CN216119371U - High heat dissipating's paster charactron - Google Patents
High heat dissipating's paster charactron Download PDFInfo
- Publication number
- CN216119371U CN216119371U CN202122564572.0U CN202122564572U CN216119371U CN 216119371 U CN216119371 U CN 216119371U CN 202122564572 U CN202122564572 U CN 202122564572U CN 216119371 U CN216119371 U CN 216119371U
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- China
- Prior art keywords
- heat dissipation
- heat
- flow guide
- tube
- pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 64
- 239000012790 adhesive layer Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000012943 hotmelt Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 8
- 230000008901 benefit Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a high-heat-dissipation chip nixie tube, which comprises a nixie tube assembly, a heat dissipation fixing assembly, a PCB (printed circuit board), an LED lamp panel, flow guide holes, heat dissipation tubes, a heat dissipation plate and an adhesive layer, wherein the heat dissipation fixing assembly is arranged at the lower end of the nixie tube assembly, the LED lamp panel is fixedly arranged at the top of the PCB, the flow guide holes are distributed in the PCB from front to back, the heat dissipation tubes are fixedly arranged in the flow guide holes, the heat dissipation plate is fixedly arranged at the left side and the right side of the heat dissipation tube, the adhesive layer is fixedly arranged at the bottom of the heat dissipation plate, firstly, the flow guide holes in the nixie tube assembly can be beneficial to the insertion and installation of the heat dissipation tubes, the heat on the subsequent PCB can be favorably transferred to the heat dissipation tubes through the flow guide holes, secondly, the heat can be favorably transferred to the heat dissipation plates by the heat dissipation plates, the diffusion of the heat is improved by virtue of the effect of the heat dissipation plates, and the adhesive layer can be also adhered and connected with an external carrier, the firmness is improved.
Description
Technical Field
The utility model relates to the technical field of display screens, in particular to a high-heat-dissipation surface-mounted nixie tube.
Background
The nixie tube is a semiconductor light-emitting device, the basic unit is a light-emitting diode or an LED lamp panel, the nixie tube is lightened by inputting relative electric power to different pins so as to display numbers, and the nixie tube is applied to the field of household appliances such as air conditioners, water heaters, refrigerators and the like in a photovoltaic mode.
According to the above, the chip digital tube in the prior art adopts the composite structure of the PCB and the LED lamp panel, and has a good display effect, but has a poor heat dissipation effect, is easy to accelerate aging, and affects display stability.
Therefore, in view of the above drawbacks, it is necessary to design a chip digital tube with high heat dissipation.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the chip nixie tube with high heat dissipation is provided to solve the problems in the prior art.
In order to solve the technical problems, the technical scheme of the utility model is as follows: a high-heat-dissipation surface-mounted nixie tube comprises a nixie tube assembly and a heat dissipation fixing assembly, wherein the nixie tube assembly comprises a PCB (printed circuit board), an LED lamp panel and flow guide holes, the heat dissipation fixing assembly comprises a heat dissipation tube, a heat dissipation plate and a pasting layer, the heat dissipation fixing assembly is arranged at the lower end of the nixie tube assembly, the heat dissipation fixing assembly and the nixie tube assembly are in tight fit connection, the LED lamp panel is fixedly arranged at the top of the PCB, the LED lamp panel and the PCB are in hot melt connection, the flow guide holes are a plurality of pieces, the flow guide holes are distributed in the PCB from front to back, the flow guide holes are circular through holes, the heat dissipation tube is fixedly arranged in the flow guide holes, the heat dissipation tube and the flow guide holes are in tight fit connection, the heat dissipation plate is fixedly arranged at the left side and the right side of the heat dissipation tube, the heat dissipation plate and the heat dissipation tube are in welded connection, and the pasting layer is fixedly arranged at the bottom of the heat dissipation plate, the adhesive layer is connected with the heat dissipation plate by adopting a high-temperature-resistant adhesive.
Further, the bottom of the PCB is fixedly provided with pins from front to back, the pins and the PCB are connected through hot melting, heat dissipation grooves are further arranged between every two pins, and the heat dissipation grooves are grooves.
Further, both ends still are equipped with heat conduction cavity around LED lamp plate is inside, heat conduction cavity be hollow cavity.
Furthermore, a hollow filter block is fixedly arranged between the LED lamp panel and the heat dissipation plate, and the hollow filter block is respectively connected with the LED lamp panel and the heat dissipation plate by adopting a high-temperature-resistant adhesive.
Compared with the prior art, the high-heat-dissipation surface-mounted nixie tube has the following advantages;
1. the first flow guide hole in the digital tube assembly can facilitate the insertion and installation of the radiating tube, and the heat on the subsequent PCB can be transferred to the radiating tube through the flow guide hole.
2. Secondly the cooling tube in the fixed subassembly of heat dissipation can transfer the heat, does benefit to on the heat conduction reaches the heating panel, with the help of the effect of heating panel, has improved thermal diffusion, pastes the layer simultaneously and also can paste with outside carrier and be connected, has improved firmly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a front view of a high heat dissipating chip nixie tube;
FIG. 2 is a perspective view of a high heat dissipating chip-on-digital tube 1;
FIG. 3 is a perspective view of a high heat dissipating chip-on-digital tube 2;
fig. 4 is a perspective view of a high heat dissipating digital tube in a separated state 1;
fig. 5 is a perspective view of a separated chip/digitizer tube with high heat dissipation.
The LED lamp comprises a digital tube assembly 1, a heat dissipation fixing assembly 2, a PCB 3, an LED lamp panel 4, a diversion hole 5, a heat dissipation tube 6, a heat dissipation plate 7, an adhesive layer 8, pins 301, a heat dissipation groove 302, a heat conduction cavity 401 and a hollow filter block 701.
The following detailed description will be further described in conjunction with the above-identified drawings.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments, however, it will be apparent to one skilled in the art that the described embodiments may be practiced without some or all of these specific details, and in other cases well-known process steps have not been described in detail.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
As shown in fig. 1, 2, 3, 4, and 5, a high heat dissipating type chip/nixie tube includes a nixie tube assembly 1, a heat dissipating fixing assembly 2, a PCB 3, an LED lamp panel 4, a guiding hole 5, a heat dissipating tube 6, a heat dissipating plate 7, and an adhesive layer 8, wherein the heat dissipating fixing assembly 2 is installed at the lower end of the nixie tube assembly 1, the heat dissipating fixing assembly 2 is tightly fitted with the nixie tube assembly 1, the LED lamp panel 4 is fixedly installed at the top of the PCB 3, the LED lamp panel 4 is connected with the PCB 3 by heat melting, the number of the guiding hole 5 is several, the guiding holes 5 are distributed inside the PCB 3 from front to back, the guiding hole 5 is a circular through hole, the heat dissipating tube 6 is fixedly installed inside the guiding hole 5, the heat dissipating tube 6 is tightly fitted with the guiding hole 5, the heat dissipating plate 7 is fixedly installed at the left side and the right side of the heat dissipating tube 6, the radiating plate 7 is connected with the radiating pipe 6 in a welding mode, the adhesive layer 8 is fixedly arranged at the bottom of the radiating plate 7, and the adhesive layer 8 is connected with the radiating plate 7 through a high-temperature-resistant adhesive;
the high-heat-dissipation surface-mounted digital tube has the following functions;
A. the flow guide holes 5 in the nixie tube assembly 1 can facilitate the insertion and installation of the radiating tubes 6, and facilitate the transmission of heat on the subsequent PCB 3 to the radiating tubes 6 through the flow guide holes 5;
B. the radiating pipe 6 in the radiating fixing component 2 can transfer heat, heat is favorably guided to the radiating plate 7, the heat diffusion is improved under the action of the radiating plate 7, and meanwhile, the adhesive layer 8 can be also bonded and connected with an external carrier, so that the firmness is improved;
it should be noted that the pins 301 can contact with an external device to achieve an electrical connection effect, and the heat dissipation grooves 302 can facilitate heat dissipation in the areas of the pins 301;
it should be noted that the heat conducting cavity 401 is beneficial to outward diffusion of heat inside the LED lamp panel 4, so that the heat dissipation performance of the LED lamp panel 4 is improved;
a hollow filter block 701 is fixedly arranged between the LED lamp panel 4 and the heat dissipation plate 7, and the hollow filter block 701 is respectively connected with the LED lamp panel 4 and the heat dissipation plate 7 by adopting a high-temperature-resistant adhesive;
it should be noted that the hollow filter block 701 can not only connect the LED lamp panel 4 and the heat sink 7, but also facilitate heat overflow and improve heat dissipation performance because the inside of the hollow filter block 701 is fine micro holes.
Claims (4)
1. A high-heat-dissipation surface-mounted nixie tube is characterized by comprising a nixie tube assembly and a heat dissipation fixing assembly, wherein the nixie tube assembly comprises a PCB (printed circuit board), an LED lamp panel and flow guide holes, the heat dissipation fixing assembly comprises a heat dissipation tube, a heat dissipation plate and an adhesive layer, the heat dissipation fixing assembly is arranged at the lower end of the nixie tube assembly and is in tight fit connection with the nixie tube assembly, the LED lamp panel is fixedly arranged at the top of the PCB, the LED lamp panel is in hot melt connection with the PCB, the flow guide holes are a plurality of flow guide holes, the flow guide holes are distributed in the PCB from front to back, the flow guide holes are circular through holes, the heat dissipation tube is fixedly arranged in the flow guide holes, the heat dissipation tube is in tight fit connection with the flow guide holes, the heat dissipation plate is fixedly arranged at the left side and the right side of the heat dissipation tube, and the heat dissipation tube are in welded connection, the pasting layer is fixedly arranged at the bottom of the heat dissipation plate and is connected with the heat dissipation plate through a high-temperature-resistant adhesive.
2. The digital tube with high heat dissipation performance as recited in claim 1, wherein the bottom of the PCB is further fixed with pins from front to back, the pins and the PCB are connected by thermal melting, and heat dissipation grooves are further disposed between every two pins, and the heat dissipation grooves are grooves.
3. The digital tube with high heat dissipation performance as recited in claim 1, wherein the LED lamp panel is further provided with heat conducting cavities at the front and rear ends, and the heat conducting cavities are hollow cavities.
4. The high heat dissipating patch digital tube according to claim 1, wherein a hollow filter is further disposed between the LED lamp panel and the heat dissipating plate, and the hollow filter is connected to the LED lamp panel and the heat dissipating plate respectively by a high temperature resistant adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122564572.0U CN216119371U (en) | 2021-10-25 | 2021-10-25 | High heat dissipating's paster charactron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122564572.0U CN216119371U (en) | 2021-10-25 | 2021-10-25 | High heat dissipating's paster charactron |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216119371U true CN216119371U (en) | 2022-03-22 |
Family
ID=80695171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122564572.0U Expired - Fee Related CN216119371U (en) | 2021-10-25 | 2021-10-25 | High heat dissipating's paster charactron |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216119371U (en) |
-
2021
- 2021-10-25 CN CN202122564572.0U patent/CN216119371U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220322 |