CN212727891U

CN212727891U - Heat radiation structure of circuit board

Info

Publication number: CN212727891U
Application number: CN202022104202.4U
Authority: CN
Inventors: 蓝常耿
Original assignee: Shenzhen Rongwei Technology Co ltd
Current assignee: Shenzhen Rongwei Technology Co ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-03-16
Anticipated expiration: 2030-09-23

Abstract

The utility model relates to a heat radiation structure of a circuit board, which comprises a circuit board body and a circulating water tank, wherein the circuit board body comprises an upper substrate, a coil pipe, a lower substrate and a copper foil circuit layer, the bottom surface of the upper substrate and the top surface of the lower substrate are provided with pipe grooves, the pipe grooves comprise a main body groove and a communicating groove, the coil pipe is arranged in the main body groove, and the inlet and the outlet of the coil pipe are arranged outside the circuit board body through the communicating groove and are connected with the circulating water tank; the bottom surface of the upper substrate and the top surface of the lower substrate are correspondingly connected in a pressing mode, the copper foil circuit layers are arranged on the top surface of the upper substrate and the bottom surface of the lower substrate, through holes used for communicating the copper foil circuit layers with the pipe grooves are formed in the upper substrate and the lower substrate, and heat conducting glue is filled in the main body grooves and the through holes; the utility model discloses can utilize the water-cooling to carry out the high-efficient heat dissipation of pertinence to the high calorific capacity region on the circuit board.

Description

Heat radiation structure of circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a heat radiation structure of circuit board.

Background

In electronic products, heat dissipation of high-power-consumption components is always an important link in PCB design, and PCB manufacturers generally use glass fibers, cloth materials and resin to form an insulating part of a PCB, and then use epoxy resin and copper foil for pressing to form the PCB. Most PCB circuit boards are not good in heat dissipation treatment, overheating problems are often caused by various conditions in the using process, the overheating easily causes instability or damage of electronic parts, and the service life of the electronic parts is also reduced.

In the prior art, the heat dissipation scheme of the PCB is to increase the copper spreading amount or the copper spreading area in the PCB layer, to conduct and disperse the heat energy to the copper spreading area of each layer, and to realize the heat dissipation of the PCB through the copper layer.

However, as the power consumption of electronic products is getting larger and larger, and the heat density generated by the electronic components on the PCB is more concentrated, the above heat dissipation scheme cannot meet the heat dissipation requirement of the high power consumption components, and a heat dissipation structure of the PCB with better heat dissipation performance is urgently needed.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a heat dissipation structure of a circuit board, which can perform targeted and efficient heat dissipation on a high heat value region on the circuit board.

The utility model discloses a heat radiation structure of circuit board, including circuit board body and circulating water tank, the circuit board body includes upper substrate, coil pipe, infrabasal plate and copper foil circuit layer, and the bottom surface of upper substrate and the top surface of infrabasal plate are equipped with the chase, and the chase includes main part groove and intercommunication groove, and the coil pipe setting is in the main part groove, and the import and the export of coil pipe set up in the outside of circuit board body and are connected with circulating water tank through the intercommunication groove; the bottom surface of upper substrate and infrabasal plate top surface correspond the pressfitting and connect, and copper foil circuit layer sets up the top surface of upper substrate and the bottom surface of infrabasal plate, is equipped with on upper substrate and the infrabasal plate to be used for the through-hole that feeds through copper foil circuit layer and tube seat with one, and main part groove and through-hole are all filled to have the heat-conducting glue.

Furthermore, the circulating water tank comprises a water pump and a water tank, the water pump is arranged in the water tank, the water tank is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected with the outlet and the inlet of the coil pipe.

Further, be equipped with on the circuit board body and connect temperature sensor and main control chip in proper order, main control chip pass through the relay with the water pump is connected, and temperature sensor is used for gathering the temperature on the circuit layer of coil pipe counterpoint position.

Further, the heat-conducting glue is organic silicon heat-conducting glue, and the coil pipe is fixed with the pipe groove through the organic silicon heat-conducting glue filled in the pipe groove.

Further, the overall shape of the coil pipe is wavy, and the inlet and the outlet are arranged at two ends of the coil pipe.

The utility model has the advantages that: the utility model discloses a heat radiation structure of circuit board, set up the main part groove in the tube seat in the high heating area of circuit board body, and fix the coil pipe in the tube seat through the heat conduction glue, the coil pipe is connected with outside circulation tank, water has been preserved inside the coil pipe, when electronic components on the copper foil circuit layer on the circuit board body produced heat, exchange with aquatic products themogenesis, circulation tank discharges the hot water inside the coil water simultaneously, draw cold water into the coil pipe again, constantly carry out the heat exchange with high heating area, simultaneously, copper foil circuit layer and coil pipe pass through the through-hole and the heat conduction glue in the through-hole is connected, further submit heat exchange efficiency; the utility model discloses can utilize the water-cooling to carry out the high-efficient heat dissipation of pertinence to the high calorific capacity region on the circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic diagram of a layered structure of a circuit board body according to the present invention;

fig. 2 is a cross-sectional view of the circuit board body of the present invention;

FIG. 3 is an enlarged cross-sectional view of the circuit board body of the present invention;

fig. 4 is the schematic diagram of the connection structure of the water pump of the present invention.

The reference numbers are as follows: 1-upper substrate, 2-coil pipe, 3-lower substrate, 4-copper foil circuit layer, 5-circulating water tank, 6-pipe groove, 61-main groove, 62-communicating groove, 611-through hole and 612-heat conducting glue.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1-4: the heat dissipation structure of the circuit board comprises a circuit board body and a circulating water tank 5, wherein the circuit board body comprises an upper substrate 1, a coil pipe 2, a lower substrate 3 and a copper foil circuit layer 4, pipe grooves 6 are formed in the bottom surface of the upper substrate 1 and the top surface of the lower substrate 3, each pipe groove 6 comprises a main body groove 61 and a communicating groove 62, the coil pipe 2 is arranged in the main body groove 61, and an inlet and an outlet of the coil pipe 2 are arranged on the outer side of the circuit board body through the communicating groove 62 and are connected with the circulating water tank 5; the bottom surface of the upper substrate 1 and the top surface of the lower substrate 3 are correspondingly connected in a pressing mode, the copper foil circuit layer 4 is arranged on the top surface of the upper substrate 1 and the bottom surface of the lower substrate 3, through holes 611 used for communicating the copper foil circuit layer 4 with the pipe grooves 6 are formed in the upper substrate 1 and the lower substrate 3, and heat-conducting glue 612 is filled in the main body groove 61 and the through holes 611.

The utility model discloses a heat radiation structure of circuit board, set up main part groove 61 in tube seat 6 in the high heat generation region of circuit board body, and fix coil pipe 2 in tube seat 6 through heat conduction glue 612, coil pipe 2 is connected with outside circulation tank 5, coil pipe 2 inside pre-stored water, when electronic components on copper foil circuit layer 4 on the circuit board body produced heat, exchange with aquatic products themogenesis, circulation tank 5 discharges the hot water in the coil pipe simultaneously, suck cold water into coil pipe 2 again, constantly carry out the heat exchange with the high heat generation region, simultaneously, copper foil circuit layer 4 is connected through heat conduction glue 612 in through-hole 611 and the through-hole 611 with coil pipe 2, submit heat exchange efficiency in this embodiment; the utility model discloses can utilize the water-cooling to carry out the high-efficient heat dissipation of pertinence to the high calorific capacity region on the circuit board.

In this embodiment, circulation tank 5 includes water pump and water tank, and the water pump setting is equipped with water inlet and delivery port in the water tank, water inlet and delivery port respectively with coil pipe 2's export and access connection, and the water pump utilizes the cold water pump of atmospheric pressure in with the water tank to go into to coil pipe 2 for setting up the micro vacuum pump at the delivery port, makes the hot water in the coil pipe 2 extruded by cold water simultaneously, flows back to in the water tank.

In this embodiment, be equipped with order connection temperature sensor and main control chip on the circuit board body, main control chip passes through the relay and is connected with the water pump, temperature sensor is used for gathering the temperature on the circuit layer of 2 counterpoint positions of coil pipe, by the work of main control chip automatic control water pump, when temperature sensor gathered the high temperature that corresponds the region, main control chip passes through the relay and connects the electric circuit of water pump as the switch, make water pump work send cold water into coil pipe 2, the electric circuit of control relay disconnection water pump after a period can.

In this embodiment, the thermal conductive adhesive 612 is an organic silicon thermal conductive adhesive 612, the coil pipe 2 is fixed to the pipe groove 6 through the organic silicon thermal conductive adhesive 612 filled in the pipe groove 6, and the organic silicon thermal conductive adhesive 612 serves as an adhesive to fix the coil pipe 2 and can serve as a thermal conductive material, so that heat of components on the copper foil circuit layer 4 can be transferred to the pipe groove 6 more quickly.

In this embodiment, coil pipe 2's whole shape is the wave, and import and export setting are at coil pipe 2's both ends, and wave coil pipe 2 is favorable to water to stay in coil pipe 2, has increased the area of contact of coil pipe 2 with the circuit board simultaneously, and then improves the efficiency of heat exchange.

Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.

Claims

1. A heat radiation structure of a circuit board is characterized in that: the water circulation type solar water heater comprises a circuit board body and a circulation water tank, wherein the circuit board body comprises an upper substrate, a coil pipe, a lower substrate and a copper foil circuit layer, pipe grooves are formed in the bottom surface of the upper substrate and the top surface of the lower substrate, each pipe groove comprises a main body groove and a communicating groove, the coil pipe is arranged in the main body groove, and an inlet and an outlet of the coil pipe are arranged on the outer side of the circuit board body through the communicating grooves and are connected with the circulation water tank; the bottom surface of upper substrate and infrabasal plate top surface correspond the pressfitting and connect, and copper foil circuit layer sets up the top surface of upper substrate and the bottom surface of infrabasal plate, is equipped with on upper substrate and the infrabasal plate to be used for the through-hole that feeds through copper foil circuit layer and tube seat with one, and main part groove and through-hole are all filled to have the heat-conducting glue.

2. The heat dissipation structure of a circuit board according to claim 1, wherein: the circulating water tank comprises a water pump and a water tank, the water pump is arranged in the water tank, a water inlet and a water outlet are formed in the water tank, and the water inlet and the water outlet are respectively connected with an outlet and an inlet of the coil pipe.

3. The heat dissipation structure of a circuit board according to claim 2, wherein: the temperature sensor and the main control chip are sequentially connected to the circuit board body, the main control chip is connected with the water pump through a relay, and the temperature sensor is used for collecting the temperature of the circuit layer at the coil pipe alignment position.

4. The heat dissipation structure of a circuit board according to claim 1, wherein: the heat-conducting glue is organic silicon heat-conducting glue, and the coil pipe is fixed with the pipe groove through the organic silicon heat-conducting glue filled in the pipe groove.

5. The heat dissipation structure of a circuit board according to claim 1, wherein: the whole shape of the coil is wave-shaped, and the inlet and the outlet are arranged at two ends of the coil.