface of insulating heat conduction cloth and the upper end butt of radiator, the radiator includes the heating panel, and the department is equipped with a plurality of one-level heat dissipation strips in the middle of the heating panel, has evenly arranged a plurality of second grade heat dissipation strips on the one-level heat dissipation strip, and the surface of one-level heat dissipation strip and second grade heat dissipation strip is the unevenness form. The heat radiator has the beneficial effects that heat generated during the working of the PCB is conducted to the radiator under the action of the insulating heat conducting cloth, and the primary radiating strips and the secondary radiating strips are arranged on the radiator, so that the radiating effect is better, and meanwhile, the surfaces of the primary radiating strips and the secondary radiating strips are uneven, so that the radiating area is increased, and the radiating effect is further improved.

Adopt foretell PCB board paster packaging structure to have following not enough: because the radiating fin is installed through seting up the recess on one side surface of heating panel, lead to only can set up the PCB board on the opposite side surface, this kind of structure is applicable to single face packaging structure promptly.

Disclosure of Invention

The utility model aims to provide a heat dissipation type packaging structure for a PCB (printed Circuit Board) to solve the problems in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat dissipation type packaging structure that PCB board was used, includes radiating substrate and sets up the PCB board main part at radiating substrate outside surface, radiating chamber has been seted up to radiating substrate's inboard, radiating substrate is provided with the cooling tube in radiating chamber, the last port of cooling tube, lower port respectively with radiating substrate's up end, lower terminal surface parallel and level, first jack has all been seted up to radiating substrate both sides surface's upper end, lower extreme, radiating substrate's side has seted up the second jack that runs through first jack, just radiating substrate is provided with the connecting rod in the second jack, PCB board main part is close to radiating substrate one side surface's upper and lower both ends all are provided with the connecting plate, the middle part of connecting plate sets up in the outside of connecting rod through seting up the third jack.

Preferably, the radiating pipe is formed by a plurality of transverse pipes and longitudinal pipes in a crossed mode, the transverse pipes are communicated with the longitudinal pipes, and two ends of the longitudinal pipes are communicated with the outside of the radiating substrate.

Preferably, the heat dissipation substrate is provided with a heat conduction rod in the heat dissipation chamber, one end of the heat conduction rod is abutted to the pipe wall of the heat dissipation pipe, and the other end of the heat conduction rod penetrates through the heat dissipation substrate and contacts with the surface of the PCB.

Preferably, the hole center connecting lines of the second jack and the third jack are parallel to the axis of the connecting rod.

Preferably, the upper end and the lower end of the heat dissipation substrate are both provided with auxiliary mounting mechanisms, each auxiliary mounting mechanism comprises a support frame and a fixing plate, the end of the support frame is fixedly connected with the end face of the heat dissipation substrate, and the fixing plate is arranged at the other end of the support frame.

Preferably, the width of the fixing plate is greater than the distance between the two PCB main bodies.

Compared with the prior art, the utility model has the beneficial effects that: through offer the radiating chamber in radiating substrate's inboard to set up the cooling tube in the radiating chamber, set up the PCB board main part simultaneously at radiating substrate's both sides surface, and with the side of PCB board and the terminal surface contact of heat conduction pole, thereby in the use, through the heat conduction pole with the heat transfer that the PCB board during operation produced to the cooling tube, carry out quick effectual heat dissipation through the cooling tube, can dispel the heat to the PCB board main part of both sides simultaneously, simultaneously through all seting up first jack at radiating substrate's upper and lower both ends, place the connecting plate of PCB board main part side in first jack, and make the connecting rod run through the third jack of connecting plate, thereby effectually ensured the stability that PCB board and radiating substrate are connected.

Drawings

FIG. 1 is a schematic overall structure of the present utility model;

fig. 2 is a schematic structural view of a PCB main body of the present utility model;

fig. 3 is a schematic structural diagram of a heat dissipating substrate according to the present utility model.

In the figure: 1. a heat-dissipating substrate; 2. a PCB main body; 3. a heat dissipation chamber; 4. a heat radiating pipe; 5. a first jack; 6. a second jack; 7. a connecting rod; 8. a connecting plate; 9. a third jack; 10. a heat conduction rod; 11. a support frame; 12. and a fixing plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a heat dissipation type packaging structure that PCB board was used, includes radiating substrate 1 and sets up at radiating substrate 1 outside surface's PCB board main part 2, radiating substrate 1's inboard has seted up radiating chamber 3, radiating substrate 1 is provided with cooling tube 4 in radiating chamber 3, cooling tube 4's upper end mouth, lower port respectively with radiating substrate 1's up end, lower terminal surface parallel and level, radiating substrate 1 both sides surface's upper end, lower extreme have all seted up first jack 5, radiating substrate 1's side has seted up the second jack 6 that runs through first jack 5, just radiating substrate 1 is provided with connecting rod 7 in second jack 6, PCB board main part 2 is close to radiating substrate 1 one side surface's upper and lower both ends all are provided with connecting plate 8, the middle part of connecting plate 8 sets up in connecting rod 7's outside through seting up third jack 9.

The heat dissipation tube 4 is formed by a plurality of transverse tubes and longitudinal tubes in a crossed mode, the transverse tubes are communicated with the longitudinal tubes, and two ends of the longitudinal tubes are communicated with the outside of the heat dissipation substrate 1.

In the embodiment, the inner sides of the two end ports of the longitudinal pipe are provided with dustproof filter elements.

The heat dissipation substrate 1 is provided with a heat conduction rod 10 in the heat dissipation chamber 3, one end of the heat conduction rod 10 is in butt joint with the pipe wall of the heat dissipation pipe 4, and the other end of the heat conduction rod 10 penetrates through the heat dissipation substrate 1 and is in contact with the surface of the PCB.

The hole center connecting lines of the second jack 6 and the third jack 9 are perpendicular to the axis of the connecting rod 7.

The upper end and the lower end of the radiating substrate 1 are respectively provided with an auxiliary installation mechanism, the auxiliary installation mechanism comprises a supporting frame 11 and a fixing plate 12, the end of the supporting frame 11 is fixedly connected with the end face of the radiating substrate 1, and the fixing plate 12 is arranged at the other end of the supporting frame 11.

The width of the fixing plate 12 is larger than the distance between the two PCB main bodies 2.

Specifically, when the utility model is used, the two PCB main bodies 2 are respectively arranged on the two side surfaces of the heat dissipation substrate 1, the connecting plates 8 on the side surfaces of the PCB main bodies 2 are inserted into the first insertion holes 5 of the heat dissipation substrate 1, after the centers of the second insertion holes 6 and the third insertion holes 9 are aligned, the connecting rods 7 are inserted into the third insertion holes 9, so that the connection between the PCB main bodies 2 and the heat dissipation substrate 1 is enhanced, in the use process, the whole device is installed and fixed through the fixing plates 12 at the two ends of the heat dissipation substrate 1, heat generated during the operation of the PCB main bodies 2 is transferred into the heat dissipation cavity 3 of the heat dissipation substrate 1 through the heat conducting rods 10, and then heat is dissipated through the heat dissipating pipes 4, so that the whole heat dissipation performance is improved.

In the above process, the radiating pipe 4 is heated, and the air in the temperature transmission is heated, and the rapid heat dissipation is realized through the flow of the air, and the radiating pipe 4 is formed by intersecting the transverse pipe and the longitudinal pipe, so that the radiating pipe 4 is effectively ensured to be heated uniformly, and the heat dissipation effect is improved.

In the description of the present utility model, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "another end," "upper," "one side," "top," "inner," "front," "center," "two ends," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," "fourth" may explicitly or implicitly include at least one such feature.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat dissipation type packaging structure that PCB board was used, its characterized in that includes radiating base plate (1) and sets up PCB board main part (2) at radiating base plate (1) outside surface, radiating cavity (3) have been seted up to radiating base plate (1) inboard, radiating base plate (1) are provided with cooling tube (4) in radiating cavity (3), upper port, lower port of cooling tube (4) respectively with radiating base plate (1) up end, lower terminal surface parallel and level, first jack (5) have all been seted up to radiating base plate (1) both sides surface's upper end, lower extreme, second jack (6) that run through first jack (5) have been seted up to radiating base plate (1) side, just radiating base plate (1) are provided with connecting rod (7) in second jack (6), PCB board main part (2) are close to radiating base plate (1) one side surface's upper and lower both ends all are provided with connecting plate (8), the middle part of connecting plate (8) sets up in connecting rod (7) outside through seting up third jack (9).

2. The heat dissipation type package structure for a PCB of claim 1, wherein: the radiating pipes (4) are formed by a plurality of transverse pipes and longitudinal pipes in a crossed mode, the transverse pipes are communicated with the longitudinal pipes, and two ends of the longitudinal pipes are communicated with the outside of the radiating substrate (1).

3. The heat dissipation type package structure for a PCB of claim 1, wherein: the heat dissipation substrate (1) is provided with a heat conduction rod (10) in the heat dissipation cavity (3), one end of the heat conduction rod (10) is in butt joint with the pipe wall of the heat dissipation pipe (4), and the other end of the heat conduction rod (10) penetrates through the heat dissipation substrate (1) and is in contact with the surface of the PCB.

4. The heat dissipation type package structure for a PCB of claim 1, wherein: and the hole center connecting lines of the second jack (6) and the third jack (9) are parallel to the axis of the connecting rod (7).

5. The heat dissipation type package structure for a PCB of claim 1, wherein: the upper end and the lower end of the radiating substrate (1) are respectively provided with an auxiliary installation mechanism, each auxiliary installation mechanism comprises a supporting frame (11) and a fixing plate (12), the end of each supporting frame (11) is fixedly connected with the end face of the radiating substrate (1), and the fixing plates (12) are arranged at the other ends of the supporting frames (11).

6. The heat dissipation type package structure for a PCB as set forth in claim 5, wherein: the width of the fixing plate (12) is larger than the distance between the two PCB main bodies (2).