CN210579890U - Composite circuit heat pipe heat dissipation device - Google Patents
Composite circuit heat pipe heat dissipation device Download PDFInfo
- Publication number
- CN210579890U CN210579890U CN201921782993.7U CN201921782993U CN210579890U CN 210579890 U CN210579890 U CN 210579890U CN 201921782993 U CN201921782993 U CN 201921782993U CN 210579890 U CN210579890 U CN 210579890U
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- heat
- heat pipe
- fin group
- circuit board
- heat dissipation
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a composite circuit heat pipe heat abstractor, its structure includes circuit board main part and heat abstractor, its characterized in that: the heat dissipation device comprises a heat conduction copper column, a heat conduction plate, a heat pipe, a heat dissipation fin group and a fan, wherein the heat conduction copper column is arranged and installed on the top surface of the heat conduction plate, the top end of the heat conduction copper column is tightly attached to the bottom surface of the circuit board main body, the heat pipe is welded and fixed on the bottom surface of the heat conduction plate, the heat pipe extends into the heat dissipation fin group, the heat pipe is in through connection with the heat dissipation fin group, the fan is arranged on the bottom surface of the heat dissipation fin group, the heat dissipation effect is obvious, the stability is high, the heat conduction is free from external drive, the manufacturing process.
Description
Technical Field
The utility model relates to a composite circuit heat pipe heat abstractor belongs to circuit board technical field.
Background
The circuit board is named as a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
Due to the continuous development of microelectronic technology, along with the development of gradually increased electronic devices and the heat flux density generated by the electronic devices, electronic equipment with high heating density generates more heat than traditional electronic equipment, but equipment for effectively radiating heat of a circuit board is lacked in the market, so that the problem that the electronic equipment fails due to the fact that the temperature of the circuit board is too high is solved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a composite circuit heat pipe heat abstractor to solve current problem not enough to prior art exists.
In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a composite circuit heat pipe heat abstractor, its structure includes circuit board main part and heat abstractor, its characterized in that: the heat dissipation device comprises a heat conduction copper column, a heat conduction plate, a heat pipe, a heat dissipation fin group and a fan, wherein the heat conduction copper column is arranged on the top surface of the heat conduction plate, the top end of the heat conduction copper column is tightly attached to the bottom surface of the circuit board main body, the heat pipe is welded and fixed on the bottom surface of the heat conduction plate, the heat pipe extends into the heat dissipation fin group, the heat pipe is in through connection with the heat dissipation fin group, and the fan is arranged on the bottom surface of the heat dissipation fin group.
Further, the heat-conducting plate both sides all are equipped with the buckle, the buckle lower extreme with the heat-conducting plate is articulated to be connected, the buckle is fold-back type structure, the circuit board main part with heat abstractor passes through the buckle is connected.
Furthermore, the radiating fin group is formed by connecting a plurality of radiating fins.
Furthermore, the fan is connected with the radiating fin group clamping hook and can be installed according to requirements.
Furthermore, the radiating fin group is made of aluminum materials, and radiating efficiency is high.
Furthermore, the heat conducting plate is made of graphene, so that the heat transfer efficiency is high and the insulation performance is high.
The utility model has the advantages that: the heat dissipation device realizes that the circuit board main part is fixed through the buckle, when not needing to use, conveniently dismantle and get off the washing, when using, install through the buckle, the heat conduction copper post can be with the heat transfer to the heat-conducting plate that circuit board main part operation produced, the design of heat conduction copper post can avoid heat-conducting plate direct contact circuit board main part to lead to backplate stitch short circuit simultaneously, then the heat pipe dispels the heat with heat transfer to the cooling fin group on the heat-conducting plate, the fan rotates and accelerates the radiating rate, the radiating effect is obvious, high stability, heat transfer need not external drive, and the manufacturing process is simple simultaneously, and can be applicable to mass production and make.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a perspective view of the composite circuit heat pipe heat dissipation device of the present invention;
fig. 2 is a structural front view of the composite circuit heat pipe heat dissipation device of the present invention.
In the figure: the circuit board comprises a circuit board main body-1, a heat dissipation device-2, a heat conduction copper column-201, a heat conduction plate-202, a heat pipe-203, a heat dissipation fin group-204, a fan-205 and a buckle-3.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1 and 2, the present invention provides a composite circuit heat pipe heat dissipation device, which comprises: its structure includes circuit board main part 1 and heat abstractor 2, its characterized in that: the heat dissipation device 2 comprises a heat conduction copper column 201, a heat conduction plate 202, a heat pipe 203, a heat dissipation fin set 204 and a fan 205, the heat sink fin set 204 is formed by connecting a plurality of heat sink fins, the heat conducting copper columns 201 are arranged on the top surface of the heat conducting plate 202, the top end of the heat conducting copper column 201 is tightly attached to the bottom surface of the circuit board main body 1, the heat pipe 203 is welded and fixed on the bottom surface of the heat conducting plate 202, the heat pipe 203 extends into the heat dissipating fin set 204, the heat pipe 203 is connected to the heat dissipating fin set 204, the fan 205 is disposed on the bottom surface of the heat dissipating fin set 204, the fan 205 is hooked with the heat dissipating fin set 204, the two sides of the heat conducting plate 202 are both provided with buckles 3, the lower ends of the buckles 3 are hinged with the heat conducting plate 202, the clip 3 is of a fold-back type structure, and the circuit board main body 1 and the heat sink 2 are connected through the clip 3.
The power interface of the fan 205 in this patent is electrically connected to the 4Pin interface on the circuit board main body 1, and the connection method is a common electrical connection, which belongs to the known technology and is not described herein again.
For example, the heat dissipation device 2 realizes the fixation of the circuit board main body 1 through the buckle 3, when the use is not needed, the cleaning is conveniently disassembled, when the use is needed, the heat dissipation device 2 is installed through the buckle 3, the heat conduction copper column 201 can transfer the heat generated by the operation of the circuit board main body 1 to the heat conduction plate 202, meanwhile, the design of the heat conduction copper column 201 can avoid the heat conduction plate 202 from directly contacting the circuit board main body 1 to cause the short circuit of the pins of the back plate, then the heat pipe 203 transfers the heat on the heat conduction plate 202 to the heat dissipation fin group 204 for heat dissipation, and the fan 205 rotates to accelerate the.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. The utility model provides a composite circuit heat pipe heat abstractor, its structure includes circuit board main part (1) and heat abstractor (2), its characterized in that: heat abstractor (2) is including heat conduction copper post (201), heat-conducting plate (202), heat pipe (203), cooling fin group (204) and fan (205), heat conduction copper post (201) arrange install in heat-conducting plate (202) top surface, heat conduction copper post (201) top close fit in circuit board main part (1) bottom surface, heat pipe (203) welded fastening in heat-conducting plate (202) bottom surface, heat pipe (203) extend to in cooling fin group (204), heat pipe (203) through connection in cooling fin group (204), fan (205) set up in cooling fin group (204) bottom surface.
2. A composite circuit heat pipe heat sink as defined in claim 1, wherein: heat-conducting plate (202) both sides all are equipped with buckle (3), buckle (3) lower extreme with heat-conducting plate (202) are articulated to be connected, buckle (3) are fold-back type structure, circuit board main part (1) with heat abstractor (2) pass through buckle (3) are connected.
3. A composite circuit heat pipe heat sink as defined in claim 1, wherein: the heat radiating fin group (204) is formed by connecting a plurality of heat radiating fins.
4. A composite circuit heat pipe heat sink as defined in claim 1, wherein: the fan (205) is connected with the radiating fin group (204) in a clamping and hooking mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921782993.7U CN210579890U (en) | 2019-10-23 | 2019-10-23 | Composite circuit heat pipe heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921782993.7U CN210579890U (en) | 2019-10-23 | 2019-10-23 | Composite circuit heat pipe heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579890U true CN210579890U (en) | 2020-05-19 |
Family
ID=70660050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921782993.7U Active CN210579890U (en) | 2019-10-23 | 2019-10-23 | Composite circuit heat pipe heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579890U (en) |
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2019
- 2019-10-23 CN CN201921782993.7U patent/CN210579890U/en active Active
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