CN215073611U

CN215073611U - Large element heat dissipation device of PCB

Info

Publication number: CN215073611U
Application number: CN202121132470.5U
Authority: CN
Inventors: 王鹏
Original assignee: Shenzhen Brilliant Star Electronics Co ltd
Current assignee: Shenzhen Brilliant Star Electronics Co ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-12-07
Anticipated expiration: 2031-05-25

Abstract

The utility model discloses a large element heat dissipation device of a PCB, which comprises a PCB large element placing platform, a cooling liquid storage bin and an extension platform, wherein the center of the PCB large element placing platform is provided with a storage chamber, the right side of the PCB large element placing platform is provided with a first slot communicated with the storage chamber, the first slot is spliced with the extension platform, the lower part of the extension platform is communicated with the storage chamber of the PCB large element placing platform, heat conducting plates are arranged above the PCB large element placing table and the extending table, a first output port is arranged at the front end of the storage chamber, the front end of the cooling liquid storage bin is provided with a second storage port connected with the first output port through a conduit, a second output port is arranged at the front end of the extension table, a first sealing cover is inserted in the second output port, a second slot is arranged at the right side of the extension table, a second sealing cover is inserted in the second slot, and two first heat insulation supports are arranged at the bottom of the PCB large element placing table; this structure improves the radiating effect.

Description

Large element heat dissipation device of PCB

Technical Field

The utility model relates to a technical field of PCB board specifically is a big component heat abstractor of PCB board.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. The PCB board comprises a base layer and a conducting layer arranged above the base layer. The base layer is an insulating layer, generally a resin composite material, the conductive layer is a copper foil layer, and the electronic component is arranged on the copper foil layer. Because the resin composite material of the insulating layer has poor heat-conducting property, heat generated by the work of the electronic components is mainly transferred to the outside air through the copper foil of the conducting layer, but the copper foil has small thickness and small size and limited heat-conducting capacity, and when some electronic components with large heat productivity are encountered, the local temperature is too high due to insufficient heat dissipation, and the components and the PCB are burnt, so that how to solve the problem is very important.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a big component heat abstractor of PCB board to solve the unable radiating problem of carrying out to the component that calorific capacity is big that provides among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a large element heat dissipation device of a PCB comprises a PCB large element placing table, wherein a cooling liquid storage bin is arranged at the bottom of the PCB large element placing table, a storage cavity capable of being communicated with the input end of the cooling liquid storage bin is arranged at the center of the PCB large element placing table, a first slot communicated with the storage cavity is arranged at the right side of the PCB large element placing table, an extension table is inserted into the first slot, the lower part of the extension table is communicated with the storage cavity of the PCB large element placing table, a socket inserted into the first slot is arranged at the left side of the extension table, the socket is ensured to be communicated with the cavity below the extension table after being inserted into the first slot, heat conduction plates are arranged above the PCB large element placing table and the extension table, a first output port is arranged at the front end of the storage cavity, a second storage port connected with the first output port through a guide pipe is arranged at the front end of the cooling liquid storage bin, the PCB large element placing table is characterized in that a second output port is formed in the front end of the extending table, a first sealing cover is inserted into the second output port, the first sealing cover can be further inserted into the first output port, a second insertion groove is formed in the right side of the extending table, a second sealing cover is inserted into the second insertion groove, the second sealing cover can be further inserted into the first insertion groove, two first heat insulation supports which are arranged at intervals are arranged at the bottom of the PCB large element placing table, and element welding holes are formed in the upper portion of the heat conducting plate.

Furthermore, the heat conduction effect is improved, and a heat insulation plate is arranged on the back of the PCB large element placing table.

Furthermore, a second heat insulation support is arranged on each of four feet at the bottom of the extension table.

Furthermore, an iron sheet is arranged on the side of the first slot, and a magnet matched with the iron sheet is arranged on the side of the socket.

Further, a sealing silica gel ring is arranged on one side of the second sealing cover.

Compared with the prior art, the beneficial effects of the utility model are as follows: can dispel the heat alone to big components and parts, further improve the radiating effect, finally can not influence PCB.

Drawings

Fig. 1 is a schematic structural diagram of a large component heat dissipation device of a PCB in embodiment 1;

fig. 2 is a schematic structural diagram of a large component heat dissipation device of a PCB board in embodiment 2;

fig. 3 is a schematic structural diagram of a large component heat dissipation device of a PCB board in embodiment 3;

fig. 4 is a schematic structural diagram of a large component heat dissipation device of a PCB in embodiment 4.

In the figure: the PCB large component placing table comprises a PCB large component placing table 1, a cooling liquid storage bin 2, a storage cavity 3, a first slot 4, an extension table 5, a socket 6, a heat conducting plate 7, a first output port 21, a second storage port 8, a second output port 9, a first sealing cover 10, a second slot 11, a second sealing cover 12, a first heat insulation support 13, a heat insulation plate 14, a second heat insulation support 15, an iron sheet 16, a magnet 17, a sealing silica gel ring 18, a guide pipe 19 and a component welding hole 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-2, the present invention provides an embodiment: a large element heat dissipation device of a PCB comprises a PCB large element placing table 1, wherein a cooling liquid storage bin 2 is arranged at the bottom of the PCB large element placing table 1, a storage chamber 3 capable of being communicated with the input end of the cooling liquid storage bin 2 is arranged at the center of the PCB large element placing table 1, a first slot 4 communicated with the storage chamber 3 is arranged at the right side of the PCB large element placing table 1, an extension table 5 is inserted on the first slot 4, the lower part of the extension table 5 is communicated with the storage chamber 3 of the PCB large element placing table 1, a socket 6 inserted with the first slot 4 is arranged at the left side of the extension table 5, the socket 6 is inserted with the first slot 4 to ensure that the storage chamber 3 is communicated with the lower chamber of the extension table 5, heat conduction plates 7 are arranged above the PCB large element placing table 1 and the extension table 5, a first output port 21 is arranged at the front end of the storage chamber 3, the front end of the cooling liquid storage bin 2 is provided with a second storage port 8 connected with a first output port 21 through a guide pipe 19, the front end of the extension table 5 is provided with a second output port 9, the second output port 9 is spliced with a first sealing cover 10, the first sealing cover 10 can also be spliced at the first output port 21, the right side of the extension table 5 is provided with a second insertion groove 11, a second sealing cover 12 is inserted in the second insertion groove 11, the second sealing cover 12 can also be spliced in the first insertion groove 4, the bottom of the PCB large-element placing table 1 is provided with two first heat insulation supports 13 arranged at intervals, and an element welding hole 20 is arranged above the heat-conducting plate 7.

Further, a silicone sealing ring 18 is provided on one side of the second seal cover 12, and the sealing performance is improved by providing the silicone sealing ring 18.

The structure has the following technical effects:

1. by arranging the device, large components are not directly welded on a PCB (printed circuit board), the large components are firstly placed on a PCB large component placing table 1 of the device, then heat conduction is carried out by utilizing a heat conduction plate 7 above the PCB large component placing table 1 to absorb heat, and cooling liquid is circularly conveyed into a storage cavity 3 by utilizing a cooling liquid storage bin 2 to carry out heat dissipation on the heat conduction plate 7, so that the heat dissipation effect is further improved, and in order to improve the circulation effect, a circulating pump is arranged at the positions of the cooling liquid storage bin 2 and the storage cavity 3 (in the figure, the circulating pump is positioned at the rear side below the cooling liquid storage bin 2, so that the circulating pump cannot be seen, and is not shown);

2. meanwhile, the length of the larger component of the structure is rotated to determine whether the extension table 5 is used or not, when the extension table 5 is not needed, the first output port 21 and the second storage port 8 are communicated through the guide pipe 19, the first slot 4 is sealed through the second sealing cover 12, then the first heat insulation support 13 is fixed on the corresponding PCB, namely, when the extension table 5 is needed, the second sealing cover 12 is detached from the first slot 4, then the first slot 4 is connected with the socket 6, then the second sealing cover 12 is inserted into the second slot 11, the guide pipe 19 is inserted into the second storage port 8 and the second output port 9, then the first output port 21 is sealed through the first sealing cover 10, at the moment, the cooling liquid firstly flows into the storage chamber 3 through the cooling liquid storage bin 2, the cooling liquid flows into the socket 6 from the first slot 4 on one side of the storage chamber 3 and is reserved in the chamber below the extension table 5, and flows into the second storage port 8 through the second output port 9 and the conduit 19 and then returns to the cooling liquid storage bin 2 to realize the function of radiating the heat conducting plate 7 above the PCB large component placing table 1 and the extending table 5.

Therefore, the invention has the following advantages: can dispel the heat alone to big components and parts, further improve the radiating effect, finally can not influence PCB.

Example 2:

referring to fig. 2, the present invention provides an embodiment: the utility model provides a big component heat abstractor of PCB board, further, improves heat conduction effect, is provided with heat insulating board 14 at the back that PCB big component laid platform 1, improves thermal-insulated effect through setting up heat insulating board 14, avoids the PCB of heat influence below.

Example 3:

referring to fig. 3, the present invention provides an embodiment: the utility model provides a large-size component heat abstractor of PCB board, further, all be provided with a second thermal-insulated support 15 in the bottom four feet of extension platform 5, make later stage installation stability better through setting up 4 second thermal-insulated supports 15 to guarantee and have the interval between the PCB to improve the radiating effect, also conveniently lay wire in the interval simultaneously and set up paster components and parts, finally let the components and parts overall arrangement compacter.

Example 4:

referring to fig. 4, the present invention provides an embodiment: the utility model provides a big component heat abstractor of PCB board, further, be provided with iron sheet 16 at the side of first slot 4, be provided with at the side of socket 6 with iron sheet 16 complex magnet 17, through above-mentioned structure setting, guarantee when first slot 4 and socket 6 cooperate, be difficult to not hard up.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a big component heat abstractor of PCB board which characterized in that: the PCB large element placing table comprises a PCB large element placing table (1), wherein a cooling liquid storage bin (2) is arranged at the bottom of the PCB large element placing table (1), a storage chamber (3) which can be communicated with the input end of the cooling liquid storage bin (2) is arranged at the center of the PCB large element placing table (1), a first slot (4) communicated with the storage chamber (3) is arranged on the right side of the PCB large element placing table (1), an extension table (5) is inserted into the first slot (4), the lower portion of the extension table (5) is communicated with the storage chamber (3) of the PCB large element placing table (1), a socket (6) inserted into the first slot (4) is arranged on the left side of the extension table (5), the storage chamber (3) is communicated with the lower chamber of the extension table (5) after the socket (6) is inserted into the first slot (4), heat conducting plates (7) are arranged above the PCB large element placing table (1) and the extension table (5), a first output port (21) is arranged at the front end of the storage chamber (3), a second storage port (8) connected with the first output port (21) through a conduit (19) is arranged at the front end of the cooling liquid storage bin (2), a second output port (9) is arranged at the front end of the extension table (5), a first sealing cover (10) is inserted in the second output port (9), the first sealing cover (10) can also be inserted into the first output opening (21), a second slot (11) is arranged at the right side of the extension table (5), a second sealing cover (12) is inserted in the second slot (11), the second sealing cover (12) can also be inserted into the first slot (4), two first heat insulation supports (13) which are arranged at intervals are arranged at the bottom of the PCB large element placing table (1), and element welding holes (20) are arranged above the heat conducting plate (7).

2. The large component heat sink of the PCB board as claimed in claim 1, wherein: a thermal insulation board (14) is arranged on the back of the PCB large component placing table (1).

3. A large component heat sink device of PCB board according to claim 1 or 2, characterized in that: a second heat insulation support (15) is arranged on each of the four feet at the bottom of the extension table (5).

4. A large component heat sink device of PCB board according to claim 1 or 2, characterized in that: an iron sheet (16) is arranged on the side of the first slot (4), and a magnet (17) matched with the iron sheet (16) is arranged on the side of the socket (6).

5. A large component heat sink device of PCB board according to claim 1 or 2, characterized in that: a sealing silica gel ring (18) is arranged on one side of the second sealing cover (12).